JP2001093109A - Magnetic head and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably provide the track shape of a narrow width coping with further recording density improvement and to improve the production efficiency and yield of a magnetic head. SOLUTION: Joined surfaces 2a and 3a are trimmed corresponding to the resist film 32 of a prescribed pattern formed on the joined surfaces 2a and 3a and a notched recessed part 19 is formed on a metal magnetic thin film 5. Thereafter, an insulation oxide 35 is sputtered on the joined surfaces 2a and 3a, the insulation oxide 35 is filled at least inside the notched recessed part 19 and mirror finishing is executed to the joined surfaces 2a and 3a where the insulation oxide 35 is sputtered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a magnetic head having a magnetic path formed by a metal magnetic thin film and a method of manufacturing the same.

[0002]

2. Description of the Related Art A magnetic head is mounted on a magnetic recording / reproducing apparatus and records and / or reproduces information signals on a magnetic recording medium (hereinafter referred to as recording / reproducing).
As such a magnetic recording / reproducing device, for example, a video tape recorder (VTR: VideoTape Recorder) or a DAT
(Digital Audio Tape) Some recorders and the like perform recording and reproduction by a so-called helical scan system in which a magnetic head is provided on a drum rotating at high speed and a tape-shaped magnetic recording medium slides on the drum. . Also, a hard disk drive (HDD: Hard Disk Drive) that performs recording / reproduction with a magnetic head on a disk-shaped magnetic recording medium such as a magnetic disk or a magneto-optical disk.
k Drive) and floppy disk drive (FDD: Floppy)
Disk Drive).

[0003] The magnetic head is generally constructed by winding a coil around a magnetic core formed of a magnetic material having high magnetic permeability. Such a magnetic head is called an electromagnetic induction type (inductive type) magnetic head because it performs recording and reproduction on a magnetic recording medium using electromagnetic induction between a magnetic core and a coil.

In a magnetic head, a magnetic core functions as a path for transmitting magnetic flux, such as from a coil to a magnetic recording medium during recording and from a magnetic recording medium to a coil during reproduction. In the magnetic core, a minute gap, that is, a magnetic gap is formed in a portion facing the magnetic recording medium. The magnetic head records a magnetic signal on the magnetic recording medium by applying a leakage magnetic field generated in the magnetic gap to the magnetic recording medium.
Further, at the time of reproduction, the magnetic head takes in the magnetic field of the magnetic signal recorded on the magnetic recording medium into the magnetic core through the magnetic gap, and detects the magnetic field with the coil.

In recent years, in the field of magnetic recording, the recording density of magnetic signals has been increased in order to reduce the size and capacity of magnetic recording media and to increase the quality of recorded video signals, for example. Therefore, it is required to accurately record and reproduce fine magnetic signals. Therefore, for example, a metal tape in which a ferromagnetic metal powder as a magnetic powder used for a magnetic layer for recording a magnetic signal is made into a paint and applied on a base film, or a vapor deposition tape in which a ferromagnetic metal material is directly vapor-deposited on the base film Magnetic recording media exhibiting high coercive force, such as, for example, have been widely used.

In order to enable recording and reproduction on a magnetic recording medium exhibiting a high coercive force, for example,
A metal-in-gap (MIG) having a magnetic layer formed of a metal magnetic material having a high magnetic permeability and a high saturation magnetic flux density such as an Fe-based alloy, an Fe-Ni-based alloy, and an Fe-Co-based alloy ) Type magnetic heads, laminated magnetic heads and the like have been put to practical use.

In the MIG type magnetic head, magnetic core halves formed by forming a metal magnetic thin film on a magnetic gap forming surface made of a Mn-Zn ferrite single crystal material are joined to each other and joined together by glass welding or the like. Magnetic head. Also, in the laminated magnetic head, the magnetic core halves sandwiching the magnetic layer between a pair of non-magnetic substrates are abutted against each other with the end faces of the magnetic layer facing each other, and a magnetic gap is formed at the interface where these magnetic layers abut. Are formed on the magnetic head.

In the magnetic head as described above, in order to cope with higher image quality and digitalization in the future,
While showing good electromagnetic conversion characteristics in higher frequency bands,
There is a demand for a plurality of, for example, a plurality of small drums to support a recording and reproducing method such as a so-called helical scan method.

However, the MIG type magnetic head has a large impedance and is not suitable for use in a high frequency band. Further, in the case of a laminated magnetic head, it is necessary to reduce the thickness of a metal magnetic thin film that forms a magnetic path in accordance with a decrease in track width due to high-density recording. There are some limits to the conversion.

To solve such a problem of the conventional magnetic head, a magnetic head exhibiting good electromagnetic conversion characteristics in a high-frequency band is disclosed in, for example, Japanese Patent Application Laid-Open No. 6-259717.
As described in Japanese Patent Laid-Open Publication No. H07-207, "Magnetic head and its manufacturing method", a magnetic head (hereinafter, referred to as a bulk thin film head) whose impedance is reduced by reducing a magnetic path formed by a metal magnetic thin film is described. Proposed.

In the bulk thin film head, a pair of magnetic core halves each having a metal magnetic thin film formed on a nonmagnetic substrate are formed by integrating these metal magnetic thin films via a nonmagnetic film. In the bulk thin film head, the metal magnetic thin film integrated as described above constitutes a magnetic core,
A magnetic gap is formed by the non-magnetic film interposed between the metal magnetic thin films. In the bulk thin film head, a coil forming recess is formed on a joint surface of at least one of the pair of magnetic core halves, and a thin film coil is formed in the coil forming recess.

In such a bulk thin film head,
In order to cope with a further increase in recording density, the track width is formed to be narrow with high precision. The narrowing of the track width is illustrated in FIG. 22 so that the effective track width is formed on the metal magnetic thin film 51 on the front gap side formed on the bonding surface 50a of the magnetic core half 50 described above. The resist film to be omitted is patterned, and then trimmed by ion etching or the like from above the resist film to form notched concave portions 52 at both ends in the track width direction of the metal magnetic thin film 51, thereby forming a narrow track. Form. At this time, the notch recess 52 is
In order to prevent the magnetic recording medium sliding on the sliding surface from being damaged by the edge of the insulating oxide 53, the insulating oxide 53 is filled. The insulating oxide 53 is once sputtered on the entire surface of the bonding surface 50a, and then polished by a polisher for roughly cutting the excess, specifically the portion other than the notched concave portion 53, until the substrate surface is exposed. Then, after polishing by a polishing machine, mirror finishing is performed as a finish, and polishing is performed to about 1 μm to flatten the substrate surface. The reason why the mirror polishing is performed after the polishing by the polishing machine is that if the polishing of the insulating oxide is performed only by the mirror polishing, there is a problem that the ground insulating oxide adheres to the grinding platen and damages the substrate.

[0013]

However, as described above, when the polishing of the insulating oxide 53 is performed in two stages, i.e., rough polishing by a polishing machine and polishing by mirror polishing, the metal magnetic thin film 51 is joined together with the bonding surface 50a. Is also polished by several μm. For this reason, when the etching shape of the metal magnetic thin film 51 changes due to the patterning condition and the etching condition when the metal magnetic thin film 51 is trimmed to form a narrow track, the change in the etching shape causes the variation in the track width. May appear. This variation appears remarkably as a variation in track width when the etched side surface 51a of the metal magnetic thin film 51 is not etched so as to be perpendicular to the bonding surface 50a. For example, as shown in FIG. 22, when the side surface 51a of the metal magnetic thin film 51 is formed at an angle θ = 65 ° to 80 ° with respect to the bonding surface 50a, the metal magnetic thin film is polished simultaneously with the polishing of the bonding surface 50a. When 51 is polished by x μm, 4 μm ± 0.1.
A variation in track width of about 4 μm will occur.

In addition, when the track width is reduced as described above, the insulating oxide is sputtered on the entire surface of the bonding surface, so that a large amount of excess insulating oxide is also formed, and the bonding surface is flattened. The polishing time for polishing is long, specifically, it takes about 60 minutes. Conventionally, due to this long polishing time,
Another problem is that the production efficiency of the magnetic head is reduced.

Further, when only one of the rough cutting using a polishing machine and the polishing by mirror polishing is performed when polishing the joint surface, the surface roughness of the joint surface after polishing becomes rough, and the magnetic core There is a problem that a bonding failure occurs at the time of metal diffusion bonding between the halves and the yield of the magnetic head is reduced.

Accordingly, an object of the present invention is to provide a magnetic head which can stably obtain a narrow track shape corresponding to a further increase in recording density, improve production efficiency and yield, and a method of manufacturing the same. I do.

[0017]

A magnetic head according to the present invention having the above-mentioned object has a pair of magnetic cores in which a metal magnetic thin film having a front butting surface and a rear butting surface is formed obliquely on a substrate. The front surface of the metal magnetic thin film is provided so that the front butting surfaces of the metal magnetic thin films are opposed to each other via the non-magnetic thin film to form a magnetic gap, and the surface of the butting surface of the magnetic core half where the non-magnetic thin film is formed The roughness is formed to be 2.0 nm or less.

According to the magnetic head of the present invention having the above-described structure, the surface roughness of the butting surface of the magnetic core half is 2.
By being formed to a thickness of 0 nm or less, bonding defects when bonding a pair of magnetic core halves by metal diffusion bonding are reduced, and the yield is improved.

A method of manufacturing a magnetic head according to the present invention, which achieves the above-mentioned object, comprises: a step of patterning a resist film for obtaining a predetermined track width on an abutting surface; A step of trimming the butted surfaces of the halves to form notch recesses on at least one end in the track width direction of the metal magnetic thin film, and a step of sputtering insulating oxide to fill at least the notch recesses, Subjecting the butted surfaces to mirror finishing.

In the above-described method for manufacturing a magnetic head according to the present invention, at least the notch recess formed in the abutting surface is filled with an insulating oxide by trimming, and the abutting surface is polished. Therefore, according to the method of manufacturing a magnetic head according to the present invention, the flattened surface is satisfactorily flattened only by mirror finishing without performing rough cutting by a polishing machine, and the butted surface is polished to a predetermined surface roughness. The time is shortened, the production efficiency of the magnetic head is improved, and a narrow track shape can be stably obtained.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of a magnetic head and a method of manufacturing the same according to the present invention will be described below in detail with reference to the drawings. FIG. 1 according to the present embodiment
The magnetic head 1 shown in FIG. 1 has a magnetic core formed of a metal magnetic thin film in order to reduce the magnetic path, and a thin film coil formed by a thin film forming process is formed on a magnetic gap forming surface. Head.

As shown in FIGS. 1 and 2, the magnetic head 1 has a pair of magnetic core halves 2 joined by metal diffusion bonding.
3. A pair of magnetic core halves 2 and 3
Are formed on a non-magnetic substrate 4 made of a non-magnetic material, a metal magnetic thin film 5 formed on an inclined surface 4a of the non-magnetic substrate 4, and a metal magnetic thin film 5 formed on the non-magnetic substrate 4 so as to cover the metal magnetic thin film 5. And low melting point glass 6.
Further, at least one of the pair of magnetic core halves 2 and 3 is formed with a thin-film coil 7 for excitation and / or detection of an induced electromotive voltage.

In the magnetic head 1, as shown in FIG. 2, a pair of magnetic core halves 2 and 3 are joined via a gap material G, and a metal magnetic thin film 5 forms a magnetic core 8. However,
In FIG. 2, illustration of the thin-film coil 7 formed on the magnetic core halves 2 and 3 is omitted. Here, the gap material G
For example, a metal thin film used for metal diffusion bonding, for example, an Au film is used. This Au film is used for the gap material G.
The pair of magnetic core halves 2 and 3 are magnetically separated.

The magnetic head 1 is slid on the medium sliding surface 9 in a direction indicated by an arrow A in FIG. Magnetic head 1
When reproducing a magnetic signal recorded on the magnetic recording medium, the magnetic signal recorded on the magnetic recording medium is read by the magnetic core 8.
, And is detected by the thin film coil 7 and converted into an electric signal. When recording a magnetic signal on the magnetic recording medium, the magnetic head 1 is provided with a thin-film coil 7 that is generated by supplying a current corresponding to the magnetic signal to be recorded on the magnetic recording medium.
Is recorded on the magnetic recording medium via the magnetic core 8.

In the magnetic head 1, in order to regulate the contact state with the magnetic recording medium, the medium sliding surface 9 is formed in an arc shape along the sliding direction of the magnetic recording medium indicated by the arrow A in FIG. I have. In the magnetic head 1, a contact width regulating groove 10 is formed in order to regulate the contact area with the magnetic recording medium. The contact width regulating grooves 10 are formed on both side surfaces of the magnetic head 1 in parallel with the sliding direction of the magnetic recording medium indicated by the arrow A in FIG.

In the magnetic head 1, the non-magnetic substrate 4 is formed using a mixed sintered material of MnO-NiO. The nonmagnetic substrate 4 has the above-described MnO—NiO
Not limited to the mixed sintered material, other materials such as calcium titanate, potassium titanate, barium titanate, zirconium oxide (zirconia), alumina, alumina titanium carbide, SiO2, Zn ferrite, crystallized glass,
High hardness glass or the like may be used.

In the magnetic head 1, the metal magnetic thin film 5 is provided with a magnetic layer formed of a material exhibiting good soft magnetism, for example, a sendust (Fe-Al-Si alloy). . Specifically, the metal magnetic thin film 5
Has a laminated structure in which the magnetic layer made of sendust and the nonmagnetic layer made of alumina are alternately formed, that is, the magnetic layer is divided into a plurality by the nonmagnetic layer. The magnetic head 1 has a laminated structure of a magnetic layer and a non-magnetic layer of the metal magnetic thin film 5, thereby reducing eddy current loss and having high sensitivity in a higher frequency range. In the present embodiment, the metal magnetic thin film 5 has a structure having three magnetic layers with a non-magnetic layer interposed.

The metal magnetic thin film 5 is provided on the non-magnetic substrate 4 with the bonding surface 2 which is the magnetic gap forming surface of the magnetic core halves 2 and 3.
It is formed on an inclined surface 4a which is formed obliquely at a predetermined angle with respect to a and 3a. For this reason, the magnetic core 8
As shown in FIG. 2, when a pair of magnetic core halves 2 and 3 on which a metal magnetic thin film 5 is formed are joined via a gap material G, the sliding direction A of the magnetic recording medium is oblique. Will be arranged.

Further, the metal magnetic thin film 5 is configured so that its cross section has a substantially U-shape. That is, the metal magnetic thin film 5 has a concave portion 5a at a substantially central portion of the end surface on the side where the magnetic core halves 2 and 3 are joined.

For this reason, the metal magnetic thin film 5 is divided in the front-rear direction by the joining surfaces 2 a and 3 a of the magnetic core halves 2 and 3 and is exposed from the low melting point glass 6, and the front butting surface 11 and the rear butting surface 12 And has the following. The front butting surface 11 of one magnetic core half 2 and the other magnetic core half 3
And a front abutting surface 11 are abutted via a gap material G to form a front gap 13. The rear butting surface 12 of one magnetic core half 2 and the rear butting surface 12 of the other magnetic core half 3 abut against each other to form a back gap 14.

In the front gap 13, the depth from the medium sliding surface 9 to the end on the side of the back gap 14 is referred to as depth.

Further, as shown in FIG. 1, the metal magnetic thin film 5 has a coil forming recess 15 in which the thin film coil 7 is formed in the joining surfaces 2a and 3a, with the rear butting surface 12 being substantially at the center. A coil connection terminal 16 is formed in the coil forming recess 15 near the rear butting surface 12. The thin-film coil 7 is formed in the coil-forming recess 15, and the end on the center side is connected to the coil connection terminal 16.

The coil connection terminals 16 are formed with their heights adjusted so as to form the same surfaces as the joint surfaces 2a, 3a of the pair of magnetic core halves 2, 3. In the magnetic head 1, when the pair of magnetic core halves 2 and 3 are joined, the pair of coil connection terminals 16 are also joined. Thus, in the magnetic head 1, when the pair of magnetic core halves 2 and 3 are joined, the pair of thin-film coils 7 are electrically connected.

The outer peripheral end of the thin-film coil 7 is led out to the side opposite to the medium sliding surface 9 with which the magnetic recording medium comes into contact. External connection terminals 17 are respectively formed on the pair of magnetic core halves 2 and 3 on the opposite side to the medium sliding surface 9. The outer peripheral end of the thin-film coil 7 is connected to the external connection terminal 17.

The external connection terminal 17 is connected to the magnetic core half 2,
The groove formed in the width direction of each of the bonding surfaces 2a and 3a of 3 is filled with a conductive material such as copper (Cu). The external connection terminal 17 is exposed on the side surface of the magnetic head 1 and electrically connects the outside and the thin-film coil 7. The pair of external connection terminals 17 are formed on the magnetic core halves 2 and 3 at different heights so that a short circuit does not occur when the pair of magnetic core halves 2 and 3 are joined.

In the magnetic head 1, the depth, which is the depth of the front gap 13 from the medium sliding surface 9, is one of the important factors for determining the head characteristics. In order to read the depth accurately and easily, the magnetic head 1 is formed with a groove 18 as a depth marker for determining a zero depth position of the front gap 13 as shown in FIGS.

The groove 18 is formed on the joining surface 2a, 3a of the pair of magnetic core halves 2, 3 on the medium sliding surface 9 of the front butting surface 11.
The magnetic head 1 is formed in parallel with the medium sliding surface 9 so as to pass through the opposite end and to reach both side surfaces of the magnetic head 1. That is, the groove 18 is formed so that the end of the front butting surface 11 opposite to the medium sliding surface 9 in the pair of magnetic core halves 2 and 3 is notched.
Therefore, the side edge 18 a of the groove 18 on the medium sliding surface 9 side is
It will always coincide with the zero depth position of the front gap 13. In other words, in the magnetic head 1, the distance from the medium sliding surface 9 to the side edge 18a of the groove 18 is a depth.

Therefore, in the magnetic head 1, the depth of the front gap 13 is reduced by polishing the medium sliding surface 9 while checking the distance from the medium sliding surface 9 to the side edge 18a of the groove 18 from the side. It can be adjusted with high precision. Therefore, the head efficiency of the magnetic head 1 can be improved by polishing the sliding surface 9 so that the depth of the front gap 13 is reduced.

In the magnetic head 1, as shown in FIG. 3, the width of the front gap 13 in the direction perpendicular to the arrow A, which is the sliding direction of the recording medium, is the track width Tw. In other words, the metal magnetic thin films 5 formed on the pair of magnetic core halves 2 and 3 are connected to each other.
3, the width of the front butting surface 11 constituting the front gap 13 in the direction perpendicular to the arrow A is the track width Tw.
It has been.

In the magnetic head 1, both sides in the track width Tw direction in which the metal magnetic thin film 5 is exposed on the joint surfaces 2a, 3a of the magnetic core halves 2, 3 are notched downward from the joint surfaces 2a, 3a. It is formed. As a result, the track width Tw of the magnetic head 1 is formed to be narrower than the track width Tw ₀ when the metal magnetic thin film 5 is formed without notching (indicated by a dashed line in FIG. 3). I have. Therefore, the magnetic head 1 can accurately record and reproduce fine magnetic signals in response to the increase in recording density.

In the magnetic head 1, as described above, the notch recesses 19 formed on both sides of the metal magnetic thin film 5 are filled with the insulating oxide 20. Thereby, it is possible to prevent the magnetic recording medium sliding on the medium sliding surface 9 from being damaged by the edge of the notch recess 19. As the insulating oxide 20 filling the notch recess 19, for example, Al ₂ O ₃ , SiO ₂ , Ta ₂ O ₅ , Cr ₂ O ₃ , TiO ₂
And metals such as Cr, Pr, Au, and Ag.

When the insulating oxide 20 is filled in the notch recess 19 formed in each of the magnetic core halves 2 and 3, the surface roughness of the bonding surfaces 2 a and 3 a of the magnetic head 1 is reduced. Each is polished to 2.0 nm or less by mirror finishing, which will be described in detail later. The surface roughness of the joining surfaces 2a and 3a affects the joining between the magnetic core halves 2 and 3, and the surface roughness of the joining surfaces 2a and 3a and the magnetic core halves 2 and 3a.
3 have the relationship shown in Table 1 below.

[0043]

[Table 1]

As shown in Table 1, in the magnetic head 1, the surface roughness of each of the joining surfaces 2a, 3a of the magnetic core halves 2, 3 is set to 2.0 nm or less, so that the magnetic core halves 2 , 3 are reduced by the metal diffusion bonding to reduce joining defects, and the yield is improved.

In the magnetic head 1, the metal magnetic thin films 5 formed on the pair of magnetic core halves 2 and 3 are formed so as to have the same width, and these metal magnetic thin films 5 abut each other without any step. It is desirable. Thereby, the recording / reproducing characteristics can be improved. However,
It is difficult to accurately align and join the metal magnetic thin films 5 having the same width, and even if a slight deviation occurs, the track width is reduced by the deviation. Therefore, in the magnetic head 1, as shown in FIG.
By forming the front gap 13 by abutting the metal magnetic thin films 5 having widths slightly different from each other, a desired track width Tw can be reliably obtained. In the magnetic head 1 shown in FIG. 3, the width of the narrower metal magnetic thin film 5 in the direction perpendicular to the arrow A is the track width Tw.

In the magnetic head 1, of the metal magnetic thin films 5 formed on the pair of magnetic core halves 2 and 3,
The above-described notch recess 19 may be formed only on one side.
Thereby, the alignment of the pair of magnetic core halves 2 and 3 can be further facilitated. Further, in the magnetic head 1, the notch recesses 19 are formed on both sides of the metal magnetic thin film 5 in the track width Tw direction, but the notch recesses 19 may be formed only on one of the sides.

In the magnetic head 1, the inclined surface 4a is formed obliquely at a predetermined angle on the non-magnetic substrate 4. However, the inclined surface 4a may be formed at an angle of about 45 °. desirable. Thereby, the track width accuracy of the magnetic head 1 is improved.

Further, in the magnetic head 1, the metal magnetic thin film 5 is formed of Sendust (Fe-Al-Si alloy), but the material is not limited to this. The metal magnetic thin film 5 is made of, for example, Fe-Al
Alloy, Fe-Si-Co alloy, Fe-Ga-Si alloy, Fe-Ga-Si-Ru alloy, Fe-Al-G
e-based alloy, Fe-Ga-Ge-based alloy, Fe-Si-Ge
It may be formed of a crystalline alloy such as a base alloy, a Fe—Co—Si—Al based alloy, and a Fe—Ni based alloy. The metal magnetic thin film 5 is made of an alloy composed of one or more elements of Fe, Co, and Ni and one or more elements of P, C, B, and Si, or an alloy containing Al, Ge, Be,
Sn, In, Mo, W, Ti, Mn, Cr, Zr, H
Amorphous alloys such as metal-metalloid amorphous alloys typified by alloys containing f, Nb, etc., and metal-metal based amorphous alloys mainly composed of transition metals such as Co, Hf, Zr and rare earth elements May be formed. Further, the metal magnetic thin film 5 may be formed of a nitride-based soft magnetic alloy or a carbide-based soft magnetic alloy.
In the magnetic head 1, alumina is used for the non-magnetic layer formed on the magnetic layer of the metal magnetic thin film 5, but the material is not limited to this. The nonmagnetic layer is made of, for example, Si
Materials such as O2 or SiO may be used alone or as a mixture.

Furthermore, the metal magnetic thin film 5 may have a structure of a single magnetic layer instead of the laminated structure of the magnetic layer and the non-magnetic layer as described above.

The magnetic head 1 configured as described above
When reproducing a magnetic signal recorded on the magnetic recording medium, a signal magnetic field from the magnetic recording medium is applied to the front gap 13.
Is applied around. When the direction of the applied signal magnetic field changes, the direction of the magnetic flux flowing through the magnetic core 8 changes. As a result, in the magnetic head 1, electromagnetic induction occurs, and a current corresponding to the magnetic signal recorded on the magnetic recording medium flows through the thin-film coil 7. And the magnetic head 1
By detecting the current flowing through the thin film coil 7,
A magnetic signal recorded on a magnetic recording medium is reproduced.

When recording a magnetic signal on a magnetic recording medium using the magnetic head 1, a current corresponding to the recording signal is supplied to the thin-film coil 7. Then, a magnetic flux is generated in the magnetic core 8 by the magnetic field generated from the thin film coil 7. Then, the magnetic head 1 records a magnetic signal on the magnetic recording medium by applying a leakage magnetic field in which the magnetic flux generated in the magnetic core 8 leaks at the front gap 13 to the magnetic recording medium.

A method for manufacturing the magnetic head 1 having the above-described configuration will be described below with reference to the drawings.

When manufacturing the magnetic head 1, first, a plurality of magnetic core halves 2 and 3 are formed on the same substrate. Then, the magnetic head 1 is completed by bonding a pair of the substrates and separating them as individual magnetic heads 1.

First, to manufacture the magnetic head 1, FIG.
As shown in (1), a substantially flat substrate 21 is prepared. This substrate 21 is to be the non-magnetic substrate 4 in the magnetic head 1 and is made of a MnO—NiO mixed sintered material as described above, for example, having a thickness of about 2 mm and a length and width of 3 mm.
It is molded to about 0 mm. The substrate 21 may have positioning notches formed on both side surfaces thereof. The positioning notch will be used in a later step to form a winding groove 2 which will be described later.
9, a reference position for forming the medium sliding surface 9 and the contact width regulating groove 10.

As shown in FIG. 5, the substrate 21 is subjected to first groove processing for forming a plurality of grooves on one main surface 21a. In the first groove processing, one main surface 21 of the substrate 21 is formed.
A plurality of magnetic core forming grooves 24 are formed in parallel with a by using a grindstone or the like having one surface formed obliquely, for example, so as to have an angle of about 25 °. In the substrate 21, a plurality of inclined surfaces 21b are formed by the magnetic core forming grooves 24 formed by the first groove processing.

In the magnetic core forming groove 24 formed by the above-described first groove processing, the inclined surface 21b preferably has an inclination angle of about 25 ° to 60 ° with respect to the plane of the substrate 21. In consideration of accuracy, an inclination angle of about 35 ° to 50 ° is more preferable. The magnetic core forming groove 24 formed by the first groove processing has a depth of 130 μm.
m and a width of 150 μm.

As shown in FIG. 6, the substrate 21 is subjected to a film forming step of forming the metal magnetic thin film 27 on the entire surface of the main surface 21a on which the above-described inclined surface 21b is formed.
In the film forming step, the metal magnetic thin film 27 is formed such that three magnetic layers made of a metal magnetic material are stacked via a nonmagnetic layer. The film forming step is performed by various PVD (Physical Vapor Deposition) methods such as sputtering, vapor deposition, MBE (Molecular Beam Epitaxy), or C
The metal magnetic thin film 27 is formed by a VD (Chemical Vapor Deposition) method. In the present embodiment, the metal magnetic thin film 27 is formed on the substrate 21 by a sputtering method. At this time, in order to obtain good soft magnetic characteristics,
By performing the sputtering while tilting the substrate 21, the sputtered particles were irradiated in a direction substantially perpendicular to the film formation surface. The tilt angle of the substrate 21 is arbitrary as long as desired soft magnetic characteristics can be obtained.

In the present embodiment, as described above, the metal magnetic thin film 27 is formed such that the nonmagnetic layer and the magnetic layer are alternately stacked. Specifically, Sendust (Fe-Al-Si alloy) was formed with a thickness of 5 μm as the magnetic layer, and alumina was formed with a thickness of 0.15 μm as the non-magnetic layer. Then, three magnetic layers were laminated via a non-magnetic layer to form a metal magnetic thin film 27.

If the thickness of the nonmagnetic layer is too large, the nonmagnetic layer acts as a pseudo gap, and if it is too thin, insulation between the magnetic layers cannot be obtained. For this reason, the non-magnetic layer needs to have such a thickness that the insulation between the adjacent magnetic layers can be at least obtained.

Next, as shown in FIG.
A second groove processing for forming a groove in a direction substantially orthogonal to the magnetic core forming groove 24 is performed on the surface on which the metal magnetic thin film 27 is formed. In the second groove processing, a separation groove 28 for separating the substrate 21 into magnetic cores 8 of a desired size, and a front gap 13 and a back gap 14 are formed in each magnetic core 8 separated by the separation grooves 28. A winding groove 29 for forming the coil-forming concave portion 15 is formed. In the substrate 21, a portion other than the metal magnetic thin film 27 formed on the inclined surface 21b, that is, the metal magnetic thin film 27 formed on the bottom of the magnetic core forming groove 24 is removed by grinding.

The separation groove 28 is a groove for forming each magnetic core 8 by magnetically separating the magnetic core 8 in the front-back direction on the substrate 21 and forming a closed magnetic path in each magnetic core 8. Also,
Although two separation grooves 28 shown in FIG. 7 are formed on the substrate 21, it is necessary to provide as many as the number of rows of the magnetic core halves 2 and 3 to be formed. Further, since the separation groove 28 magnetically separates the magnetic cores 8 arranged side by side in the front-rear direction, the depth of the separation groove 28 is sufficient to completely cut the metal magnetic thin film 27, particularly the magnetic layer constituting the metal magnetic thin film 27. It must be formed to have Specifically, the separation groove 28 is formed to have a depth of 150 μm from the bottom of the magnetic core forming groove 24, that is, a depth of 280 μm from the main surface 21 a of the substrate 21.

On the other hand, the winding groove 29 forms the concave portion 5 a formed in the metal magnetic thin film 27 in the magnetic head 1 having the above-described configuration. Therefore, the winding groove 29
In order to form the magnetic core 8 having the front butting surface 11 and the rear butting surface 12 and to form the coil forming recess 15, it is necessary to form the metal magnetic thin film 27 at a depth that does not cut the metal magnetic thin film 27. . Therefore, the cross section of the metal magnetic thin film 27 is exposed on the surface of the winding groove 29.

The shape of the winding groove 29 is determined according to the lengths of the front butting surface 11 and the rear butting surface 12. Here, the width is set to about 140 μm, and And the length of the rear butting surface 12 was 85 μm. The winding groove 29 may have such a depth that the metal magnetic thin film 27 is not cut. However, if the winding groove 29 is too deep, the magnetic path length becomes longer, and the efficiency of magnetic flux transmission may decrease. The winding groove 29
Is a thin-film coil 7 whose depth is formed in a process described later.
Although it depends on the thickness, it was set to 20 μm here.

Further, the shape of the winding groove 29 is not limited, but here, the front abutting surface 1 serving as the front gap apex 13 a in the magnetic head 1.
The side surface on one side is an inclined surface 29a of about 45 °. Thus, the magnetic core 8 has a structure in which the magnetic flux concentrates on the medium sliding surface 9 side, and the sensitivity is improved. When the inclined surface 29a is formed, it may be formed, for example, in a circular or polygonal shape.

Next, as shown in FIG.
As described above, the glass filling step of filling the melted low-melting glass 30 into the main surface 21a on which the magnetic core forming groove 24, the separation groove 28, and the winding groove 29 are formed is performed. In the glass filling step, it is desirable that the filling of the low-melting glass 30 is performed at a heat treatment temperature sufficient for the metal magnetic thin film 27 to obtain good soft magnetic properties. Thereby, the heat treatment of the metal magnetic thin film 27 and the filling of the low-melting glass 30 can be performed in the same step. Further, in the glass filling step of the low melting point glass 30, it is necessary to completely fill the grooves formed in the substrate 21. Therefore,
It is desirable that the viscosity of the low-melting glass 30 at the above-described heat treatment temperature is about 10 ² Pa · s to 10 ⁶ Pa · s, more preferably about 10 ³ Pa · s to 10 ⁵ Pa · s.

In this embodiment, the metal magnetic thin film 2
7 shows a coercive force of 30 A / m or less by heat treatment at 520 ° C., and good soft magnetic properties can be obtained. Therefore, SiO ₂ , PbO, B ₂ O ₃ , and Bi ₂ O ₃ are used for the low melting point glass 30. Glass having a viscosity at 520 ° C. of about 10 ^4.5 Pa · s as a main component was used.

Thereafter, the filled low melting point glass 30 is cooled and solidified, and the surface of the solidified low melting point glass 30 is subjected to a flattening process by polishing or the like.

The flattening treatment of the low-melting glass 30 is performed by the substrate 2
It is desirable to polish and flatten the surface of the substrate 1 to such an extent that a portion of the substrate 1 is slightly exposed. When a part of the substrate 21 is not exposed as described above, when the pair of magnetic core halves 2 and 3 of the magnetic head 1 are joined, the opening angle of the track edge becomes small, and the fringing may become large. There is. However, if the exposure width is too large, the low melting glass 30
Since the etching rates of the thin film coil 7 and the substrate 21 are different, a step occurs in a step of forming the thin film coil 7 described later.
Therefore, it is desirable that the exposed width at this time is smaller than the width at the innermost periphery of the thin film coil 7.

Next, as shown in FIG.
The terminal groove 31 is formed by subjecting the solidified low-melting glass 30 to grinding using a grindstone or the like. The terminal groove 31 is located immediately above the separation groove 28 described above.
The width and the depth are set to 100 μm. The inside of the terminal groove 31 is filled with a conductive material such as Cu by plating or the like, and thereafter, a flattening process is performed. The conductive material such as Cu filled in the terminal groove 31 serves as the external connection terminal 17 in the magnetic head 1 described above.

Next, as shown in FIGS. 10A and 10B, a metal magnetic thin film 27 is formed on a substrate 21 in a step described later.
Is formed by patterning a resist film 32 for trimming the front abutting surface 11 to a small width. Specifically, the resist film 32 is formed on the low melting point glass 30 on the substrate 21.
A bridge-like portion 32a is provided on the metal magnetic thin film 27 corresponding to the front abutting surface 11 and is exposed from the front surface. The front abutting surface 11 of the metal magnetic thin film 27 is provided with the bridge-like portion 32a interposed therebetween.
The two openings 32b exposing the both side edges of are formed. The resist film 32 has the above-described pattern formed on the substrate 21.
It is formed for each metal magnetic thin film 27 exposed above.

The resist film 32 has a bridge-like portion 32a formed on the substrate 2
1 and the metallic magnetic thin film 27
It is preferably formed around a position shifted by 10 to 16 μm to the side. Further, the resist film 32 is formed such that an ion beam irradiated at the time of etching, which will be described later, is concentrated on the base 32c on the side of the rear abutting surface 12 of the bridge-like portion 32a, and the resist pattern is thinly deformed as the etching proceeds. 11 is formed at a position shifted by 20 to 30 μm toward the rear butting surface 12 from the end 11a.

The resist film 32 has a thickness of 13 in consideration of a thickness to be etched at the time of etching described later.
It is preferable to form the bridge-like portion 3
Considering the width accuracy in 2b, it is more preferable to form the film with a thickness of 14 to 15 μm.

In the present embodiment, the above-described resist film 32 is formed by using photolithography. The resist film 32 may be a positive or negative resist material.

Next, the resist film 32 having the above-described pattern is formed.
The substrate 32 on which is formed is subjected to an etching process. The etching process is performed on the bridge portion 32a of the resist film 32.
In the thickness direction, the vicinity of both side edges of the metal magnetic thin film 27 is cut out in the thickness direction, and the front abutting surface 11 is formed narrow.
As shown in FIG. 11, a notch concave portion 19 in which the side wall of the metal magnetic thin film 5 on the front butting surface 11 side is cut out substantially vertically is formed in the substrate 21 by this etching process. In the magnetic head 1, since the track width Tw of the front gap 13 is formed by the narrow front butting surface 11, the fine magnetic signal can be accurately transmitted in response to the increase in the recording density of the magnetic recording medium. Recording and reproduction can be performed.

In the above-described etching process, for example, Ar,
It is preferable to perform an ion etching method using an inert gas ion such as Kr, Xe, or He. According to the ion etching method, the metal magnetic thin film 27 can be etched in the thickness direction of the substrate 21 while maintaining the projection shape of the bridge-like portion 32a of the resist film 32 with high accuracy by an ion beam having excellent linearity. It is said. At this time, assuming that the incident angle of the ion beam with respect to the substrate 21 is 30 °, the rate at which the burrs are re-attached by etching and the burrs themselves are substantially equalized.
The shape of the side surface a and the side surface of the metal magnetic thin film 27 are not deformed, and the shape immediately below the resist film 32 is formed almost vertically. In the magnetic head 1, the track width Tw after the etching is set to 4.0 μm ± 0.25 μm by the above-described etching process.
It is formed with high accuracy up to about m.

Next, the notch concave portion 19 formed by the above-described etching process is filled with an insulating oxide by a lift-off method. In the magnetic head 1, the filling of the notch recess 19 with the insulating oxide prevents the magnetic recording medium sliding on the medium sliding surface 9 from being damaged by the edge of the side edge of the notch recess 19. To prevent.

First, as shown in FIG.
A resist material 33 that enables lift-off is applied on the substrate 21 on which the substrate 9 is formed. As the resist material 33 used at this time, it is desirable to use a resist having a forward taper such as a positive resist, and to apply the resist material 33 with a film thickness at least equal to or greater than the depth of the notch recess 19. On the other hand, a negative resist is generally a thin film type (about 3 μm or less), and even if it is applied, it is completely covered with an insulating oxide. Although it becomes difficult to remove the organic solvent by ultrasonic cleaning, a negative resist may be used as long as the thickness can be equal to or greater than the depth of the notch 19.

In the magnetic head 1, the insulating material on the resist material 33 is peeled off by dissolving and removing the resist material 33 by infiltrating a solvent from a thin portion of the sputtered insulating oxide as described later in detail. Remove,
A so-called lift-off method is performed. For this reason, if the resist material 33 is applied to a thickness equal to or less than the depth of the notch recess 19, the insulating oxide is formed thicker, so that the solvent does not permeate the resist material 33. The thicker the resist material 33 is, the easier the lift-off method is to be implemented. However, if the resist material 33 is applied too thick, the resist material 33 is hardly removed due to the limit of the illuminance of the exposing machine and remains without being removed. . Therefore, the resist material 3
3 is applied to a thickness at least about the depth of the notch concave portion 19, and is applied to a thickness in consideration of the limit of the illuminance of the exposure machine to be used. In the present embodiment, a positive resist is applied in a thickness of 12 μm.

Then, as shown in FIGS. 13 (a) and 13 (b), a predetermined region, that is, a region other than the portion subjected to the etching process is exposed by using a photomask 34, and the resist is exposed. Material 33 is removed. For this reason, the resist material 33 remains only in the portion where the etching process has not been performed, and the step in the substrate 21 where the film thickness of the resist material 33 is added to the etching depth, in other words, the step which is twice or more the etching depth. C is secured.

Next, as shown in FIG. 14, an insulating oxide 35 is formed on the entire surface of the substrate 21 by a sputtering method. The insulating oxide 35 is made of, for example, Al ₂ O ₃ , SiO ₂ ,
Oxides such as Ta ₂ O ₅ , Cr ₂ O ₃ , TiO ₂ , Cr, P
Metals such as r, Au and Ag are used. Insulating oxide can be prepared by various P methods such as plating, in addition to sputtering.
It may be formed using a VD method.

Then, as shown in FIG. 15, ultrasonic cleaning using an organic solvent or the like is performed. In the substrate 21, the solvent penetrates through the thin forward tapered portion 35a of the insulating oxide 35 covering the resist material 33, so that the resist material 33 is dissolved and removed.

When the resist material 33 on the substrate 21 is dissolved and removed by the above ultrasonic cleaning, the insulating oxide 35 formed so as to cover the resist material 33 is removed as shown in FIG. Then, as shown in FIG.
Excess insulating oxide 35 is scraped off by mirror polishing to flatten the substrate 21. At this time, the insulating oxide to be polished is a track formed by trimming, that is, the insulating oxide 35 on the front abutting surface 11 and the burr of the insulating oxide 35 generated by the above-described lift-off method, and has a small area. Therefore, the flattening of the substrate 21 can be performed only by mirror finishing.

In the above-mentioned mirror finishing, the surface roughness of the bonding surfaces 2a and 3a on which the gap material G described later is formed is polished to 2.0 nm or less. Therefore, in the magnetic core head 1, when the magnetic core halves 2 and 3 are bonded and integrated by metal diffusion bonding, bonding defects are reduced, and the yield is improved.

Next, as shown in FIG. 18, the low-melting glass 30 is etched to form the coil-forming recess 15 and the groove 18 serving as a depth marker. A thin film coil 7 is formed therein.

The coil-forming recess 15 is provided at the rear butting surface 1.
It is formed in a substantially rectangular shape having a center at about 2 by performing etching on a portion excluding the rear butting surface 12 and the coil connection terminal 16. The coil forming recess 15 is formed with a groove 15 reaching the terminal groove 31 from one end thereof.
a.

The groove 18 has an end on the front gap 13 side and a front gap 13 with respect to the top of the winding groove 29.
And the other end is formed to be outside in the depth direction. In the groove 18, the distance between the end on the front gap 13 side and the top of the winding groove 29 is 1
It is preferably 5 μm or less, more preferably 7 μm or less. The groove 18 has a depth of 2 μm to 15 μm.
Is more preferable, more preferably 5 μm to 10 μm
Range. When the depth of the groove 18 is 2 μm or less, the magnetic flux leaks. When the depth is 15 μm or more, the core volume under the depth becomes small. The core efficiency is lower than that of the head.

The groove 18 may be formed in a polygonal shape or a semicircular shape. Like the groove 18 and the coil-forming concave portion 15, it may be formed by etching, or may be formed by machining using a slicer.

Thereafter, a thin film coil 7 is formed in the coil forming recess 15. The thin-film coil 7 has one end 7a disposed on the coil connection terminal 16 and the rear abutting surface 1.
It has a shape wound many times so as to draw a circle centered at 2. The thin-film coil 7 is drawn out into a groove 15 a formed at one end of the coil forming recess 15, and the other end 7 b is electrically connected to an external connection terminal 17 made of a conductive material filled in a terminal groove 31. Connection.

When the thin film coil 7 is formed, first, the above-described coil shape is patterned by a photoresist. Next, Cu is formed in the coil forming recess 15.
Is formed into a thin film by a technique such as plating so as to have a thickness of about 3 μm. Then, by removing the photoresist, the thin film coil 7 having a patterned coil shape can be formed. In forming the thin film coil 7, a sputtering method, a vapor deposition method, or the like may be used instead of the plating method described above. In the present embodiment, the magnetic head 1
Although the thin film coil 7 is formed on each of the pair of magnetic core halves 2 and 3 in the above, the thin film coil 7 may be formed on only one of them.

Next, although not shown in detail, a protective film for protecting the thin-film coil 7 from contact with the outside air is provided on the substrate 2.
1 is formed on one main surface 21a. This protective film is formed so as to fill the coil forming recess 15 in which the above-described thin film coil 7 is formed. The protective film is preferably formed of a non-magnetic insulating material that is not removed by the oxygen ashing. Specifically, as a non-magnetic insulating material, Al ₂ O ₃ , Ta ₂ O ₅ , SiO ₂ , Zr
Examples include oxides such as O ₂ and TiO ₂ and inorganic substances such as glass. Here, as the protective film, one principal surface 2 of the substrate 21 is formed by sputtering Al ₂ O ₃ to a thickness of 0.4 μm.
1a was formed on the entire surface. At this time, the protective film is
The front butting surface 11 and the rear butting surface 12 exposed on the one main surface 21a are also covered, but the portions covering these are removed in a step described later. Note that this protective film can be formed only in a predetermined region by using a so-called mask sputtering method or a lift-off method. Examples of the method for forming the protective film include, besides the sputtering method, an evaporation method and spin coating of coating type SiO ₂ .

Next, the surface of the substrate 21 is flattened again, and a metal film or an alloy film serving as the gap material G is formed by sputtering or the like. The gap material G is subjected to patterning to remove an unnecessary portion in order to prevent a short circuit between the insulating film and the coil. In the present embodiment,
An Au film was used for the gap material G.

Next, as shown in FIG. 19, the substrate 21 on which the magnetic core halves 2 and 3 are formed in a plurality of rows in parallel is provided with one magnetic core half 2 and the other magnetic core half 3 in one row. Then, the magnetic core half block 38 is formed. Then, as shown in FIG. 20, the pair of magnetic core half blocks 38 is accurately positioned to perform metal diffusion bonding. Then, by applying a predetermined temperature and pressure to the pair of butted magnetic core half blocks 38, metal diffusion bonding is performed, and then cylindrical grinding is performed to obtain good contact with the magnetic recording medium. The magnetic head block 39 is manufactured by subjecting a sliding surface width processing to.

Next, as shown in FIG. 21, the magnetic head block 39 is separated into individual magnetic heads 1. At this time, the magnetic head block 39 is, for example, D- in FIG.
Cut at the portion indicated by the D line.

As described above, one magnetic head 1 is completed.

In the magnetic head 1, as described above, the joint surface 2 is formed only by mirror finishing without performing rough cutting by a polishing machine.
By polishing the a and 3a, the amount of polishing of the surfaces of the joint surfaces 2a and 3a is reduced, and a stable track width Tw which is not affected by the etching shape of the metal magnetic thin film 5 can be obtained. You. In addition, the bonding surface 2
By performing the polishing of a and 3a, the manufacturing time of the magnetic head 1 can be shortened. More specifically, the polishing step, which conventionally took about 60 minutes, can be performed within 5 minutes, and the production efficiency is improved.

In this embodiment, the notch recess is filled with the insulating oxide by the lift-off method.
The present invention is not limited to such an embodiment, and the insulating oxide may be filled only in the recessed portion by a method such as mask sputtering.

[0097]

As described in detail above, in the magnetic head and the method of manufacturing the same according to the present invention, at least the notch recess is filled with the insulating oxide sputtered on the butt surface by the lift-off method or the like. Thereafter, the surface roughness of the butted surface is polished to 2.0 nm or less only by mirror finishing. Therefore, according to the magnetic head of the present invention, bonding defects between the magnetic core halves are reduced, and the yield can be improved. According to the method of manufacturing a magnetic head according to the present invention, the roughing by the polishing machine can be omitted, the manufacturing time can be shortened, the production efficiency can be improved, and the stable track whose track width does not change due to the influence of polishing can be improved. Shape can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view of a magnetic head according to the present invention.

FIG. 2 is an enlarged perspective view of a main part of the magnetic head.

FIG. 3 is an enlarged plan view of a main part of the magnetic head.

FIG. 4 is a view for explaining the method for manufacturing the magnetic head according to the present invention, and is a perspective view showing a substrate.

FIG. 5 is a diagram for explaining the method for manufacturing the magnetic head, and is a perspective view of the substrate on which the first groove processing has been performed.

FIG. 6 is a diagram for explaining the method for manufacturing the magnetic head, and is a perspective view of the substrate on which the metal magnetic thin film is formed.

FIG. 7 is a diagram for explaining the method for manufacturing the magnetic head, and is a perspective view of the substrate on which the second groove processing has been performed.

FIG. 8 is a diagram for explaining the method for manufacturing the magnetic head, and is a perspective view of the substrate in a state where each groove is filled with low-melting glass.

FIG. 9 is a diagram for explaining the method for manufacturing the magnetic head, and is a perspective view of a substrate in which terminal grooves are formed in low-melting glass.

10A and 10B are views for explaining a method of manufacturing the magnetic head, wherein FIG. 10A is a plan view of a main part showing a state where a resist film is formed, and FIG. 10B is a state where a resist film is formed. FIG.

FIG. 11 is a view for explaining the method of manufacturing the magnetic head, and is a longitudinal sectional view of an essential part showing a state in which the metal magnetic thin film is etched to form a notched concave portion.

FIG. 12 is a view for explaining the method for manufacturing the magnetic head, and is a longitudinal sectional view of an essential part showing a state where a resist material is applied on the substrate.

FIG. 13 is a view for explaining the method for manufacturing the same magnetic head, and is a longitudinal sectional view of an essential part showing a state where the resist material applied on the substrate is exposed and developed.

FIG. 14 is a view for explaining the method for manufacturing the same magnetic head, and is a longitudinal sectional view of relevant parts showing a state where an insulating oxide is sputtered on the substrate.

FIG. 15 is a view for explaining the method for manufacturing the same magnetic head, and is a longitudinal sectional view of an essential part showing a state where the substrate has been subjected to ultrasonic cleaning.

FIG. 16 is a view for explaining the method for manufacturing the magnetic head, and is a longitudinal sectional view of an essential part showing a state where the resist material on the substrate is removed.

FIG. 17 is a view for explaining the method for manufacturing the magnetic head, and is a longitudinal sectional view of relevant parts showing a state where the substrate has been mirror-finished;

FIG. 18 is a diagram for explaining the method for manufacturing the same magnetic head, and is a perspective view showing a state where a thin-film coil is formed.

FIG. 19 is a diagram for explaining the method for manufacturing the same magnetic head, and is a perspective view showing a state where the substrate is cut and separated into magnetic core half blocks.

FIG. 20 is a diagram for explaining the method for manufacturing the magnetic head, and is a perspective view showing a state in which a pair of magnetic core half blocks is being joined.

FIG. 21 is a view for explaining the method for manufacturing the magnetic head, and is a perspective view showing the magnetic head block.

FIG. 22 is a view for explaining a conventional method of manufacturing a magnetic head, and is a longitudinal sectional view of an essential part for explaining a substrate to be polished.

[Explanation of symbols]

1 magnetic head, 2, 3 magnetic core half, 4 non-magnetic substrate, 5 metal magnetic thin film, 6 low melting point glass, 7 thin film coil, 8 magnetic core, 11 front butting surface, 12 rear butting surface, 13 front gap, 19 Notch recess, 20 (35) insulating oxide, 32 resist film, 33
Resist material

Continuation of the front page (72) Inventor Eiji Takahashi 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo F-term (reference) in Sony Corporation 5D093 AA01 BB05 BC07 BC09 BD01 DA02 EA02 FA15 FA16 FA18 HA17 HA18 HA20 5D111 AA22 BB18 BB38 BB48 FF04 FF15 GG09 GG14 GG16 JJ05 JJ08 JJ22 KK01

Claims (4)

[Claims] A pair of magnetic core halves on which a metal magnetic thin film having a front butting surface and a rear butting surface are formed obliquely on a substrate, wherein the front butting surfaces of the metal magnetic thin film are connected to each other. In a magnetic head in which a magnetic gap is formed by being opposed to each other via a non-magnetic thin film, a surface roughness of an abutting surface of the magnetic core half on which the non-magnetic thin film is formed is formed to be 2.0 nm or less. A magnetic head. And a pair of magnetic core halves on which a metal magnetic thin film having a front butting surface and a rear butting surface is formed obliquely on a substrate, wherein the front butting surfaces of the metal magnetic thin film are connected to each other. In a method of manufacturing a magnetic head in which a magnetic gap is formed by being opposed to each other via a non-magnetic thin film, a step of patterning a resist film for obtaining a predetermined track width on the abutting surface; Trimming the butted surface of the magnetic core half in accordance with the pattern of above to form a cutout recess at least at one end in the track width direction of the metal magnetic thin film; and sputtering an insulating oxide on the butted surface. Then, at least a step of filling the notched concave portion with an insulating oxide, and a step of performing mirror finishing on the butted surface on which the insulating oxide is sputtered. And a method of manufacturing a magnetic head. 3. The method according to claim 1, wherein the insulating oxide is sputtered on a resist pattern formed so that a resist material remains on a portion excluding the notched concave portion and the metal magnetic film on the abutting surface, and then the lift-off method is used. 3. The method according to claim 2, wherein the resist material is dissolved and removed, and the insulating oxide on the resist pattern is peeled off to fill the notched recess. 4. The method according to claim 3, wherein the resist material is applied on the abutting surface to a thickness at least equal to a depth of the notch recess.