JP2001086377A - Image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the size and also to shorten the hard length of an image pickup device. SOLUTION: Electrical components 4 are mounted on a substrate 5 and other electrical components are arranged laminated on the components 4. These electrical components are connected to the substrate 5 via a jumper line 8. This lamination of electrical components attains mounting in high density and can reduce the size of this image pickup device. In addition, electrical connection secured by the line 8 between those electrical components and substrate can attain free setting of position of a land to increase the design flexibility of a circuit pattern. Thus, the size of the image pickup device is further reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus suitable for being built in a distal end portion of an endoscope.

[0002]

2. Description of the Related Art Conventionally, various devices for electronically capturing a subject image using a solid-state image sensor have been developed. For example, an imaging device using a CCD (charge coupled device) is also used in an electronic endoscope device and the like.

In a conventional image pickup apparatus applied to an endoscope apparatus, a light receiving section of a solid-state image pickup device is arranged at an image forming position of an objective lens provided at the end of the endoscope. The solid-state imaging device is mounted on a circuit board on which electric components are mounted. A land portion is formed on the circuit board, and a lead and a cable extending from the solid-state imaging element are electrically connected using the land portion.

[0004] As described above, the conventional image pickup apparatus has a board (flexible board or rigid board) on which electric components are mounted.
It is constructed by attaching a solid-state imaging device on top. The electric component is connected to a chip connection portion (land portion) of a circuit pattern provided on a substrate, and the substrate and the solid-state image pickup device are connected to a video processor by a signal cable.

[0005]

In recent years, the size of solid-state imaging devices has been rapidly reduced. In contrast, the size of the electrical components has not changed much. For this reason,
The size of the land portion, which is a chip connection portion for connecting electric components, has not changed.

Although the circuit pattern on the substrate has been miniaturized in accordance with the miniaturized solid-state image pickup device, the size of the land formed for chip connection and cable connection is relatively large. The layout of the circuit pattern is restricted due to the land portion, and as a result, it is difficult to reduce the size of the substrate according to the size of the solid-state imaging device. Also,
When the imaging device is applied to an endoscope device, there is also a problem that the rigid length of the endoscope device cannot be shortened.

The present invention has been made in view of such a problem, and an object of the present invention is to provide an imaging apparatus which can be reduced in size and can shorten a rigid length.

[0008]

An imaging apparatus according to the present invention comprises: a solid-state imaging device for converting a formed observation image into an electric signal; a substrate to which the solid-state imaging device is connected; An electric component provided at a position separated from the substrate surface, and a connecting member for connecting the electric component and the substrate.

In the present invention, the electric components on the substrate to which the solid-state imaging device is connected are electrically connected to the substrate by connecting members, and the electric components are arranged apart from the surface of the substrate. This enables high-density mounting.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 and 2 relate to a first embodiment of the present invention, and FIG. 1 is an explanatory diagram showing an imaging device according to the first embodiment, showing an example applied to an electronic endoscope. . FIG. 2 is an explanatory view showing the vicinity of the substrate 5 in FIG. 1, and FIG.
FIG. 2B shows the back surface viewed from the direction A in FIG.

In FIG. 1, an imaging device 1 is provided at a distal end portion 25 of an electronic endoscope. The observation optical system 2 is attached to the distal end of the distal end portion 25, and the observation optical system 2 is configured by an objective lens optical system including a plurality of objective lenses. The solid-state imaging device 3 is disposed at the rear end of the observation optical system 2, and the observation optical system 2 guides the subject image from the front end of the front end 25 to the light receiving unit of the solid-state imaging device 3 at the rear end. ing.

A substrate 5 is provided at the rear end of the solid-state imaging device 3 in parallel with the longitudinal direction of the front end portion 25. An electric component 4 such as a capacitor and a transistor is mounted on the substrate 5, and the solid-state imaging device 3 and the electric component 4 are electrically connected to the substrate 5.

A composite signal cable 6 having a plurality of single wires and coaxial wires is connected to the rear end of the board 5. The composite signal cable 6 is connected to a video processor (not shown), and transmits a drive signal and a power supply voltage to be supplied from the video processor to the solid-state imaging device 3 and supplies a video signal from the solid-state imaging device 3 to the video processor. It is supposed to.

The substrate 5 is coated with an adhesive 16 or the like all around.
The outer periphery of the distal end portion 25 near the substrate 5 is covered with the heat-shrinkable tube 14.

Next, the vicinity of the substrate 5 will be described in detail with reference to FIG.

On the substrate 5, for example, a transistor 7 and a capacitor 9 are provided as the electric components 4. The transistor 7 is arranged on the surface of the substrate 5 while being covered with the sealing resin 10.

In the present embodiment, the transistor 7
The capacitor 9 is mounted on the upper sealing resin 10. The lower end side of the capacitor 9 is fixed to the sealing resin 10 above the transistor 7 arranged below by an adhesive 11 or the like. That is, the transistor 7 and the capacitor 9 are substantially
The transistors 7 and capacitors 9 are stacked and mounted in two layers, and the area occupied by the transistor 7 and the capacitor 9 on the substrate 5 is determined only by the transistor 7. That is, in the present embodiment, the capacitor 9 is disposed in an empty space of the imaging device 1, and the area occupied on the substrate 5 is reduced.

The jumper wire 8 electrically connects the board 5 and the electric component 4. Substrate 5 has through hole 12
And an electrode 15. One end of the jumper wire 8 is soldered to the through hole 12 or the electrode 15, and the other end is connected to the electric component 4.

The substrate 5 is electrically connected to the front surface and the back surface through a through hole 12, and a circuit pattern (not shown) is formed on the front surface and the back surface. As shown in FIG. 2B, lands for connecting the composite signal cable 6 which is the electrode 15 are collectively arranged on the back surface of the substrate 5. Each signal line of the signal cable 6 is connected to these electrodes 15. Each signal line of the signal cable 6 connected to the electrode 15 is electrically connected to the electric component 4 by the through hole 12.

By arranging the electrodes 15 collectively, the signal cable 6 can be easily removed at the time of repairing the solid-state imaging device 3 or the substrate 5 or the like. Also,
By arranging the electrodes (land portions) 15 collectively, the removal range of the adhesive 16 on the land portions can be minimized.

The solid-state imaging device 3 includes a plurality of leads 13.
Is connected to the board 5 and the signal cable 6. For example, one lead 13 can be connected to a substrate by being soldered to an electrode on the substrate 5. Further, in the present embodiment, it is possible to directly connect the lead 13 and the signal cable 6 by the jumper wire 8.

Next, the operation of the embodiment configured as described above will be described.

The substrate 5 is disposed at the rear end of the solid-state imaging device 3 disposed at the distal end portion 25 of the endoscope. The board 5 is disposed on the bottom side of the distal end portion 25 with a gap for connecting the signal cable 6 by utilizing a gap between the back surface and the heat shrinkable tube 14. With this arrangement, there is a sufficient space between the surface of the substrate 5 and the heat-shrinkable tube 14 so that the electric components 4 can be stacked.

In the present embodiment, not only the electric component 4 is arranged on the surface of the substrate 5 but also other electric components are arranged on the electric component 4 arranged on the surface of the substrate 5. That is, for example, the capacitor 9 is disposed on the sealing resin 10 for sealing the transistor 7 as an electric component by the adhesive 11.
Thus, the electric components 4 are stacked on the substrate 5.

Further, the electric component 4 disposed at a position away from the surface of the substrate 5 and the substrate 5 are connected by a jumper wire 8. The jumper wire 8 is also used for connecting the signal cable 6 and the lead 13 of the solid-state image sensor 3.

As described above, in the present embodiment, electric components are stacked and arranged in an empty space between the surface of the substrate and the heat-shrinkable tube 14, and the electric components separated from the surface of the substrate 5 are electrically connected by the jumper wires 8. Since the electrical connection is made, the area occupied by the electric components on the substrate 5 is relatively small, and the electric components 4 can be mounted on the substrate 5 at a high density. Thereby, the size of the imaging device 1 can be reduced, and the rigid length of the distal end portion of the endoscope can be reduced.

Further, the electric component 4 is connected by using the jumper wire 8.
Since the electrode 15 is connected to the substrate 5, the electrode 15 can be freely arranged, and the degree of freedom in designing a circuit pattern is high.
The size of the substrate 5 can be reduced.

FIG. 3 is a sectional view showing an image pickup apparatus according to a second embodiment of the present invention.

In the present embodiment, TAB (ta
pe automated bonding) The first point is the use of tape 17.
This embodiment is different from the embodiment. In the first embodiment,
The example in which the electric components are stacked on the electric components arranged on the surface of the substrate 5 has been described.
The electric components are stacked and arranged thereon.

That is, each signal line of the signal cable 6 is connected to a connection portion (not shown) at the rear end of the TAB tape 17. An adhesive 11 is applied to each signal line on the connection portion,
The electric component 4 is provided on the adhesive 11. The electric component 4 is connected to the TAB tape 17 by a jumper wire 8.

It is apparent that the embodiment thus configured has the same operation and effect as the first embodiment.

Incidentally, the image pickup devices in the first and second embodiments are miniaturized, so that they are suitable for use in endoscope end parts and the like. FIG. 4 is an explanatory view showing a distal end structure of such an endoscope distal end portion.

The distal end portion 18 is formed in a cylindrical shape, and its distal end surface has a vertical surface perpendicular to the optical axis and an inclined surface 19 in which a part of the distal end surface is cut off obliquely. The tip of the objective lens 20 and the tip of the illumination lens 21 are arranged adjacent to the inclined surface 19. Assuming that the depth of the objective lens 20 is, for example, 1 to 100 mm, the inclined surface 19 is formed such that the distance x in the optical axis direction from the vertical plane to the center of the objective lens is 1 mm.

With such a configuration, at the time of near point observation (1 m
(at the time of m observation), even when the vertical plane is brought into contact with the observation site, the object distance between the observation site and the lens center of the objective lens 20 is kept at 1 mm, so that good close-up observation is possible.

Since the illumination lens 21 is arranged near the objective lens 20 on the inclined surface 19, it is possible to irradiate the illumination light to the observation site even during close-up observation.

FIG. 5 is an explanatory view showing the structure of such an illumination lens. The illumination lens shown in FIG. 5 shows a structure for enabling illumination light to be reliably applied to an observation part even at the time of near point observation.

FIG. 5A shows an example in which a lens having an inclined surface which is notched obliquely on the objective lens 20 side of the illumination lens 21 is arranged. By providing the inclined surface, the light distribution can be increased toward the objective lens 20 side.

FIG. 5B shows that the light distribution is increased toward the objective lens 20 by making the material of the illumination lens 21 on the objective lens 20 side have a large refractive index.

In these examples, the light distribution on the objective lens 20 side of the illumination lens 21 is increased, so that a good image can be obtained during close-up observation.

[Supplementary Notes] (1) A solid-state image pickup device for converting the formed observation image into an electric signal, a substrate to which the solid-state image pickup device is connected, and a position provided on the substrate at a distance from the substrate surface An imaging device comprising: an electric component that processes the electric signal from the solid-state imaging device; and a connection member that connects the electric component and the substrate.

(2) The image pickup apparatus according to item 1, wherein the electric component is stacked on another electric component mounted on the surface of the substrate.

(3) The imaging apparatus according to item 1, wherein the electric components are stacked on a signal cable connected to a connection portion on the surface of the substrate.

(4) The image pickup apparatus according to item 1, wherein the connection member is a jumper wire.

[0044]

As described above, according to the present invention, there is an effect that the size can be reduced and the hard length can be shortened.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an imaging device according to a first embodiment of the present invention.

FIG. 2 is an explanatory view showing the vicinity of a substrate 5 in FIG.

FIG. 3 is a cross-sectional view illustrating an imaging device according to a second embodiment of the present invention.

FIG. 4 is an explanatory view showing a tip structure.

FIG. 5 is an explanatory diagram showing an illumination lens structure.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Imaging device, 2 ... Observation optical system, 3 ... Solid-state imaging device, 4
... electric parts, 5 ... substrates, 6 ... signal cables

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // G02B 23/24 G02B 23/24 B F term (Reference) 2H040 BA13 CA12 CA22 DA12 DA17 GA03 4C061 AA00 BB02 CC06 DD00 JJ06 LL02 MM00 NN01 PP08 PP12 RR06 RR11 SS01 5C022 AA09 AC41 AC54 AC70 AC75 5C024 AA01 BA03 CA32 EA04 FA01

Claims (1)

[Claims] 1. A solid-state imaging device for converting a formed observation image into an electric signal, a substrate to which the solid-state imaging device is connected, and an electric component provided on the substrate at a position separated from the substrate surface. An imaging apparatus, comprising: a connection member that connects the electric component and the substrate.