JP2001102894A - Crystal vibrator - Google Patents
Crystal vibratorInfo
- Publication number
- JP2001102894A JP2001102894A JP27545299A JP27545299A JP2001102894A JP 2001102894 A JP2001102894 A JP 2001102894A JP 27545299 A JP27545299 A JP 27545299A JP 27545299 A JP27545299 A JP 27545299A JP 2001102894 A JP2001102894 A JP 2001102894A
- Authority
- JP
- Japan
- Prior art keywords
- metal cover
- welding
- crystal
- seam welding
- buffer band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は表面実装用の水晶振
動子を産業上の技術分野とし、特にシーム溶接によって
封止した水晶振動子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal resonator for surface mounting in the technical technical field, and more particularly to a crystal resonator sealed by seam welding.
【0002】[0002]
【従来の技術】(発明の背景)水晶振動子は共振特性に
優れることから、各種の電子機器に周波数及び時間の基
準源として広く使用されている。近年では、軽薄短小の
もと表面実装型が主流をなし、これらの一つに信頼性の
高いシーム溶接とした封止手段がある。2. Description of the Related Art A quartz resonator is widely used as a frequency and time reference source in various electronic devices because of its excellent resonance characteristics. In recent years, the surface mount type has become the mainstream under the lightness, shortness and small size, and one of these is a highly reliable seam welding sealing means.
【0003】(従来技術の一例)第4図は一従来例を説
明する水晶振動子の断面図である。水晶振動子は、凹状
としたセラミック容器1内に水晶片2を収容し、開口面
を金属カバー3のシーム溶接によって封止する。セラミ
ック容器1は底壁1aと枠壁1bの2層構造として、開
口面には溶接用の金属リング4が銀と銅の合金鑞によっ
て設けられる。金属カバー3及び金属リング4はコバー
ルからなり、それぞれ接合面にニッケル及び金メッキを
有する(未図示)。シーム溶接は、金属カバー3の両辺
をローラを回転させて電流を供給し、当接部にジュール
熱を発生させて特にニッケルメッキを溶融して、いわば
抵抗溶接によって接合する。なお、図中の符号5は導電
性接着剤である。(Example of Prior Art) FIG. 4 is a cross-sectional view of a quartz oscillator for explaining a conventional example. The crystal unit accommodates a crystal blank 2 in a concave ceramic container 1 and seals an opening surface of the metal cover 3 by seam welding. The ceramic container 1 has a two-layer structure of a bottom wall 1a and a frame wall 1b, and a metal ring 4 for welding is provided on an opening surface by an alloy solder of silver and copper. The metal cover 3 and the metal ring 4 are made of Kovar, and have nickel and gold plating on their joint surfaces (not shown). In seam welding, current is supplied by rotating rollers on both sides of the metal cover 3 to generate Joule heat in the abutting portion, particularly melting nickel plating, and joining by so-called resistance welding. Reference numeral 5 in the drawing is a conductive adhesive.
【0004】[0004]
【発明が解決しようとする課題】(従来技術の問題点)
しかしながら、上記構成の水晶振動子では、シーム溶接
時に発生する熱によって次の問題があった。すなわち、
シーム溶接によって発生する熱によって金属カバー3が
伸張し、溶接後の温度低下とともに収縮する。そして、
金属カバー3とセラミック容器1とは膨張係数が異な
る。したがって、シーム溶接時における金属カバー3の
伸縮時にセラミック容器1に応力が発生し、特に底壁1
a枠壁1bの境界部(矢印P)に欠けやひびを生ずる問
題があった。また、応力によって底壁に撓みを生じて水
晶片2に歪みを与え、振動特性を低下させるおそれもあ
った。特に、小型化が促進され厚みが小さくなるほどそ
の影響は大きくなる。[Problems to be Solved by the Invention]
However, the crystal resonator having the above configuration has the following problem due to heat generated during seam welding. That is,
The metal cover 3 expands due to the heat generated by seam welding, and contracts as the temperature decreases after welding. And
The metal cover 3 and the ceramic container 1 have different expansion coefficients. Therefore, stress is generated in the ceramic container 1 when the metal cover 3 expands and contracts during seam welding, and particularly, the bottom wall 1
There was a problem that the boundary (arrow P) of the frame wall 1b was chipped or cracked. In addition, there is a possibility that the bottom wall is bent by the stress to give a distortion to the crystal blank 2 to deteriorate the vibration characteristics. In particular, the effect is greater as the size is promoted and the thickness is reduced.
【0005】(発明の目的)本発明はシーム溶接時のセ
ラミック容器の欠けや振動特性の低下を防止した水晶振
動子を提供することを目的とする。(Object of the Invention) It is an object of the present invention to provide a crystal resonator in which chipping of a ceramic container during seam welding and deterioration of vibration characteristics are prevented.
【0006】[0006]
【課題を解決するための手段】本発明は、シーム溶接時
の熱による伸縮を防止する緩衝帯6を金属カバー3に設
けたことを基本的な解決手段とする。The basic solution of the present invention is to provide a buffer band 6 on the metal cover 3 for preventing expansion and contraction due to heat during seam welding.
【0007】[0007]
【作用】本発明では、金属カバー3に緩衝帯6を設けた
ので溶接時の熱による伸縮を吸収してセラミック容器1
への影響を小さくする。以下、本発明の一実施例を説明
する。According to the present invention, the buffer band 6 is provided on the metal cover 3 so that expansion and contraction due to heat during welding can be absorbed and the ceramic container 1 can be used.
To reduce the impact on Hereinafter, an embodiment of the present invention will be described.
【0008】[0008]
【実施例】第1図及び第2図は本発明の一実施例を説明
する図で、第1図は水晶振動子の断面図、第2図は金属
カバーの平面図である。なお、前従来例図と同一部分に
は同番号を付与してその説明は簡略又は省略する。水晶
振動子は、前述同様に凹状としたセラミック容器1内に
水晶片2を収容し、開口面を金属カバー3のシーム溶接
によって封止する。そして、金属カバー3はシーム溶接
時の熱による伸縮を防止する緩衝帯6を有する。この例
では、緩衝帯6は金属カバー3の外周を周回して、外表
面では溝を内表面では突起となる突起溝とする。但し、
突起溝はセラミック容器1の内部に位置し、例えばプレ
ス加工により形成される。1 and 2 are views for explaining an embodiment of the present invention. FIG. 1 is a cross-sectional view of a quartz oscillator, and FIG. 2 is a plan view of a metal cover. The same parts as those in the prior art are denoted by the same reference numerals, and description thereof will be simplified or omitted. The crystal unit accommodates a crystal blank 2 in a ceramic container 1 having a concave shape as described above, and seals an opening surface of the metal cover 3 by seam welding. The metal cover 3 has a buffer band 6 for preventing expansion and contraction due to heat during seam welding. In this example, the buffer band 6 goes around the outer periphery of the metal cover 3, and has a groove on the outer surface and a projection groove on the inner surface. However,
The protrusion groove is located inside the ceramic container 1 and is formed by, for example, press working.
【0009】このような構成であれば、シーム溶接時に
おける金属カバー3の膨張及び収縮は、突起溝の伸縮に
よって吸収される。したがって、容器本体に生ずる応力
を軽減して、特に底面と側面の境界部での欠けやひびを
防止する。また、底面の撓みを防止して振動特性を良好
に維持する。なお、金属リング4も同様にシーム溶接時
に枠方向に伸縮するが中空状なので、金属カバー3によ
る伸縮の影響が大きい。With such a configuration, expansion and contraction of the metal cover 3 during seam welding are absorbed by expansion and contraction of the projection groove. Therefore, the stress generated in the container body is reduced, and chipping or cracking is particularly prevented at the boundary between the bottom surface and the side surface. Also, the vibration characteristics are maintained satisfactorily by preventing bending of the bottom surface. The metal ring 4 also expands and contracts in the frame direction at the time of seam welding, but is hollow, so that the influence of expansion and contraction by the metal cover 3 is large.
【0010】なお、この例での緩衝帯6は金属カバー3
の外周に設けたので、シーム溶接時のセラミック容器1
に対する位置決めもでき、位置ズレによる封止漏れをも
防止することができる。Note that the buffer band 6 in this example is a metal cover 3
Of the ceramic container 1 during seam welding
And sealing leakage due to misalignment can be prevented.
【0011】上記実施例では、緩衝帯6は外表面に溝を
内表面を突起としたが、外表面に突起して内表面を溝と
した突起溝でもよく、一主面に溝を他主面を突起とした
突起溝であればよい(未図示)。また、突起溝は外周を
周回するとしたが、例えば外周4辺にのみ設けても(未
図示)、あるいは第3図に示したように中央に十字状に
形成してもよい。さらには、斜め方向や一方向のみに設
けてもよい。In the above embodiment, the buffer band 6 has a groove on the outer surface and a protrusion on the inner surface. However, a protrusion groove on the outer surface and a groove on the inner surface may be used. Any projection groove having a surface as a projection may be used (not shown). In addition, although the projection groove circumscribes the outer periphery, for example, it may be provided only on four sides of the outer periphery (not shown), or may be formed in a cross shape at the center as shown in FIG. Further, it may be provided only in an oblique direction or one direction.
【0012】また、緩衝帯6は突起溝としたが、例えば
エッチングにより厚みを小さくしてもその効果は期待で
き、要は伸縮を吸収する緩衝帯6を形成すればよい。ま
た、溶接はシーム溶接としたが、例えば電子ビームを照
射して接合する場合でも同様に熱を発生するので適用で
きる。Although the buffer band 6 is formed as a projection groove, the effect can be expected even if the thickness is reduced by, for example, etching. In short, the buffer band 6 that absorbs expansion and contraction may be formed. In addition, although the seam welding is used for welding, for example, when welding is performed by irradiating an electron beam, heat is similarly generated, so that the present invention can be applied.
【0013】また、上記実施例ではセラミック容器1に
水晶片2のみを収容した水晶振動子について例示した
が、例えばICチップを収容して水晶発振器等としたも
のについても適用でき、本発明はこれらを技術的範囲か
ら排除するものではない。In the above-described embodiment, the crystal resonator in which only the crystal piece 2 is accommodated in the ceramic container 1 has been exemplified. However, the present invention can also be applied to a crystal oscillator in which an IC chip is accommodated. Is not excluded from the technical scope.
【0014】[0014]
【発明の効果】本発明は、シーム溶接時の熱による伸縮
を防止する緩衝帯6を金属カバー3に設けたので、セラ
ミック容器1の欠けやひび及び振動特性の低下を防止し
た水晶振動子を提供できる。According to the present invention, since the buffer band 6 for preventing expansion and contraction due to heat at the time of seam welding is provided on the metal cover 3, a crystal resonator in which chipping and cracking of the ceramic container 1 and deterioration of vibration characteristics are prevented is prevented. Can be provided.
【図面の簡単な説明】[Brief description of the drawings]
【図1】本発明の一実施例を説明する水晶振動子の断面
図である。FIG. 1 is a cross-sectional view of a crystal unit illustrating one embodiment of the present invention.
【図2】本発明の一実施例を説明する金属カバーの平面
図である。FIG. 2 is a plan view of a metal cover illustrating one embodiment of the present invention.
【図3】本発明の他の実施例を説明する金属カバーの平
面図である。FIG. 3 is a plan view of a metal cover for explaining another embodiment of the present invention.
【図4】従来例を説明する水晶振動子の断面図である。FIG. 4 is a cross-sectional view of a crystal unit illustrating a conventional example.
1 セラミック容器、2 水晶片、3 金属カバー、4
金属リング、5 導電性接着剤、6 緩衝帯.1 ceramic container, 2 crystal pieces, 3 metal cover, 4
Metal ring, 5 conductive adhesive, 6 buffer band.
Claims (3)
バーを溶接してなる水晶振動子において、溶接時の熱に
よる伸縮を防止する緩衝帯を前記金属カバーに設けたこ
とを特徴とする水晶振動子。1. A crystal resonator in which a quartz piece is housed in a concave container body and a metal cover is welded, wherein a buffer band for preventing expansion and contraction due to heat during welding is provided on the metal cover. Crystal oscillator.
晶振動子。2. The crystal unit according to claim 1, wherein said welding is seam welding.
一主面では溝を他主面では突起となる突起溝である請求
項1の水晶振動子。3. The crystal unit according to claim 1, wherein said buffer band is a projection groove which goes around the outer periphery of the metal cover and has a groove on one main surface and a protrusion on another main surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27545299A JP2001102894A (en) | 1999-09-29 | 1999-09-29 | Crystal vibrator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27545299A JP2001102894A (en) | 1999-09-29 | 1999-09-29 | Crystal vibrator |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001102894A true JP2001102894A (en) | 2001-04-13 |
Family
ID=17555733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27545299A Pending JP2001102894A (en) | 1999-09-29 | 1999-09-29 | Crystal vibrator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001102894A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009135599A (en) * | 2007-11-28 | 2009-06-18 | Nippon Dempa Kogyo Co Ltd | Crystal device for surface mounting |
JP2011139223A (en) * | 2009-12-28 | 2011-07-14 | Kyocera Kinseki Corp | Cover member, method for manufacturing cover member wafer and method for manufacturing cover member |
-
1999
- 1999-09-29 JP JP27545299A patent/JP2001102894A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009135599A (en) * | 2007-11-28 | 2009-06-18 | Nippon Dempa Kogyo Co Ltd | Crystal device for surface mounting |
JP2011139223A (en) * | 2009-12-28 | 2011-07-14 | Kyocera Kinseki Corp | Cover member, method for manufacturing cover member wafer and method for manufacturing cover member |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2003318690A (en) | Quartz resonator for surface mounting | |
JP2007013628A (en) | Manufacturing method of piezoelectric vibrator and piezoelectric vibrator | |
JP4905859B2 (en) | Piezoelectric device and method for manufacturing piezoelectric device | |
JP2004229255A (en) | Crystal oscillator ceramic package | |
JP2007189282A (en) | Piezoelectric device and manufacturing method thereof | |
JP2001102894A (en) | Crystal vibrator | |
JPH11354660A (en) | Package for electronic part and hermetic sealing method therefor | |
JP4460051B2 (en) | Quartz crystal holding structure | |
JP5171228B2 (en) | Crystal device for surface mounting | |
JP4893578B2 (en) | Electronic component sealing method | |
JP2005051513A (en) | Crystal resonator | |
JP3837265B2 (en) | Crystal oscillator | |
JP2002084159A (en) | Surface-mounted piezoelectric vibrator | |
JP2008167237A (en) | Crystal device | |
JPH11274881A (en) | Crystal resonator and its manufacture | |
JP2009105747A (en) | Crystal device for surface mounting | |
JP2013243232A (en) | Metal frame for ceramic package and ceramic package | |
JP2013140876A (en) | Manufacturing method of electronic device, electronic device, piezoelectric oscillator, and electronic apparatus | |
JP4363990B2 (en) | Surface mount crystal unit | |
JP2006324797A (en) | Crystal device for surface mounting | |
JPH0590870A (en) | Crystal oscillator | |
JP2001217666A (en) | Method for manufacturing crystal vibrator | |
JP2004153100A (en) | Sheet lid | |
JP6382626B2 (en) | Piezoelectric vibrating piece and piezoelectric device | |
JPH09246415A (en) | Package for electronic part |