JP2001053346A - Method of forming electrode layer, and manufacture of multilayer piezoelectric element, and the multilayer piezoelectric element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer piezoelectric element, which can reduce cost by reducing the thickness of the electrode layer of a multilayer piezoelectric element and prevent the occurrence of delaminations and cracks. SOLUTION: In the manufacture of a multilayer piezoelectric element, first in step S105, an electrode layer on a film made at step S103 is transcribed to a green sheet made in step S101. Subsequently, in step S107, the green sheet where the electrode layer is transcribed, a new green sheet, and a film where an electrode layer is made are laid in the order on top of each other, and they are thermo compression bonded through addition of heat and pressure. Then, the film is peeled off, and lamination and compression bonding and transcription are finished at the same time. This treatment is repeated, and then at step S111, the stacking and thermo compression bonding of the last green sheet is conducted, and lastly at step S113, the entire body is backed at a high temperature.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for forming an electrode layer,
Regarding a multilayer piezoelectric element manufacturing method and a multilayer piezoelectric element,
In particular, a method for forming an electrode layer for forming an electrode thin film on a piezoelectric ceramic layer, a method for manufacturing a multilayer piezoelectric element for thinning an internal electrode layer of a multilayer piezoelectric element in which a large number of piezoelectric ceramic layers and electrode layers are alternately stacked, and It relates to a piezoelectric element.

[0002]

2. Description of the Related Art Piezoelectric ceramics such as PZT (lead zirconate titanate) exhibiting a piezoelectric phenomenon are used as actuators for various devices as piezoelectric elements. This piezoelectric element usually has a single-layer structure in which a conductor layer (electrode layer) for applying a voltage is provided on both surfaces of a piezoelectric ceramic. However, when a larger displacement is required because the obtained displacement is small in a single-layer structure, a multilayer structure in which a large number of piezoelectric ceramic layers and electrode layers are alternately stacked is often used.

FIG. 14 is a longitudinal sectional view of a conventional multilayer piezoelectric element. As shown in the figure, the multilayer piezoelectric element has a structure in which a large number of piezoelectric ceramic layers 101 and electrode layers 105 are alternately stacked. The number of layers varies depending on the required displacement, but usually 100 or more layers are required to obtain a high displacement.

[0004] The multilayer piezoelectric element according to the prior art is manufactured by the following steps. First, a green sheet to be a piezoelectric ceramic layer is formed by a doctor blade method or the like. Next, a conductor paste is printed on the green sheet by a screen printing method to form an electrode layer. Then, thermocompression bonding is performed in a state where many green sheets on which the electrode layers are formed are stacked. Finally, the multi-layered ceramic layers are fired at a high temperature, and the production of the multilayer piezoelectric element is completed.

[0005]

However, the conventional multi-layer piezoelectric element manufacturing method has the following problems. That is, as described above, the process of firing is required for the production of the multilayer piezoelectric element. This firing is 10
Since it is necessary to perform the treatment in an oxidizing atmosphere at a temperature of 00 ° C. or higher, conductors that can be used as electrode layers are limited to noble metals such as Au, Pt, Pd, and Ag that can withstand this firing. For this reason, when the electrode layer becomes thicker, the amount of noble metal used increases and the cost increases. Therefore,
In order to reduce the cost, it was necessary to reduce the thickness of the electrode layer even slightly.

Further, the multilayer piezoelectric element has a structure in which the piezoelectric ceramic layers 101 and the electrode layers 105 are alternately laminated, but strictly speaking, as shown in FIG. A where the parts alternate
And a part B which does not overlap alternately exists. Therefore, the thicknesses of the two layers are different from each other, and when the piezoelectric ceramic layers are laminated and pressed, the pressing force may not be applied uniformly, resulting in poor adhesion.

For this reason, problems such as delamination (peeling) after lamination and cracking after firing are liable to occur. This tendency becomes more remarkable as the number of stacked layers increases. Therefore, when manufacturing a multilayer piezoelectric element having 100 or more layers, it is particularly necessary to reduce the thickness of the electrode layer.

[0008] However, the electrode layer is formed by adding a resin and a solvent to a powdered noble metal to form an electrode metal paste, and screen-printing this on a green sheet. Therefore, the thickness of the electrode layer could not be reduced below the particle size of the metal powder. Actually, a thickness of two to three times or more of the particle size is required in consideration of various factors such as mass productivity and adhesive strength.

Specifically, the particle size of the metal powder is about 0.3 μm. Therefore, theoretically, the thickness of the electrode layer can be 0.3 μm. However, the thickness of the electrode layer actually formed is 1 to 3 times or more of this particle size.
μm or more.

That is, in the method of forming the electrode layer by the screen printing method, it is practically very difficult to make the thickness of the electrode layer smaller than two to three times the particle diameter of the metal powder. However, since the vacuum state cannot be applied to the green sheet, a thin film can be formed more than the screen printing method, and the electrode layer cannot be formed directly by using an evaporation method or the like.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for forming an electrode layer capable of reducing the thickness of an electrode layer formed on piezoelectric ceramics. . It is another object of the present invention to provide a multilayer piezoelectric element manufacturing method and a multilayer piezoelectric element that can reduce the cost and prevent the occurrence of delamination and cracks by reducing the thickness of the electrode layer of the multilayer piezoelectric element. It is still another object of the present invention to provide a multilayer piezoelectric element manufacturing method and a multilayer piezoelectric element capable of reliably forming a desired pattern of an internal electrode layer.

[0012]

According to one aspect of the present invention, there is provided an electrode layer forming method for forming an electrode layer on a piezoelectric ceramic layer, comprising the steps of: forming an electrode layer on a film; And a transfer step of transferring the electrode layer formed on the film to the piezoelectric ceramic layer.

According to the present invention, it is possible to make the electrode layer formed on the film thin, so that the electrode layer on the piezoelectric ceramic obtained by transferring the electrode layer can also be made thin. Therefore, it is possible to provide an electrode layer forming method capable of reducing the thickness of the electrode layer.

According to another aspect of the present invention, a method of manufacturing a multilayer piezoelectric element includes a step of forming a piezoelectric ceramic layer for forming a piezoelectric ceramic layer, and an electrode layer for forming an electrode layer on the piezoelectric ceramic layer by the electrode forming method. The method includes a forming step and a laminating step of laminating the piezoelectric ceramic layers such that the piezoelectric ceramic layers and the electrode layers are laminated alternately.

According to the present invention, the thickness of the internal electrode layer of the multilayer piezoelectric element can be reduced. Therefore, it is possible to provide a method for manufacturing a multilayer piezoelectric element that can reduce cost and prevent occurrence of delamination and cracks.

Preferably, the method of manufacturing a multilayer piezoelectric element is characterized in that the electrode layer transferred in the transferring step is a solid pattern, and further comprises a patterning step of patterning the transferred electrode layer.

According to this, it is possible to avoid a situation in which the fine line portions and the like of the previously patterned electrode layer are not formed on the green sheet due to poor transfer, and the desired pattern of the electrode layer is reliably formed. It is possible to do.

In the method of manufacturing a multilayer piezoelectric element, it is preferable that the step of forming the piezoelectric ceramic layer and the step of transferring are performed simultaneously in one step. According to this, a multilayer piezoelectric element can be manufactured with fewer manufacturing steps. Therefore, it is possible to reduce the manufacturing time and the cost.

Further, in the method of manufacturing a multilayer piezoelectric element, it is preferable that the transferring step and the laminating step be performed simultaneously in one step.

By stacking the piezoelectric ceramic layers one by one at the same time as transferring the electrode layers, the energy supplied for the transfer can be used for stacking. For this reason, the energy required for manufacturing the multilayer piezoelectric element can be minimized as compared with the case where the entire piezoelectric ceramic layer to which the electrode layer is transferred is collectively stacked at the end and thermocompression-bonded for a long time. Therefore, it is possible to reduce the manufacturing time and the cost.

According to another aspect of the present invention, a multi-layer piezoelectric element is manufactured by the above-described method for manufacturing a multi-layer piezoelectric element, and has at least 100 piezoelectric ceramic layers.

The effect of reducing the cost and reducing the occurrence of delamination and cracking by reducing the thickness of the internal electrode layer is particularly significant in a piezoelectric element having a multilayer structure of 100 layers or more. Therefore, according to the present invention, it is possible to provide a multilayer piezoelectric element that can reduce costs and prevent delamination and cracks.

[0023]

Next, embodiments of the present invention will be described with reference to the drawings. [First Embodiment] FIG. 1 is a flowchart showing a method for manufacturing a multilayer piezoelectric element according to a first embodiment of the present invention. Referring to FIG. 1, the multilayer piezoelectric element is manufactured by the following steps. First, in step S101, a green sheet to be a piezoelectric ceramic layer is formed by a doctor blade method or the like. Then, separately from the creation of the green sheet, step S103
, An electrode pattern is formed on a film having good releasability by plating, vapor deposition, sputtering, or the like.

Next, in step S105, the electrode layer on the film created in step S103 is transferred to one green sheet created in step S101. That is, first, one film on which an electrode layer is formed is overlaid on one green sheet so that the electrode layer is in contact with the green sheet. Then, after thermocompression bonding, the electrode layer is transferred onto the green sheet by peeling off the film.

Subsequently, in step S107, a new green sheet is stacked on the green sheet to which the electrode layer has been transferred, and a new film on which the electrode layer has been formed is further stacked thereon, and heat and pressure are applied. After the thermocompression bonding, the electrode layer is transferred onto the green sheet by peeling the film. This makes it possible to simultaneously perform the lamination and compression of the green sheet on which the electrode layer is formed and the new green sheet, and transfer of the electrode layer on the film to the new green sheet.

Next, in step S109, it is determined whether or not the last new green sheet to be laminated is the last one, and processing for simultaneously laminating and pressing this green sheet and transferring the electrode layer is performed (step S109). Step S107)
Is repeated 100 times or more until the last green sheet is obtained.

Then, in step S111, the last green sheet is laminated and thermocompression-bonded. This completes the lamination and pressure bonding of all the green sheets of 100 layers or more. Subsequently, the process proceeds to step S113, and firing at a high temperature is performed. Thereafter, cutting, polarization processing, and the like of the multilayer piezoelectric element are performed, and the manufacture of the multilayer piezoelectric element ends.

Next, each step of the manufacturing process of the multilayer piezoelectric element shown in FIG. 1 will be described with reference to FIGS. 2 to 6, the film 203, the electrode layer 2
05 and the green sheet 201 are shown in cross-sectional views.

FIG. 2 shows a green sheet forming step (step S10) in the multilayer piezoelectric element manufacturing process shown in FIG.
It is a figure for explaining 1) and the step of forming an electrode layer on a film (step S103).

First, the step of forming an electrode layer on the film (step S103 in FIG. 1) is performed by forming a composition ratio of Ag: Pd = 7: 3 on a film 203 having excellent releasability such as polyester or polyimide. AgPd alloy,
An electrode layer 205 having a thickness of 0.3 μm is formed by performing plating, vapor deposition, sputtering, or the like. At this time, as shown in this drawing, the electrode layer 205 is formed in a pattern according to the plane pattern (electrode shape) of the internal electrode by mask processing or the like.

On the other hand, the green sheet 201 is formed in a step separate from the step of forming electrodes on the film (step S101 in FIG. 1). Here, a doctor blade method is used in which the raw material is applied to a plastic film so that the film pressure becomes constant with a blade, and then the plastic film is peeled off, so that the plastic film has a predetermined thickness (100 μm) after firing.

FIG. 3 is a view for explaining a step (step S105) of transferring the electrode layer on the film onto the green sheet in the manufacturing process of the multilayer piezoelectric element shown in FIG.

First, as shown in FIG. 3A, a film 2 on which an electrode layer 205 is formed
Layer 03. In this state, 150 kg / cm ² and 1
The electrode 205 is thermocompression-bonded on the green sheet 201 at 20 ° C. Thereafter, as shown in FIG. 2B, the film 203 is peeled off, and the electrode layer 205 is transferred onto the green sheet 201.

FIG. 4 is a view for explaining a process (Step S107) of simultaneously performing the lamination and pressing of the green sheets and the transfer of the electrode layers in the multi-layer piezoelectric element manufacturing process shown in FIG.

As shown in FIG. 4A, the electrode layer 205
A new green sheet 201 (b) is overlaid on the green sheet 201 (a) to which (a) has been transferred, and a film 203 on which the electrode layer 205 (b) has been formed is further overlaid thereon. In this state, heat of 120 ° C. and 150 kg / cm ²
And the electrode layers 205 (a) and 20
5 (b) is thermocompression-bonded to both surfaces of the green sheet 201 (b). Thereafter, as shown in FIG. 4B, the step of transferring the electrode layer 205 (b) onto the green sheet 201 (b) is completed by peeling off the film 203.

Therefore, in this step, the electrode layer 2
The step of laminating and pressing the green sheet 201 (a) on which the film 05 (a) is formed and the new green sheet 201 (b) is performed, and the electrode layer 205 (b) on the film 203 is replaced with the new green sheet 201 (b). And the step of transferring the image data to the same is performed at the same time. This operation is repeated many times to complete the transfer and the lamination.

FIG. 5 is a view for explaining the firing step (step S113) after the completion of the lamination and pressure bonding of all the green sheets in the manufacturing process of the multilayer piezoelectric element shown in FIG. FIG. 6 is a cross-sectional view of the multilayer piezoelectric element after being cut into a predetermined size.

As shown in FIG. 5, baking is performed at 1100 ° C. in an electric furnace in a state where many green sheets 201 and electrode layers 205 are alternately laminated. After that, it is cut into a predetermined size, and a polarization process or the like is performed.

According to the manufacturing method described above, the electrode layer is formed on the green sheet by transferring the electrode layer formed on the film. Therefore, by reducing the thickness of the electrode layer formed on the film, the thickness of the electrode layer after transfer can be reduced as a result. That is, when the vapor deposition method or the like is used, it is possible to stably form an electrode layer on a film with a metal particle size of about 0.3 μm used in the screen printing method. Therefore, by transferring this on a green sheet, as a result,
A stable electrode layer of about 0.3 μm can be formed.

Further, by simultaneously performing the green pressing of the green sheets and the transfer of the electrode layers, the manufacturing time can be reduced as compared with the case where all the layers are finally stacked and pressed. In addition, since the amount of heat required for transfer can be used for lamination and compression without wasting, the efficiency is high in terms of energy utilization.

<Modification> FIG. 7 is a flowchart showing a method for manufacturing a multilayer piezoelectric element according to a modification. In the method for manufacturing the multilayer piezoelectric element shown in FIG. 1, in step S107, the processing of simultaneously performing the green pressing and the transfer of the electrode layers is performed. However, in FIG. 7, the processing is not performed simultaneously. This is different from FIG. That is, after all the transfer steps of transferring the electrode layers on the film onto the green sheet are completed, the process shifts to a laminating step of finally laminating the layers collectively. Hereinafter, the general flow will be described.

Referring to FIG. 7, first, similarly to the case of FIG. 1, in step S101, a green sheet is created. Separately, in step S103, an electrode layer is formed on the film.

Next, in step S105, the electrode layer formed on the film is transferred onto the green sheet. Then, this transfer process is performed on all necessary green sheets (step S707).

When the transfer to all the necessary green sheets is completed, all the green sheets on which the electrode layers have been formed in step S709 and one green sheet on which the electrode layers have not been formed are placed such that the electrode layers are inside. The layers are collectively laminated and thermocompression-bonded at 100 ° C. for about 1 hour while applying a predetermined pressure. Then, in step S113,
After firing, necessary processing such as cutting and polarization is performed, and the production of the multilayer piezoelectric element is completed.

[Second Embodiment] Next, a second embodiment of the present invention will be described.
An embodiment will be described. FIG. 8 shows a second embodiment of the present invention.
5 is a flowchart showing a method for manufacturing a multilayer piezoelectric element according to the embodiment. Referring to FIG. 8, the multilayer piezoelectric element
It is manufactured through the following steps.

First, in step S103, a patterned electrode layer is formed on a film by plating, vapor deposition, sputtering, or the like. Next, step S8
At 05, a step of forming a green sheet and a step of transferring an electrode layer on a film are performed simultaneously.
That is, here, the doctor blade method is used to create the green sheet, and the raw material is applied on the film on which the electrode layer is formed in a slurry state before the green sheet is created. When the green sheet is completed by drying, the film is peeled off, and the electrode layer is transferred.

The process of simultaneously performing the step of forming the green sheet and the step of transferring the electrode layer is performed on all the green sheets necessary for lamination. And
After all of the green sheets on which the electrode layers are formed are completed, in step S707, the laminated thermocompression bonding of all the layers is performed.

Thereafter, in step S113, baking is performed, and cut into an appropriate size. Finally, a polarization process is performed, and the manufacture of the multilayer piezoelectric element ends.

FIG. 9 is a schematic diagram for explaining the step (step S805) of FIG. 8 in which the formation of the green sheet and the transfer of the electrode layer on the film are simultaneously performed. Referring to FIG. 9, raw material 901 in a slurry state before forming a green sheet is formed to a predetermined thickness by doctor blade 903.

At this time, a film 205 on which an electrode layer 205 is formed in advance is used as a carrier for transporting the raw material 901 in a slurry state. Therefore, the raw material 901 in a slurry state is applied on the film 205 so as to cover the electrode layer 205 on the film 205 formed in a convex state. For this reason, the green sheet formed by drying the raw material 901 in a slurry state is a sheet that is smooth on the surface on which the electrode layer is present and has no irregularities.

Therefore, when the green sheets thus formed are laminated, there is no difference in the lamination thickness between the portion having the electrode layer and the portion having no electrode layer, and the defective adhesion at the time of lamination can be further reduced. It becomes possible.

[Third Embodiment] Next, a method for manufacturing a multilayer piezoelectric element according to a third embodiment of the present invention will be described. The method for manufacturing a multilayer piezoelectric element according to the present embodiment is different from the first embodiment in that the patterning is performed by transferring the electrode layer to a green sheet instead of performing patterning in the step of forming the electrode layer on the film. It is to do.

FIG. 10 is a flowchart showing a method for manufacturing a multilayer piezoelectric element according to the third embodiment of the present invention. As shown in FIG. 10, in this manufacturing method, FIG.
Are different in the steps S1003, S1006, and S1008 as compared with the manufacturing method shown in FIG.

That is, in the present manufacturing method, similarly to FIG. 1, first, in step S1003, an electrode layer is formed on the film. However, the electrode layer created here is a mere solid pattern and is not patterned as in the case of FIG. Then, step S1
After transferring the solid pattern electrode layer to the green sheet in 05, patterning is performed in step S1006. That is, here, for the first time, a patterning process of forming the electrode layer on the green sheet into a desired pattern by etching, trimming, or the like is performed.

Then, in step S107, a new green sheet and a film on which the solid pattern electrode layer is formed are sequentially stacked on the green sheet on which the patterning electrode layer has been formed. Are performed simultaneously.

Here, since the transferred electrode layer is a solid pattern, in Step S1008, Step S1 is performed.
As in 006, a patterning process such as etching is performed. Then, this series of processing is repeated until the new green sheet is the last one (Step S107, Step S1008, Step S109).

The subsequent steps are the same as those in FIG. 1 (steps S111 and S11).
3) Finally, the manufacture of a multilayer piezoelectric element having 100 or more layers having patterned internal electrode layers is completed.

FIG. 11 shows a step of forming an electrode layer on a film (step S1003) and a step of transferring an electrode layer (step S10) in the multilayer piezoelectric element manufacturing process shown in FIG.
5) and pattern formation step of electrode layer (step S
1006).

First, in the step of forming an electrode layer on a film shown in FIG. 11 (a), for example, an AgPd alloy having a thickness of about 0.3 μm is formed on a film 203 of polyester, polyimide or the like by plating, vapor deposition, sputtering or the like. It is formed as an electrode layer 204 having a uniform solid pattern.

Next, in the electrode layer transfer step shown in FIG.
4 is superimposed on the green sheet 201, and predetermined heating and pressing are performed. Then, by peeling the film 203, the electrode layer 204 having a solid pattern is formed on the green sheet 2.
01 is transferred.

Thereafter, in the electrode layer pattern forming step shown in FIG. 11C, the solid pattern electrode layer 204 formed on the green sheet 201 is formed into a desired electrode pattern 205 by etching or trimming. .

As described above, in the method for manufacturing the multilayer piezoelectric element according to the third embodiment of the present invention, the fine line portions of the electrode layer previously patterned on the film are not transferred onto the green sheet due to transfer failure or the like. Can be avoided. Therefore, a desired pattern of the electrode layer can be reliably formed even if the pattern is difficult to transfer.

In the method of manufacturing the multilayer piezoelectric element according to the third embodiment, as shown in FIG. 12, the stacking process may be performed at once. In this case, in step S1206, a process of patterning the solid pattern electrode layer transferred onto the green sheet by etching or the like is added.

[Fourth Embodiment] Finally, a method of manufacturing a multilayer piezoelectric element according to a fourth embodiment of the present invention will be described. As in the third embodiment, the method of manufacturing a multilayer piezoelectric element according to the present embodiment is such that a solid pattern electrode layer is transferred and then patterned into a desired pattern.

FIG. 13 is a flowchart showing a method for manufacturing a multilayer piezoelectric element according to the fourth embodiment of the present invention. As shown in FIG. 13, in this manufacturing method, FIG.
Are different in the steps of Step S1003 and Step S1305 as compared with the manufacturing method shown in FIG.

That is, in step S1003,
An electrode layer having a solid pattern rather than a patterned one is formed on the film. Then, step S805
In step S1305, the preparation of the green sheet and the transfer of the electrode layer are performed simultaneously. In step S1305, the solid pattern electrode layer formed on the green sheet is patterned into a desired pattern by etching or the like. The subsequent processing is the same as that in FIG. 8 (steps S806, S707, and S13).

As described above, when patterning is performed after transferring the solid pattern electrode layer, the thickness of the electrode layer can be reduced, and in addition, poor transfer of the fine line portion of the electrode can be avoided. As a result, it is possible to sufficiently form the electrode layer of the fine line portion.

In FIG. 1, FIG. 7, FIG. 8, etc., the laminated piezoelectric ceramic layers are fired and then cut to a predetermined size. That is, the laminated and pressure-bonded piezoelectric ceramic layer may be cut into a predetermined size first, and then fired at a high temperature.

Further, an arbitrary number of layers of only green sheets without electrode layers may be laminated during the manufacturing process of the multilayer piezoelectric element.

The embodiment disclosed this time is an example in all respects, and should not be construed as limiting. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[Brief description of the drawings]

FIG. 1 is a flowchart illustrating a method for manufacturing a multilayer piezoelectric element according to a first embodiment of the present invention.

FIG. 2 shows a green sheet forming step (step S101) and a film-forming electrode layer forming step (step S10) in the multilayer piezoelectric element manufacturing process shown in FIG.
It is a figure for explaining 3).

FIG. 3 is a view for explaining a step (step S105) of transferring an electrode layer on a film onto a green sheet in the multilayer piezoelectric element manufacturing process shown in FIG.

FIG. 4 is a view for explaining a process (step S107) of simultaneously performing lamination and pressure bonding of a green sheet and transfer of an electrode layer in the multilayer piezoelectric element manufacturing process shown in FIG.

FIG. 5 is a view for explaining a firing step (step S113) in the manufacturing process of the multilayer piezoelectric element shown in FIG. 1 after all the green sheets have been stacked and pressed.

FIG. 6 is a cross-sectional view of the multilayer piezoelectric element after being cut into a predetermined size.

FIG. 7 is a flowchart illustrating a method for manufacturing a multilayer piezoelectric element according to a modification.

FIG. 8 is a flowchart illustrating a method for manufacturing a multilayer piezoelectric element according to a second embodiment of the present invention.

FIG. 9 is a schematic diagram for explaining a step (Step S805) of simultaneously performing creation of a green sheet and transfer of an electrode layer on a film in FIG.

FIG. 10 is a flowchart illustrating a method for manufacturing a multilayer piezoelectric element according to a third embodiment of the present invention.

FIG. 11 shows a step of forming an electrode layer on a film (step S100) in the multilayer piezoelectric element manufacturing process shown in FIG.
3), electrode layer transfer step (step S105) and electrode layer pattern formation step (step S1006)
FIG.

FIG. 12 is a flowchart illustrating a method for manufacturing a multilayer piezoelectric element in a case where a stacking process is collectively performed last in the third embodiment.

FIG. 13 is a flowchart illustrating a method for manufacturing a multilayer piezoelectric element according to a fourth embodiment of the present invention.

FIG. 14 is a longitudinal sectional view of a multilayer piezoelectric element according to the related art.

[Explanation of symbols]

201 Green sheet, 203 film, 204
Solid pattern electrode layer, 205 electrode layer (patterned), 901 slurry raw material, 903 doctor blade.

Claims (6)

[Claims] An electrode layer forming method for forming an electrode layer on a piezoelectric ceramic layer, comprising: an electrode layer forming step of forming an electrode layer on a film; and transferring the electrode layer formed on the film to the piezoelectric ceramic layer. And a transferring step. 2. A piezoelectric ceramic layer forming step of forming the piezoelectric ceramic layer, an electrode layer forming step of forming an electrode layer on the piezoelectric ceramic layer by the electrode layer forming method according to claim 1, and the piezoelectric ceramic layer. And a laminating step of laminating the piezoelectric ceramic layers so that the piezoelectric ceramic layers are alternately laminated with the electrode layers. 3. The multi-layer piezoelectric element according to claim 2, wherein the electrode layer transferred in the transferring step is a solid pattern, and further comprising a patterning step of patterning the transferred electrode layer. Method. 4. The method according to claim 2, wherein the step of forming the piezoelectric ceramic layer and the step of transferring are performed simultaneously in one step. 5. The method according to claim 2, wherein the transferring step and the laminating step are performed simultaneously in one step. 6. A multilayer piezoelectric element manufactured by the method for manufacturing a multilayer piezoelectric element according to claim 2, wherein the number of the piezoelectric ceramic layers is 100 or more. element.