JP2001094023A - 電子デバイス用冷却装置 - Google Patents

電子デバイス用冷却装置

Info

Publication number
JP2001094023A
JP2001094023A JP2000247419A JP2000247419A JP2001094023A JP 2001094023 A JP2001094023 A JP 2001094023A JP 2000247419 A JP2000247419 A JP 2000247419A JP 2000247419 A JP2000247419 A JP 2000247419A JP 2001094023 A JP2001094023 A JP 2001094023A
Authority
JP
Japan
Prior art keywords
wall
heat
chamber
cooling
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000247419A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001094023A5 (enExample
Inventor
R Wagner Guy
ガイ・アール・ワーグナー
D Patel Chandorakanto
チャンドラカント・ディー・パテル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2001094023A publication Critical patent/JP2001094023A/ja
Publication of JP2001094023A5 publication Critical patent/JP2001094023A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2000247419A 1999-08-18 2000-08-17 電子デバイス用冷却装置 Withdrawn JP2001094023A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/376627 1999-08-18
US09/376,627 US20010050164A1 (en) 1999-08-18 1999-08-18 Cooling apparatus for electronic devices

Publications (2)

Publication Number Publication Date
JP2001094023A true JP2001094023A (ja) 2001-04-06
JP2001094023A5 JP2001094023A5 (enExample) 2007-09-27

Family

ID=23485796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000247419A Withdrawn JP2001094023A (ja) 1999-08-18 2000-08-17 電子デバイス用冷却装置

Country Status (2)

Country Link
US (2) US20010050164A1 (enExample)
JP (1) JP2001094023A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010058520A1 (ja) * 2008-11-18 2010-05-27 日本電気株式会社 沸騰冷却装置
CN109903907A (zh) * 2019-02-26 2019-06-18 广州粤道智能科技发展有限公司 一种高效散热的安全电缆

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CN1195196C (zh) * 2002-01-10 2005-03-30 杨洪武 集成式热管及其换热方法
US6857283B2 (en) 2002-09-13 2005-02-22 Isothermal Systems Research, Inc. Semiconductor burn-in thermal management system
US6880350B2 (en) * 2002-09-13 2005-04-19 Isothermal Systems Research, Inc. Dynamic spray system
US7424907B2 (en) * 2002-10-01 2008-09-16 Enertron, Inc. Methods and apparatus for an integrated fan pump cooling module
US6889515B2 (en) * 2002-11-12 2005-05-10 Isothermal Systems Research, Inc. Spray cooling system
DE50202798D1 (de) * 2002-12-20 2005-05-19 Innowert Service Ct In Ges Fue Kühlvorrichtung für eine elektrische und/oder elektronische Einheit
TW568299U (en) * 2003-04-01 2003-12-21 Delta Electronics Inc Heat dissipation module
TW566822U (en) * 2003-04-01 2003-12-11 Datech Technology Co Ltd Heat sink assembly for facilitating air flow
TW577683U (en) * 2003-06-02 2004-02-21 Jiun-Guang Luo Heat sink
TWI229583B (en) * 2003-08-03 2005-03-11 Hon Hai Prec Ind Co Ltd Liquid-cooled heat sink device
US7063130B2 (en) * 2003-08-08 2006-06-20 Chu-Tsai Huang Circular heat sink assembly
US6789610B1 (en) * 2003-08-28 2004-09-14 Hewlett-Packard Development Company, L.P. High performance cooling device with vapor chamber
US20050161196A1 (en) * 2004-01-22 2005-07-28 Hsieh Hsin-Mao Heat radiator for a CPU
DE102004009500B3 (de) * 2004-02-27 2005-08-25 Minebea Co., Ltd. Kühleinrichtung zur Kühlung elektronischer Komponenten
US6967841B1 (en) 2004-05-07 2005-11-22 International Business Machines Corporation Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover
CN2705893Y (zh) * 2004-05-26 2005-06-22 鸿富锦精密工业（深圳）有限公司 相变化散热器
TW200608179A (en) * 2004-08-18 2006-03-01 Delta Electronics Inc Heat dissipation apparatus
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US20060054311A1 (en) * 2004-09-15 2006-03-16 Andrew Douglas Delano Heat sink device with independent parts
US7677052B2 (en) * 2005-03-28 2010-03-16 Intel Corporation Systems for improved passive liquid cooling
US20060256523A1 (en) * 2005-05-11 2006-11-16 Belady Christian L Fan and heat sink combination
US7424906B2 (en) * 2006-04-19 2008-09-16 Delphi Technologies, Inc. High performance thermosiphon with internally enhanced condensation
US20070246195A1 (en) * 2006-04-19 2007-10-25 Bhatti Mohinder S Orientation insensitive thermosiphon with squirrel cage configuration
US7406999B2 (en) * 2006-04-27 2008-08-05 Delphi Technologies, Inc. Capillary-assisted compact thermosiphon
US7520317B2 (en) * 2006-05-16 2009-04-21 Delphi Technologies, Inc Orientation insensitive compact thermosiphon with a remote auxiliary condenser
US20070279862A1 (en) * 2006-06-06 2007-12-06 Jia-Hao Li Heat-Dissipating Structure For Lamp
US7475718B2 (en) * 2006-11-15 2009-01-13 Delphi Technologies, Inc. Orientation insensitive multi chamber thermosiphon
TWI325046B (en) * 2006-12-01 2010-05-21 Delta Electronics Inc Heat dissipation module and flat heat column and heat dissipation apparatus thereof
US20100132924A1 (en) * 2007-04-27 2010-06-03 National University Of Singapore Cooling device for electronic components
US8240871B2 (en) * 2007-09-27 2012-08-14 Enertron, Inc. Method and apparatus for thermally effective removable trim for light fixture
CN101573018B (zh) * 2008-04-28 2012-03-21 富准精密工业(深圳)有限公司 散热装置
CN101600320B (zh) * 2008-06-04 2012-06-13 富准精密工业(深圳)有限公司 散热装置
TWM353311U (en) * 2008-10-07 2009-03-21 Shi-Ming Chen Improved heat dissipator
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
CN102956582A (zh) * 2011-08-29 2013-03-06 富准精密工业(深圳)有限公司 散热装置
US20150219401A1 (en) * 2012-01-18 2015-08-06 Shanghai Dazhi Heat Dissipation Technology Co., Ltd. Heat-wing
US20230020152A1 (en) * 2014-07-18 2023-01-19 Yue Zhang Plate vapor chamber array assembly
US11448469B2 (en) * 2014-07-18 2022-09-20 Yue Zhang Heat-wing
US10749308B2 (en) 2016-10-17 2020-08-18 Waymo Llc Thermal rotary link
CN109302826B (zh) * 2017-07-25 2020-09-04 国基电子（上海）有限公司 散热风扇及应用该散热风扇的电子装置
US20200232714A1 (en) * 2019-01-23 2020-07-23 Taiwan Microloops Corp. Heat dissipating device
US10985085B2 (en) * 2019-05-15 2021-04-20 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method for manufacturing the same
CN113012855A (zh) * 2021-03-09 2021-06-22 安徽渡江电缆集团有限公司 一种新型耐高温防火焰的阻燃型控制电缆

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US4012770A (en) * 1972-09-28 1977-03-15 Dynatherm Corporation Cooling a heat-producing electrical or electronic component
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
JP3451737B2 (ja) * 1994-09-06 2003-09-29 株式会社デンソー 沸騰冷却装置
US5526875A (en) * 1994-10-14 1996-06-18 Lin; Shih-Jen Cooling device for CPU
JPH09210582A (ja) * 1995-12-01 1997-08-12 Fujikura Ltd ヒートパイプ
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
JP3768598B2 (ja) * 1996-05-31 2006-04-19 山洋電気株式会社 発熱体冷却装置
DE19805930A1 (de) * 1997-02-13 1998-08-20 Furukawa Electric Co Ltd Kühlvorrichtung
US6085830A (en) * 1997-03-24 2000-07-11 Fujikura Ltd. Heat sink, and process and apparatus for manufacturing the same
US6109340A (en) * 1997-04-30 2000-08-29 Nidec Corporation Heat sink fan
JPH1183355A (ja) * 1997-09-02 1999-03-26 Furukawa Electric Co Ltd:The ファン付きヒートシンク

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010058520A1 (ja) * 2008-11-18 2010-05-27 日本電気株式会社 沸騰冷却装置
JP5678662B2 (ja) * 2008-11-18 2015-03-04 日本電気株式会社 沸騰冷却装置
US9297589B2 (en) 2008-11-18 2016-03-29 Nec Corporation Boiling heat transfer device
CN109903907A (zh) * 2019-02-26 2019-06-18 广州粤道智能科技发展有限公司 一种高效散热的安全电缆

Also Published As

Publication number Publication date
US20010050164A1 (en) 2001-12-13
US20020185263A1 (en) 2002-12-12
US6986384B2 (en) 2006-01-17

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