JP2001105304A - Disc holding carrier material - Google Patents
Disc holding carrier materialInfo
- Publication number
- JP2001105304A JP2001105304A JP28363999A JP28363999A JP2001105304A JP 2001105304 A JP2001105304 A JP 2001105304A JP 28363999 A JP28363999 A JP 28363999A JP 28363999 A JP28363999 A JP 28363999A JP 2001105304 A JP2001105304 A JP 2001105304A
- Authority
- JP
- Japan
- Prior art keywords
- fiber
- carrier material
- resin
- organic
- fibers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体ウエハー、液
晶ディスプレー、ハードディスクなどのディスクを平面
研磨機で研磨する際に、そのディスクを保持するキャリ
アー材に関し、さらに詳しくは、耐摩耗性に優れ、しか
も大型化しても「そり」や「ねじれ」を生じない比較的
低価格のディスク保持用キャリアー材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier material for holding a disk such as a semiconductor wafer, a liquid crystal display, and a hard disk when the disk is polished by a plane polishing machine. The present invention relates to a relatively low-cost carrier material for holding a disk, which does not cause warpage or twisting even when the size is increased.
【０００２】[0002]
【従来の技術】従来、半導体ウエハー等のディスクを平
面研磨機で研磨加工する際に、そのディスクを保持する
ために使用するキャリアー材として、ＳＫ鋼などの金属
板が多く使用されていた。キャリアー材は円盤状に切り
出され、その円周に研磨機のインターナルギア、サンギ
アと噛み合うギアが切り込まれ、被研磨物であるディス
クを保持するための円形穴が設けられてキャリアーとな
る。2. Description of the Related Art Conventionally, when a disk such as a semiconductor wafer is polished by a plane polishing machine, a metal plate such as SK steel is often used as a carrier material used to hold the disk. The carrier material is cut into a disk shape, and a gear meshing with an internal gear and a sun gear of the polishing machine is cut into the circumference thereof, and a circular hole for holding a disk to be polished is provided to form a carrier.
【０００３】これらの材料は重金属を極度に嫌う被研磨
物の研磨にとって都合が良いが、金属板は研磨加工中に
流出する金属成分が半導体等の特性を低下させることが
わかるようになってから、炭素繊維やガラス繊維の繊維
強化樹脂シート材が広く使用されてきている。[0003] These materials are convenient for polishing objects to be polished, which extremely dislike heavy metals. However, in the case of metal plates, it has been found that metal components flowing out during polishing processing deteriorate the properties of semiconductors and the like. Fiber reinforced resin sheet materials such as carbon fiber and glass fiber have been widely used.
【０００４】しかし、ガラス繊維も研磨加工中に流出す
る金属成分が半導体等の特性を低下させることが確認さ
れており、また炭素繊維とガラス繊維は耐摩耗性が低い
ためにこれらの繊維強化樹脂シートからなるキャリアー
材は頻繁に交換する必要があり、平面研磨機の稼働率を
下げるという欠点があった。[0004] However, it has been confirmed that metal components flowing out during polishing also lower the properties of semiconductors and the like in glass fibers, and carbon fibers and glass fibers have low abrasion resistance, so that these fiber reinforced resins are used. The carrier material made of a sheet needs to be replaced frequently, and there is a drawback that the operation rate of the plane polishing machine is lowered.
【０００５】また、近年では生産性向上のために、キャ
リアー材の大型化（大面積化）が進んでいるが、この大
型化に伴いガラス繊維を使用した繊維強化樹脂シート材
はそりやねじれを生ずる傾向があり、そり・ねじれを持
つキャリアー材でディスク状の被研磨物を保持して研磨
加工すると研磨加工中にキャリアーから被研磨物がはず
れることによって、不良品を発生することがあった。[0005] In recent years, the size of a carrier material (increase in area) has been increasing in order to improve productivity. However, with this increase in size, a fiber-reinforced resin sheet material using glass fibers has been warped or twisted. When a disk-shaped object to be polished is held and polished by a carrier material having a warp and a twist, the object to be polished may come off from the carrier during the polishing, thereby causing a defective product.
【０００６】[0006]
【発明が解決しようとする課題】本発明の目的は、磨耗
に強く、そりやねじれを起こしにくく、経済的にも有利
なディスク保持用キャリアー材を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a disk holding carrier material which is resistant to abrasion, hardly warps or twists, and is economically advantageous.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に本発明は次の手段をとる。In order to solve the above problems, the present invention takes the following means.
【０００８】即ち本発明は、多層繊維強化樹脂シートの
積層体からなり、該積層体の最外層として、アラミド繊
維、ＰＢＯ(ポリ-ｐ-フェニレンベンズビスオキサゾー
ル)繊維または全芳香族ポリエステル繊維からなる短繊
維を分散させた基材紙に熱硬化性樹脂を含浸させた繊維
強化樹脂シートを配置し、中央層として、有機系繊維基
材紙、または有機系繊維の長繊維束、不織布または織物
のプリプレグを配置したディスク保持用キャリアー材で
ある。That is, the present invention comprises a laminate of a multilayer fiber reinforced resin sheet, and the outermost layer of the laminate comprises aramid fiber, PBO (poly-p-phenylene benzobisoxazole) fiber or wholly aromatic polyester fiber. A fiber reinforced resin sheet impregnated with a thermosetting resin is disposed on a base paper in which short fibers are dispersed, and as a central layer, an organic fiber base paper, or a long fiber bundle of organic fibers, a nonwoven fabric or a woven fabric. This is a carrier material for holding a disk on which a prepreg is arranged.
【０００９】また、この発明において、 短繊維の長さ
が０．１〜１０ｍｍであること、有機系繊維がセルロー
ス系、アクリル系、ポリエステル系、ポリビニルアルコ
ール系またはセルロース系パルプであること、熱硬化性
樹脂がエポキシ樹脂、フェノール樹脂、ポリイミド樹脂
またはビスマレイミド樹脂であることは好ましい態様で
ある。Further, in the present invention, the short fibers have a length of 0.1 to 10 mm, the organic fibers are cellulose, acrylic, polyester, polyvinyl alcohol or cellulose pulp. In a preferred embodiment, the conductive resin is an epoxy resin, a phenol resin, a polyimide resin, or a bismaleimide resin.
【００１０】[0010]
【発明の実施の形態】本発明における、多層繊維強化樹
脂シートの積層体は、最外層、つまり最表面と最裏面
に、アラミド繊維、ＰＢＯ繊維または全芳香族ポリエス
テル繊維からなる短繊維を分散させた基材紙に熱硬化性
樹脂を含浸させた繊維強化樹脂シートを配置する。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, a laminate of a multilayer fiber reinforced resin sheet is prepared by dispersing short fibers made of aramid fiber, PBO fiber or wholly aromatic polyester fiber in the outermost layer, that is, the outermost surface and the outermost surface. A fiber reinforced resin sheet impregnated with a thermosetting resin is placed on the base paper.
【００１１】アラミド繊維、ＰＢＯ繊維、全芳香族ポリ
エステル繊維は寸法安定性に優れ、磨耗に強いので、こ
れらの繊維で強化した樹脂シートを最外層に配置するこ
とにより、キャリアー材のギア部の磨耗を軽減すること
が可能になる。Aramid fibers, PBO fibers, and wholly aromatic polyester fibers have excellent dimensional stability and are resistant to abrasion. By disposing a resin sheet reinforced with these fibers in the outermost layer, wear of the gear portion of the carrier material is reduced. Can be reduced.
【００１２】一方、本発明においては、多層繊維強化樹
脂シート積層体の中央層には、有機系繊維基材紙、また
は有機系繊維の長繊維束、不織布または織物のプリプレ
グを配置する。On the other hand, in the present invention, an organic fiber base paper, a long fiber bundle of organic fibers, a non-woven fabric or a woven prepreg is disposed in the central layer of the multilayer fiber reinforced resin sheet laminate.
【００１３】有機系繊維としては、セルロース系、アク
リル系、ポリエステル系、ポリビニルアルコール系また
はセルロース系パルプが用いられ、これらは通常の衣
料、紙に用いられるものが使用でき、経済的に有利なも
のである。As the organic fibers, cellulose-based, acrylic-based, polyester-based, polyvinyl alcohol-based or cellulose-based pulp is used, and those used for ordinary clothing and paper can be used, and are economically advantageous. It is.
【００１４】有機系繊維基材紙とは、これらの繊維の短
繊維またはパルプを分散させた紙である。有機系繊維の
長繊維束とは、これらの長繊維を一方向に引き揃えたも
のである。そして、これらの紙、長繊維束、不織布、織
物に熱硬化性樹脂を含浸させたものがプリプレグであ
る。The organic fiber base paper is paper in which short fibers or pulp of these fibers are dispersed. The organic fiber long fiber bundle is obtained by aligning these long fibers in one direction. A prepreg is obtained by impregnating a thermosetting resin into these papers, long fiber bundles, nonwoven fabrics and woven fabrics.
【００１５】熱硬化性樹脂としては、エポキシ樹脂、フ
ェノール樹脂、ポリイミド樹脂等が選ばれ、好ましくは
エポキシ樹脂が選定される。As the thermosetting resin, an epoxy resin, a phenol resin, a polyimide resin, or the like is selected, and preferably, an epoxy resin is selected.
【００１６】キャリアー材の成型方法としては、まず熱
硬化性樹脂を含浸したアラミド繊維、ＰＢＯ繊維、全芳
香族ポリエステル繊維の一種または二種以上から構成さ
れる基材紙からなるシートを最外層用としてあらかじめ
準備する。次にこれとは別に有機系繊維機材紙または長
繊維を一方向に引きそろえた長繊維束または織物のプリ
プレグの一種または二種以上からなる同一樹脂使用のシ
ートを中央層用として準備する。これらを必要な大きさ
のシートに切り出し、離型シートで覆って、所定の枚
数、所定の順序に従って積層プレスに仕込み、定法によ
り加熱・加圧成形する。得られた多層硬化シートを切り
出し、研磨用キャリアー材に加工する。As a method of molding a carrier material, first, a sheet made of a base paper made of one or more of aramid fibers, PBO fibers, and wholly aromatic polyester fibers impregnated with a thermosetting resin is used for the outermost layer. Prepare in advance. Next, separately from this, a sheet made of one or two or more kinds of long fiber bundles or woven prepregs prepared by aligning organic fiber paper or long fibers in one direction is prepared for the central layer. These are cut into sheets of a required size, covered with a release sheet, charged into a laminating press according to a predetermined number of sheets and in a predetermined order, and are subjected to heat and pressure molding by a standard method. The obtained multilayer cured sheet is cut out and processed into a polishing carrier material.
【００１７】[0017]
【実施例】以下、詳細を実施例で述べる 実施例１ 繊維の目付１５０ｇ／ｍ2のポリビニルアルコール繊維
（カット長：５ｍｍ）不織布にエポキシ樹脂を含浸・硬
化せさ、Ｂステージ状態のＰＰシート（Ａ１）を準備し
た。また別に東レ・デュポン（株）製のアラミド繊維
（商品名：ケブラー）の目付７０ｇ／ｍ2の紙（カット
長：３ｍｍ）に同じエポキシ樹脂を含浸、硬化させ、Ｂ
ステージ状態のＰＰシート（Ｂ１）を準備した。Ａ１を
２枚中心にして、上下にＢ１を各１枚配置して、積層し
た。これをホットプレスを使って、１５０℃、２０ｋｇ
ｆ／ｃｍ2の圧力で１時間加熱・加圧硬化し、厚さ０．
７ｍｍ、１ｍ角の積層シート（キャリアー材）を得た。
これを定法により切り出し、４つの直径４０ｃｍの円形
穴が開いた外径９０ｃｍのキャリアーを作成し、平面研
磨機に取り付け半導体ウェハーディスクの研磨試験を行
い、その結果を表１に示した。 実施例２ 見かけ厚さ０．２ｍｍのセルロース系紙にエポキシ樹脂
を含浸・硬化せさ、Ｂステージ状態のＰＰシート（Ａ
２）を準備した。Ａ２を２枚中心にして、上下に実施例
１で得たＢ１を各１枚配置して、積層した。これをホッ
トプレスを使って、１５０℃、２０ｋｇｆ／ｃｍ2の圧
力で１時間加熱・加圧硬化し、厚さ０．７ｍｍ、１ｍ角
の積層シート（キャリアー材）を得た。これを実施例１
と同様の試験に供し、結果を表１に示した。 比較例１ 実施例１で得たＢ１を６枚積層しホットプレスを使っ
て、１５０℃、２０ｋｇｆ／ｃｍ2の圧力で１時間加熱
・加圧硬化し、厚さ０．７ｍｍ、１ｍ角の積層シート
（キャリアー材）を得た。これを実施例１と同様の試験
に供し、結果を表１に示した。The details will be described in the following examples. Example 1 A nonwoven fabric of a polyvinyl alcohol fiber (cut length: 5 mm) having a basis weight of 150 g / m 2 is impregnated with an epoxy resin and cured, and a PP sheet in a B-stage state ( A1) was prepared. Separately, a paper (cut length: 3 mm) with a basis weight of 70 g / m 2 of aramid fiber (trade name: Kevlar) manufactured by Dupont Toray Co., Ltd. is impregnated with the same epoxy resin, cured, and B
A PP sheet (B1) in a stage state was prepared. A1 was placed at the center and two B1s were arranged above and below each other, and laminated. Using a hot press, 150 ℃, 20kg
It is heated and pressurized for 1 hour at a pressure of f / cm 2 , and has a thickness of 0.
A 7 mm, 1 m square laminated sheet (carrier material) was obtained.
This was cut out by a conventional method, a carrier having an outer diameter of 90 cm having four circular holes with a diameter of 40 cm was prepared, mounted on a plane polishing machine and subjected to a polishing test of a semiconductor wafer disk, and the results are shown in Table 1. Example 2 An epoxy resin was impregnated and cured in a cellulosic paper having an apparent thickness of 0.2 mm, and a PP sheet (A
2) was prepared. With two sheets of A2 as the center, one sheet of each of the sheets B1 obtained in Example 1 was arranged above and below and laminated. This was heated and pressurized and cured at 150 ° C. and a pressure of 20 kgf / cm 2 for 1 hour using a hot press to obtain a 0.7 mm thick, 1 m square laminated sheet (carrier material). Example 1
And the results are shown in Table 1. Comparative Example 1 Six layers of B1 obtained in Example 1 were laminated and heated and cured under pressure at 150 ° C. and a pressure of 20 kgf / cm 2 for 1 hour using a hot press, and a 0.7 mm thick, 1 m square laminate was formed. A sheet (carrier material) was obtained. This was subjected to the same test as in Example 1, and the results are shown in Table 1.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【発明の効果】この発明によりそり・ねじれが少なく、
磨耗に強い長寿命でかつ重金属を含まない、安価なディ
スク保持用キャリアー材を得ることができる。According to the present invention, warpage and twist are reduced,
An inexpensive disk holding carrier material having a long life and being resistant to abrasion and containing no heavy metal can be obtained.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小菅 一彦 東京都中央区日本橋本町１丁目５番６号 東レ・デュポン株式会社東京本社内 Ｆターム(参考） 3C058 AA07 AA14 CB05 CB10 DA06 DA17 4F100 AJ04B AJ04C AK01A AK01D AK21B AK21C AK25B AK25C AK33A AK33D AK41B AK41C AK43A AK43D AK47A AK47D AK49A AK49D AK49K AK53A AK53D AK54A AK54D BA02 BA04 BA06 BA10A BA10D DG01B DG01C DG02B DG02C DG03A DG03D DG04B DG04C DG10A DG10B DG10C DG10D DG12B DG12C DG15B DG15C DH01B DH01C DH02A DH02D EJ82A EJ82D GB41 JB13A JB13D JK09 JL02 JL04 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kazuhiko Kosuge 1-5-6 Nihonbashi Honcho, Chuo-ku, Tokyo Toray Dupont Co., Ltd. Tokyo Head Office F-term (reference) 3C058 AA07 AA14 CB05 CB10 DA06 DA17 4F100 AJ04B AJ04C AK01A AK01D AK21B AK21C AK25B AK25C AK33A AK33D AK41B AK41C AK43A AK43D AK47A AK47D AK49A AK49D AK49K AK53A AK53D AK54A AK54D BA02 BA04 BA06 BA10A BA10D DG01B DG01C DG02B DG02C DG03A DG03D DG04B DG04C DG10A DG10B DG10C DG10D DG12B DG12C DG15B DG15C DH01B DH01C DH02A DH02D EJ82A EJ82D GB41 JB13A JB13D JK09 JL02 JL04
Claims (4)
り、該積層体の最外層として、アラミド繊維、ＰＢＯ繊
維または全芳香族ポリエステル繊維からなる短繊維を分
散させた基材紙に熱硬化性樹脂を含浸させた繊維強化樹
脂シートを配置し、中央層として、有機系繊維基材紙、
または有機系繊維の長繊維束、不織布または織物のプリ
プレグを配置したディスク保持用キャリアー材。1. A thermosetting resin composition comprising a laminate of a multi-layer fiber reinforced resin sheet and a base paper in which short fibers made of aramid fiber, PBO fiber or wholly aromatic polyester fiber are dispersed as the outermost layer of the laminate. A fiber-reinforced resin sheet impregnated with resin is arranged, and as a central layer, an organic fiber base paper,
Alternatively, a carrier material for holding a disc in which a long fiber bundle of organic fibers, a non-woven fabric or a woven prepreg is arranged.
請求項１記載のディスク保持用キャリアー材。2. The carrier material according to claim 1, wherein the short fibers have a length of 0.1 to 10 mm.
系、ポリエステル系、ポリビニルアルコール系またはセ
ルロース系パルプである請求項１または２記載のディス
ク保持用キャリアー材。3. The carrier material for holding a disk according to claim 1, wherein the organic fiber is a cellulosic, acrylic, polyester, polyvinyl alcohol or cellulosic pulp.
ル樹脂、ポリイミド樹脂またはビスマレイミド樹脂であ
る請求項１〜３記載のディスク保持用キャリアー材。4. The carrier material for holding a disk according to claim 1, wherein the thermosetting resin is an epoxy resin, a phenol resin, a polyimide resin or a bismaleimide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28363999A JP2001105304A (en) | 1999-10-05 | 1999-10-05 | Disc holding carrier material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28363999A JP2001105304A (en) | 1999-10-05 | 1999-10-05 | Disc holding carrier material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001105304A true JP2001105304A (en) | 2001-04-17 |
Family
ID=17668135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28363999A Pending JP2001105304A (en) | 1999-10-05 | 1999-10-05 | Disc holding carrier material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001105304A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010275505A (en) * | 2009-06-01 | 2010-12-09 | Mitsubishi Rayon Co Ltd | Prepreg and production method thereof |
| JP2012042812A (en) * | 2010-08-20 | 2012-03-01 | Kyoto Univ | Substrate for film optical waveguide, film optical waveguide using the same, and manufacturing method thereof |
| GB2503864A (en) * | 2012-03-08 | 2014-01-15 | Hexcel Composites Ltd | Composite material for automated tape lay-up with fibre reinforced backing paper |
| JP2015080824A (en) * | 2013-10-21 | 2015-04-27 | 利昌工業株式会社 | Carrier material for polishing |
| JP2016087767A (en) * | 2014-11-10 | 2016-05-23 | Ｋｂセーレン株式会社 | Material for holding object to be polished |
| JP2016097462A (en) * | 2014-11-20 | 2016-05-30 | Ｋｂセーレン株式会社 | Material for holding article to be polished |
| CN114829070A (en) * | 2019-10-25 | 2022-07-29 | 马吕斯·克拉森 | Method for manufacturing a carrier plate for a flap wheel, carrier plate and flap wheel comprising said carrier plate |
-
1999
- 1999-10-05 JP JP28363999A patent/JP2001105304A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010275505A (en) * | 2009-06-01 | 2010-12-09 | Mitsubishi Rayon Co Ltd | Prepreg and production method thereof |
| JP2012042812A (en) * | 2010-08-20 | 2012-03-01 | Kyoto Univ | Substrate for film optical waveguide, film optical waveguide using the same, and manufacturing method thereof |
| GB2503864A (en) * | 2012-03-08 | 2014-01-15 | Hexcel Composites Ltd | Composite material for automated tape lay-up with fibre reinforced backing paper |
| GB2503864B (en) * | 2012-03-08 | 2014-09-03 | Hexcel Composites Ltd | Composite material for automated lay-up |
| JP2015080824A (en) * | 2013-10-21 | 2015-04-27 | 利昌工業株式会社 | Carrier material for polishing |
| JP2016087767A (en) * | 2014-11-10 | 2016-05-23 | Ｋｂセーレン株式会社 | Material for holding object to be polished |
| JP2016097462A (en) * | 2014-11-20 | 2016-05-30 | Ｋｂセーレン株式会社 | Material for holding article to be polished |
| CN114829070A (en) * | 2019-10-25 | 2022-07-29 | 马吕斯·克拉森 | Method for manufacturing a carrier plate for a flap wheel, carrier plate and flap wheel comprising said carrier plate |
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