JP2001052612A - Manufacture of back plate of plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispense with a developing process and to form a closely contact uniform fluorescent material layer by laminating a photosensitive resin film having a photosensitive resin layer capable of lowering its stickness of an exposed part on a surface of a base film, on a surface of an adhesive resin layer formed between barrier ribs on a board and a wall surface, exposing the same, separating and removing the resin layer of a non-exposed area, packing a fluorescent material to the area, and baking the same. SOLUTION: A base film 1 having a photosensitive resin layer 2 packed in an adhesive layer 23 formed by coating a board 21 having a plurality of barrier ribs 22 with a solution or a dispersion liquid and drying the same, on its surface is exposed through a photomask 24 having a specific light shielding zone. Only the photosensitive resin layer 2 of the non-exposed zone keeping the adhesiveness is separated together with the base film 1, the fluorescent material powder is collided with the exposed adhesive layer 23 to be packed, and backed. The floating, separation or the like of blue or green, and red luminous fluorescent material layer R or the like, can be prevented, the packing concentration is increased, the luminous brightness can be improved, an amount of burnt organic matter is small, and a back board can be manufactured in a short time while reducing the heat energy and the generated gas.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a back plate of a plasma display panel (PDP).

[0002]

2. Description of the Related Art In general, a PDP has a structure in which a pair of electrodes arranged regularly on two opposing glass substrates are provided, and a gas mainly composed of Ne or the like is sealed between them. Then, a voltage is applied between these electrodes, and a discharge is generated in minute cells around the electrodes, so that each cell emits light to perform display. In order to display information, regularly arranged cells are selectively caused to emit light. This PDP has a direct current type (DC type) in which electrodes are exposed to the discharge space and an alternating current type (A) in which electrodes are covered with an insulating layer.
C type), and both types are further classified into a refresh driving method and a memory driving method according to differences in display functions and driving methods.

FIG. 8 shows an example of the configuration of an AC type PDP. In this figure, the front plate 61 and the rear plate 62 are shown separated from each other. As shown, the front plate 61 and the rear plate 62 made of glass are arranged in parallel and opposed to each other. A barrier rib 63 standing upright is fixed to the front side of the face plate 62, and the front plate 61 and the back plate 62 are held at a constant interval by the barrier rib 63. On the back side of the front plate 61, a composite electrode composed of a sustain electrode 64 which is a transparent electrode and a bus electrode 65 which is a metal electrode is formed in parallel with each other, and a dielectric layer 66 is formed so as to cover the composite electrode. , And a protective layer 67 (M
gO layer).

On the front side of the back plate 62, address electrodes 68 are formed between the barrier ribs 63 so as to be perpendicular to the composite electrode and parallel to each other. A phosphor layer 69 is provided to cover. In this AC type PDP, by applying a predetermined voltage from an AC power source between composite electrodes on the front plate 61 to form an electric field, the front plate 61 and the rear plate 6 are formed.
Discharge is performed in each cell as a display element partitioned by 2 and the barrier rib 63. Then, the phosphor layer 69 emits light by the ultraviolet rays generated by the discharge, and the light transmitted through the front plate 61 is visually recognized by the observer.
As a method of applying the phosphor, a method of using a photoresist film made of a photosensitive resin composition containing the phosphor has been proposed (for example, JP-A-6-27).
3925, JP-A-8-95239, JP-A-8-95250, etc.).

[0005]

According to the above-mentioned proposed method, a phosphor-containing dry film composed of a photosensitive composition is pressed into a cell formed on a back plate of a PDP, and after exposure and development, it is baked and pressed. This method burns off organic matter in the dried dry film and forms a phosphor layer on the cell surface. However, since it is necessary to ensure a sufficient discharge space in the fired cell, the photosensitive resin composition It is indispensable to increase the content of organic substances in the inside, that is, to reduce the content of the phosphor. Under such circumstances, there is a problem that not only a large amount of heat energy is required for firing, but also a large amount of decomposition gas is generated during firing, so that the management of the firing furnace is complicated.

As a more serious problem, since the dry film impressed into the cell contains a large amount of organic substances, the dry film shrinks with the elapse of the firing time, and the fluorescent light to be finally formed is reduced. There is a problem that the body layer rises from the cell surface and the phosphor layer does not adhere to the cell surface. In order to solve such a problem, when the content of the phosphor in the dry film is increased, that is, when the content of the organic substance is reduced, the amount of the phosphor after firing increases, and a sufficient cell space is obtained. Can not secure.

In the above method, an exposure and development step, that is, a wet treatment is indispensable for forming a patterned phosphor layer in a cell formed between barrier ribs, and the process is complicated. In addition, there is a restriction that a resin that can always be developed as a photosensitive resin, particularly a photosensitive resin that can be alkali-developed, must be used. Therefore, it has been difficult to select a photosensitive resin excellent in burnout property. Therefore, an object of the present invention is to solve the above-mentioned problems of the prior art,
PDP that does not require a development process, is simple in process, and can form a uniform phosphor layer in close contact with the cell surface
It is to provide a back plate.

[0008]

The above object is achieved by the present invention described below. That is, the present invention provides a step of forming an adhesive resin layer between a plurality of barrier ribs formed on a substrate and on a wall surface thereof, and a photosensitive resin layer in which the adhesiveness of an exposed region is reduced on the entire surface of the resin layer. Laminating a photosensitive resin film (hereinafter referred to as “UVC”) provided on the surface of a base film, exposing the photosensitive resin layer via a photomask having a desired pattern, exposing a non-exposed area to light. A method for manufacturing a back plate of a plasma display panel, comprising a step of peeling and removing a conductive resin layer, a step of filling an exposed adhesive resin layer with a phosphor powder, and a step of firing a phosphor powder-filled resin layer. It is.

According to the present invention, the adhesive resin layer is formed between the barrier ribs and on the wall surface thereof, and the phosphor powder is caused to collide with the adhesive resin layer, whereby the phosphor powder and the adhesive resin layer are formed. By embedding or adhering the phosphor powder present in the collision portion between the barrier ribs and the adhesive resin layer formed between the barrier ribs and on the wall surface thereof, and thereafter firing, the amount of organic substances to be burned is reduced. . Therefore, the time and heat energy used for burning off organic matter are small, and
Since the amount of gas generated by sintering is small, the management of the sintering furnace is easy. In addition, a sufficient discharge space is formed in the cell, and the phosphor layer finally formed in the cell is sufficiently adhered to the surface of the cell. Does not occur. Moreover, since the phosphor powder is forcibly filled into the adhesive resin layer by colliding with it, the packing density of the phosphor layer can be improved, and the emission luminance of the phosphor layer finally improves. Further, since only the desired adhesive resin layer can be filled with the phosphor powder, there is no waste of the phosphor powder. Further, the use of UVC eliminates the need for complicated development steps, and is extremely advantageous in terms of steps.

[0010]

Next, the present invention will be described in more detail with reference to preferred embodiments. The feature of the present invention lies in the method of forming the phosphor layer on the back plate of the PDP shown in FIG. 8, and in particular, the formation of the phosphor layer is performed by using UVC and by causing the phosphor powder to collide with the adhesive resin layer. It is characterized by embedding or attaching body powder. The substrate 62, barrier rib 63, and other components constituting the back plate in the present invention are formed from a conventionally known material by a conventionally known method, and there is no special point in their shapes.

FIG. 1 shows a configuration of a UVC used in the present invention. This UVC has a configuration in which an adhesive photosensitive resin layer 2 is provided on the surface of a base film 1 such as polyethylene terephthalate, and a protective film 3 is further laminated as necessary. The adhesive photosensitive resin layer 2 is a soft layer made of a photocurable resin, and has a property of decreasing the adhesiveness (β) between the base film and the resin layer in the exposed area. Therefore, by laminating the UVC on a suitable substrate (FIG. 1b) and exposing through a suitable photomask, the relationship between the adhesiveness (β) of the exposed area and the adhesiveness (α) of the non-exposed area is determined. α> β can be satisfied. Next, when the base film is peeled off, as shown in FIG. 1c, the photosensitive resin layer in the non-exposed area is peeled off together with the base film,
On the other hand, the photosensitive resin layer in the exposed area remains on the substrate side and acts as a resist for the substrate. Generally, the above UVC
The disadvantage of the film is that it is difficult to sharply separate the boundary between the exposed region and the non-exposed region in the thickness direction of the film, and the edge of the formed pattern in the thickness direction tends to be jagged. However, in the present invention, since the boundary is exposed so that the above-mentioned boundary is the flat end face of the top of the rib, the thickness of the photosensitive resin at the boundary between the exposed part and the non-exposed part is small, and therefore, the jaggedness generated at the boundary is small. Further, even if the boundary is formed when the adhesive photosensitive resin is formed between the ribs, there is no problem in the generation of the slight unevenness because the flat end face at the top of the rib has a width.

The method of the present invention using the above UVC will be described with reference to FIG. FIG. 2A shows a state in which an adhesive resin layer 23 is formed between a plurality of barrier ribs 22 formed on a substrate 21 and on the wall surfaces thereof. By applying and drying a solution or dispersion of an adhesive resin on a back plate substrate provided with barrier ribs 22 on a known substrate 21, adhesive resin layers 23 are formed between the barrier ribs and on the wall surfaces thereof. As the pressure-sensitive adhesive to be used, an acrylic resin-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, or the like, which is easy to bake, is preferable.
In the present invention, the pressure-sensitive adhesive is not only a resin having tackiness at room temperature, but also a thermoplastic resin having no tackiness at room temperature but exhibiting tackiness at a modest temperature (for example, 100 ° C. or lower). Good. For example, polyvinyl acetate, vinyl acetate-ethylene copolymer, aliphatic polyester, ethylene-
Examples include a polyethylene copolymer, an acrylic resin, an ethylene-acrylic copolymer, and a polyurethane resin. When such a thermoplastic resin is used, the filling of the phosphor powder in the subsequent step is performed while heating. The thickness of the adhesive resin layer made of these resins is preferably about 5 to 10 μm.

The above-mentioned adhesive resin layer is preferably made of silane,
By including an aluminum-based or titanate-based coupling agent, the adhesion of the phosphor layer finally formed in the cells of the PDP back plate to the cell surface can be improved. In addition, these coupling agents are
It may be applied to the cell surface of the back plate of the DP.

FIG. 2B shows a state in which the photosensitive resin layer 2 of UVC is pressed by a laminator between the barrier ribs in the state shown in FIG. 2A, and the photosensitive resin layer 2 is filled on the adhesive resin layer 23. Is shown. In the example shown in the figure, the photosensitive resin layer 2 is completely filled with the gap between the barrier ribs, but this is not essential, and there is a space between the adhesive resin layer 23 and the photosensitive resin layer 2. No problem. Next, as shown in FIG. 2C, the entire surface of the UVC substrate film 1 is exposed through a photomask 24 having a light shielding portion in a specific region. By performing such exposure, the adhesiveness (β) of the interface between the UVC base film 1 and the photosensitive resin layer 2 is reduced in the exposed area, and the base film 1 in the non-exposed area is exposed to light. (Α) at the interface with the conductive resin layer 2
Does not change, so that the adhesive force between the two is α> β. When the UVC substrate film 1 is peeled off in this state, as shown in FIG. 2D, only the photosensitive resin layer 2 in the non-exposed area is peeled off together with the substrate film 1, and the photosensitive resin layer 2 ′ in the exposed area becomes a barrier rib. It is left in between and acts as a resist in a later step.

Next, the adhesive resin layer 23 exposed as described above
And the phosphor powder is filled in the resin layer 23. The phosphor powder used at this time is not particularly limited, but is preferably a powder obtained by using a rare earth oxyhalide or the like as a base and activating the base with an activator. For example, as an ultraviolet excitation type phosphor, Y ₂ O ₃ : Eu, YVO ₄ : Eu,
(Y, Gd) BO ₃ : Eu (more than red), Zn ₂ Ge
O ₂ : Mn, BaAl ₁₂ O ₁₉ : Mn, Zn ₂ SiO ₄ : M
n, LaPO ₄ : Tb (green above), Sr ₅ (PO ₄ ) ₃ C
1: Eu, BaMgAl ₁₄ O ₂₃ : Eu ²⁺ , BaMgAl
₁₆ O ₂₇ : Eu (above blue) and the like, and other phosphors include Y ₂ O ₃ S: Eu, γ-Zn ₃ (PO ₄ ) ₂ :
Mn, (Zn, Cd) S: Ag + In ₂ O ₃ (more than red), ZnS: Cu, Al, ZnS: Au, Cu, A
1, (Zn, Cd) S: Cu, Al, Zn ₂ SiO ₄ : M
n, As, Y ₃ Al ₅ O ₁₂ : Ce, Gd ₂ O ₂ S: Tb, Y
_{3 Al 5 O 12: Tb,} ZnO: Zn ( or green), Zn
S: Ag + red pigment, Y ₂ SiO ₃ : Ce (above, blue) and the like can be used, and of course, two or more kinds of these phosphors can be used in combination.

The method of filling the above-mentioned phosphor powder into the adhesive resin layer 23 is not particularly limited, but a method capable of filling the phosphor powder with as high a concentration as possible is preferable. For example, the back plate substrate on which the adhesive resin layer 23 is formed is held in a closed container made of a hard synthetic resin or metal, and a sphere made of a phosphor powder and a hard material, for example, a ceramic sphere, Filling steel balls and glass spheres (larger diameter than phosphor powder) and applying vibration, the phosphor powder adheres to the adhesive resin layer, and the impact of the sphere causes the phosphor powder to enter the adhesive resin layer. Embedded. As the sphere at this time, a material having a specific gravity greatly different from that of the phosphor powder, for example, by using a steel ball, when filling the phosphor powder into the adhesive resin layer, the steel ball adhered to the adhesive resin layer. This is preferable because it can be easily separated from the phosphor powder. According to this method, about 3 to 30 parts by weight of phosphor powder per 1 part by weight of the adhesive resin is filled and held in the adhesive resin layer. Such a high-concentration phosphor powder layer cannot be achieved by a method of applying a phosphor paste or the like. In addition, the thickness of the phosphor layer can be controlled in accordance with the thickness of the adhesive resin layer, and a conventional phosphor paste or the like cannot be used to form the phosphor layer on the wall surface of the barrier rib by the conventional method. This is possible. Therefore, the firing in the final step becomes very effective.
FIG. 2E shows a state in which the phosphor powder R is filled in this way.

The phosphor powder to be filled above is referred to as a red-emitting phosphor powder (R). Next, the photosensitive resin layer remaining between the barrier ribs is removed by an appropriate method. As an example of a suitable method, as shown in FIGS. 3f and 3g, an adhesive tape is uniformly applied to the substrate surface, and the adhesive tape is peeled off with the adhesive tape adhered to the exposed surface of the photosensitive resin layer. By doing so, the photosensitive resin layer remaining between the barrier ribs can be easily peeled off. Next, as shown in FIG. 4B, the entire surface is again filled with a UVC photosensitive resin layer, exposed through another pattern of a photomask (FIG. 4C), and peeled (FIG. 4D) and green light emission as described above. Is filled in the adhesive resin layer (FIG. 4E). Similarly, as shown in FIG. 5, a blue light-emitting phosphor powder B is filled, and as shown in FIG. 5f, a rear substrate is filled with phosphor powders of R, G and B between the barrier ribs and on the wall surfaces thereof. By baking this back substrate, a PDP back plate is obtained.

As another method, as shown in FIGS. 6A to 6D, a UVC film is further pressed against the substrate surface in the state of FIG. 2E (FIG. 6A), and a photosensitive resin layer is pressed between R ribs. Next, a photomask having a light-shielding portion aligned between ribs filled with a photosensitive resin to be removed is superposed and exposed. Due to this exposure, the adhesive strength (β) between the photosensitive resin layer and the base film is reduced in the exposed area, while the adhesive strength (α) in the rear part of the non-exposed area is not reduced.
By peeling the base film as shown in FIG. 6C, the photosensitive resin layer between the desired ribs can be removed. In this state, for example, the phosphor powder of G is adhered and filled in the adhesive resin layer 23 in the same manner as described above.
Thereafter, the third color (B) is carried out in the same manner as described above as shown in FIG. 7e, and the last remaining adhesive photosensitive resin layer is carried out as described above using an adhesive tape.
A P back plate is obtained.

By sintering the back substrate filled with the phosphor powder as described above, the adhesive resin component is burned off, and the phosphor layers R, G, and B are formed on the barrier ribs and the wall surfaces thereof. The firing method may be an ordinary method, for example, 500 to
By baking at a temperature of 550 ° C., the adhesive resin is burned off.

The tacky photosensitive resin constituting the UVC comprises a base polymer (a), an ethylenically unsaturated compound (b) and a photopolymerization initiator (c), and the base polymer (a) is ethyl cellulose. , Hydroxyethylcellulose, ethylhydroxycellulose, hydroxypropylcellulose, methylcellulose, cellulose acetate, cellulose acetate butyrate, and other cellulose-based resins; polyvinyl alcohol, polyvinyl acetate, polyvinyl butyral, polyvinyl acetal, polyvinylpyrrolidone, and other vinyl-based resins; ) Acrylic polymers such as acrylates, poly (meth) acrylamides or acrylic copolymers, polyurethane resins, polyamide resins,
Examples include polyester-based resins.

As the ethylenically unsaturated compound (b),
Methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth)
Acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, Glycidyl (meth) acrylate, acrylamide, methacrylamide, acrylonitrile, methacrylonitrile, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-phenoxy-2- Hydroxypropyl (meth) acrylate, 2- (meth) acryloyloxy-2-hydroxypropylphthalate, 3-chloro-
2-hydroxypropyl (meth) acrylate, glycerin mono (meth) acrylate, 2- (meth) acryloyloxyethyl acid phosphate, acrylate modified carboxylic acid such as phthalic acid, N-methylol (meth) acrylamide, styrene, α- Monofunctional monomers such as methylstyrene, vinyl acetate, alkyl vinyl ether, acrylic acid, methacrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, and anhydrides and monoesters thereof are exemplified.

Examples of the polyfunctional ethylenically unsaturated compound (b) include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and propylene glycol di (meth) acrylate. Acrylate, polypropylene glycol di (meth) acrylate, butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexane glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, glycerin di (Meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, 2,2-bis (4 (Meth) acryloxydiethoxyphenyl) propane, 2,2-bis - (4- (meth) acryloxy polyethoxy phenyl) propane, 2
-Hydroxy-3- (meth) acryloyloxypropyl (meth) acrylate, ethylene glycol diglycidyl ether di (meth) acrylate, diethylene glycol diglycidyl ether di (meth) acrylate,
Examples include polyfunctional monomers such as phthalic acid diglycidyl ester di (meth) acrylate and glycerin polyglycidyl ether poly (meth) acrylate. These polyfunctional monomers can be used in combination with the above monofunctional monomers in an appropriate amount.

The ratio of the ethylenically unsaturated compound (b) to 100 parts by weight of the base polymer (a) is from 5 to 200.
It is desirable to select from the range of 10 parts by weight, especially 10 to 50 parts by weight. If the amount of the ethylenically unsaturated compound (b) is too small, the adhesion at the interface is insufficiently reduced due to poor curing of the photosensitive composition, and the amount of the ethylenically unsaturated compound (b) is too large. In this case, the composition becomes almost liquid, and the shape retention of the formed photosensitive resin layer is insufficient.

Further, as the photopolymerization initiator (c), benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin phenyl ether,
Benzyl diphenyl disulfide, benzyl dimethyl ketal, dibenzyl, diacetyl, anthraquinone, naphthoquinone, 3,3'-dimethyl-4-methoxybenzophenone, benzophenone, p, p'-bis (dimethylamino) benzophenone, p, p'-bis (diethylamino) ) Benzophenone, p, p'-diethylaminobenzophenone, pivaloin ethyl ether, 1,1-dichloroacetophenone, pt-butyldichloroacetophenone, hexaarylimidazole dimer, 2,2 '
-Bis (o-chlorophenyl) 4,5,4 ', 5'-tetraphenyl-1,2'-biimidazole, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-
Diethylthioxanthone, 2,2′-diethoxyacetophenone, 2,2′-dimethoxy-2-phenylacetophenone, 2,2′-dichloro-4-phenoxyacetophenone, phenylglyoxylate, α-hydroxyisobutylphenone, dibezosparone, -(4-isopropylphenyl) -2-hydroxy-2-methyl-1
-Propanone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propanone, tribromophenylsulfone, tribromomethylphenylsulfone and the like. At this time, the total mixing ratio of the photopolymerization initiator (c) is 0.1 to 2 with respect to 100 parts by weight of the total amount of the base polymer (a) and the ethylenically unsaturated compound (b).
It is appropriate to use about 0 parts by weight.

The UVC used in the present invention can be obtained by applying the above-mentioned photosensitive resin composition to an appropriate substrate film surface to form a photosensitive resin layer. At this time, if necessary, polyethylene film from above the coating layer surface,
A laminate can be formed by coating a protective film such as a polyvinyl alcohol film. At this time, the thickness of the photosensitive resin layer varies depending on the structure of the back plate or the like of the PDP to be manufactured, and cannot be determined unconditionally.
Is suitably selected from the range.

[0026]

Next, the present invention will be described more specifically with reference to examples. In the examples, “%” or “parts” is based on weight unless otherwise specified. Example 1 Preparation of a photosensitive resin composition for UVC A photosensitive resin composition was prepared by mixing 23 parts of the following base polymer, 27 parts of the following ethylenically unsaturated compound, and 4 parts of a photopolymerization initiator having the following formulation. . (Base polymer) Methyl acrylate / 2-ethylhexyl acrylate / acrylic acid copolymer (copolymerization ratio (weight) = 25/70)
/ 5)

(Ethylene Unsaturated Compound) A mixture of trimethylolpropane triacrylate / polyethylene glycol (# 600) dimethacrylate / ethylene oxide-modified phthalic acrylate (manufactured by Kyoeisha Yushi Kogyo Co., Ltd.) in a weight ratio of 20/10/6 ( Photopolymerization initiator) Benzophenone / p, p'-diethylaminobenzophenone / 2,2'-bis (o-chlorophenyl) 4,5
Mixture of 4 ', 5'-tetraphenyl-1,2'-biimidazole in a weight ratio of 8 / 0.15 / 1

Preparation of UVC The above photosensitive composition was coated on a polyester film having a thickness of 25 μm using an applicator having a gap of 4 mil and left at room temperature for 1 minute and 30 seconds.
The resultant was dried in an oven at 110 ° C. and 110 ° C. for 3 minutes each to obtain UVC having a photosensitive resin layer having a thickness of 120 μm (however, no protective film was provided). The thickness of 120 μm may be formed by three coatings of 40 μm each.

Formation of Adhesive Resin Layer A dispersion of methyl ethyl ketone (solid content: 20%) of an acrylic resin-based adhesive was used to form a back substrate (a conductive circuit and barrier ribs (height 150 μm, width 50 μm, pitch 200 μm)). On a phosphor screen forming substrate] using a die coater and dried at 60 ° C. for 30 minutes to form an adhesive resin layer. The thickness of the bottom of the resin layer between the barrier ribs was about 10 μm, and the thickness of the wall was about 10 μm.

Lamination on back substrate and exposure The UVC was applied to the entire surface of the back substrate filled with the adhesive resin layer, at a laminating roll temperature of 100 ° C. and a roll pressure of 3 kg.
/ Cm ² , lamination speed 1.5 m / min. And the photosensitive resin layer was filled. After lamination, a pitch of 1050μ parallel to the rib with an opening width of 200μm on the entire surface
The pattern mask was superimposed on the surface of the photosensitive resin layer so that a strip-shaped pattern exposure portion of m was formed, and exposure was performed at 200 mJ with a 3 kw ultra-high pressure mercury lamp using an exposure machine HMW-532D manufactured by Oak Manufacturing Co., Ltd. . After a hold time of 15 minutes after the exposure, the polyester film was peeled off to obtain the state shown in FIG. 2D.

Filling of phosphor powder The above-mentioned rear substrate is fixed to the center of a closed container at both ends thereof on the inner wall, and 300 g of a red light-emitting phosphor powder described later is further placed in the container.
And 10 kg of steel ball with a diameter of 1.2 mm
Vibration was performed for 20 minutes in a vibrating device, and the adhesive resin layer was filled with the phosphor powder (FIG. 2E). When a part of the packed layer was taken and the ratio of the resin and the phosphor powder was measured, the weight ratio of the phosphor powder 7 to the resin 1 was found. Next, after peeling and removing the resist film, the UVC was laminated, the mask pattern was changed to the pattern shown in FIG. 4C, a green light emitting phosphor powder described later was used as the phosphor powder, and the green light emitting phosphor was formed on the adhesive resin layer. Powder G was filled. When a part of the packed layer was taken and the ratio of the resin to the phosphor powder was measured, the weight ratio of the phosphor powder 5 to the resin 1 was found. Next, after removing and removing the resist film, the UVC is laminated, the mask pattern is changed to the pattern shown in FIG. 5C, and a blue light emitting phosphor powder described later is used as the phosphor powder,
The adhesive resin layer was filled with a blue light emitting phosphor powder. When taking a part of the packed layer and measuring the ratio of resin and phosphor powder,
The weight ratio of the phosphor powder 5 to the resin 1 was found. Finally, the remaining resist was removed (see FIG. 5f).

Firing Next, the back substrate filled with the phosphor powder of each of the three colors is raised from room temperature to 550 ° C. in a firing furnace in one hour, and the resin in the phosphor layer is burned off to emit the fluorescent light. A body layer was formed to obtain a back plate of the PDP. This phosphor layer was sufficiently adhered to the substrate, there was no lifting of the phosphor layer, and a sufficient discharge space was secured. The phosphor powder used above is as follows. Red light emitting phosphor: Y ₂ O ₃ : Eu (trade name: LP-RE)
I, manufactured by Kasei Optonics Co., Ltd.) Green-emitting phosphor: Zn ₂ SiO ₄ : Mn (trade name: P1-
G1S, manufactured by Kasei Optonics Co., Ltd.) Blue light-emitting phosphor: BaMgAl ₁₀ O ₁₇ : Eu (trade name:
KX-501A, manufactured by Kasei Optonics)

Example 2 96 parts of n-butyl acrylate, 1 part of hydroxyethyl methacrylate, 3 parts of acrylic acid, 0.3 part of benzoyl peroxide were placed in a flask equipped with a thermometer, a stirrer, a reflux condenser, and a nitrogen inlet tube. Parts, 40 parts of ethyl acetate and 60 parts of toluene
Then, nitrogen was introduced from a nitrogen introduction tube to make the inside of the flask a nitrogen atmosphere, and then heated to 65 ° C. to carry out a polymerization reaction for 10 hours to obtain an acrylic polymer solution. To this solution was added 15 parts of trimethylolpropane triacrylate and 0.4 part of benzophenone per 100 parts of the acrylic polymer.
Then, the UV curable pressure-sensitive adhesive was obtained. One part of polyisocyanate (trade name: Coronate L, manufactured by Nippon Polyurethane Co., Ltd.) was added to 100 parts of the solid content of the pressure-sensitive adhesive to obtain a photosensitive pressure-sensitive adhesive composition. A PDP back plate was prepared in the same manner as in Example 1, except that the above composition was used in place of the photosensitive resin composition in Example 1. The same results as in Example 1 were obtained.

[0034]

According to the present invention, the time and heat energy used for burning off organic substances are small, and the amount of gas generated by firing is small, so that the firing furnace can be easily managed. In addition, a sufficient discharge space is formed in the cell, and the phosphor layer finally formed in the cell is sufficiently adhered to the surface of the cell. Does not occur. Further complicated development steps can be omitted.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating UVC used in the present invention.

FIG. 2 is a diagram illustrating a preferred embodiment of the present invention.

FIG. 3 is a continuation of FIG. 2;

FIG. 4 illustrates a preferred embodiment of the present invention.

FIG. 5 is a diagram illustrating a preferred embodiment of the present invention.

FIG. 6 is a diagram illustrating a preferred embodiment of the present invention.

FIG. 7 is a continuation of FIG. 6;

FIG. 8 is a diagram illustrating the configuration of a PDP.

[Explanation of symbols]

 1: Base film 2: Photosensitive resin layer 3: Protective layer 21: Substrate 22: Barrier rib 23: Adhesive layer 24: Photomask R: Red light emitting phosphor layer G: Green light emitting phosphor layer B: Blue light emitting phosphor Layer 61: Front plate 62: Back plate 63: Barrier rib 64: Sustain electrode 65: Bus electrode 66: Dielectric layer 67: Protective layer 68: Address electrode 69: Phosphor layer

Claims (3)

[Claims] 1. A step of forming an adhesive resin layer between a plurality of barrier ribs formed on a substrate and on a wall surface thereof, and forming a photosensitive resin layer having reduced adhesiveness in an exposed region on the entire surface of the resin layer. Laminating a photosensitive resin film provided on the surface of the base film, exposing the photosensitive resin layer via a photomask having a desired pattern, and removing and removing the photosensitive resin layer in a non-exposed area. A method of filling the exposed adhesive resin layer with a phosphor powder and firing the phosphor powder-filled resin layer. 2. The back substrate on which the adhesive resin layer is formed is held in a closed container, and the container is filled with a sphere made of a phosphor powder and a hard material, and vibration is applied to the back substrate, whereby the phosphor powder is removed. 2. The method for manufacturing a back plate of a plasma display panel according to claim 1, wherein the back plate is filled in the adhesive resin layer. 3. The phosphor powders are three kinds of phosphor powders that emit red, green and blue light, and lamination of a photosensitive resin film, exposure, peeling and removal, and filling of the phosphor powders for each of the phosphor powders. 2. The method according to claim 1, wherein baking is performed lastly.