JP2001077597A - Method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To optimize the mounting order for enhanced mounting efficiency by additionally mounting electronic components which belong to the group and has not been mounted in the planned mounting sequence, each time a schedulued mounting sequence for one group ends. SOLUTION: First, electronic components are mounted according to the scheduled mounting sequence for a first group (ST4). Whether there is any electronic component that belongs to the first group and has not been mounted in the execution of the scheduled mounting sequence is judged, and if there is such a component, a recovery process is performed to additionally mount those electronic components unmounted (ST5). After all the electronic components belonging to the first group have been mounted, electronic components are mounted according to the scheduled mounting sequence for the second group (ST6). If there is an unmounted component in the second group, similarly, a recovery process is performed to additionally mount those electronic components (ST7), and then the mounting operation is finished.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art In mounting electronic components on a substrate, a plurality of types of electronic components may be mounted on a single mounting stage. When mounting a plurality of types of electronic components, the mounting order of electronic components in adjacent parts may be restricted by restrictions on mounting operations such as the mounting position and the shape of the electronic components. For example, when a large electronic component is mounted in a form that covers it after mounting a small electronic component,
In the case where the mounting positions are close to each other and the mounting operation of subsequent components is hindered, it is necessary to mount those electronic components in accordance with a predetermined leading / succeeding relationship.

[0003]

For this reason, there are electronic components that must be mounted in advance due to physical constraints on the mounting operation, and such electronic components may be broken or may be defective due to recognition. In the case where it is determined, it becomes impossible to mount the electronic components having a subsequent relationship. Conventionally, mounting interruptions due to such constraints on mounting operations have occurred at a high frequency, and this has been one factor that hinders optimization of mounting operations.

Accordingly, an object of the present invention is to provide a mounting method of an electronic component which can optimize a mounting order and improve mounting efficiency.

[0005]

According to a first aspect of the present invention, there is provided an electronic component mounting method, wherein a plurality of types of electronic components are picked up from an electronic component supply unit by a transfer head and transferred and mounted on a substrate on the same mounting stage. Mounting method, wherein the electronic components are grouped based on the leading / succeeding relationship derived from the constraints on the mounting operation, and these groups are ranked according to the precedence order. Each time the scheduled mounting sequence for one group is completed, the electronic components belonging to the group and the unmounted components that are not mounted in the execution of the scheduled mounting sequence are refilled and mounted. I made it.

According to the present invention, the electronic components are divided into groups based on the leading / succeeding relationship in the mounting operation and are ranked in these groups. The mounting efficiency can be improved by repeatedly performing the mounting in units of groups and the replenishment mounting of the electronic components belonging to the group and not mounted yet.

[0007]

Embodiments of the present invention will now be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus, and FIG. 3 is a block diagram illustrating a configuration of a control system of the electronic component mounting apparatus. 4 (a) and 4 (b) are explanatory diagrams of a leading / succeeding relationship in the mounting operation of the electronic component, and FIG. 5 is a flowchart showing a mounting method of the electronic component.

First, an electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a transport path 2 is provided in the center of a base 1 in the X direction. The transport path 2 transports and positions the substrate 3. A first supply section 4A and a second supply section 4B for electronic components are arranged on both sides of the transport path 2, and a large number of tape feeders 5 are arranged in each supply section 4A, 4B. The tape feeder 5 stores the electronic components held by the tape, and supplies the electronic components by feeding the tape at a pitch.

On the X-axis table 6, a transfer head 7 for electronic components is mounted. The X-axis table 6 is supported on both ends by a Y-axis table 8A and a guide 8B arranged side by side opposite to the Y-axis table 8A. Therefore, by driving the X-axis table 6 and the Y-axis table 8A, the transfer head 7 moves horizontally, and the nozzle 7a (see FIGS. Electronic components are picked up from the pick-up position 9 and transferred onto the substrate 3. Therefore, this electronic component mounting apparatus is configured so that a plurality of types of electronic components are picked up by the transfer head 7 and transferred and mounted on the substrate 3 positioned on the transport path 2 which is the same mounting stage.

A first camera 10 for recognizing electronic components is provided between the transport path 2 and the second supply section 4B.
The transfer head 7 is equipped with a second camera 11 that is a board recognition camera that moves integrally with the transfer head 7. The second camera 11 captures an image of the substrate 3 from above, and recognizes a recognition mark provided on the substrate 3.

Next, the configuration of a control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 3, a control unit 20 is a CPU, which performs various types of arithmetic processing and controls the whole of each unit described below. The image recognizing unit 21 uses the first camera 10 to recognize the displacement of the electronic component, and the second camera 11 to recognize the position of the recognition mark provided at the recognition point on the board. Motor control unit 22
X is used to perform horizontal movement, elevation, and rotation of the transfer head 7.
The operation of the axis motor 23, the Y axis motor 24, the Z axis motor 25, and the θ axis motor 26 is controlled. The Z-axis motor 2
The description of the 5 and θ-axis motors 26 is omitted in FIG.

The coordinate position storage unit 27 stores mounting position coordinate data of electronic components mounted on the board 3. The mounting ranking data storage unit 28 stores data of a leading / succeeding relationship in a mounting operation existing between electronic components mounted on the substrate 3 positioned on the transport path 2 which is a mounting stage. The grouping data storage unit 29 stores grouping data of electronic components grouped based on the leading / succeeding relationship in the mounting operation. The scheduled mounting sequence storage unit 30 stores a scheduled mounting sequence representing a mounting operation sequence created as a result of the electronic component mounting order optimizing process in each of the groups. The program storage unit 31 stores various programs necessary for controlling the mounting operation and performing the above-described arithmetic processing. The electronic component grouping process and the scheduled mounting sequence creation process are performed by the control unit 20 according to the program stored in the program storage unit 31.

Here, the preceding / succeeding relationship of the electronic components will be described with reference to FIG. When a plurality of electronic components are mounted in adjacent areas, the mounting order may be restricted by physical restrictions on the mounting operation due to the positional relationship between the electronic components. For example, as shown in FIG. 4A, when another electronic component P2 is mounted so as to cover above the small electronic component P1, the electronic component P1 is mounted after the electronic component P2 is clearly mounted. It is not possible. Therefore, the mounting order of the electronic components P1 and P2 in the mounting operation, that is, the leading / succeeding relationship, is uniquely determined, and a free mounting order cannot be set.

A plurality of electronic components P3 having different thicknesses are provided.
Even when P4 comes close and is mounted at a close distance,
If the electronic component P3 having a larger thickness is mounted first, the electronic component P4 having a smaller thickness is held by the nozzle 7a, and if the electronic component P4 is to be mounted later, as shown in FIG. Interference with the already mounted electronic component P3 occurs. That is, the electronic component P3 having the larger thickness cannot be mounted first, and the preceding / succeeding relationship also exists between such two electronic components P3 and P4.

When the preceding / succeeding relationship described above exists between a plurality of electronic components mounted on the same mounting stage,
When an electronic component to be mounted earlier runs out of components, it is necessary to suspend mounting of not only the broken component but also subsequent electronic components. When such a leading / succeeding relationship exists between a large number of electronic components, the probability of the above-described mounting interruption occurring during mounting work increases. In other words, in such a case, even if the mounting order is optimized in advance, all subsequent mounting operations will be interrupted due to unexpected parts running out of the preceding part, and mounting in the originally planned mounting order will be performed. Can't do it.

Therefore, in order to minimize the probability of the interruption of the mounting operation due to the above-mentioned restriction on the mounting order, in this embodiment, the electronic components are grouped as described below prior to the mounting of the electronic components. Do. That is, first, the leading / succeeding relationship in the mounting operation existing between the electronic components mounted on the same mounting stage is listed in advance. Then, these electronic components are classified into a plurality of groups based on the preceding / succeeding relationship. This group classification is performed based on the leading / succeeding ranks derived from the constraints on the mounting operation as shown in FIGS. 4A and 4B, and the groups are ranked according to the preceding ranks.

Here, when the existing leading / succeeding relationship exists between all two electronic components, the electronic components are classified into two groups. If the preceding / succeeding relationship is complicated and exists over three or more electronic components, the components are classified into groups corresponding to the number of related electronic components. For example, in the example shown in FIG. 4A, an example in which a third electronic component having a smaller thickness than the electronic component P1 other than the electronic component P1 is mounted below the electronic component P2.

In other words, the operation of dividing a plurality of electronic components mounted on the same mounting stage into groups of electronic components having no preceding / subsequent relationship is performed. Thus, there is no restriction on the mounting order between electronic components belonging to the same group, and the mounting order can be set freely. Therefore, with respect to the electronic components belonging to the same group, even if any one of the electronic components breaks down, other electronic components can be mounted immediately. That is, the mounting operation can be improved without interrupting the mounting operation due to running out of components.

The specific mounting operation of the electronic component mounting apparatus will be described with reference to the flow chart of FIG. First, in the flow of FIG. 5, the electronic components mounted on the mounting stage are divided into groups prior to the mounting operation. This grouping is performed based on the preceding and succeeding ranking data on the mounting operation stored in the mounting ranking data storage unit 28 in advance. Here, the first group and the second group are used.
It is classified into two groups (ST1). That is, all electronic components which have electronic components in the subsequent order and need to be mounted earlier are classified into the first group, and all electronic components corresponding to the electronic components in the subsequent order are classified into the second group. The classification result is stored in the grouping data storage unit 29.

Next, in each group, a process of optimizing the order of mounting the electronic components using parameters such as the moving distance of the transfer head to the mounting point of each electronic component is performed to create a scheduled mounting sequence ( ST2). The created scheduled mounting sequence is stored in the scheduled mounting sequence storage unit 31.

It should be noted that there is no leading / succeeding relationship with any of the electronic components, and the electronic components which can be mounted at any time may have a bias in the number of electronic components belonging to the entire group in the grouping of ST1. Are appropriately divided into two groups so that there is no As a result, the number of electronic components without restrictions is increased, and the degree of freedom in optimizing the mounting order is increased, so that the optimization can be performed more easily.

Next, the mounting operation is started (ST3), and first, electronic components are mounted according to the scheduled mounting sequence of the first group in the preceding order (ST4). In this mounting operation, mounting is performed based on the above-described optimized mounting order. If a component break occurs during the mounting operation, an electronic component other than the component is mounted. However, at this time, since there is no leading / succeeding relationship between the broken electronic component and the other electronic component, other electronic components are immediately mounted. Components can be mounted, and there is no interruption of the mounting operation due to running out of components.

When the scheduled mounting sequence for the electronic components in the first group is completed, the electronic components belonging to the first group are not mounted in the execution of the scheduled mounting sequence due to a component exhaustion or an error. It is determined whether or not there is an electronic component that is set as described above, and if there is an unmounted component, a recovery process for replenishing and mounting these electronic components is performed (ST5). When the mounting of all the electronic components for the first group is completed, the electronic components are mounted according to the next planned mounting sequence of the second group (ST6), and similarly, the unmounted components for the second group are removed. If there is, a recovery process for replenishing and mounting these electronic components is performed (ST7), and the mounting operation in the mounting stage ends. In the above example, an example in which the groups are divided into two groups has been described, but the same applies to a case where three or more groups exist.

That is, at the time of the mounting operation, the electronic components are mounted in groups in order from the group of the prioritized order, and each time the scheduled mounting sequence for one group is completed, the electronic components belonging to the group are executed. Performs supplemental mounting of unmounted components that have not been mounted. As a result, even when a plurality of electronic components having complicated leading / succeeding relationships are mixed and mounted on the same mounting stage, constraints on mounting operations can be arranged by grouping, and the mounting order can be optimized easily. As a result, the overall mounting efficiency can be improved.

[0025]

According to the present invention, the electronic components are divided into groups based on the leading / succeeding relationship in the mounting operation and are ranked in the groups. Since the mounting operation of each group and the replenishment mounting of unmounted components that are electronic components belonging to the group and not mounted are repeatedly performed, the probability of interruption of the mounting operation due to constraints on the mounting operation is reduced. It is possible to optimize the mounting order and improve the mounting efficiency.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 4 (a) is an explanatory diagram of a leading / succeeding relationship in an electronic component mounting operation according to an embodiment of the present invention; FIG. 4 (b) is a diagram of a leading / succeeding relationship in an electronic component mounting operation according to an embodiment of the present invention; Illustration

FIG. 5 is a flowchart showing a method for mounting an electronic component according to an embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 2 transport path 3 substrate 4A first supply unit 4B second supply unit 7 transfer head 28 mounting ordering data storage unit 29 grouping data storage unit 30 scheduled mounting sequence storage unit

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hideki Kadoma 1006 Kadoma, Kazuma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Terms (reference) 5E313 AA01 AA11 AA15 CC04 DD15 DD31 EE02 EE03 EE22 FF11 FF24 FF28

Claims (1)

[Claims] An electronic component mounting method for picking up a plurality of types of electronic components from an electronic component supply unit by a transfer head and transferring and mounting the electronic components on a substrate on the same mounting stage, wherein the electronic components are restricted in a mounting operation. Grouping is performed based on the leading / succeeding relationship derived from the conditions, and these groups are ranked according to the precedence order. At the time of implementation work, implementation is performed in groups from the group with the precedence order, and scheduled implementation for one group A mounting method of an electronic component, wherein each time the sequence is completed, an unmounted component, which is an electronic component belonging to the group and has not been mounted in the execution of the scheduled mounting sequence, is supplementarily mounted.