JP2001107210A - Chip for plating and manufacturing method thereof - Google Patents

Chip for plating and manufacturing method thereof

Info

Publication number
JP2001107210A
JP2001107210A JP2000045044A JP2000045044A JP2001107210A JP 2001107210 A JP2001107210 A JP 2001107210A JP 2000045044 A JP2000045044 A JP 2000045044A JP 2000045044 A JP2000045044 A JP 2000045044A JP 2001107210 A JP2001107210 A JP 2001107210A
Authority
JP
Japan
Prior art keywords
chip
plating
plate
cut
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000045044A
Other languages
Japanese (ja)
Inventor
Masao Koyama
征男 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEIWA PRESS KK
Original Assignee
SEIWA PRESS KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEIWA PRESS KK filed Critical SEIWA PRESS KK
Priority to JP2000045044A priority Critical patent/JP2001107210A/en
Publication of JP2001107210A publication Critical patent/JP2001107210A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coating With Molten Metal (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a chip having uniform shape for plating which can manufacture at a low cost by using a pure iron plate and can efficiently execute the work because a feeding to a cutting position is easily executed, and the manufacturing method thereof. SOLUTION: For manufacturing the square chip for alloy plating, the cutting shape surface of a die 2 for the chip for plating is formed as a stepping state and at this time, the number of the steps in the staircase state are made to have the cutting shape surface formed as two or more steps. Further, in the case of using x for width of the step in the stepping containing the uppermost step, the difference between the respective steps is desirable to be 2x. In this way, when the plate 3 is cut off, the plate is fed out by x distance having the same width as the step in the stepping and thus, the plate is cut off and formed as a regular rectangular parallelepiped state having the height (a) in the thickness of the plate 3 in the state of the regular quadrangle having x in the length of one side of the chip 4 for alloy plating.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、層毎に異なる素材の鍍
金を行う多層鍍金において、その層のうち合金鍍金を行
う場合に使用される材料で、溶解して使われる純鉄チッ
プとその製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-layer plating method in which a different material is plated for each layer. It relates to a manufacturing method.

【0002】[0002]

【従来の技術】合金鍍金を行う場合、丸棒に加工された
純鉄を何十本かまとめ並べて任意の大きさに切断(シャ
ーリング)し、円柱状の純鉄チップにしてから、溶解炉
にて溶解した後、合金鍍金を行っていた。
2. Description of the Related Art When performing alloy plating, dozens of pure irons processed into round bars are arranged in a row, cut into arbitrary sizes (shearing), formed into cylindrical pure iron chips, and then put into a melting furnace. After melting, alloy plating was performed.

【0003】[0003]

【発明が解決しようとする課題】前記従来の丸棒に加工
された純鉄を任意の大きさに切断(シャーリング)する
において、丸棒を何十本かまとめ並べて一度に切断を行
っていたが、丸棒を並べたり、切断位置に送り出す際に
ずれてしまうなど、手間が必要以上にかかるとともに、
加工された純鉄の丸棒を使用することから、純鉄丸棒の
コストも純鉄の板材より高価なものとなっていた。
In cutting (shearing) pure iron processed into the conventional round bar into an arbitrary size, dozens of round bars are arranged and cut at a time. , It takes extra time to arrange the round bars and shifts when sending to the cutting position.
Since a processed pure iron round bar is used, the cost of the pure iron round bar has been higher than that of a pure iron plate.

【0004】また、切断された純鉄チップは、複数の丸
棒を切断しているため、送り出しがそろわないと、チッ
プになったときの寸法が不揃いものとなっていた。
[0004] In addition, since the cut pure iron chips are formed by cutting a plurality of round bars, if the chips are not sent out, the dimensions of the chips become irregular.

【0005】前記従来の問題点に鑑み、純鉄の板材を使
用することにより、コスト面でも安価に製造することが
でき、また、切断位置への送り出しも容易となることか
ら、作業能率もよくおこなうことができるとともに、均
一な四角形状の純鉄チップとその製造方法を提供するこ
とを目的としている。
[0005] In view of the above-mentioned conventional problems, the use of a pure iron plate material makes it possible to manufacture the device at a low cost in terms of cost, and it is easy to send the material to the cutting position. An object of the present invention is to provide a pure iron chip having a uniform square shape and a method for manufacturing the same.

【0006】[0006]

【課題を解決するための手段】上記目的を解決するため
に、本発明の鍍金用チップは純鉄の板材を用いて四角形
状にプレス金型によって切断形成するものである。
In order to solve the above-mentioned object, a plating chip of the present invention is formed by cutting a pure iron plate into a square shape by a press die.

【0007】そして、前記記載の四角形状に切断形成さ
れる本考案の鍍金用チップの製造方法は、鍍金用チップ
金型の切断形状面が階段状に形成されるとともに、その
段数は2段以上あるように成形された切断形状面を持つ
金型によって切断製造されるものである。
According to the method for manufacturing a plating chip of the present invention, which is cut and formed into a square shape, the cut surface of the plating chip mold is formed stepwise, and the number of steps is two or more. It is manufactured by cutting with a mold having a cut-shaped surface that is shaped in a certain way.

【0008】また、前記階段状の金型において、最上段
を含めた階段のステップの幅をxとしたとき、各階段の
段差は2xとすることが好ましく、それにより板材の切
断時に、階段のステップと同じ幅であるx分だけ送り出
すことで、合金鍍金用チップの1辺の長さがxとなる正
四角形の状態で、板材の板圧が高さとなる正直方体状で
切断成形され、尚且つ、合金鍍金用チップは、板材の無
駄をだすことなく連続して製造することが可能となる。
In the step-like mold, when the width of the step including the uppermost step is x, the step of each step is preferably 2x. By sending out by x, which is the same width as the step, the chip for alloy plating is cut and formed in a rectangular parallelepiped shape in which the plate pressure of the plate material is high in a square shape where the length of one side is x. On the other hand, the alloy plating chip can be manufactured continuously without wasting the plate material.

【0009】[0009]

【作用】本発明の鍍金用チップは、純鉄の板材を使用す
ることにより、加工した丸棒状の純鉄よりコストダウン
が可能となるとともに、切断位置への送り出しも容易と
なる。
By using a pure iron plate material, the plating tip of the present invention can reduce the cost compared to the processed round bar-shaped pure iron, and can be easily sent to the cutting position.

【0010】また、本発明である鍍金用チップの製造方
法は、四角形状の鍍金用チップが、板材の無駄をだすこ
となく連続して、尚且つ、チップ全てを同じ大きさの四
角形に切断成形し製造することができる。
Further, in the method of manufacturing a plating chip according to the present invention, the square plating chip is continuously formed without wasting the plate material, and all the chips are cut and formed into a square of the same size. Can be manufactured.

【0011】[0011]

【実施例】本発明の実施例について図面を参照して具体
的に説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described with reference to the drawings.

【0012】図1は、従来の純鉄丸棒の斜視図であり、
これを切断(シャーリング)し、円柱状のチップにして
から合金鍍金をおこなっていた。そして図2は、本発明
の合金鍍金用の四角形状に切断されたチップの斜視図で
ある
FIG. 1 is a perspective view of a conventional pure iron round bar.
This was cut (sheared) to form a columnar chip and then subjected to alloy plating. FIG. 2 is a perspective view of a square-shaped chip for alloy plating of the present invention.

【0013】図3は、図2の合金鍍金用の四角形状チッ
プを製造するための金型の平面図、そして図4は側面図
であり、鍍金用チップ金型2の切断形状面が階段状に形
成されている。このとき階段状の段数は2段以上あるよ
うに成形された切断形状面を持つようにし、また、最上
段を含めた階段のステップの幅をxとしたとき、各階段
の差は2xとすることが好ましく、それにより板材3の
切断時に、階段のステップと同じ幅であるx分だけ送り
出すことで、合金鍍金用チップ4の1辺の長さがxとな
る正四角形の状態で、板材3の板圧aが高さとなる正直
方体状で切断成形されるものである。
FIG. 3 is a plan view of a mold for producing the square chip for alloy plating shown in FIG. 2, and FIG. 4 is a side view, in which the cutting shape of the plating chip mold 2 is stepped. Is formed. At this time, the number of steps has a cut shape surface formed so that there are two or more steps, and when the width of the steps of the steps including the uppermost step is x, the difference between the steps is 2x. Therefore, when the plate material 3 is cut, the plate material 3 is fed by the same width x as that of the steps of the stairs, so that the length of one side of the alloy plating chip 4 is x, and the plate material 3 is cut out. Is cut and formed in a rectangular parallelepiped shape in which the plate pressure a becomes high.

【0014】また図5は、合金鍍金用の四角形状チップ
を製造するための金型において、切断された途中の状態
を示す純鉄板材の平面図であり、図が示すように板材3
が階段状に切断され、x分送り出されることで四角形状
のチップ4が連続して製造されるものである。
FIG. 5 is a plan view of a pure iron sheet material showing a state in the middle of cutting in a mold for manufacturing a square chip for alloy plating. As shown in FIG.
Are cut in steps, and are sent out for x times, whereby the square chips 4 are continuously manufactured.

【0015】[0015]

【発明の効果】本考案の鍍金用チップは、純鉄の板材を
使用することにより、加工した丸棒状の純鉄よりコスト
ダウンが可能となるとともに、切断位置への送り出しも
容易となることから、作業効率も向上することができ、
尚且つ、四角形状の鍍金用チップが、板材の無駄をだす
ことなく連続して製造し、尚且つ、チップ全てを同じ大
きさの四角形に成形すことから、鍍金作業自体のコスト
ダウンにもつながる素晴らしい発明である。
According to the present invention, the use of a pure iron plate material makes it possible to reduce the cost of the processed round bar-shaped pure iron and to facilitate the sending to the cutting position. , Work efficiency can be improved,
In addition, square-shaped plating chips are continuously manufactured without wasting the plate material, and all the chips are formed into the same size square, which leads to a reduction in the cost of the plating operation itself. A wonderful invention.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来の鍍金用チップを製造するための丸棒を示
す斜視図
FIG. 1 is a perspective view showing a round bar for manufacturing a conventional plating chip.

【図2】本発明による四角形状の鍍金用チップを示す斜
視図である。
FIG. 2 is a perspective view showing a square plating chip according to the present invention.

【図3】本発明による鍍金用チップの製造方法による金
型を示す平面図ある。
FIG. 3 is a plan view showing a mold according to a method for manufacturing a plating chip according to the present invention.

【図4】本発明による鍍金用チップの製造方法による金
型を示す側面図ある。
FIG. 4 is a side view showing a mold according to the method of manufacturing a plating chip according to the present invention.

【図5】本発明による鍍金用チップの製造方法による金
型によって切断途中の板材の切断面を示す平面図ある。
FIG. 5 is a plan view showing a cut surface of a plate material being cut by a mold according to a plating chip manufacturing method according to the present invention.

【符号の説明】[Explanation of symbols]

1 ピン 2 金型 3 板材 4 四角形状の鍍金用チップ a 板材の板圧 x ステップの幅 1 Pin 2 Die 3 Plate 4 Square plating tip a Plate pressure of plate x Step width

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】鍍金用チップを四角形状にしたことを特徴
とする鍍金用チップ
1. A plating chip, wherein the plating chip has a square shape.
【請求項2】請求項1記載の四角形状の鍍金用チップを
製造するにおいて、鍍金用チップ金型の切断形状面が階
段状に形成されており、このとき階段状の段数は2段以
上あるように成形された切断形状面を持つ金型によっ
て、製造されることを特徴とする鍍金用チップの製造方
2. The manufacturing method of a quadrangular plating chip according to claim 1, wherein the cut surface of the plating chip mold is formed in a stepped shape, and at this time, the number of steps is two or more. A method for producing a plating chip characterized by being produced by a mold having a cut shape surface formed as described above.
JP2000045044A 1999-09-30 2000-01-19 Chip for plating and manufacturing method thereof Pending JP2001107210A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000045044A JP2001107210A (en) 1999-09-30 2000-01-19 Chip for plating and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000045044A JP2001107210A (en) 1999-09-30 2000-01-19 Chip for plating and manufacturing method thereof

Publications (1)

Publication Number Publication Date
JP2001107210A true JP2001107210A (en) 2001-04-17

Family

ID=18567705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000045044A Pending JP2001107210A (en) 1999-09-30 2000-01-19 Chip for plating and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP2001107210A (en)

Similar Documents

Publication Publication Date Title
US6709892B2 (en) Electronic device fabrication method comprising twofold cutting of conductor member
DE102014102810A1 (en) Production of optoelectronic components
JP2001107210A (en) Chip for plating and manufacturing method thereof
CN101404272A (en) Labeling type semiconductor component and its production method
CN106914567A (en) The general shearing die and cutting method of electronic encapsulation shell outer lead technique line
JP2003080322A (en) Method for manufacturing washer
JP3175504B2 (en) Lead frame manufacturing method and manufacturing apparatus
US20030020147A1 (en) Method of making leadframe by mechanical processing
JP2521234B2 (en) Method and apparatus for manufacturing lead frame for semiconductor device
JPS5933983B2 (en) Method for manufacturing lead frames for semiconductor devices
JP2011101065A (en) Semiconductor device
JP2003073711A (en) Method for manufacturing porous body of metallic fiber
JPH0314263A (en) Manufacture of lead frame
JPH0660861A (en) Manufacture of battery electrode terminal plate
JP5071028B2 (en) Expanded grid for lead-acid batteries
JP2005088025A (en) Blanking die and blanking method
JPH07169895A (en) Lead frame and manufacture of the same
JP2648053B2 (en) Semiconductor device lead cutting method
JP4175623B2 (en) Mold for processing base plate and method for manufacturing processed plate
JP2005340529A (en) Method for manufacturing thermoelectric element
CN201266606Y (en) Patch type semiconductor element
JP2954155B1 (en) Lead frame manufacturing equipment
JP2006167880A (en) Die for processing base plate, manufacturing method of processed plate and manufacturing method of product plate
JP2007313628A (en) Die for processing of mother board, manufacturing method for working plate, and manufacturing method for product plate
JP2008235881A (en) Method for manufacturing ignition iron core