JP2001084346A - Ic card and manufacture therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an extremely useful method for constituting an IC card capable of connecting a conductive panel to a ground electrode on a circuit board and extremely improving the reliability of the connection further without increasing the number of components and work man-hour and work time at the time of assembly. SOLUTION: In this IC card provided with the circuit board 11 loaded with components 14 including an integrated circuit and a pair of the conductive panels 16 and 17 respectively fixed on the surface side and back surface side of the circuit board 11, a conductive terminal part 161 integrally molded with the conductive panel 16 and the ground electrode 12 on the circuit board 11 are electrically/mechanically connected by solder 13 connection by ultrasonic wave welding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having a built-in IC such as a memory IC or a microprocessor. It is about structure.

[0002]

2. Description of the Related Art An IC card such as a memory card has a structure including a substrate on which components including an integrated circuit are mounted, and a pair of conductive panels fixed to the front and back surfaces of the substrate, respectively. ing. In such an IC card such as a memory card, in order to protect components such as a built-in IC from static electricity generated from a human body or the like, it is generated when the card performs operations such as reading and writing. In order to prevent radiation noise that causes malfunction of other electronic devices from being emitted to the outside of the card, it is necessary to connect the conductive panel to a ground potential, that is, to ground the panel.

In the prior art, as a method of grounding a panel, in a ground electrode forming portion of a component mounting board,
A method in which a coil-shaped ground spring is sandwiched and pressed by a conductive panel from above and below, or a leaf spring-shaped ground spring is soldered to the ground electrode forming portion of the component mounting board to hold the ground spring. A method of attaching a panel to a vehicle has been adopted.

FIG. 2 shows a configuration example of an IC card according to the former method. In the drawing, 1 is a mounted component such as an IC, 2 is a circuit board on which the mounted component 1 is mounted, 3 is a conductive panel, 4 is a ground electrode formed on the circuit board, 5 is a ground spring, 6 Is a frame.

[0005] However, the above-mentioned conventional method has problems such as an increase in the number of parts of the card and an increase in the number of work steps in the card manufacturing process.

The following patent applications have been published as proposals for solutions to these problems.

1) In an IC card, a conductive member for electrically connecting a pair of conductive panels covering both surfaces of the circuit board and a ground line of the circuit board is provided on a frame portion holding the circuit board. (JP-A-6-309522).

[0008] 2) A conductive terminal for establishing conduction with the metal panel is provided in the connector portion of the IC card, thereby electrically connecting the GND signal of the connector to the metal panel (Japanese Patent Application Laid-Open No. H08-208, Hei 8). -44838).

3) Conduction between the metal panel and the circuit board is achieved by the ground terminal fixed to the metal panel (Japanese Patent Laid-Open No. 7-192105).

4) A spring formed by cutting and raising a part of the front metal panel and the rear metal panel is brought into contact with the GND pattern of the circuit board (Japanese Utility Model Laid-Open No. 6-30860).

[0011]

At present, in an IC card, it is general to electrically connect a ground electrode of an internal circuit board and a conductive panel covering both surfaces thereof to ground the panel. It is a specification that is required in general. As a means, as described above, when the panel is grounded by sandwiching a coil-shaped ground spring or soldering a leaf spring-shaped ground spring, as described above, the coil-shaped ground spring or the leaf spring-shaped ground spring is separated. However, the number of components of the IC card increases. Inserting and positioning coiled ground springs on the substrate
Alternatively, the number of work steps increases by the amount of soldering of the leaf spring-shaped ground spring.

Therefore, when a frame is provided with a built-in conductive member for making electrical connection between the panel and the circuit board as disclosed in Japanese Patent Application Laid-Open No. 6-309522, the conductive member is not included in the frame manufacturing process. , The number of parts increases. In the frame manufacturing process, some measures for positioning the conductive member are required. When assembling an IC card, operations such as soldering a conductive member and a circuit board are required. And so on.

When a conductive terminal for establishing conduction with a metal panel is provided in a connector portion of a card as disclosed in Japanese Patent Application Laid-Open No. 8-44838, it is a matter of course that a card that does not use a connector has a terminal. Can not be adopted. In the connector manufacturing process, the number of components increases by the amount of the grounding terminal. And so on.

Further, as disclosed in JP-A-7-192105,
If the ground terminal is fixed to the metal panel, the ground terminal must be connected to the panel before the card casing in some way in the panel manufacturing process. The number of components increases by the amount of the ground terminal. And so on.

Further, in the method of contacting a spring formed by cutting and raising a part of the front metal panel and a part of the rear metal panel with the GND pattern of the circuit board as in Japanese Unexamined Utility Model Publication No. Although there is no problem, since the spring and the circuit board are just in contact with each other and no processing such as soldering has been performed, if the surface condition deteriorates due to aging, etc. Reliability may be impaired. The metal panel used must be made of a flexible material, especially because the terminal part that conducts with the circuit board must have spring properties, or the terminal part must be large and easy to have elasticity. There is. And so on.

The present invention provides a method of constructing an IC card which can solve all of these problems in the prior art.

[0017]

Means for Solving the Problems The present invention (first invention) I
A C card is an IC card including a circuit board on which components including an integrated circuit are mounted, and a pair of conductive panels fixed to the front and back sides of the circuit board, respectively.
A conductive terminal portion integrally formed with the conductive panel, wherein the conductive terminal portion is electrically and mechanically connected to the panel ground electrode on the circuit board by soldering by ultrasonic welding. It is.

Further, an IC card according to the present invention (second invention) is characterized in that, in the IC card according to the first invention, the conductive terminal portion has almost no spring function. Things.

Further, the IC card according to the present invention (third invention) is the IC card according to the first or second invention, wherein the conductive terminal portion formed integrally with the conductive panel is provided on the circuit board. And a part of the frame is in contact with the opposite side of the circuit board at the solder connection portion by ultrasonic welding between the panel ground electrode and the panel ground electrode.

The method of manufacturing an IC card according to the present invention (fourth invention) is the method of manufacturing an IC card according to the first, second, or third invention, wherein the mounting component on the circuit board is provided. It is characterized in that the solder application to the panel grounding electrode is performed simultaneously with the solder application to the land portion.

Further, the method for manufacturing an IC card according to the present invention (fifth invention) is characterized in that, in the method for manufacturing an IC card according to the first, second or third invention, when the ultrasonic welding is performed at the time of casing the card. At the same time, the conductive terminal portion integrally molded with the conductive panel and the panel ground electrode on the circuit board are connected by soldering by ultrasonic welding. is there.

Further, the method for manufacturing an IC card according to the present invention (sixth invention) is the method for manufacturing an IC card according to the first, second or third invention, wherein the mounting component on the circuit board is provided. At the same time as applying the solder to the land, applying the solder to the electrode for panel grounding, and at the time of ultrasonic welding at the time of the casing of the card, at the same time, the conductive terminal unit integrally molded with the conductive panel, A solder connection between the panel ground electrode on the circuit board and the panel ground electrode is made by ultrasonic welding.

More specifically, when mounting the components on the circuit board, first, the solder is applied to the panel grounding electrode simultaneously with the application of the solder to the lands of the mounted components. Thereafter, predetermined components are mounted on the circuit board. Next, a conductive panel in which conductive terminals located at a connection portion between the panel and the circuit board are integrally molded, or a frame integrally including the panel is prepared. And the above-mentioned circuit board is sandwiched by the above-mentioned panel or frame, and at the same time as being ultrasonically welded, casing into a card shape,
Grounding of the conductive panel is also realized.

In the present invention, the terminal for electrical connection between the circuit board and the conductive panel is a part of the conductive panel covering both sides of the circuit board. The increase in the number of components due to the realization of the connection does not occur at the stage of assembling the card nor at the stage of fabricating the mechanical components. Also, solder application to the connection terminal with the panel can be performed simultaneously with solder application for other component mounting, and further, when the panel and the frame are welded at the time of casing by ultrasonic welding. At the same time, since the circuit board and the panel are connected by soldering, a highly reliable connection between the circuit board and the panel can be obtained without increasing the number of work steps and work time. That is, in the present invention, the circuit board and the conductive panel covering the front and back of the circuit board are automatically formed by casing the card (covering the front and back of the circuit board with a conductive panel (frame) to form a card). Are electrically connected to each other, so that there is no increase in the number of work steps and work time due to the electrical connection between the circuit board and the conductive panel covering the front and back of the circuit board. Further, in the present invention, the terminal for electrical connection between the circuit board and the conductive panel is a part of the conductive panel covering both sides of the circuit board. Applicable.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments of the present invention.

FIG. 1 is an exploded perspective view showing the configuration of an IC card according to one embodiment of the present invention. FIG. 3 is a cross-sectional view after the assembly of the IC card of the embodiment is completed.

A solder paste is applied to a component mounting land (not shown) of the circuit board 11. At this time, the solder paste 13 is simultaneously applied to the upper surface of the ground electrode 12 (only the electrode that is on the upper side (horn side during ultrasonic welding)) on the substrate connected to the conductive panel. This solder paste 1
The thickness of the ground electrode 3 is set to be as large as about 0.3 mm, and the ground electrode is small and the lead wire from the ground electrode on the substrate is also thin to reduce the heat capacity. The reason for setting “0.3 mm” is as follows. In other words, when mounting general parts, even if it is thick,
Although it is generally about 0.2 mm, there is almost no possibility of short-circuit with other terminals in the ground electrode part.
Welding varies in thickness (about ± 50μm)
This thickness is considered appropriate for setting so that the conductive terminal hits the solder and does not reach the substrate.

The components 14 are mounted on the circuit board 11 configured as described above, and the components are soldered by reflow. A connector 15 for connection to the outside is also soldered to the circuit board 11.

A portion of the conductive panel is bent, and the bent portion is used as a conductive terminal portion for establishing conduction with a ground electrode on a circuit board. In addition, the conductive terminal portion formed on the conductive panel is less likely to be deformed with little spring property, which is more convenient in ultrasonic welding. Since the friction generated between the terminal and the solder becomes small and it is not likely to be welded correctly (the solder does not melt), a stainless steel sheet having a thickness of about 0.2 mm is used as a material for forming the conductive panel. In forming the conductive terminal portion, it is only necessary to simply bend this stainless steel plate into a predetermined shape. This also helps increase the strength of the card.

Reference numeral 16 denotes a front-side conductive panel, and the above-mentioned conductive terminal portion 161 is integrally formed on a part thereof.
Reference numeral 17 denotes a back side conductive panel, and the conductive terminal portion 171 is integrally formed on a part thereof. The back side conductive panel 17 is integrally formed with a frame 18 to form a panel integrated frame 19.

The circuit board 11 is sandwiched from above and below using the front-side conductive panel 16 and the panel-integrated frame 19 on the back side. At this time, the conductive terminal portion 161 formed integrally with the front side conductive panel 16 is connected to the ground electrode 12.
The conductive terminal portion 171 pressed against the upper solder 13 and formed integrally with the panel integrated frame 19 on the back side is
It is pressed into contact with a ground electrode 12 ′ formed on the back surface of the circuit board 11 at a position facing the ground electrode 12. At this time, in order to transmit the ultrasonic wave of the horn as it is to the solder portion which is the connection portion between the conductive terminal portion 161 of the front side conductive panel 16 and the ground electrode 12 of the circuit board 11. The play is made small so that the lower (anvil side) frame 19 and the circuit board 11 at the time of welding are securely fixed.

Thereafter, the casing is made into a card state by ultrasonic welding. At this time, at the same time as the casing, the solder connection between the conductive terminal portion 161 of the front-side conductive panel 16 and the ground electrode 12 on the circuit board 11 is also made.

The cross-sectional structure of the card after the casing is as shown in FIG.

The description of the first embodiment has been completed.

Next, a second embodiment of the present invention will be described.

FIG. 4 is a sectional view of a second embodiment of the present invention. As shown in FIG.
A front panel integrated frame 191 formed by integrally molding the front conductive panel 16 and the front frame 181, and a back panel integrated frame 192 formed by integrally forming the back conductive panel 17 and the back frame 182. In this case, the circuit board 11 is sandwiched from above and below, and the casing is formed into a card state by ultrasonic welding.

Next, a third embodiment of the present invention will be described.

FIG. 5 is a sectional view of a third embodiment of the present invention. As shown in FIG.
The ultrasonic vibration is more reliably transmitted to the solder 24 by making a part of the frame 23 abut on the back side of the ground electrode 22 forming part. Thereby, more reliable electrical connection can be obtained. In the figure, reference numeral 25 denotes a mounting component, 26 denotes a front-side conductive panel, and 261 denotes a conductive terminal unit integrally formed with the front-side conductive panel.
Reference numeral 27 denotes a back side conductive panel. In the present embodiment, the frame 23 is provided with a front-side conductive panel 26.
And the front side may be a panel-integrated frame, and conversely, it is integrally formed with the back side conductive panel 27,
The back side may be a panel-integrated frame.

[0039]

As described above, according to the present invention, according to the present invention, the number of parts, the number of man-hours for assembling,
It is possible to connect the conductive panel to the ground electrode on the circuit board without increasing the working time, and it is possible to provide a very useful IC card construction method with extremely high connection reliability. It is what becomes.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a configuration of an IC card according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a configuration of a conventional IC card.

FIG. 3 is a sectional view showing a configuration of the IC card of the embodiment.

FIG. 4 is a cross-sectional view illustrating a configuration of an IC card according to a second embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a configuration of an IC card according to a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Circuit board 12 Ground electrode 13 Solder 14 Mounting parts 16 Front conductive panel 161 Conductive terminal 17 Back conductive panel 171 Conductive terminal 18 Frame 19 Panel integrated frame 181 Front frame 182 Back frame 191 Front panel integrated frame 192 Back panel integrated frame 21 Circuit board 22 Ground electrode 23 Frame 24 Solder 25 Mounting component 26 Front conductive panel 261 Conductive terminal 27 Back conductive panel

Claims (6)

[Claims] 1. An IC card comprising: a circuit board on which a component including an integrated circuit is mounted; and a pair of conductive panels fixed to a front side and a back side of the circuit board, respectively. An IC card, wherein a conductive terminal portion integrally formed with a panel is electrically and mechanically connected to a panel ground electrode on the circuit board by soldering by ultrasonic welding. 2. The IC card according to claim 1, wherein the conductive terminal portion has almost no spring function. 3. A solder connection portion formed by ultrasonic welding between a conductive terminal portion integrally formed with the conductive panel and a panel ground electrode on the circuit board, on an opposite side of the circuit board. 3. The IC card according to claim 1, wherein a part of the frame abuts. 4. The method of manufacturing an IC card according to claim 1, wherein solder is applied to a land portion of the mounting component on the circuit board, and simultaneously to the panel ground electrode. A method for manufacturing an IC card, characterized in that solder coating is performed. 5. The method of manufacturing an IC card according to claim 1, wherein said conductive terminal portion is integrally formed with said conductive panel at the same time as ultrasonic welding at the time of casing of said card. And a solder connection by ultrasonic welding between the panel ground electrode on the circuit board and the panel ground electrode. 6. The method for manufacturing an IC card according to claim 1, wherein solder is applied to a land portion of the mounting component on the circuit board, and simultaneously the solder is applied to the panel grounding electrode. At the same time as performing the solder coating and the ultrasonic welding at the time of the casing of the card, the ultrasonic wave between the conductive terminal portion integrally molded with the conductive panel and the panel grounding electrode on the circuit board. A method for manufacturing an IC card, wherein a solder connection is made by welding.