JP2001091596A - Noncontact measuring device for large scale integrated circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an easy noncontact measuring device for an LSI capable of measuring an electrical potential fluctuation in a power wiring in the LSI even if a seal structure of the LSI is not removed. SOLUTION: The device 1 is provided with an antenna 20 for receiving a radiation electromagnetic wave W from a power wiring in a LSI 10, a voltmeter 30 chronologically measuring an induced electromotive force vA by the radiation electromagnetic wave W received, a computing part 40 converting time series data P of a measurement result to a potential fluctuation vL produced in the LSI 10 by a conversion factor, an indication part 50 indicating the converted potential fluctuation vL to a measuring person. The antenna 20 is arranged in a neighborhood of the LSI 10 of a measuring object or in a state of contacting with an insulation part of the LSI 10. Preferably, an insulated metal plate 21 is added a back side of the antenna 20 to be covered against an unnecessary electromagnetic wave from other part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an improvement of an apparatus for non-contact testing of potential fluctuations occurring in power supply wiring of a large-scale integrated circuit (hereinafter referred to as LSI).

[0002]

2. Description of the Related Art In general, a power supply wiring inside an LSI has a potential change along with a change in a power supply current, and various devices for observing the potential change have been known. But LS
Since I is enclosed in a package made of a mold resin, ceramic, or metal, it is impossible to measure the internal potential fluctuation with a test apparatus as it is. Therefore, some pre-preparation is required in advance.

FIG. 17 is a view for explaining a potential fluctuation observation apparatus according to a conventional example. This test apparatus 100 is an apparatus for observing potential fluctuations via a contact probe 171 made of metal or the like. According to this device 100, LSI
The semiconductor pellet 111 is exposed by removing part or all of the sealing structure 101 from the sealing structure. Thus, the potential variation can be measured by directly applying the contact probe 171 of the voltmeter 103 to the power supply wiring portion (not shown) formed on the semiconductor pellet 111.

[0004] FIG. 18 is a diagram for explaining a potential fluctuation observing apparatus according to another conventional example. This other observation device 200
Is an apparatus using an optical non-contact probe 272 such as an electro-optic effect voltmeter. According to this, unlike the observation device 100, it is possible to eliminate the adverse effects such as the parasitic capacitance associated with the contact probe 171. However, since it is necessary to irradiate the light beam L to the power supply wiring on the semiconductor pellet 111, it is necessary to remove the sealing structure of the LSI 101 even if it is partial.

There are several established techniques for removing such a sealing structure. For example,
If sealed with a mold resin, the sealed portion is dissolved with fuming nitric acid or the like. In the case of ceramic sealing, there has been a technique of cutting a sealing portion, and in the case of metal, there is a technique of cutting or peeling.

[0006]

However, the conventional LSI test apparatus has the following problems. That is, if a part of the sealing structure of the LSI is removed, there is a very high possibility that the physical characteristics of the internal semiconductor pellet are changed or sometimes deteriorated. In addition, there is a risk that the semiconductor pellet itself may be damaged during this operation process.

Further, even if the characteristics do not change depending on the removal of the sealing structure itself, if the semiconductor pellet is irradiated with light during the measurement, a significant change in physical characteristics will still occur. For this reason, it is necessary to install the LSI to be tested in a dark room and then perform required measurements. In any case, such preparation is extremely troublesome.

SUMMARY OF THE INVENTION An object of the present invention is to provide a simple LSI non-contact measurement device capable of measuring a potential change in a power supply wiring inside the LSI without contact without removing the sealing structure of the LSI. It is in.

[0009]

SUMMARY OF THE INVENTION A first LS according to the present invention
The non-contact measurement device of I is a non-contact measurement device that non-contactly measures a potential variation generated in a power supply wiring inside a large-scale integrated circuit from above the large-scale integrated circuit, and detects electromagnetic waves radiated from the power supply wiring To receive, an antenna placed near the semiconductor pellet, a voltmeter that measures the induced electromotive force induced in this antenna over time, and a multiplication factor multiplied by the induced electromotive force measured by this voltmeter And a calculator for calculating a potential change of the integrated circuit.

A certain inductance component is parasitic on the power supply wiring of the semiconductor pellet. Due to this inductance component, a change in the power supply current of the LSI, that is, a potential fluctuation approximately proportional to a differential value of the power supply current occurs, and accordingly, an electromagnetic wave is radiated toward a very nearby area. Further, an induced electromotive force proportional to the electric field strength E is generated in the antenna by the radiated electromagnetic wave.

Therefore, the induced electromotive force of the antenna is
It is considered that there is an approximate proportional relationship with the potential fluctuation in the internal power supply wiring. Therefore, the original potential fluctuation can be measured by multiplying the induced electromotive force by an appropriate conversion coefficient.

In the non-contact measuring device for LSI according to the second aspect of the present invention, the conversion factor of the computer is set as a proportional constant to the induced electromotive force. According to this, a potential change proportional to the induced electromotive force is obtained.

According to a third aspect of the present invention, there is provided a non-contact measurement device for an LSI, wherein an antenna is juxtaposed in parallel with a power supply wiring surface with a planar surface facing a semiconductor pellet, and a metal plate is stacked on the back surface of the antenna. In addition, the antenna part is electrically insulated from the antenna part and is kept at a constant potential. According to this, the effective aperture area of the antenna faces linearly polarized waves along the power supply wiring.

A second non-contact measurement device for an LSI according to the present invention is a non-contact measurement device for non-contact measurement of a potential change occurring in a power supply wiring inside a large-scale integrated circuit from above a semiconductor pellet, An antenna attached to the package of a large-scale integrated circuit with the flat front facing the semiconductor pellet to receive electromagnetic waves radiated from the wiring, and a connection terminal through which the induced electromotive force generated in this antenna is led to the outside And a metal cap that is electrically insulated from the antenna portion while covering the back surface of the antenna to keep the potential constant, a voltmeter that measures the induced electromotive force induced in the antenna over time, The calculation unit multiplies the result of the measurement of the induced electromotive force by the voltmeter by a conversion coefficient, and calculates the potential fluctuation of the large-scale integrated circuit.

[0015] Since the planar antenna is attached to the package facing the semiconductor pellet, the radiated electromagnetic wave caused by the potential fluctuation of the power supply wiring causes the antenna to generate induced electromotive force efficiently. In addition, the back surface of the antenna is covered with a metal cap that is insulated to a certain potential, and the metal cap is provided with an antenna connection terminal. For this reason,
The induced electromotive force of the antenna is guided to the outside and measured while the floating electromagnetic wave from the outside of the LSI is shielded.

According to a fifth aspect of the present invention, there is provided a non-contact measurement device for an LSI, wherein the conversion factor of the calculation unit is such that a current change in the power supply wiring of the large-scale integrated circuit is converted into an inductance component parasitic on the power supply wiring of the large-scale integrated circuit. The ratio is obtained by multiplying and dividing by the induced electromotive force generated in the antenna. According to this, the potential fluctuation caused by the inductive impedance is
It is determined by a value proportional to the induced electromotive force.

According to a sixth aspect of the present invention, there is provided a non-contact measurement apparatus for an LSI, wherein a calculation unit comprises a package structure of a large-scale integrated circuit, types and arrangement conditions of an antenna, and a conversion coefficient of a measurement result of a voltmeter. A plurality of combinations are stored, and one conversion coefficient is determined from these combinations based on conditions at the time of calculation. According to this, the corresponding conversion coefficient is selectively determined based on the propagation characteristics of the radiated electromagnetic wave from the LSI.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing a first embodiment of an LSI non-contact measurement device according to the present invention. In the first embodiment, the LSI 1
Antenna 20 for receiving radiated electromagnetic waves W from zero
And a voltmeter 30 that measures the induced electromotive force vA due to the received radiated electromagnetic wave W over time (along the time axis), and converts the time-series data P, which is the measurement result, into a potential fluctuation vL generated inside the LSI 10. Calculation section 40 and converted potential fluctuation v
An LSI non-contact measurement device 1 having a display unit 50 for displaying an L time-series pattern to a measurer is configured.

The antenna 20 is connected to the LSI 1 to be measured.
An electromagnetic wave W radiated from the LSI 10 is received by being disposed near zero or in contact with an insulating part of the LSI 10.
According to the non-contact measurement device 1, when the radiated electromagnetic wave W is received by the antenna 20, an induced electromotive force vA corresponding to the electric field intensity E is generated. It is organized into series data P. And
The time series data P is processed by the calculation unit 40, and the LSI
10 is converted into an actual potential fluctuation vL generated in the power supply wiring inside. As such a voltmeter 30 and the calculation unit 40, known instruments well known to those skilled in the art may be used.

FIG. 2 is a perspective view of a main part inside the LSI shown in FIG. In general, a semiconductor pellet 11 on which an integrated circuit is printed and wired, and lead frames 13, 13,... For connection to an external power supply device are mounted inside the LSI 10. .. Are connected to one end of each lead frame 13 by bonding wires 12 from the connection wiring pads 19 on the semiconductor pellet 11.
Usually, when such a mounting structure is adopted, the power supply wiring 18 including the bonding wire 12 and the lead frame 13 is
It has a significantly longer wiring length than an integrated circuit. Therefore, a parasitic inductance component 14.14 that cannot be ignored is formed in the power supply wiring 18.

FIG. 3 is a diagram for explaining a process in which a potential variation occurs in the power supply wiring due to the parasitic inductance component shown in FIG. A constant power supply voltage V is supplied from an external power supply 90 to a power supply terminal 17 of the LSI 10 shown in FIG.
When dd is applied, the power supply current idd causes a current change Δidd within a short time with the operation of the integrated circuit. Therefore, a transient potential difference occurs at both ends of the power supply wiring 18 due to the parasitic inductance component 14 described above, and this is measured as a potential change vL. Note that 91 is the power supply voltage V
dd is a stabilizing circuit, and 92 is a bypass capacitor for preventing noise for each signal line.

FIG. 4 is a time chart showing the relationship between the power supply current and the potential fluctuation shown in FIG. The clock signal CLK is
This signal is supplied from the outside to the clock signal terminal unit 17 and operates each unit of the integrated circuit. Since the processing state of each unit transits in synchronization with this clock signal CLK,
Generally, at the rising and falling timings of the clock signal CLK, the current change Δidd of the power supply current idd
Indicates a large value.

At this time, a potential difference (potential variation) v due to a current change Δid is applied to both ends of the parasitic inductance component 14.
L occurs. The relationship between the parasitic inductance component 14 and the current change Δid potential difference (potential variation) vL can be expressed by the following equation 1. vL = Li × (Δidd / Δt) (Equation 1) Here, Li is a value of the parasitic inductance component 14 and is a constant uniquely determined by the material and shape of the bonding wire 12 and the lead frame 13 and the like. is there. Δt represents a minute time.

The power supply voltage Vdd is applied to the semiconductor pellet 11 via the parasitic inductance component 14. Therefore, the integrated circuit on the semiconductor pellet 11
A value (Vdd-vL) obtained by subtracting the above-described potential difference (potential fluctuation) vL from the power supply voltage Vdd is added as the supply voltage Vdd0. That is, if the power supply voltage Vdd is reliably stabilized and always keeps a constant value, the supply voltage Vdd
The potential fluctuation vL of 0 has a negative value (−vL) with respect to the power supply voltage Vdd.

At the same time, the power supply wiring 18 functions as a kind of transmitting antenna. Therefore, the power supply wiring 18 induces the radiated electromagnetic wave W with the current change Δidd of the power supply current idd, and radiates it toward the surroundings. The relationship between the radiation intensity I of the radiated electromagnetic wave W and the current fluctuation Δidd can be expressed by the following equation 2. I = a × (Δid / Δt) (Equation 2) Here, a is a propagation coefficient of the radiated electromagnetic wave W, and a printing layout of the power supply wiring 18, a propagation distance and direction of the radiated electromagnetic wave W, a medium of space, and the like. It is a constant uniquely determined by

Therefore, the antenna 20 (see FIG. 1) of the present apparatus 1 is installed in an appropriate spatial position and receiving direction. Then, an induced electromotive force vA proportional to the radiation intensity I of the radiated electromagnetic wave W is generated in the antenna 20. The induced electromotive force vA depends on the structure, shape and size of the antenna 20, the LSI 10
If the relative positional relationship between the antenna 20 and the antenna 20 is constant, the following expression 3 can be used. vA = b × I (Equation 3) where b is a constant uniquely determined by the above-described conditions of the antenna 20 and the LSI 10.

Therefore, from the above equations 2 and 3, the antenna 2
An induced electromotive force vA induced to 0 is obtained, and has a relationship of the following equation 4 with respect to the above-described current fluctuation Δidd of the power supply current idd. vA = b × a × (Δid / Δt) (Expression 4) By transforming Expression 1 into Expression 4 and substituting it into (Δid / Δt), Expression 5 below is obtained. vL = − {Li / (b × a)} × vA (Equation 5)

According to this equation 5, since Li / (b × a) has a constant value, the potential difference (potential fluctuation) vL due to the parasitic inductance component 14 is proportional to the induced electromotive force vA. The induced electromotive force vA corresponds to the electric field strength E of the radiated electromagnetic wave W at the position of the antenna 20. For this reason,
From the induced electromotive force vA, the aforementioned potential difference (potential fluctuation)
vL is calculated, and the potential change vL of the supply voltage Vdd0 to the integrated circuit can be calculated back as -vL.

The calculation at this time is performed by the above-described calculation unit 40.
(See FIG. 1). Also,
Since the power supply voltage Vdd of the power supply device 90 is constant,
The supply voltage Vdd0 to the integrated circuit can be obtained by the following equation (6). Vdd0 = Vdd− {Li / (b × a)} × vA (Equation 6)

In Equations 5 and 6, various constants can be theoretically obtained by numerical analysis.
That is, based on the wiring layout information of the integrated circuit on the semiconductor pellet 14, the LSI package information such as the bonding wires 12 and the lead frame 13, the antenna information such as the structure, shape, dimensions of the antenna 20 and the receiving distance and direction from the LSI. It is.

In addition, the calibration curve of the induced electromotive force vA can be created as a time-series proportional function to the above-described potential difference (potential fluctuation) vL. To find this calibration curve, the parasitic inductance component 14
Since the value is unique to the package, the value Li is measured in advance using an LCR meter or the like. Next, the integrated circuit is activated, and the current change Δi of the power supply current idd is performed.
Measure dd. Then, the potential difference (potential fluctuation) vL between both ends of the parasitic inductance component 14 at this time is obtained from the above equation 1, and the calculation result and the induced electromotive force vA of the antenna 20 are obtained.
Is calculated.

FIG. 5 is a circuit diagram for creating a calibration curve of the calculation unit shown in FIG. The resistor R0 shown in FIG.
It is connected in series with the power supply voltage Vdd, and has a smaller value than the parasitic inductance component 14. The above-described current change Δidd can be directly obtained from the potential difference generated between both ends of the minute resistor R0. In addition to the above, other principles are used, such as measuring the intensity of an electric field or a magnetic field generated around the power supply wiring 18, appropriately calibrating the measurement result, and indirectly obtaining a current change Δidd of the power supply current idd. It is also possible.

FIG. 6 is a diagram for explaining a modification of the first embodiment shown in FIG. In this modification, the antenna 20
The basic configuration is the same as that of the first embodiment except that the structure is improved. The antenna 20 shown in FIG. 6 is formed in a planar shape as a whole, and is attached to a metal plate 21 with one surface facing the LSI 20 and the other surface facing the LSI 20. Then, the front surface of the antenna 20 is brought into contact with or close to the LSI 10 to measure the potential fluctuation vL.

7 and 8 are cross-sectional views of the structure of the antenna shown in FIG. 6 as viewed from the direction of the voltmeter (II-II '). FIG.
Shows an example of a structure in which the antenna 20 and the metal plate 21 are electrically insulated from each other and the metal plate 21 is kept at a constant potential by another power supply device 99. FIG. 8 shows a structure in which an insulating plate 22 is interposed between the antenna 20 and the metal plate 21 to ensure this insulation.

According to the antenna 20 of this modified example, the metal plate 21 added to the back surface of the antenna 20 has an effect as an electrostatic shield. Normally, unnecessary electromagnetic waves arrive at the antenna 20 from a radiation source other than the LSI 10 to be tested. However, the reception sensitivity to unnecessary electromagnetic waves can be reduced by the metal plate 21. As a result, only the radiated electromagnetic wave W from the LSI 10 can be selectively received, thereby enabling accurate measurement of the potential fluctuation vL.

Next, a second embodiment according to the present invention will be described. FIG. 9 is a block diagram showing a second embodiment of the present invention. The second embodiment is the same as the first embodiment except that a part of the package of the LSI 10 in the first embodiment is constituted by a metal cap 27 having an antenna 20.

FIG. 10 is a sectional view of the structure of the LSI shown in FIG. 9 as viewed from the direction of the arrows (III-III '). FIG.
The structure of the metal cap 27 shown in FIG. 1 has the antenna 20 on one surface facing the LSI 10 and has both ends of the antenna 20 drawn out on the other surface on the opposite side. Both ends of these antennas 20 are connection terminals 28, which are connected to the voltmeter 30 to measure the induced electromotive force vA.

FIG. 11 is a plan view of the structure of the LSI shown in FIG. 10 as viewed from the direction of the arrows (IV-IV '). According to the metal cap 27, since unnecessary electromagnetic waves from other sources described above can be shielded, the directivity of the antenna 20 with respect to the radiated electromagnetic waves W of the LSI is increased. Moreover, metal cap 2
7 is supported in the package of the LSI 10, so that the relative position and the facing direction between the semiconductor pellet 11 and the antenna 20 are always kept constant, and there is also an effect of suppressing the measurement fluctuation of the induced electromotive force vA.

[0039]

FIG. 12 is a block diagram of a first embodiment based on the first embodiment shown in FIG. The first embodiment is a non-contact type non-contact type comprising a semi-rigid circular loop antenna 220 having an electrostatic shielding function, a differential oscilloscope 230 as a voltmeter, and a personal computer 240 as a calculation unit and a display unit. It is a measuring device 200.

The logic LSI 210 is a resin-sealed QFP type having an operating frequency of 10 MHz, and is mounted on a mounting board 211 and connected to a power supply 212.
The loop antenna 220 has a loop diameter of 1 cm. The logic LSI 210 to be tested is vertically arranged above the logic LSI 210, and the lower end thereof is brought into contact with a resin-sealed package of the logic LSI 210.

The differential oscilloscope 230 uses a 400 MHz band in order to measure up to a frequency band sufficiently higher than the operating frequency of the logic LSI 210. According to the oscilloscope 230, the induced electromotive force v of the antenna 220 based on the electric field strength E of the radiated electromagnetic wave W
A is introduced and the value is measured. The oscilloscope 230 and the personal computer 240 are connected by a data line 250.

The personal computer 240 multiplies the measurement result of the transmitted induced electromotive force vA by a previously obtained conversion coefficient to obtain a potential variation of the supply voltage Vdd0 inside the logic LSI 210. Then, this potential variation is displayed on the screen 241 and stored in a predetermined area of the storage unit 242 while being organized in a predetermined data format.

FIG. 13 is a block diagram of a second example according to the first embodiment. In the second embodiment, the loop surface of the loop antenna 320 is turned sideways, and its planar front surface is arranged parallel to the upper surface of the logic LSI 210. The second embodiment is the same as the first embodiment except that the data line 250 is deleted and the oscilloscope is replaced with another differential oscilloscope 331 having a floppy (registered trademark) disk unit 232.

According to the second embodiment, the data measured by the oscilloscope 331 is transferred to the floppy disk unit 33.
2 is stored in the floppy disk. Then, the floppy disk is transferred to the storage unit 242 of the personal computer 241, and data is input to the personal computer 241 via the storage unit 242.

FIG. 14 is a front view of the loop antenna shown in FIG. 13 as viewed from the direction of the arrow (VV '). In the loop antenna 320, a metal plate 321 is superimposed on the back surface opposite to the logic LSI 210. The metal plate 321 is electrically insulated from the loop antenna 320 and is kept at the ground potential GND. Therefore, unnecessary electromagnetic waves from radiation sources other than the logic LSI 210 are shielded, and the radiation electromagnetic waves W have high directivity.

FIG. 15 is a block diagram of a third example according to the second embodiment shown in FIG. This third embodiment is similar to the first embodiment.
In place of the logic LSI in the embodiment, a part of the package is replaced with another logic LSI 410 formed by a metal cap 427. The loop antenna is replaced with another loop antenna 420 built in the metal cap 427, and the oscilloscope is replaced with another differential oscilloscope 430 having the connection probe 431. Connection probe 43
Reference numeral 1 denotes a unit that can conduct with the connection terminal of the loop antenna 420.

Further, the personal computer has a configuration in which a personal computer 440 having a conversion coefficient database in its storage section 442 is substituted. Other configurations are the same as those of the first embodiment. The database in the storage unit 442 includes the wiring layout information of the integrated circuit on the semiconductor pellet 14 and the LSI such as the bonding wire 12 and the lead frame 13.
A search key is formed by combining the antenna information such as the package information, the structure, the shape, and the size of the antenna 20 and the reception distance and direction from the LSI.

Therefore, the induced electromotive force vA of the loop antenna 420 is stored in the database according to these search keys.
And conversion coefficients for the potential fluctuation of the supply voltage Vdd0 in the logic LSI 410 are arranged and stored. As these conversion coefficients, numerical values obtained in advance based on the above-described theoretical values or calibration values may be used.

According to the third embodiment, for example, the package model number of the logic LSI 410 is used as LSI package information, and measurement conditions based on antenna information are specified and input to the personal computer 441. The personal computer searches the database according to these pieces of information, selects an appropriate conversion coefficient, and multiplies the time-series data P from the oscilloscope 430 by multiplication. Therefore, appropriate measurement can be performed more easily than ever before even for various LSI packages and measurement conditions.

FIG. 16 is a block diagram of a fourth embodiment according to the second embodiment. This fourth embodiment uses an electrostatic shield type loop antenna 520 instead of the loop antenna of the third embodiment, and replaces the metal cap with
The third embodiment is the same as the third embodiment except that a metal cap 527 attached to the loop antenna 520 is used.

According to the metal cap 527, the loop antenna 520 itself is of an electrostatic shielding type and has a function of applying a reference potential to the metal cap 527 to the connection terminal 528 of the loop antenna 520. .
It should be noted that the present invention is not limited to the above embodiments, and it is obvious that the embodiments can be appropriately modified within the scope of the technical idea of the present invention.

[0052]

As described in detail above, according to the LSI non-contact measuring device of the present invention, the LS
The radiated electromagnetic wave is measured over time by an antenna arranged near the LSI without the need to open the I package, and the time series data is multiplied by a predetermined conversion coefficient. Therefore, L
It is possible to provide a simple LSI non-contact measurement device capable of non-contact measurement of potential fluctuations generated in the internal power supply wiring without removing the sealing structure of the SI.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a first embodiment of an LSI non-contact measurement device according to the present invention.

FIG. 2 is a perspective view of a main part inside the LSI shown in FIG. 1;

FIG. 3 shows the parasitic inductance component shown in FIG.
FIG. 7 illustrates a process in which a potential change occurs in a power supply wiring.

FIG. 4 is a time chart showing a relationship between a power supply current and a potential change shown in FIG. 3;

FIG. 5 is a circuit diagram for creating a calibration curve of the calculation unit shown in FIG. 1;

FIG. 6 is a view for explaining a modification of the first embodiment shown in FIG. 1;

FIG. 7 shows the structure of the antenna shown in FIG.
-II ') sectional drawing seen from.

FIG. 8 shows the structure of the antenna shown in FIG.
-II ') sectional drawing seen from.

FIG. 9 is a block diagram showing a second embodiment of the present invention.

FIG. 10 shows the structure of the LSI shown in FIG.
Sectional drawing seen from the direction of I ').

FIG. 11 shows the structure of the LSI shown in FIG.
FIG. 5 is a plan view seen from the direction of V ′).

FIG. 12 is a configuration diagram of a first example according to the first embodiment of the present invention.

FIG. 13 is a configuration diagram of a second example according to the first embodiment of the present invention.

14 is a view of the loop antenna shown in FIG.
The front view seen from the direction of V ').

FIG. 15 is a configuration diagram of a third example according to the second embodiment of the present invention.

FIG. 16 is a configuration diagram of a fourth example according to the second embodiment of the present invention.

FIG. 17 is a diagram illustrating a potential fluctuation observation device according to a conventional example.

FIG. 18 is a diagram illustrating a potential fluctuation observation device according to another conventional example.

[Explanation of symbols]

1 200.300.400. Large-scale integrated circuits (LS
I) Non-contact measurement device 10 Large-scale integrated circuit (LSI) 11 Semiconductor pellet 12 Bonding wire 13 Lead frame 14 Parasitic inductance component 17 Terminal section 18 Power supply wiring 19 Wiring pad 20 Antenna 21 Metal plate 27 Metal cap 30 Voltmeter 40 Calculation unit 50 Display unit P Time series data V Potential fluctuation vA Induced electromotive force

Claims (6)

[Claims] 1. A non-contact measurement device for non-contactly measuring a potential change occurring in a power supply wiring inside a large-scale integrated circuit from above the large-scale integrated circuit, the electromagnetic wave radiated from the power supply wiring being received. Therefore, an antenna placed near the semiconductor pellet, a voltmeter that measures the induced electromotive force induced in the antenna over time, and a multiplication factor multiplied by the induced electromotive force measured by the voltmeter,
A non-contact measurement device for a large-scale integrated circuit, comprising: a calculation unit for calculating a potential change of the large-scale integrated circuit. 2. The non-contact test apparatus for a large-scale integrated circuit according to claim 1, wherein the conversion coefficient of the calculation unit is a proportional constant to an induced electromotive force. 3. The antenna according to claim 1, wherein the flat surface is arranged parallel to the power supply wiring surface toward the semiconductor pellet, and a metal plate is superposed on the back surface of the antenna to be electrically insulated from the antenna portion. 2. A non-contact measuring device for a large-scale integrated circuit according to claim 1, wherein said non-contact measuring device is maintained at a potential of. 4. A non-contact measuring device for non-contactly measuring a potential change generated in a power supply wiring inside a large-scale integrated circuit from above a semiconductor pellet, wherein the apparatus receives electromagnetic waves radiated from the power supply wiring. An antenna attached to the package of a large-scale integrated circuit with the front surface formed in a planar shape facing the semiconductor pellet, and a connection terminal through which the induced electromotive force generated in this antenna is led to the outside, and the back surface of the antenna is covered A metal cap that is electrically insulated from the antenna portion while maintaining a constant potential, a voltmeter that measures the induced electromotive force induced in the antenna over time, and a result of measuring the induced electromotive force with this voltmeter. A non-contact measurement device for a large-scale integrated circuit, comprising: a calculation unit for multiplying the conversion factor by a conversion coefficient to calculate a potential change of the large-scale integrated circuit. 5. The conversion coefficient of the calculation unit is obtained by multiplying a current change in a power supply wiring of a large-scale integrated circuit by an inductance component parasitic on the power supply wiring of the large-scale integrated circuit, and dividing the result by an induced electromotive force generated in the antenna. The non-contact measuring device for a large-scale integrated circuit according to claim 4, wherein 6. The calculation unit stores a plurality of combinations of a package structure of a large-scale integrated circuit, types and arrangement conditions of antennas, and conversion coefficients of measurement results of a voltmeter, and, based on these combinations, The non-contact measurement apparatus for a large-scale integrated circuit according to claim 4, wherein one conversion coefficient is determined based on a condition at the time of calculation.