JP2001085587A5 - - Google Patents
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- Publication number
- JP2001085587A5 JP2001085587A5 JP2000243865A JP2000243865A JP2001085587A5 JP 2001085587 A5 JP2001085587 A5 JP 2001085587A5 JP 2000243865 A JP2000243865 A JP 2000243865A JP 2000243865 A JP2000243865 A JP 2000243865A JP 2001085587 A5 JP2001085587 A5 JP 2001085587A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/373664 | 1999-08-13 | ||
| US09/373,664 US6157539A (en) | 1999-08-13 | 1999-08-13 | Cooling apparatus for electronic devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001085587A JP2001085587A (ja) | 2001-03-30 |
| JP2001085587A5 true JP2001085587A5 (enExample) | 2007-09-27 |
| JP4627357B2 JP4627357B2 (ja) | 2011-02-09 |
Family
ID=23473343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000243865A Expired - Fee Related JP4627357B2 (ja) | 1999-08-13 | 2000-08-11 | 電子デバイス用冷却装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6157539A (enExample) |
| JP (1) | JP4627357B2 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6282091B1 (en) * | 1999-11-11 | 2001-08-28 | Sunonwealth Electric Machine Industry Co. Ltd | Mounting devices for a heat-generating element and a heat-dissipating device |
| US20030175091A1 (en) * | 2000-03-10 | 2003-09-18 | Aukzemas Thomas V. | Floating captive screw |
| US6374906B1 (en) * | 2000-04-11 | 2002-04-23 | Hewlett-Packard Company | Heat sink having a captive handle |
| US6441631B1 (en) * | 2000-06-02 | 2002-08-27 | Advanced Micro Devices, Inc. | Processor module heatsink mounting guide posts for function test |
| JP2002134973A (ja) * | 2000-10-19 | 2002-05-10 | Matsushita Electric Ind Co Ltd | ヒートシンク装置及び電子機器 |
| US6769175B2 (en) * | 2001-05-01 | 2004-08-03 | Agilent Technologies, Inc. | Heat sink device manufacture |
| US6535389B2 (en) * | 2001-06-07 | 2003-03-18 | Agilent Technologies, Inc. | Heat sink mounting assembly |
| US7044202B2 (en) * | 2001-06-27 | 2006-05-16 | Rotys Inc. | Cooler for electronic devices |
| US6505680B1 (en) | 2001-07-27 | 2003-01-14 | Hewlett-Packard Company | High performance cooling device |
| US6557675B2 (en) * | 2001-07-31 | 2003-05-06 | Compaq Information Technologies Group, L.P. | Tunable vibration damper for processor packages |
| FR2831018B1 (fr) | 2001-10-17 | 2003-12-19 | Bull Sa | Dispositif de maintien d'au moins deux composants electroniques disposes en vis-a-vis de part et d'autre d'une carte de connexion |
| EP1343362A1 (en) * | 2002-03-07 | 2003-09-10 | Hewlett-Packard Company (a Delaware corporation) | Cooling system for elecronic devices |
| US6785138B1 (en) | 2002-09-05 | 2004-08-31 | Added Communications Of Georgia, Inc. | Repeater case for HDSL modules |
| US6830097B2 (en) | 2002-09-27 | 2004-12-14 | Modine Manufacturing Company | Combination tower and serpentine fin heat sink device |
| TWM245517U (en) * | 2003-10-30 | 2004-10-01 | Quanta Comp Inc | Computer device and its modular structure |
| CN2713636Y (zh) * | 2004-06-11 | 2005-07-27 | 鸿富锦精密工业（深圳）有限公司 | 散热器扣合装置 |
| US6948555B1 (en) * | 2004-06-22 | 2005-09-27 | Hewlett-Packard Development Company, L.P. | Heat dissipating system and method |
| US20060011324A1 (en) * | 2004-07-13 | 2006-01-19 | Rogers C J | Wound, louvered fin heat sink device |
| US8020608B2 (en) * | 2004-08-31 | 2011-09-20 | Hewlett-Packard Development Company, L.P. | Heat sink fin with stator blade |
| US20060054311A1 (en) * | 2004-09-15 | 2006-03-16 | Andrew Douglas Delano | Heat sink device with independent parts |
| US20100142136A1 (en) * | 2008-12-08 | 2010-06-10 | Sun Microsystems, Inc. | Method and apparatus that isolates a computer system from vibrations generated by internal fans |
| US8829700B2 (en) * | 2009-12-01 | 2014-09-09 | Vestas Wind Systems A/S | Wind turbine nacelle comprising a heat exchanger assembly |
| US9714762B2 (en) * | 2011-10-02 | 2017-07-25 | Nanker(Guang Zhou)Semiconductor Manufacturing Corp. | LED photo-electric source assembly and LED road lamp |
| US11107962B2 (en) * | 2018-12-18 | 2021-08-31 | Soulnano Limited | UV LED array with power interconnect and heat sink |
| EP4096376B1 (en) * | 2021-05-24 | 2025-09-24 | Aptiv Technologies AG | Cooling device and heatsink assembly incorporating the same |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4715438A (en) * | 1986-06-30 | 1987-12-29 | Unisys Corporation | Staggered radial-fin heat sink device for integrated circuit package |
| US5019880A (en) * | 1988-01-07 | 1991-05-28 | Prime Computer, Inc. | Heat sink apparatus |
| JP3069819B2 (ja) * | 1992-05-28 | 2000-07-24 | 富士通株式会社 | ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置 |
| US5484262A (en) * | 1992-10-23 | 1996-01-16 | Nidec Corporation | Low profile fan body with heat transfer characteristics |
| US5445215A (en) * | 1992-12-22 | 1995-08-29 | Herbert; Edward | Fan assembly with heat sink |
| JP2880646B2 (ja) * | 1994-05-18 | 1999-04-12 | 株式会社ピーエフユー | ファン付きヒートシンク |
| FR2729045B1 (fr) * | 1994-12-29 | 1997-01-24 | Bull Sa | Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes |
| JP3058818B2 (ja) * | 1995-10-05 | 2000-07-04 | 山洋電気株式会社 | 電子部品冷却用ヒートシンク |
| US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
| US5896917A (en) * | 1996-02-22 | 1999-04-27 | Lemont Aircraft Corporation | Active heat sink structure with flow augmenting rings and method for removing heat |
| JP2773732B2 (ja) * | 1996-04-05 | 1998-07-09 | 日本電気株式会社 | 電子部品の冷却構造 |
| JP3768598B2 (ja) * | 1996-05-31 | 2006-04-19 | 山洋電気株式会社 | 発熱体冷却装置 |
| JP3206436B2 (ja) * | 1996-07-03 | 2001-09-10 | 松下電器産業株式会社 | ヒートシンク装置 |
| JPH10154889A (ja) * | 1996-11-25 | 1998-06-09 | Yaskawa Electric Corp | 冷却装置 |
| US5794685A (en) * | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
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1999
- 1999-08-13 US US09/373,664 patent/US6157539A/en not_active Expired - Fee Related
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2000
- 2000-08-11 JP JP2000243865A patent/JP4627357B2/ja not_active Expired - Fee Related