JP2001093754A - 表面実装回路組立体 - Google Patents
表面実装回路組立体Info
- Publication number
- JP2001093754A JP2001093754A JP2000248692A JP2000248692A JP2001093754A JP 2001093754 A JP2001093754 A JP 2001093754A JP 2000248692 A JP2000248692 A JP 2000248692A JP 2000248692 A JP2000248692 A JP 2000248692A JP 2001093754 A JP2001093754 A JP 2001093754A
- Authority
- JP
- Japan
- Prior art keywords
- core
- assembly
- support
- support rail
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/378,138 US6335671B1 (en) | 1999-08-20 | 1999-08-20 | Surface mount circuit assembly |
| US09/378138 | 1999-08-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001093754A true JP2001093754A (ja) | 2001-04-06 |
| JP2001093754A5 JP2001093754A5 (https=) | 2007-10-11 |
Family
ID=23491894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000248692A Withdrawn JP2001093754A (ja) | 1999-08-20 | 2000-08-18 | 表面実装回路組立体 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6335671B1 (https=) |
| EP (1) | EP1079673A3 (https=) |
| JP (1) | JP2001093754A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008205210A (ja) * | 2007-02-20 | 2008-09-04 | Densei Lambda Kk | トランス |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7129809B2 (en) * | 2004-10-14 | 2006-10-31 | Alexander Estrov | Surface mount magnetic component assembly |
| US7460002B2 (en) * | 2005-06-09 | 2008-12-02 | Alexander Estrov | Terminal system for planar magnetics assembly |
| TWI512770B (zh) * | 2007-09-29 | 2015-12-11 | Delta Electronics Inc | 功率變換器結構 |
| US9378885B2 (en) * | 2012-03-27 | 2016-06-28 | Pulse Electronics, Inc. | Flat coil windings, and inductive devices and electronics assemblies that utilize flat coil windings |
| US8988890B2 (en) * | 2012-08-29 | 2015-03-24 | Apple Inc. | Component mounting structures with breakaway support tabs |
| US20140340186A1 (en) * | 2013-04-10 | 2014-11-20 | Pulse Electronics, Inc. | Interleaved planar inductive device and methods of manufacture and use |
| US9901265B2 (en) | 2014-11-07 | 2018-02-27 | Welch Allyn, Inc. | Medical device |
| US11670448B2 (en) | 2018-05-07 | 2023-06-06 | Astronics Advanced Electronic Systems Corp. | System of termination of high power transformers for reduced AC termination loss at high frequency |
| FR3109837B1 (fr) | 2020-05-04 | 2023-12-22 | Mbda France | Transformateur planaire équipé de composants, carte mère comprenant un tel transformateur planaire et procédé d’assemblage d’une telle carte mère. |
| WO2021257359A1 (en) | 2020-06-19 | 2021-12-23 | Murata Manufacturing Co., Ltd. | Transformer module with ui core |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06151179A (ja) * | 1992-11-02 | 1994-05-31 | Murata Mfg Co Ltd | コイル |
| US5345670A (en) * | 1992-12-11 | 1994-09-13 | At&T Bell Laboratories | Method of making a surface-mount power magnetic device |
| EP0689214B1 (en) * | 1994-06-21 | 1999-09-22 | Sumitomo Special Metals Co., Ltd. | Process of producing a multi-layered printed-coil substrate |
| US6081180A (en) * | 1998-09-22 | 2000-06-27 | Power Trends, Inc. | Toroid coil holder with removable top |
-
1999
- 1999-08-20 US US09/378,138 patent/US6335671B1/en not_active Expired - Fee Related
-
2000
- 2000-08-07 EP EP00306698A patent/EP1079673A3/en not_active Withdrawn
- 2000-08-18 JP JP2000248692A patent/JP2001093754A/ja not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008205210A (ja) * | 2007-02-20 | 2008-09-04 | Densei Lambda Kk | トランス |
Also Published As
| Publication number | Publication date |
|---|---|
| US6335671B1 (en) | 2002-01-01 |
| EP1079673A3 (en) | 2002-03-13 |
| EP1079673A2 (en) | 2001-02-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070820 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070820 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070822 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070926 |