JP3606546B2 - High spatial resolution near-field probe or near-field probe system - Google Patents

Description

[0001]
[Industrial application fields]
The present invention is a printed wiring board that detects electromagnetic noise from various electric and electronic devices such as electronic copying machines, facsimiles, printing machines, personal computers and other office equipment, household electrical equipment, industrial equipment, etc., and is embedded in the apparatus. Detecting noise from the electromagnetic field, etc., and using EMC magnetic field countermeasures and electromagnetic interference countermeasure inspection equipment, especially in close proximity to the object to detect the near magnetic field necessary to identify the noise source current. The present invention relates to a so-called near-field probe for detecting the above.
[0002]
[Prior art]
Conventionally, EMC countermeasures include a method of taking countermeasures based on the results of measuring electromagnetic waves in a distant place such as 10m, 30m, etc. in an open site or anechoic chamber defined by legal regulations using a predetermined antenna. On the other hand, there is another method in which an electromagnetic field from the target device is detected by a probe that is brought into close proximity before measurement at such an authentication site, and necessary measures are taken based on the detection result.
As a means for detecting electromagnetic noise, there are a type that is used by wrapping around a cable like a current probe, and a type that uses a probe that detects a current close to a relatively large object using a winding as a loop coil (Credence). Company probe: US577974)
However, a so-called near-field probe is used to detect minute electromagnetic noise from a printed wiring board with high accuracy, and an example thereof is disclosed in Japanese Patent Application Laid-Open No. 62-106379. This is configured to detect a signal generated only by a magnetic field in a symmetrical loop coil and a circuit in a shield box subsequent thereto. Moreover, in what is described in Unexamined-Japanese-Patent No. 7-191058, the sensor formed by etching on the flexible substrate and the output connector were provided at the tip of the elbow. In what is described, the near-field probe is formed of a printed circuit board, and a shield is provided. Furthermore, “EMI probe” described in Japanese Utility Model Laid-Open No. 4-67977
Is a probe composed of a metal wire coil, a connector, and a resistor, which is provided with a cone-shaped shield plate having a generally widened opening for an electromagnetic noise measurement target, or a shield plate having a partially opened opening. .
Further, although not known, there is also one disclosed in Japanese Patent Application No. 9-059267. This thing is
It is configured to apply the minimum necessary shield to the transmission path section that continues from the coil. By creating a near-field probe with a thin film, providing a shield on the transmission path, and making the transmission path a triplate structure , Which reduces measurement errors.
[0003]
Further, there is one of Japanese Patent Application No. 10-39797, which is a near-field probe that can be positioned, in which a coil portion is laminated and a part thereof is used as a positioning sensor to increase positioning accuracy. It is a thing.
Furthermore, as known ones, Japanese Patent Application Laid-Open No. 7-159378 (Patent No. 2882316) describes a leakage magnetic flux detection device and a switching power supply device.
This is a leakage magnetic flux detection device in which the detection probe is composed of at least a pair of individual coils and detects the magnetic flux leakage by the electromagnetic induction method, so that one of the individual coils is in a phase opposite to that of the other individual coil. In addition, each individual coil was connected to a differential amplifier by a lead line, and by this differential amplifier, the addition calculation of the leakage magnetic flux signal component of each individual coil and the subtraction calculation of the noise component of each individual coil were performed simultaneously. It is configured to obtain an amplified signal.
[0004]
On the other hand, a current probe for detecting the current flowing through the cable has been used in the past. However, in order to detect the current flowing through the PCB or the like in order to take an EMC measure, the wiring on the printed circuit board is cut off and the extra current is detected. Therefore, it is necessary to provide a new lead line and the like, and due to an error in the circuit for routing, the measurable frequency range is low and it cannot be applied to a substrate mounted at high density. In addition, in the magnetic field and current probe of the credence company in which the magnetic field detection loop coil is brought close to the loop coil, the loop coil is constituted by windings, and a high resolution enough to detect the current flowing through the pins of the LSI cannot be realized. In US Pat. No. 5,773,974 of the company, the coil portion of this magnetic field probe is described as an inductive antenna in the claims, but it is questionable whether this can achieve high resolution.
[0005]
[Problems to be solved]
Therefore, the present invention provides a near-field probe or a near-field probe that can detect electromagnetic noise and current with a simple configuration and high sensitivity and high resolution without picking up extraneous noise depending on the measurement target in a magnetic field detection probe having a loop coil. The challenge is to devise the system.
[0006]
[Measures taken to solve the problem]
Means of the present invention for solving the above problems are as follows.
[Solution 1]
The solution 1 is that the near-field probe composed of the loop coil and the transmission path is integrally covered with a conductive member by providing an opening on the tip coil side of the detection unit.
This solution 1 is a structure that has been tried in a performance test, and this provides a simple and effective shielding method and structure.
[Solution 2]
Solution 2 is that the near magnetic field probe that is integrally covered with the conductive member to the vicinity of the tip coil is arranged so that the distance between the tip coil arrangement surface arranged on the plane and the conductive member is matched to the measurement target interval. .
The solution 2 is obtained by applying the solution obtained by the solution 1 to a structure for obtaining a higher spatial resolution, and a high spatial resolution can be obtained by adjusting the distance above the coil.
[Solution 3]
The solving means 3 includes a conductive member that is disposed with a gap between the tip position of the tip coil arranged on the plane and the placement surface of the tip coil, with respect to the near-field probe integrally covered to the vicinity of the tip coil with the conductive member. That is, the position of the tip is arranged according to the measurement object.
As a result, the exposed area of the coil can be optimized.
[0007]
[Solution 4]
Solution 4 is a near magnetic field probe comprising a loop coil and a transmission path of Solution 1 to Solution 3, wherein a pad is provided following the transmission line, a connector is provided at the connection, a coaxial cable is connected, The coaxial cable is connected to a circuit unit that integrates and the near magnetic field probe system further outputs the output from the circuit unit through the coaxial cable. The circuit unit is a signal processing unit, and the signal processing unit performs signal processing such as integrating the differential waveform into a real-time current waveform.
[Solution 5]
The solution means 5 is the solution means 4 in which the integration circuit part composed of the chip parts is directly connected to the transmission line part, the pad part is provided at the output part of the integration circuit part, and the connector is provided at the connection part. That is, a near magnetic field probe system is configured by connecting a coaxial cable to the connector.
[Solution 6]
Solution means 6 is that, in Solution means 4, a signal processing circuit section such as an integration circuit is formed integrally with a transmission line section on a semiconductor substrate.
[0008]
[Solution 7]
Solution 7 is a probe according to Solution 1 to Solution 3, in which a coaxial cable having a connector is connected to the connection portion, and a probe tip is connected to a holding member to constitute a pen-type probe.
The probe can be operated by holding the holding member by hand, or it can be brought close to the measurement object in a state where the holding member is supported by a support member.
[Solution 8]
Solution 8 is a solution in which the support member of the near-field probe is a conductive member in Solution 7;
The shield member is provided integrally therewith.
[Solution 9]
Solution 9 is that, in Solution 1 to Solution 3, the probe tip is attached to at least two surfaces of the holding member having a plurality of surfaces.
Thereby, the vector amount can be detected and error correction can be performed.
[0009]
[Solution 10]
The solution 10 is that an amplifier unit is connected to the probe or probe unit according to solution 1 to solution 3 and solution 7 to solution 9, and further connected to a measuring instrument to constitute a measurement system.
As a result, the gain can be increased by the amplifier to facilitate connection to the oscilloscope or the like, and the impedance can be changed by the amplifier to improve the degree of freedom in probe design.
[Solution 11]
The solution means 11 is a measurement system in which a probe unit in which a large number of probes according to the solution means 1 to solution means 3 and solution means 7 to 9 are arranged in parallel on the holding substrate is connected to the amplifier unit, and further connected to a measuring instrument. It is to have constituted.
As a result, it is possible to make an array and simultaneously measure a large number of measurement objects, and to perform parallel contact measurement or distribution measurement.
[Solution 12]
The solving means 12 is the probe of the solving means 1 to 3 or the probe unit having the angle correcting function of the solving means 9, the probe unit having the amplifier function of the solving means 10 or the probe array of the solving means 11, and these are XYZ. The measurement system is composed of the three-dimensional movement means and the measurement unit for detecting signals obtained by the probe, the probe unit, and the probe array.
This makes it possible to measure the real-time current distribution of a circuit such as an LSI.
[Solution 13]
The solving means 13 is the probe or the probe unit of the solving means 1 to 3, the solving means 9, and the solving means 10, sampling its output at regular intervals, executing the sum of the outputs, and integrating each time Is provided with an integration circuit or a signal processing circuit.
This eliminates the need for adjustments such as drift, and allows measurement data to be directly output to a computer such as a personal computer.
[0010]
【Example】
Next, examples will be described with reference to the drawings.
Example 1 is an example of a near-field probe according to Solution 1 and is manufactured as follows by the procedure shown in each drawing of FIG.
The loop coil 1, transmission line 2 (parallel line type), and pad part 3 at the probe tip are made of conductive foil. First, a sheet is cut into a desired shape,
The loop coil 1, the transmission line portion 2, and the pad portion 3 are manufactured, and then bonded onto an insulating substrate 4 such as a glass epoxy substrate. In this example, the insulating material 5 and the conductive metal foil 6 are bonded together as a support material (FIGS. 1A, 1B, 1C). Thereafter, the connector 7 is further connected to the pad connecting portion 3 with solder or the like, and the coaxial cable 8 is connected (FIGS. 2A and 2B). For the transmission line, a coplanar type is used. Moreover, it can also be set as a microstrip type | mold by setting it as a double-sided board | substrate. Then, a near-field probe system that can be connected to a measuring instrument such as an oscilloscope is formed by integrally providing a conductive member 9 made of a metal foil such as A1, Cu so as to cover the entire probe (external shield). (Fig. 3 (a), (b)
, (C)). At that time, the conductive member 9 may be configured not to cover the loop coil 1 at the tip (FIGS. 4A, 4B, and 4C), or may be configured to have a shield on the front surface. (FIG. 5 (a), (b), (c)). If this shield member is about 100 μm, a support plate for holding the outer shape may be used, and if it is about 0.5 mm, a structure that also serves as a cover can be used.
Moreover, when covering with the conductive member 9, that is, the metal foil, an insulating member is provided in advance, so that a short circuit between the probe portion and the metal portion can be avoided. Therefore, the shield member can be formed in close contact, and the overall shape can be reduced. By covering with the conductive member 9 as compared with the conventional type, that is, by providing the shield member, there is no extra magnetic flux linkage, and a highly sensitive probe is realized.
[0011]
Example 2
The second embodiment shown in FIGS. 6, 7 and 8 is an embodiment of the near-field probe by the solution means 2, and is the same procedure as FIGS. 1A, 1 </ b> B, and 1 </ b> C of the first embodiment. A probe in which a connector unit 11 of a signal processing unit including the integrating circuit unit 10 provided on the back surface and a pad unit of a parallel line unit are connected by a coaxial cable 12 (FIGS. 6A and 6B)
The conductive member 9 is provided so as to cover a part or all of the loop coil at the tip (FIGS. 7A, 7B and 7C). The distance E between the arrangement surface of the loop coil at the tip of this and the conductive member 9 is set in accordance with the minimum pitch of the wiring on the PCB substrate to be measured. For example, if the dimension of the loop coil at the tip is 2 mmφ, the minimum pitch of the wiring on the PCB substrate is O.D. If it is 5 mm, the interval E is set to 0.5 mm, and if the minimum pitch of the wiring is 1 mm, the interval E is set to 1 mm. By setting the interval E in this way, the magnetic field from the signal generator can be mainly detected, so that an optimum high-resolution probe corresponding to the measurement object is realized.
[0012]
Example 3
The third embodiment shown in FIG. 9 or FIG. 10 is an example of a near-field probe by the solution means 3, and for the probe manufactured in the same manner as that of the second embodiment, the tip position and tip coil of the tip loop coil arranged in a plane. The position of the front end portion of the conductive member 9 arranged at a distance from the arrangement surface of the electrode is arranged in accordance with the measurement object (arrangement interval E1)
The conductive member 9 is provided so as to cover a part or all of it. The position of the tip of the conductive member disposed at this time is experimentally determined according to the object to be measured and disposed. For example, if the dimension of the tip coil portion is 2 mmφ and the minimum pitch of the PCB wiring is 0.5 mm, the interval E is first set to 0.3 mm, and the difference between the position of the coil tip portion and the conductive member (placement interval) E1) is set to 0.2 mm (FIGS. 9A, 9B, and 9C), and if the minimum pitch of the wiring is 1 mm and the interval E is also 0.3 mm, the arrangement interval E1 is set to 0. 0. It can be set to 7 mm (FIGS. 10A, 10B, and 10C). This value is set by obtaining a dimension from actual measurement in accordance with the measurement object.
The conductive member having such a design can further shield an external magnetic field and can limit the detection region according to the target measurement target, thereby realizing an optimum high-resolution probe.
[0013]
Example 4
The fourth embodiment shown in FIG. 11 is a near-field probe based on the solving means 4 having an integrating circuit.
A connector is connected to the connection part of the pad of the near-field probe manufactured in the same manner as in Example 1, Example 2, and Example 3 by soldering or the like, and a coaxial cable is connected. Further, FIGS. ) Is provided on the same glass epoxy substrate as in the case of
A coaxial cable is connected to the input connector portion, and the coaxial cable 11 is connected from the integrating circuit portion to the output connector portion. Thereafter, a conductive member 9 using a metal foil such as A1, Cu is provided and completed (FIGS. 11 (a), (b), (c)), and the coaxial cable 11 is connected to a measuring instrument such as an oscilloscope. A near-field probe system capable of measuring a real-time waveform is configured (note that the DC power supply for the integration circuit is omitted).
The signal from the loop coil, which is a differential waveform, is signal-processed by the integrating circuit 10 so that real-time detection of the current flowing in the planar wiring such as a PCB can be performed without adding extra elements or providing a lead line. It becomes possible. In addition, the loop coil at the probe tip,
With respect to the transmission line and the pad portion, the same process as a normal printed circuit board manufacturing process can be performed. The integration circuit unit may be another signal processing unit as required.
[0014]
Example 5
The fifth embodiment shown in FIGS. 12 and 13 is an example of the solving means 5, that is, a specific example of the integrating circuit section.
In the same manner as in Example 1, Example 2, Example 3, etc., a loop coil and a transmission line at the probe tip are manufactured in the same process as the normal printed circuit board manufacturing process. A wiring pattern provided with a chip component connection pad 3 and an output connector pad 13 for constituting the integrating circuit 10 is provided simultaneously. A chip component (integration circuit 10) and a connector 11a are connected to the wiring pattern portion by soldering or the like, and a coaxial cable 11 is connected to the connector 11a (FIG. 12A,
(B)) Further, the entire probe part is integrally covered with a metal foil (conductive member 9) such as Al or Cu (FIGS. 13A and 13B), and the coaxial cable 11 is attached to a measuring instrument such as an oscilloscope. Connected to form a near-field probe system capable of measuring a real-time waveform (however, the illustration of the DC power supply for the integration circuit is omitted in the figure). In this way, a small probe is configured. In addition, after forming Al or the like as a conductive thin film on the quartz substrate that is the insulating substrate 4, the same wiring pattern as before can be realized even after passing through a photolithography etching step according to a normal semiconductor process, Further, the same can be realized by connecting the chip component and the connector with a conductive adhesive.
In this case, the integrating circuit 10 can exhibit a sufficient function by providing a differential amplifier, feeding back its output, and providing a chip capacitor having excellent high frequency characteristics in its path. As an example of the integration circuit unit, the one shown in FIG. 14 may be used. When another signal processing unit needs to be provided, this may be provided in accordance with the production of the integration circuit unit.
[0015]
Example 6
The sixth embodiment shown in FIGS. 15 to 18 is an example of the integration circuit section of the solving means 6.
An integration circuit portion is formed in advance on a semiconductor substrate such as Si and GaAs by a normal semiconductor process, and further an insulating layer and a through hole 12 are formed (FIGS. 15A, 15B, 16A, 16A, 16B). b)). Then, after forming the loop coil 1 and the transmission line 2 at the tip of the probe with a conductive metal such as Al on a semiconductor substrate such as Si or GaAs where the integration circuit portion is formed instead of the quartz substrate in Example 5, The integration circuit unit 10 manufactured through a normal photolithography process and the probe tip are connected. In addition, the probe tip portion is formed on the quartz substrate as in the fifth embodiment, and the same can be realized by flip-chip mounting or the like. Thereafter, after mounting on the coaxial cable connector 11a, the coaxial cable 11 is connected (FIGS. 17 (a) and (b)), and the entire probe portion is integrally formed with a conductive member such as Al or Cu ( Shield with metal foil 9 (FIGS. 18A and 18B). By connecting this to a measuring instrument such as an oscilloscope, a near-field probe system capable of measuring a real-time waveform is constructed.
In this embodiment, the whole is further reduced in size, and for example, a near-field probe capable of detecting the current of the wiring pattern dimensions inside the LSI is manufactured. A signal processing unit other than the integration circuit unit can be configured in the same manner.
[0016]
Example 7
A seventh embodiment shown in FIGS. 19 and 20 is a pen-type near-field probe by the solution means 7.
In the seventh embodiment, a probe portion having an integration circuit portion formed on the Si substrate of the sixth embodiment and a conductive member made of a metal foil such as A1, Cu are provided, and the integrated probe tip portion is provided. The holding member 14 is connected with an epoxy adhesive such as Araldite. The material of the holding member 14 may be plastic, metal, glass, etc., and may be determined in consideration of the material of the substrate at the probe tip and the presence or absence of conductivity. As the shape, it is preferable to make it easy to hold it by hand and to make it close to the measurement location, or to make the substrate itself forming the loop coil easy to contact (FIGS. 19A and 19B). A near-field probe system is configured by connecting a coaxial cable to the connector at the probe tip and connecting it to a measuring instrument such as an oscilloscope (FIGS. 20A and 20B).
This near-field probe system allows you to check the current that flows in a planar wiring such as a PCB without adding extra elements or providing a lead wire. The current signal can be easily measured by bringing it to the part. It is possible to use a method of temporarily fixing the probe tip to a target location by processing the tip of the probe or using an adhesive or the like.
Further, a support member 15 is provided, the holding member 14 is fixed to the support member 15, and the current signal is easily detected by fixing the holding member 14 in a state where it is brought into contact with a target portion without processing the tip of the probe. It is also possible.
[0017]
Example 8
Example 8 shown in FIG. 21 is a near-field probe by means 8 for solving. The probe tip integrated with the integration circuit part formed on the Si substrate of Example 6 is held with an epoxy adhesive such as Araldite. 14 is connected. A conductive member is used as the material of the holding member, and a conductive member made of a metal foil such as A1, Cu is provided on the holding member so as to be integrated. It is preferable that the entire shape is easily brought close to the measurement location, or the substrate itself forming the loop coil is easily brought into contact with the measurement location. A near-field probe system is configured by connecting the coaxial cable 11 to the connector at the probe tip and connecting it to a measuring instrument such as an oscilloscope.
Real-time waveform detection is possible, and it is possible to detect and check the current flowing in a planar wiring such as PCB without adding extra elements or providing a lead line. Similar to the probe, the current signal can be easily measured by simply holding the tip of the near-field probe to the target portion on the oscilloscope.
In addition, the method of fixing the probe tip part temporarily or using a bonding material or the like to a target place can be used, or a support member is provided, and the holding member 14 is fixed to the support member. The current signal can be easily detected by bringing the tip of the probe into contact with the measurement target portion without processing the tip.
[0018]
Example 9
The ninth embodiment shown in FIGS. 22 and 24 is an example of a current detection system using the solving means 9, and two or more probe tips in the seventh embodiment are attached to the holding member 14 (FIGS. 22A and 22B). b), (c)), one of the probe tips is placed parallel to the support substrate, and the other probe tip is placed vertically and attached. The magnetic field components generated by the currents are detected at the two probe tip portions, and the detection signal is fed back, thereby correcting the angle deviation at the time of contact. According to this current detection probe system, it is possible to detect a highly accurate current value with a small absolute value error by synthesizing the vectors detected by the two probe tips (FIG. 24).
In addition, the display unit displays the output of one probe and the output of the other probe,
And the value which carried out the square average of both outputs is output to a measuring device. In addition, the probe is held in parallel with the support member 15 at the measurement location so that the indicated value on the display unit is as large as possible.
[0019]
Example 10
The embodiment 10 shown in FIG. 25 is based on the solving means 10, and is a unit in which a probe (for example, FIG. 8) provided with an integration circuit as in the embodiment 2 and an amplifier is unitized, and the probe and amplifier are unitized. As a result, it can be directly connected to a measuring instrument such as an oscilloscope having a normal gain, and the real-time current flowing through the LSI on the PCB can be sufficiently detected. Further, since the impedance can be easily changed by connecting an amplifier and the degree of freedom of design increases, the setting of the dimensions of each part of the probe can be appropriately changed according to the measurement object.
[0020]
Example 11
In the eleventh embodiment shown in FIG. 26, a number of probes (for example, FIG. 8) provided with integrating circuits such as those of the second embodiment are arranged in parallel, and a plurality of probes flowing in a flat cable are sequentially switched by a switch. Can be detected simultaneously. Depending on the dimensions, it is possible to arrange a large number of probes corresponding to the pins of the LSI, and in this way, for example, it is possible to simultaneously measure current values for a large number of address data lines.
[0021]
Example 12
The embodiment 12 shown in FIG. 27 is based on the solving means 12, and the probe (FIGS. 18A and 18B) of the embodiment 6 is supported on the movable stage 16 that moves in the XYZ directions that can be moved minutely. By moving the probe minutely by the moving stage 16, it is possible to measure the real-time current at any number of positions in the wiring in the LSI and measure the current value distribution.
[0022]
Example 13
The thirteenth embodiment shown in FIG. 28 is based on the solving means 13, and the detection signal from the probe is sampled at regular intervals by the sampling unit, integrated by the integrating unit, or AD converted by the AD converting unit and output. It can be done. As a result, it is possible to directly output to a computer such as a personal computer without adjusting drift.
[0023]
【The invention's effect】
According to the probe of the present invention, the shield member is integrated with the outside of the probe portion,
Excessive noise can be eliminated by providing an opening only on the measurement target side, and an extremely small current signal (differential waveform) can be detected. In addition, according to the inventions according to claim 2 and claim 3, by adjusting the position of the shield member, signals from a region narrowed down to a narrower measurement object can be mainly detected, so that higher resolution can be realized.
According to the invention of claim 4, by providing a signal processing unit such as an integration circuit, a high-frequency real-time current waveform or the like is obtained, and signal analysis is facilitated.
According to the invention of claim 5, the entire probe can be reduced in size because it is constituted by a chip component, and the probe tip and the integration circuit unit are monolithically reduced by the invention of claim 6, thereby further reducing the size of the entire probe. it can.
[0024]
In the inventions according to claims 7 and 8, since the probe can be held by hand or using a simple fixing jig, the measurement location should be specified → measurement → moved while visually observing. This improves the workability during measurement.
According to the invention of claim 9, since the probe is arranged at two different angles, information equivalent to the angle at the time of fixation can be detected. Measurement error can be reduced.
Since the amplifier or the impedance conversion device is provided according to the invention of claim 10, a smaller current source can be detected. In addition, it is possible to design the dimensions of each part of the probe in accordance with the measurement target.
By arranging the probes in parallel according to the invention according to claim 11, the parallel signal lines of the LSI can be measured simultaneously, and the probe according to the invention according to claim 12 can be minutely moved in three dimensions. It becomes possible to measure the current distribution in the region.
According to the thirteenth aspect of the present invention, the probe output is digitized in advance, so that no drift adjustment is required and it can be output to a computer.
[Brief description of the drawings]
1A is a plan view showing a production procedure 1 of Example 1, FIG. 1B is a plan view showing a production procedure 2, and FIG. 1C is a plan view showing a production procedure 3;
2A is a side view showing a production procedure 4 of Example 1, and FIG. 2B is a plan view showing the production procedure 4. FIG.
3A is a front view of Example 1 of the probe of Example 1, FIG. 3B is a side view of Example 1, and FIG. 3C is a plan view of Example 1. FIG.
4A is a front view of another example 2 of the probe of Example 1, FIG. 4B is a side view of Example 2, and FIG. 4C is a plan view of Example 2. FIG.
5A is a front view of yet another example 3 of the probe of Example 1, FIG. 5B is a side view of Example 3, and FIG. 5C is a plan view of Example 3. FIG. .
6A is a front view showing a production procedure 4 of Example 2, and FIG. 6B is a plan view showing the production procedure 4. FIG.
7A is a front view of Example 1 of the probe of Example 2, FIG. 7B is a side view of Example 1, and FIG. 7C is a plan view of Example 1. FIG.
8A is a front view of another example 2 of the probe of Example 2, FIG. 8B is a side view of Example 2, and FIG. 8C is a plan view of Example 2. FIG.
9A is a front view of Example 1 of the probe of Example 3, FIG. 9B is a side view of Example 1, and FIG. 9C is a plan view of Example 1. FIG.
10A is a front view of another example 2 of the probe of Example 3, FIG. 10B is a front view of the example 2, and FIG. 10C is a plan view of the example 2;
11A is a front view of Example 1 of the probe of Example 4, FIG. 11B is a side view of Example 1, and FIG. 11C is a plan view of Example 1. FIG.
12A is a side view of the probe unit of Example 5, and FIG. 12B is a plan view of the probe.
FIG. 13 (a) is a side view of the probe of Example 5 with a shield, (b)
Is a plan view of the probe.
FIG. 14 is an equivalent circuit diagram of an integrating circuit unit according to the fifth embodiment.
FIG. 15A is a plan view showing a manufacturing process 1 of Example 6, and FIG. 15B is the same side view.
16 (a) is a plan view showing a manufacturing process 2 of Example 6, and FIG. 16 (b) is a side view thereof.
17A is a plan view of a probe unit according to Embodiment 6, and FIG. 17B is a side view thereof.
18 (a) is a plan view of a probe of Example 6 with a shield, and FIG. 18 (b)
Is the same side view.
FIG. 19A is a plan view of a pen-type near-field probe of Example 7, and FIG. 19B is a side view thereof.
FIG. 20 is a side view of an example of using the pen-type near-field probe according to the seventh embodiment.
FIG. 21 (a) is a plan view of a probe of Example 8, and FIG. 21 (b) is a side view thereof.
22A is a plan view of a current detection system of Example 9, FIG. 22B is a side view of a probe in the current detection system, and FIG. 22C is a bottom view of the probe.
FIG. 23 is a side view of a usage example of the current detection system according to the ninth embodiment.
FIG. 24 is a conceptual diagram illustrating an example of an angle correction method according to the ninth embodiment.
25A is a side view of Example 10, FIG. 25B is a plan view of the example, and FIG. 25C is a front view of the example.
FIG. 26 is a side view of a usage example of the current detection system according to the eleventh embodiment.
FIG. 27 is a side view of an example of use of the current detection system according to the twelfth embodiment.
FIG. 28 is a conceptual diagram of an integrating circuit unit according to a thirteenth embodiment.
[Explanation of symbols]
1: Loop coil
2: Parallel line section
3: Pad part
4: Insulating substrate
5: Insulation sheet
6: Conductive metal foil
7: Connector
8: Coaxial cable
9: Conductive member
10: Integration circuit section
11: Coaxial cable
11a: Connector for coaxial cable
12: Through hole
13: Pad for connection
14: Holding member
15: Support member
16: Moving stage

Claims (13)

A near-magnetic field probe comprising a loop coil and a transmission line, wherein an opening is provided on a tip coil side of a detection unit with a conductive member, and the whole is integrally covered. In a near-field probe that is integrally covered with a conductive member up to the vicinity of the tip coil, the near-field probe is characterized in that the spacing between the tip coil arrangement surface and the conductive member arranged in a plane is set in accordance with the distance to be measured. . In the near-field probe integrally covered with the conductive member up to the vicinity of the tip coil, the position of the tip of the conductive member arranged at a distance between the tip position of the tip coil placed on the plane and the placement surface of the tip coil A near-field probe characterized by the placement of the 4. A near magnetic field probe comprising a loop coil and a transmission line according to claim 1, wherein a pad portion is provided following the transmission line, a connector is provided at the connection portion, a coaxial cable is connected, and a signal is integrated. A near-field probe system that connects the coaxial cable to the circuit and outputs the output from the circuit section via a coaxial cable. Connected to a circuit unit that integrates a signal composed of chip parts directly from the transmission line unit, and further provided a pad unit at the output unit of the integration circuit unit and a connector at the connection unit to connect a coaxial cable. Item 5. The near-field probe system according to Item 4. 5. The near-field probe system according to claim 4, wherein the signal processing circuit section including integration is formed integrally with the transmission line section on the semiconductor substrate. Connect the probe tip with a coaxial cable with a connector to the connection part and connect the tip to the holding member, hold the holding member by hand, or operate it close to the object to be measured using the support member The pen-type near-field probe according to claim 1, wherein the pen-type near-field probe can be made to operate. The near-field probe according to claim 8 or 7, wherein the support member is a conductive member, and the shield member is provided integrally therewith. 4. The near magnetic field probe according to claim 1, wherein a probe tip is attached to at least two surfaces of a holding member having a plurality of surfaces. A measurement system in which an amplifier is connected to the near magnetic field probe according to any one of claims 1 to 3 and claims 7 to 9, and a measuring instrument is further connected. A probe unit in which a number of near-field probes according to claims 1 to 3 and claims 7 to 9 are arranged in parallel on a holding substrate is connected integrally with an amplifier unit,
A measurement system connected to a measuring instrument. A probe unit having an angle correction function according to any one of claims 1 to 3 or claim 9, a probe unit having an amplifier function according to claim 10, or a probe array according to claim 11, and moving them in three dimensions of XYZ A measurement system comprising means and a measurement unit for detecting signals obtained by a probe, a probe unit, and a probe array. An integration circuit or signal processing that samples the outputs of the probes or probe units of claims 1 to 3, 9, and 10 at regular intervals, sums the outputs, and integrates at each time. A measurement system with a circuit.

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