JP2001051165A - Module case and module assembling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a module case having a structure capable of ensuring the assembling workability while keeping the air-tightness. SOLUTION: This module case of the pigtail shape capable of accomodating an optical semiconductor element and other optical parts, and directly drawing out an optical fiber code 7, is provided with openings 1a, 1b of a side capable of allowing a structural body accomodated in a module, to be passed therethrough, on at least one of upper and lower surfaces of the module case and at least one of four side surfaces, and has a through hole 2 for drawing out the optical fiber code on a surface opposite to the opened side surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case structure for a pigtail type module for accommodating an optical semiconductor element and other optical components and for directly leading out an optical fiber cord, and a module assembling method using the case. .

[0002]

2. Description of the Related Art FIG. 4 shows a first conventional example showing an assembly structure of a conventional optical semiconductor mounting module. The optical semiconductor mounting module of this conventional example has a high frequency connector 9 for signal input / output on one side surface of the module case main body 1, and an optical fiber cord 7 is pulled out from a side surface opposite to the side surface having the high frequency connector 9. This is an example of a so-called pigtail type optical semiconductor mounting module having a folded structure.

The process of assembling the conventional module will be described below. First, the optical semiconductor element 6 and other necessary electronic components are mounted on the element mounting bench 5, and are housed and fixed in the module case body 1. Next, the element mounting bench 5 on which necessary electronic components are mounted, the high-frequency connector 9 and the electric terminals 10 are electrically connected by bonding wires or ribbons. Next, an optical fiber cord 7 having an optical coupling unit 8 composed of a lens or the like is inserted from the insertion sleeve 2 into the module case main body 1, and optical coupling alignment with the optical semiconductor element 6 is performed in the module case main body 1. After the alignment, the optical coupling unit 8 is fixed. Next, the insertion sleeve 2 is filled with a resin and sealed, and finally, hermetically sealed with a seal cap 4 to complete the module.

FIG. 5 is a perspective view of a second conventional example showing an assembly structure of a conventional optical semiconductor mounting module. Figure 6
FIG. 13 is a perspective view showing a state immediately before the upper cover 13 is applied to the module 5;

[0005] The optical semiconductor mounting module of this conventional example is composed of a plurality of optical fiber cords 7 from both sides of a module case.
Is an example of a pigtail-type multi-channel optical semiconductor mounting module from which a lead is drawn.

In assembling the module of the conventional example, mounting of the optical semiconductor element 6 and other necessary electronic components on the element mounting bench 5 and optical alignment and fixing of the optical coupling unit 8 are performed by the module case body 1. And then fixed at a predetermined position in the module case body 1. The optical fiber cord 7 is bonded and fixed to the fiber support 12 so that no mechanical stress is applied to the optical coupling portion. Finally, the upper cover 13 is covered to complete the module.

[0007]

In the module structure of the first conventional example, airtightness can be easily achieved by joining the flat plate-shaped seal cap 4 to the case body 1, so that the airtightness is high. However, after the insertion sleeve 9 is filled with resin, the upper cover 4 must be optically coupled and aligned in the module case main body 1, so that the chuck mechanism of the optical coupling unit 8 of the alignment apparatus and the optical coupling unit 8 are required. The module structure must be accepted, so that the chuck mechanism of the optical coupling unit 8 and the size and shape of the optical coupling unit 8 or the size and shape of the module case are restricted and the module case Therefore, there is a disadvantage that the workability of alignment and fixing is extremely poor.

Further, in the module structure of the second conventional example, mounting of the optical semiconductor element 6 and other necessary electronic components, and optical alignment and fixing of the optical coupling unit 8 are both performed outside the module case body 1. The assembly workability is high. However, due to the module structure as shown in FIGS. 5 and 6, it is difficult to perform a complete hermetic seal in the step of bonding and fixing the draw-out portion of the optical fiber 7 and the step of attaching the upper lid 13. Therefore, although the assembly workability is high, there is a disadvantage that the airtightness is extremely incomplete.

The present invention has been made in view of the above circumstances, and an object of the present invention is to maintain high airtightness as in the first conventional optical semiconductor mounting module. Another object of the present invention is to provide a module case having a structure capable of ensuring high assembling workability, such as the optical semiconductor mounting module of the second conventional example. Another object of the present invention is to provide a module assembling method using the module case.

[0010]

In order to achieve the above object of the present invention, a module case according to a first aspect of the present invention is a pigtail for housing an optical semiconductor element or other optical parts and directly pulling out an optical fiber cord. Module case of the form, at least one surface of the upper or lower surface of the module case, and at least one of the four side surfaces,
The module case has a structure in which an opening large enough to allow a structure housed in the module to pass through is provided, and an insertion hole for drawing out an optical fiber cord is provided on a surface facing the opening side surface. .

A module assembling method according to a second aspect of the present invention is the module assembling method using the module case according to the first aspect, wherein the optical fiber cord is drawn into the module case from the insertion hole, and further, is inserted into the module case. First to be pulled out of the module case from the side of the opening facing
And a second step of performing assembly and optical coupling work outside of the module case on a pedestal body on which the optical semiconductor element and other optical components are mounted, and the structure completed with the assembly and optical coupling work, A third step of pulling into the module case from the opening side and fixing it at a predetermined position, a fourth step of filling and sealing the insertion hole of the module case with a resin, and a fifth step of closing the opening side of the module case with an end cap. Step, a sixth step of electrically connecting the structure on which the optical semiconductor element and other optical components are mounted and the terminals of the module case, and a seventh step of hermetically sealing the module case with a seal cap. This is to make a module.

Another aspect of the present invention (claim 7) is:
A module case for a pigtail type optical module including first and second optical fiber cords,
The module case includes a module case main body having a first opening, a second opening, a first optical fiber insertion passage, a seal cap for sealing the first opening, The present invention relates to a module case including an end cap for sealing an opening of the second optical fiber and a second optical fiber insertion passage provided in the end cap for inserting an optical fiber cord into the module case.

Still another embodiment of the present invention (Claim 11)
Inserting the optical fiber cord into the first optical fiber insertion passage portion, pulling out the end of the optical fiber cord to the outside of the module case main body through the second opening, Inserting the optical fiber cord end and the optical element outside the module case main body to form a structure joined to the optical fiber cord; Introducing the structure into the module case main body through the second opening and fixing the structure inside the module case main body; sealing the second opening with an end cap; The present invention relates to a method for assembling an optical module, comprising a step of sealing an insertion passage and a step of sealing a first opening with a seal cap.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIG. 1 is a perspective view of a first embodiment showing a module case according to the present invention and an assembly structure of an optical semiconductor mounting module using the module case. It is. FIG. 2 is a perspective view showing a state immediately before applying the seal cap 4 in the module of FIG. The optical semiconductor mounting module according to the first embodiment is provided with a high frequency connector 9 for signal input / output on the left side in FIGS. 1 and 2, and a pigtail in which an optical fiber cord 7 is drawn out from the opposite side. FIG.

[0015] In FIGS. 1 and 2, the module case main body 1 has an opening 1 _a, 1 _b are provided on the upper surface and left side surface, high-frequency connector 9 in order to cover the opening 1 _b of the left side surface Attached to the end cap 3. This is on the left side facing the right side surface having an opening 1 _b is inserted sleeve 2 is provided with an insertion path for inserting the optical fiber cord 7 in the module case body 1, electricity to another aspect A terminal 10 is provided.

[0016] Incidentally, the seal cap 4 in order to cover the opening 1 _a of the upper surface, end cap 3 is used to cover the opening 1 _b of the left side.

An element mounting bench 5 is arranged on the bottom surface of the module case main body 1, and an optical semiconductor element 6 is mounted on the element mounting bench 5. The element mounting bench 5 has a plurality of terminals (not shown) connected to the terminals of the optical semiconductor element 6,
The optical semiconductor element 6 is electrically connected to the high-frequency connector 9 and the electric terminal 10 via the plurality of terminals.

At the end of the optical fiber cord 7, an optical joining unit 8 for joining the optical fiber cord 7 and the optical semiconductor element 6 is provided. The optical bonding unit 8 is mounted on the element mounting bench 6 at a position aligned with the optical semiconductor element 6.
Is fixedly mounted.

The module assembly of the first embodiment is performed by the following steps.

(Step 1) The optical semiconductor element 6 and other optical parts are mounted on the element mounting bench 5.

[0021] (Step 2) drawn into an optical fiber cord 7 within the module case main body 1 through the insertion path of the insertion sleeve 2, further drawn to the outside of the module case main body 1 through the opening 1 _b opposite to the insertion sleeve 2 , Outside of the module case body 1, a bench for mounting a coupling lens or element
The optical fiber unit 7 is assembled so that an optical coupling unit 8 composed of parts for fixing to the optical fiber 5 and the like (not shown) is provided at the end of the optical fiber cord 7.

(Step 3) The optical semiconductor element 6 mounted on the element mounting bench 5 and the optical coupling unit 8 connected to the optical fiber cord 7 are aligned, and after the alignment, the optical coupling unit 8 and the element mounting bench are aligned. 5 and connected.

(Step 4) A structure in which an element mounting bench 5 on which an optical semiconductor element 6 is mounted and an optical coupling unit 8 are integrated,
And drawn from the opening 1 _b of the side to the module case main body 1 is fixed in position, the resin was packed seal insertion path inside the insertion sleeve 2.

[0024] (Step 5) sealing the opening 1 _b by an end cap 3 fitted with a high-frequency connector 9.

(Step 6) The terminals of the element mounting bench 5 on which the optical semiconductor element 6 and other optical components are mounted are electrically connected to the high-frequency connector 9 and the electric terminals 10 of the module case body 1.

The hermetically sealed module case main body 1 by sealing the (step 7) opening 1 _a in the sealing cap 4.

The optical semiconductor mounting module is completed by the above steps 1 to 7.

The resin filled in the insertion passage in the above step 4 is solidified to form the optical fiber cord 7.
Are fixed to the insertion sleeve 2 to prevent mechanical stress from being applied to the structure.

In the first embodiment shown in FIG. 1, the device mounting bench 5 is illustrated as being separated from and independent of the end cap 3, but the device mounting bench 5 and the end cap 3 are integrated. There may be. Also, the element mounting bench 5
May be connected to the high-frequency connector 9 before mounting the optical semiconductor element 6 and other optical components.
You may go after that.

The material of the module case body 1 is as follows.
It may be made of resin or metal. When made of metal, the sealing by the end cap 3 and the seal cap 4 is desirably seam welding from the viewpoint of airtightness and electrical connection.

According to the above-described module assembling process using the module case main body 1 having the above structure, the mounting of the optical semiconductor element 6, the assembly of the optical coupling unit 8, and the optical coupling alignment work outside the module case main body 1. Therefore, the limitation on the structure of the optical coupling unit 8, which was a drawback of the optical semiconductor mounting module of the first conventional example, is eliminated, and the assembling workability is significantly improved as compared with the first conventional example. And airtightness equivalent to that of the first conventional optical semiconductor mounting module can be ensured.

[Second Embodiment] FIG. 3 is a perspective view of a second embodiment showing an assembly structure of a module case according to the present invention and an optical semiconductor mounting module using the module case. FIG. 4 is a perspective view showing a state immediately before applying the seal cap 4 in the module of FIG.

The optical semiconductor mounting module in the second embodiment, a plurality of sides of the module case main body 1 optical fiber cord _71, 7 ₂ elicited, the multi-channel optical semiconductor mounting module pigtail form It is an example.

[0034] In FIGS. 3 and 4, the module case main body 1 is provided with a top surface and each of the left side opening 1 _a, 1 _b, the end cap 3 to cover the opening 1 _b of the left side surface an insertion sleeve 2 ₁ having an insertion path for inserting the optical fiber cord ₇₁ is provided. Moreover, by providing an insertion sleeve 2 ₂ having an insertion path for inserting the optical fiber cord 7 ₂ similarly to the right side surface facing the opening 1 _b of the left side, the electrical terminals 10 on the other side Provided.

[0035] Incidentally, the seal cap 4 to cover the opening 1 _a of the upper surface is used.

An element mounting bench 5 is mounted on the bottom surface of the module case main body 1, and an optical semiconductor element 6 is mounted on the element mounting bench 5. The element mounting bench 5 has a plurality of terminals (not shown) for connecting the optical semiconductor element 6 to the electric terminals 10 and the like, and the optical semiconductor element 6 is electrically connected to the electric terminal 10 via the plurality of terminals. Connected to.

Further, each end of the optical fiber cord _71, 7 _2, optical bonding units _81, 82 for joining the optical fiber cord and an optical semiconductor element 6 is provided. The optical bonding units 8 ₁ and 8 ₂ are fixedly mounted on the element mounting bench 6 at positions aligned with the optical semiconductor element 6.

The module assembly of the second embodiment is performed in substantially the same steps as those of the first embodiment, and specifically includes the following steps. (Step 1) The optical semiconductor element 6 and other optical components are mounted and mounted on the element mounting bench 5.

[0039] (Step 2) pulls the optical fiber cord 7 ₂ inside the module case main body 1 through the insertion path of the insertion sleeve 2 _2, further insertion sleeve 2 ₂ facing the side opening 1 _b from the module case main body 1 outside pull out the optical fiber cord 7 _2, the module case main body 1
Performing integrated assembly of the optical coupling unit ₈₂ at the outside.

[0040] (Step 3) is inserted the optical fiber cord ₇₁ to the insertion path of the insertion sleeve 2 ₁ provided in the end cap 3, integral with the optical combining unit ₈₁ on the side that is housed in the module case main body 1 Carry out assembly.

[0041] (Step 4) for both of the optical coupling unit ₈₁ and the optical coupling unit ₈₂ performs an optical semiconductor element 6 concert centering mounted on the element mounting bench 5, mounting the element mounting bench 5 after alignment Place and integrate.

[0042] (Step 5) The optical semiconductor element 6 mounted with element mounting bench 5 and the optical coupling unit _81, 82 and are integrated structure from the opening 1 _b of the side module case main body 1 therein Pull in and secure in place.

[0043] (Step 6) by the end cap 3 together with the sealing the openings 1 _b of the side surface, respectively filled with a resin insertion path of the insertion sleeve 2 ₁ of the module case main body 1 of the insertion sleeve 2 ₂ and the end caps 3 Seal.

(Step 7) The terminals (not shown) of the element mounting bench 5 on which the optical semiconductor element 6 and other optical parts are mounted are electrically connected to the electric terminals 10 of the module case body 1. (Step 8) opening 1 _a of the upper surface by the seal cap 4
To hermetically seal the module case main body 1. The optical semiconductor mounting module is completed by the above steps 1 to 8.

It should be noted that the resin filled in the insertion passage in the above step 6 is solidified, so that the optical fiber cord 7
_1, 7 ₂ are fixed to the insertion sleeve 2 _1, 2 _2, to prevent the mechanical stress is applied to the structure.

The material of the module case body 1 may be made of resin or metal. When made of metal, sealing by the end cap 3 and the seal cap 4 is preferably seam welding from the viewpoint of airtightness and electrical connection.

[0047] In the module case main body 1 of the above structure, the optical fiber cord _{71, 7 2} for inserting the opening area small insertion sleeve ₂ 1, _{2 2} of the insertion path, through the sleeve ₂ 1, ₂ in the ₂ Sufficient airtightness can be obtained by filling the resin. Further, according to the above module assembling step using a module case main body 1 of the above construction, mounting and optical combining unit ₈₁ of the optical semiconductor element 6 at the outside of the module case main body _1, 8 ₂ assembly and optical coupling alignment Since work can be performed, high assembly workability can be secured.

Therefore, the imperfect airtightness, which is a drawback of the second conventional optical semiconductor mounting module, can be eliminated, and a multi-channel optical semiconductor mounting module can be manufactured without impairing high assembly workability. be able to.

Further, the U-shaped upper cover 13 as in the second conventional example is not required, and the flat seal cap 4 can be used, so that the member cost can be reduced.

[0050]

According to the module assembling method of the present invention, using the module case having the structure of the present invention, the mounting of the optical semiconductor element, the assembling of the optical coupling unit, and the optical coupling alignment work can be performed outside the module case. Can be
There is an advantage that the assembling work can be easily performed, and since the insertion portion for drawing out the optical fiber cord can be formed into a sleeve shape having a small opening size, sufficient airtightness can be obtained by filling the insertion portion with resin. it can. Therefore, when the module case of the present invention is applied, there is an effect that an optical semiconductor mounting module that achieves both high assembly workability and high airtightness can be realized.

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment showing an assembly structure of a module case and an optical semiconductor mounting module using the module case according to the present invention.

FIG. 2 is a perspective view showing a state immediately before a seal cap is applied in the optical semiconductor mounting module of FIG. 1 exemplified in the first embodiment of the present invention;

FIG. 3 is a perspective view of a second embodiment showing a module case according to the present invention and an assembly structure of an optical semiconductor mounting module using the module case.

FIG. 4 is a perspective view showing an assembling structure of a first conventional optical semiconductor mounting module for explaining a conventional technique.

FIG. 5 is a perspective view showing an assembling structure of an optical semiconductor mounting module of a second conventional example for explaining the conventional art.

FIG. 6 is an illustration of a second conventional example illustrating the prior art.
FIG. 13 is a perspective view showing a state immediately before an upper lid is attached in the optical semiconductor mounting module of FIG.

[Explanation of symbols]

1 ... module case main body 1 _a ... opening 2,2 ₁ of the opening 1 _b ... side of the upper surface, _{2 2} ... inserted through the sleeve 3 ... end cap 4 .... Seal cap 5 ... element mounting bench 6 ... optical semiconductor element 7, 7 _{1, 7 2} ... optical fiber cord 8,8 _{1, 8 2} ... optical coupling unit 9 ... high-frequency connector 10 ... electrical terminals 11 ... seam weld 12 ... fiber support 13 ... lid

Continuation of the front page (72) Inventor Noboru Iwasaki 2-3-1 Otemachi, Chiyoda-ku, Tokyo F-term in Nippon Telegraph and Telephone Corporation (reference) 2H037 AA01 BA03 BA12 DA03 DA04 DA05 DA06 DA18 DA36 4E360 AB02 AB14 AB34 BA02 BC20 BD03 BD05 CA08 EA18 EA24 ED07 ED27 EE09 FA08 FA09 GA23 GA53 GB99 GC08

Claims (12)

[Claims] 1. A pigtail type module case for accommodating a structure on which an optical component is mounted and directly leading out an optical fiber cord, wherein the module case includes at least one of an upper surface or a lower surface of the module case, and 4 At least one of the side surfaces is provided with an opening having a size that allows the structure to pass therethrough, and a surface facing the side surface provided with the opening is provided with an insertion hole for drawing out an optical fiber cord. A module case, comprising: a module case main body. 2. A method for assembling a module using the module case according to claim 1, wherein the optical fiber cord is drawn into the module case main body from the insertion hole, and further, the module fiber main body is opened from the side of the opening facing the insertion hole. A first step of drawing out the structure, and a second step of assembling and optically coupling the structure on which the optical component is mounted outside the module case. A third step of pulling in the module case from the side and fixing it at a predetermined position, and a fourth step of filling and sealing the insertion hole of the module case with resin.
A fifth step of closing the opening side of the module case with an end cap; and a fifth step of electrically connecting a structure provided with the optical semiconductor element and other optical components to a terminal provided on the module case body. A module assembling method, comprising: a sixth step; and a seventh step of hermetically sealing the module case with a seal cap. 3. A module case for a pigtail type optical module having an optical element mounted structure and an optical fiber cord, the module case comprising: a first opening for connection work; A module case main body having a second opening for carrying the structure into the module case, and an optical fiber insertion passage for inserting the optical fiber cord into the module case; A seal cap for sealing the opening, an end cap for sealing the second opening, and a connector provided on the end cap for transmitting and receiving signals to and from the optical element. Features,
Module case. 4. The apparatus according to claim 1, wherein the second opening is formed at a position facing the optical fiber insertion section.
The module case according to claim 3. 5. A method for assembling an optical module using the module case according to claim 3 or 4, wherein the optical fiber cord is inserted into the optical fiber insertion passage, and an end of the optical fiber cord is connected to the optical fiber cord. Drawing out the module case body through a second opening; and optically joining an end of the optical fiber cord and the optical element to the outside of the module case body, Forming the joined structure; introducing the structure into the module case body through the second opening; and fixing the structure at a predetermined position inside the module case body; A step of sealing the insertion passage, a step of sealing the second opening with the end cap, and a step of connecting the optical element and the connector via the structure. Performing, and sealing the first opening with the seal cap. 6. The method according to claim 5, wherein forming the structure includes assembling and forming an optical coupling unit at an end of the optical fiber cord outside the module case main body. Method. 7. A module case for a pigtail type optical module including a structure on which an optical element is mounted and at least first and second optical fiber cords, wherein the module case is used for: Opening, a second opening for carrying the structure into the module case, and a first optical fiber insertion for inserting the first optical fiber cord into the module case. A module case main body having a passage portion, a seal cap for sealing the first opening, an end cap for sealing the second opening, and the second optical fiber cord inside the module case. A module case, comprising: a second optical fiber insertion passage portion provided in the end cap for insertion. 8. The method according to claim 1, wherein the second opening is formed at a position facing the optical fiber insertion portion.
The module case according to claim 7. 9. The module according to claim 7, wherein the first and second optical fiber insertion paths are tubular bodies having an insertion path communicating with the inside of the module case.
The module case described in. 10. The module case according to claim 7, wherein the seal cap is a plate-like body. 11. A method of assembling an optical module using the module case according to claim 7, wherein the first optical fiber cord is connected to the first optical fiber passage section. Inserting the end of the first optical fiber cord to the outside of the module case main body through the second opening; and inserting the second optical fiber cord into the second optical fiber A step of inserting the first case and the second case outside the module case main body;
Optically joining the end of the optical fiber cord and the optical element to form a structure joined to the first and second optical fiber cords; and forming the structure into the second opening A step of introducing the module into the module case main body through a portion and fixing the module to a predetermined position inside the module case main body; a step of sealing the second opening with the end cap; And c. Sealing the first opening with the seal cap. 12. The step of forming the structure includes assembling and forming an optical coupling unit at an end of each of the first and second optical fiber cords outside the module case main body. The method of claim 11, wherein