JP2001091557A - Method for inspecting electronic parts and jig therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for inspecting electronic parts by which a number of electronic parts can be inspected efficiently. SOLUTION: This inspection method is used to inspect a module 1 by connecting the module 1 to be measured to an inspection table 3, and it includes a step to fit the module 1 to a holding member 2 by which the module 1 is held on the inspection table 3, and a step to connect the module 1 to the inspection table 3 by fitting to the inspection table 3 the holding member 2 to which the module 1 is fitted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection method for inspecting an electronic component such as an infrared data communication module and an inspection jig used for the inspection method.

[0002]

2. Description of the Related Art Heretofore, it has been used in portable information devices and notebook personal computers, etc., and an I / O is required between these devices or peripheral devices such as a printer.
Infrared data communication by rDA is performed. In the infrared data communication, an infrared data communication module (hereinafter, referred to as an infrared data communication module) including an infrared light emitting element and a light receiving element, and an LSI chip for controlling the light emitting element and the light receiving element.
Simply referred to as “module”).

[0003] Such a module is manufactured through a predetermined manufacturing process, and a function test for checking whether or not it has a predetermined function is performed before manufacturing and before shipping. This functional inspection is performed over the entire number of manufactured modules for quality assurance, and the items of the functional inspection include, for example, the light emitting intensity of the light emitting element, the receiving sensitivity of the light receiving element, and the operation check of the LSI chip. No.

FIG. 12 is a block diagram showing an example of an inspection system for inspecting the module. This inspection system is connected to an inspection table S to which a module 1 to be inspected is connected, a lid-shaped holding member 61 for holding the module 1 connected to the inspection table S, and the inspection table S, And an inspection device (not shown) for performing the function inspection described above.

According to this inspection system, the module 1
Is placed at the placement position Sa on the upper surface of the inspection table S. In this case, the module 1 is placed on the inspection table S such that the terminal portions (not shown) formed on the side surfaces thereof match the inspection terminals 62 formed on the inspection table S. However, in this state, the contact resistance of the terminal portion to the inspection terminal 62 may be large. Therefore, the holding member 61 is pressed from above the module 1, and the module 1 is pressed by the holding member 61.
Hold.

[0006]

When performing a function test of a large number of modules 1 using the above-described test system, first, one module 1 is connected to the test stand S.
Then, the module 1 is pressed and held by the holding member 61 to perform an inspection. After the inspection, the holding member 6
1 and the module 1 is removed from the inspection table S. As described above, in the conventional inspection method, each of the module 1 and the holding member 61 must be mounted on the inspection table S, and after the inspection is completed, they must be detached from the inspection table S, respectively, which is very troublesome. There was a problem.
Here, a method of increasing the number of the inspection tables S and the inspection devices and inspecting a large number of modules 1 at a time is also conceivable.
It is not preferable because the equipment cost is increased. Therefore, there is a demand for an inspection method capable of efficiently attaching and detaching a large number of modules 1 to and from the inspection table S.

[0007]

DISCLOSURE OF THE INVENTION The present invention has been conceived under the circumstances described above, and is used for an electronic component inspection method capable of efficiently inspecting a large number of electronic components, and used in the inspection method. An object of the present invention is to provide an electronic component inspection jig.

In order to solve the above problems, the present invention takes the following technical measures.

According to a first aspect of the present invention, there is provided an inspection method for inspecting an electronic component by connecting an electronic component to be inspected to an inspection table, wherein the electronic component is held by the inspection table. A mounting step of attaching an electronic component to a holding member for mounting, and a connecting step of connecting the electronic component to the inspection table by mounting the holding member having the electronic component mounted on the inspection table, An electronic component inspection method is provided. Specifically, in the mounting process,
A plurality of holding members are used, and a plurality of electronic components are collectively attached to the holding members.

As described above, when the electronic component is connected to the inspection table, the electronic component is attached to the holding member, and the electronic component is connected to the inspection table by mounting the holding member on the inspection table. Therefore, for example, when inspecting a large number of electronic components, in the step of attaching the electronic components to the holding member, if a plurality of (for example, one hundred) electronic components are collectively attached to the holding member, the Compared with the conventional method of performing the inspection by directly mounting the component and the holding member on the inspection table, the working time in the preparation stage before the actual inspection can be reduced. Therefore, the inspection of the electronic component can be performed efficiently. In particular, in the conventional method, the opportunity to mount the member on the inspection table is performed twice with the electronic component and the holding member. In the present application, the holding member only needs to be performed once. For example, when the number of the inspection table is small, The above method becomes effective.

According to a preferred embodiment of the present invention,
After the inspection of the electronic component is completed, the method includes a step of detaching the holding member attached to the inspection table and removing the electronic component attached to the holding member. Specifically, in the removing step, a plurality of electronic components are collectively removed from the plurality of holding members. In this way, even after the inspection is completed, if the plurality of holding members are detached from the inspection table and the plurality of electronic components are collectively removed from the plurality of detached holding members, the inspection can be performed. As compared with the conventional method of detaching the holding member and the electronic component from the table, respectively, the work efficiency can be improved as in the case where the electronic component is connected to the inspection table.

According to a second aspect of the present invention, there is provided an electronic component inspection jig used when an electronic component to be inspected is connected to an inspection table to inspect the electronic component, wherein the electronic component is detachable. And a mounting means for mounting the electronic component on an inspection table. According to this configuration, in the inspection of the electronic component, the electronic component is supported by the support unit,
By mounting the electronic component on the inspection table by the mounting means, the electronic component can be easily connected to the inspection table, so that the inspection operation time does not increase. Further, the operation and effect described in the method according to the first aspect can be realized by this configuration.

According to a preferred embodiment, the electronic component is an infrared data communication module having a light emitting element and a light receiving element. As described above, the inspection jig can be effectively applied to an infrared data communication module having a light emitting element and a light receiving element.

[0014] Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

FIG. 1 is a block diagram showing an inspection system to which an electronic component inspection method according to the present invention is applied. This inspection system includes a holding member 2 as an inspection jig for holding an infrared data communication module (hereinafter, simply referred to as a “module”) 1 as an electronic component to be inspected.
And an inspection table 3 to which the holding member 2 holding the module 1 is connected, and an inspection device (not shown) connected to the inspection table 3 for performing a function inspection of the module 1. The inspection table 3 includes an intermediate base 4 that detachably supports the holding member 2 and an inspection table main body 5 on which the intermediate base 4 is mounted.

As shown in FIGS. 2 and 3, the module 1 includes a substantially rectangular substrate 11, a light emitting element 12 such as a light emitting diode mounted on the substrate 11, and a light receiving element 13 such as a PIN photodiode. And light emitting element 1
LS for controlling transmission / reception operation by light receiving element 13 and light receiving element 13
I chip 14 and sealing body 15 for integrally sealing them
Are provided. The light emitting element 12, the light receiving element 13, and the LSI chip 14 are each wire-bonded with a gold wire W or the like and connected to a conductor pattern described later.

The substrate 11 is made of a glass epoxy resin, a predetermined conductor pattern 16 is formed on a surface 11a, and a substantially semi-cylindrical groove 17 is formed on a side surface 11b. The conductor pattern 16 is connected to a terminal portion 18 formed on the back surface 11c. The groove 17 may be filled with solder.

The sealing body 15 is made of, for example, an epoxy resin containing a pigment, and is integrally formed so as to cover the light emitting element 12, the light receiving element 13 and the LSI chip 14. The sealing body 15 does not transmit visible light but transmits infrared light sufficiently well. On the surface of the sealing body 15 facing the light emitting element 12 and the light receiving element 13, a light emitting lens part 19 and a light receiving lens part 20 are formed, respectively.

As shown in FIGS. 1, 4 and 5, the holding member 2 has a substantially rectangular shape, and has two side cutouts 23 formed from the upper surface to both ends in the longitudinal direction. 23 is provided with mounting pieces 24 as mounting means for mounting on the intermediate base 4. The mounting piece 24 includes an upper piece 24a and a lower piece 24, as shown in FIG.
b are formed in a substantially rectangular cross section, and side plates 25 extending in a direction perpendicular to the two pieces 24a and 24b are formed on a part of both ends of the upper piece 24a and the lower piece 24b, respectively. The mounting piece 24 extends in the short direction of the holding member 2 and is rotatably supported around a support shaft 26 that penetrates a part of the holding member 2 and the side plate 25. The mounting piece 24 includes a support shaft 26.
The lower piece 24b is normally urged by the spring 27 fitted over the holding member 2 so as to be flush with the side surface of the holding member 2. A reinforcing rib 28 is formed at an intermediate portion of the mounting piece 24, and a pawl 29 that extends in a direction perpendicular to the lower piece 24 b and locks the intermediate base 4 is formed at an end of the lower piece 24 b. Have been. With this configuration, when the upper piece 24a is pressed from above (see white arrow A), the mounting piece 24 opens outward (see white arrow B) and can be mounted on the intermediate base 4.

On the other hand, a substantially semi-cylindrical concave portion 31 is formed on the front side surface of the holding member 2, and the concave portion 31 has a module support piece 32 as a support means for supporting the module 1 in a detachable manner. Is provided. As shown in FIG. 5, the module support piece 32 includes an upper and lower piece 33 extending in the vertical direction, and a left piece 34 and a right piece 35 extending in the left and right direction from the middle of the upper and lower pieces 33. It is formed in a cross shape. At both ends of the left piece 34 and the right piece 35, extending pieces 36 extending in a direction perpendicular to the two pieces 34, 35 are formed, respectively. Module support piece 32
Extends in the longitudinal direction of the holding member 2 and is rotatably supported around a support shaft 37 that penetrates both a part of the holding member 2 and the extension piece 36. The module support piece 32 includes the support shaft 3
7 by means of a spring 38 fitted over the upper and lower pieces 33.
Are urged to be flush with the side surface of the holding member 2. At the lower ends of the upper and lower pieces 33, claws 39 extending in a direction perpendicular to the upper and lower pieces 33 to lock the module 1 are provided.
Are formed.

A storage section 41 for storing the module 1 is formed below the recess 31 and extends in the left-right direction and is open at the bottom. The storage section 41 has substantially the same shape and size as the shape and size of the module 1, and the module 1 is arranged in the storage section 41 such that the lens sections 19 and 20 of the module 1 face forward. You.

With this structure, when the upper end of the module support piece 32 is pressed inward as shown in FIG.
), The lower end of the module support piece 32 opens outward (see a white arrow D), and the module 1 can be arranged in the storage section 41. When the module supporting piece 32 is released after the module 1 is disposed, the module supporting piece 32 is closed by the action of the spring 38, and the module 1 is held by the holding member 2. Thus, the module 1 can be easily attached to the holding member 2 by the module support pieces 32.

On the other hand, when connecting the holding member 2 to the inspection table main body 5, the intermediate base 4 of the inspection table 3 supports the holding member 2 in a detachable manner, and electrically connects the module 1 and the inspection table main body 5. This is to make the conduction. As shown in FIG. 1, the intermediate base 4 is formed in a substantially rectangular shape, and has cutouts 46 extending in the thickness direction at both ends in the longitudinal direction. The notch 46 is formed to have substantially the same width as the width of the mounting piece 24 of the holding member 2, and a step 4
7 are formed. The intermediate base 4 is attached to the holding member 2 by locking the claw 29 of the mounting piece 24 to the step 47.

A substantially arc-shaped concave portion 48 is formed on the front side surface of the intermediate base 4. This recess 48
When the module support piece 32 is closed,
9 is to be accommodated. As shown in FIG. 7, a spring pin 51 as a conduction pin extending through the intermediate base 4 is provided in a thick portion near the concave portion 48 of the intermediate base 4. This spring pin 51
Is the groove 17 of the module 1 housed in the housing 41
And the inspection terminals of the inspection table main body 5 to be described later, and the same number of the grooves 17 and the number of the inspection terminals of the module 1 are provided. In addition,
The spring pin 51 has a spring (not shown) provided inside, and one end or both ends can be freely protruded and retracted.

An upper projection 52 is provided on the upper surface of the intermediate base 4 to be inserted into an insertion hole (not shown) formed on the lower surface of the holding member 2 when the intermediate base 4 is mounted on the holding member 2.
(See FIG. 1). A lower projection 53 is provided on the lower surface of the intermediate base 4 so as to be inserted into an insertion hole (described later) formed in the test table main body 5 when the intermediate base 4 is mounted on the test table main body 5. As described above, the intermediate base 4 can be easily mounted on the holding member 2 and the inspection table main body 5 by using the upper projecting piece 52 and the lower projecting piece 53.

According to FIG. 1, the inspection table 1 is formed in a substantially plate shape, and an upper surface thereof is provided with an insertion hole 54 for mounting the intermediate base 4. In addition, an inspection terminal 55 corresponding to the groove 17 of the module 1 is formed on the upper surface.

Next, a method of inspecting a module in the inspection system will be described. In the present inspection method, a functional inspection for inspecting whether or not each module 1 has a predetermined function is performed over the entire number of manufactured modules 1. This functional inspection is performed by using the above-described holding member 2 and the inspection table 3, attaching the module 1 to the holding member 2, and attaching the holding member 2 to the inspection table 3. In this inspection method, for example, a large number of holding members 2 are prepared for one inspection table 3.

First, before mounting the holding member 2 on the inspection table 3, the intermediate base 4 is mounted on the inspection table main body 5. That is, the lower protruding piece 53 formed on the lower surface of the intermediate base 4 is inserted into the insertion hole 54 formed on the upper surface of the inspection table main body 5.
Through. Thereby, the intermediate base 4 is positioned with respect to the inspection table main body 5, and the lower ends of the spring pins 51 of the intermediate base 4 contact the inspection terminals 55 of the inspection table main body 5.

Next, the completed module 1 is attached to the holding member 2. In this case, as shown in FIG.
The lower end of the module support piece 32 is opened outward, and the module 1 is arranged in the storage section 41 such that the lens portions 19 and 20 of the module 1 face forward and the groove 17 of the module 1 faces downward. . When the module support piece 32 is released with the module 1 disposed, the module support piece 32 is closed by the action of the spring 38. As a result, the module supporting piece 32 supports the side surface 11b of the module 1 and a part of the inner wall surface of the module supporting piece 32 abuts on the back surface 11c of the module 1, and the module 1 is held by the holding member 2.

The attachment of the modules 1 to the holding members 2 is performed by preparing a large number of holding members 2 and collectively attaching a large number of modules 1 to each holding member 2. As described above, by performing the repetitive operation of mounting the module 1 to the holding member 2 collectively, for example, a conventional method of directly mounting one module and one holding member on an inspection table and performing an inspection In comparison with the above, the working efficiency can be improved, and the working time in the preparation stage before the actual inspection can be shortened. Therefore, the inspection of the module 1 can be performed efficiently, and the inspection work cost can be reduced.

Next, one of the holding members 2 to which the module 1 is attached is mounted on the intermediate base 4 mounted on the inspection table main body 5. That is, as shown in FIGS. 1 and 8, the lower piece 24 b of the mounting piece 24 of the holding member 2 is opened outward, and the upper protruding piece 52 formed on the upper surface of the intermediate base 4.
Is inserted through an insertion hole (not shown) formed on the lower surface of the holding member 2. Then, the holding member 2 is mounted on the intermediate base 4 by closing the lower piece 24 b of the mounting piece 24 and locking the pawl 29 on the step 47 of the intermediate base 4. In this case, as shown in FIG. 9, the module support piece 32 holds the module 1, and the pawl 39 is housed in the recess 48 of the intermediate base 4.

When the holding member 2 is mounted on the intermediate base 4, the ends of the spring pins 51 of the intermediate base 4 are pushed into the grooves 17 of the module 1 as shown in FIG. . Since the spring pin 51 has an appropriate pressing force against the groove 17 of the module 1, the spring pin 51 can reliably contact the groove 17. Therefore, the groove 17 of the module 1 is electrically connected to the inspection terminal 55 of the inspection table main body 5 via the spring pin 51 of the intermediate base 4, and the connection between the module 1 and the inspection table main body 5 is made. , Good signal delivery.

As described above, by simply opening and closing the mounting piece 24 and inserting the upper protruding piece 52 of the intermediate base 4 into the insertion hole of the holding member 2, the groove 17 of the module 1 is held while being in contact with the spring pin 51. The member 2 can be easily converted to the intermediate base 4
Can be attached.

Thereafter, as shown in FIG. 11, the holding member 2 to which the module 1 is attached is mounted on the inspection table main body 3 via the intermediate base 4, and the inspection apparatus is operated to thereby hold the module 1 with respect to the module 1. A predetermined function test is performed. As the function inspection, for example, the quality of the light emission intensity of the light emitting element, the quality of the reception sensitivity of the light receiving element, and the operation check of the LSI chip are performed.

When the function test of one module 1 is completed, the holding member 2 is detached from the intermediate base 4, and the holding member 2 is stored with the module 1 attached once. Next, the holding member 2 to which the next module 1 is attached is attached to the intermediate base 4, and the same function test of the module 1 is performed as described above.

Hereinafter, the function test is performed for each module 1 by attaching the holding member 2 to the intermediate base 4 in the same procedure. In this way, for example, when the function test is completed for each module 1 of one lot, the module 1 is removed from the holding member 2. Also in this case, similarly to the mounting process, the holding members 2 on which the modules 1 that have been inspected are mounted are collectively performed. Therefore, as in the operation of attaching the module 1 to the holding member 2, the operation efficiency is improved by the repetitive operation, and the removal operation can be performed efficiently.

Of course, the scope of the present invention is not limited to the above embodiment. For example, the module 1 to be attached to or detached from the holding member 2 collectively
The number is not particularly limited. For example, it is desirable to appropriately set the number for each lot or for each predetermined number of shipments.

The above-described inspection jig and inspection method are not limited to being applied only when inspecting an infrared data communication module, but can be applied to other module devices and the like. Also, the spring pin 51 of the intermediate base 4
It is desirable that the number of the test pieces and the number of the test terminals 55 of the test table main body 5 are not limited to the numbers shown in the above-described embodiment, and are appropriately set according to the module 1 to be tested. Further, the intermediate base 4 may be configured to be incorporated in the inspection table main body 5.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an inspection system according to an electronic component inspection method according to the present invention.

FIG. 2 is a perspective view of the infrared data communication module shown in FIG.

FIG. 3 is an internal configuration diagram of the infrared data communication module shown in FIG. 1;

FIG. 4 is a cross-sectional view of the inspection jig shown in FIG. 1 taken along the line II.

5 is a cross-sectional view of the inspection jig shown in FIG. 1 along the line II-II.

FIG. 6 is a sectional view of a main part of the inspection jig.

FIG. 7 is a diagram showing a configuration of a spring pin.

FIG. 8 is a diagram for explaining an inspection method of the infrared data communication module.

FIG. 9 is a diagram for explaining an inspection method of the infrared data communication module.

FIG. 10 is a diagram for explaining an inspection method of the infrared data communication module.

FIG. 11 is a diagram for explaining an inspection method of the infrared data communication module.

FIG. 12 is a configuration diagram showing an inspection system according to a conventional electronic component inspection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Infrared data communication module 2 Holding member 3 Inspection table 4 Intermediate base 5 Inspection table main body 24 Mounting piece 32 Module support piece

Claims (6)

[Claims] An inspection method for inspecting the electronic component by connecting an electronic component to be inspected to an inspection table, wherein a holding member for holding the electronic component with respect to the inspection table includes: Attaching the electronic component, and attaching the holding member to which the electronic component is attached to the inspection table, thereby connecting the electronic component to the inspection table. Inspection method for electronic components. 2. A method for inspecting an electronic component, wherein a plurality of holding members are used in the mounting step, and the plurality of electronic components are collectively mounted on the holding member. 3. The method according to claim 1, further comprising, after the inspection of the electronic component, removing the holding member attached to the inspection table and removing the electronic component attached to the holding member. Inspection method of the described electronic components. 4. The electronic component inspection method according to claim 3, wherein in the removing step, the plurality of electronic components are collectively removed from the plurality of holding members. 5. An electronic component inspection jig used when an electronic component to be inspected is connected to an inspection table and the electronic component is inspected, and a supporting means for detachably supporting the electronic component, An inspection jig for an electronic component, comprising: a mounting means for mounting the electronic component on the inspection table. 6. The electronic component inspection jig according to claim 5, wherein said electronic component is an infrared data communication module having a light emitting element and a light receiving element.