JPH09101434A - Module for optical communication and its manufacture - Google Patents

Module for optical communication and its manufacture

Info

Publication number
JPH09101434A
JPH09101434A JP25776195A JP25776195A JPH09101434A JP H09101434 A JPH09101434 A JP H09101434A JP 25776195 A JP25776195 A JP 25776195A JP 25776195 A JP25776195 A JP 25776195A JP H09101434 A JPH09101434 A JP H09101434A
Authority
JP
Japan
Prior art keywords
optical
photoelectric conversion
conversion element
system frame
ferrule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25776195A
Other languages
Japanese (ja)
Inventor
Yuuji Tsuetani
勇二 杖谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP25776195A priority Critical patent/JPH09101434A/en
Publication of JPH09101434A publication Critical patent/JPH09101434A/en
Pending legal-status Critical Current

Links

Landscapes

  • Optical Couplings Of Light Guides (AREA)

Abstract

PROBLEM TO BE SOLVED: To eliminate the need to perform operation in the narrow space in a package and to facilitate operation for aligning optical axes with each other and connecting an optical signal transmission member and a photoelectric transducing element by connecting them through an optical system frame. SOLUTION: After the photoelectric converting element 1 and an element stem 2 are coupled with the horizontal part 3a of the optical system frame 3, a ferrule holding member 5 and a lens 4 are fixed to the vertical part 3 of the optical system frame 3 while the optical axes are positioned. A ferrule 6 equipped with an optical fiber is inserted and held, and while an optical signal is projected from the optical fiber, the ferrule is connected and fixed by adjusting the position so that the optical coupling with the photoelectric transducing element 1 becomes maximum. Then, an electric element is mounted on a substrate 8 where an electric circuit is constituted and covered with a sealant 10, and then the optical system frame 3 is connected onto the substrate 8 ad covered with a case 7 fir airtight sealing.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はパッケージ型の光通
信用モジュール及びその製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package type optical communication module and a method for manufacturing the same.

【0002】[0002]

【従来の技術】光信号と電気信号を変換するためにパッ
ケージ型の光通信用モジュールが用いられている。その
構造は、箱状のパッケージ内にレーザーダイオードやフ
ォトダイオード等の光電変換素子と該光電変換素子を駆
動するための電気素子(ICチップ)を内蔵し、上記光
電変換素子に対する光信号伝送部材として、光ファイバ
を備えたフェルールをパッケージ側面に取り付けた構造
のものがあった。
2. Description of the Related Art A package type optical communication module is used for converting an optical signal and an electric signal. The structure is such that a photoelectric conversion element such as a laser diode or a photodiode and an electric element (IC chip) for driving the photoelectric conversion element are built in a box-shaped package, and as a light signal transmission member for the photoelectric conversion element. In some cases, a ferrule equipped with an optical fiber was attached to the side of the package.

【0003】このような光通信用モジュールを用いれ
ば、フェルール内の光ファイバによって導入・導出され
る光信号をパッケージ内の光電変換素子によって電気信
号に変換することができる。
By using such an optical communication module, an optical signal introduced / derived by the optical fiber in the ferrule can be converted into an electric signal by the photoelectric conversion element in the package.

【0004】また、上記の光通信用モジュールを製造す
る場合は、まずパッケージ内に電気素子及び光電変換素
子を実装した後、このパッケージの側面に光ファイバを
備えたフェルールを挿入し、光電変換素子との光軸合わ
せを行って接合するようになっている。
In the case of manufacturing the above optical communication module, first, an electric element and a photoelectric conversion element are mounted in a package, and then a ferrule equipped with an optical fiber is inserted into a side surface of the package to convert the photoelectric conversion element. The optical axis is aligned with and joined.

【0005】[0005]

【発明が解決しようとする課題】ところが、上記の光通
信用モジュールを製造する際に、パッケージ内の狭い空
間に光電変換素子と電気素子を実装しなければならない
ため、実装作業に手間がかかるという問題点があった。
However, when manufacturing the above-mentioned optical communication module, it is necessary to mount the photoelectric conversion element and the electric element in a narrow space inside the package, which is troublesome for the mounting work. There was a problem.

【0006】また、上記各種素子を実装した後で、光信
号伝送部材であるフェルールを接合する際にも、パッケ
ージ内の狭い空間で光電変換素子との光軸合わせを行う
ため、作業に手間がかかるという問題があった。
Also, after the above-mentioned various elements are mounted, when the ferrule which is the optical signal transmission member is joined, the optical axis alignment with the photoelectric conversion element is performed in a narrow space in the package, which is troublesome. There was a problem of this.

【0007】さらに、上記パッケージ内の電気素子は樹
脂等の封止材で覆われているが、一般に樹脂の誘電率は
高いため、高周波信号に対する損失が大きいという問題
点もあった。
Further, although the electric element in the package is covered with a sealing material such as resin, there is a problem that the loss of a high frequency signal is large because the dielectric constant of the resin is generally high.

【0008】[0008]

【課題を解決するための手段】そこで本発明は、光電変
換素子及び電気素子をパッケージに内蔵し、上記光電変
換素子への光信号伝送系統を備えた光通信用モジュール
において、上記光信号伝送系統と光電変換素子とを光学
系フレームを介して接合したことを特徴とする。
Therefore, the present invention provides an optical communication module having a photoelectric conversion element and an electric element built in a package, and an optical signal transmission system for the photoelectric conversion element. And a photoelectric conversion element are joined together via an optical system frame.

【0009】また本発明は、上記光通信用モジュールを
製造する際に、まず光電変換素子と光信号伝送部材とを
光学系フレームを介して互いの光軸を合わせた状態で接
合し、次に上記光電変換素子を電気素子を備えた基板に
固定し、ケースで覆って気密封止するようにしたことを
特徴とする。
Further, according to the present invention, in manufacturing the optical communication module, first, the photoelectric conversion element and the optical signal transmission member are joined together with their optical axes aligned with each other through an optical system frame, and then, The photoelectric conversion element is fixed to a substrate provided with an electric element, covered with a case, and hermetically sealed.

【0010】即ち、本発明によれば、まず最初に光信号
伝送部材と光電変換素子とを光学系フレームを介して接
合することによって、パッケージ内の狭い空間内で作業
を行う必要がないため、光軸を一致させて接合する作業
を容易に行うことができる。次に、別途電気素子を備え
た基板に上記光電変換素子を固定するが、この時は単に
接合するだけで良い。
That is, according to the present invention, since the optical signal transmission member and the photoelectric conversion element are first bonded to each other through the optical system frame, it is not necessary to work in a narrow space in the package. The operation of aligning the optical axes and joining them can be easily performed. Next, the photoelectric conversion element is fixed to a substrate separately provided with an electric element, but at this time, it is sufficient to simply bond the photoelectric conversion element.

【0011】さらに本発明は、上記電気素子を、電気回
路を構成する基板上に空間層を介して接合したことを特
徴とするものである。
Further, the present invention is characterized in that the above-mentioned electric element is bonded onto a substrate constituting an electric circuit via a space layer.

【0012】即ち、空気は誘電率が1と非常に低いた
め、電気素子と基板間に誘電率の低い空間層を介在させ
ることによって、高周波信号の損失を防止することがで
きるのである。
That is, since air has a very low dielectric constant of 1, it is possible to prevent high frequency signal loss by interposing a space layer having a low dielectric constant between the electric element and the substrate.

【0013】[0013]

【発明の実施の形態】以下本発明の実施形態を図によっ
て説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

【0014】図1に示すように、レーザーダイオードや
フォトダイオード等の光電変換素子1は素子ステム2に
結合され、L字状断面を有する金属又はセラミックス製
の光学系フレーム3の水平部3aに固定されている。ま
た、この光学系フレーム3の垂直部3bには、光信号伝
送系統としてフェルール保持部材5及びその光電変換素
子1側の端部にはレンズ4が固定されている。一方、フ
ェルール保持部材5のレンズ4と反対側の端部には、光
ファイバを備えたフェルール6が挿入保持されている。
As shown in FIG. 1, a photoelectric conversion element 1 such as a laser diode or a photodiode is coupled to an element stem 2 and fixed to a horizontal portion 3a of an optical system frame 3 made of metal or ceramics having an L-shaped cross section. Has been done. Further, a lens 4 is fixed to the vertical portion 3b of the optical system frame 3 as an optical signal transmission system, and a ferrule holding member 5 and an end portion thereof on the photoelectric conversion element 1 side. On the other hand, a ferrule 6 including an optical fiber is inserted and held at the end of the ferrule holding member 5 opposite to the lens 4.

【0015】ここで、フェルール保持部材5は、図1で
は単なる円筒部材としてあるが、実際にはフェルール6
を挿入するためのスリーブ、軸方向の位置決めのための
フェルールストッパ、これらを保持するボディなどを含
むものである。また、フェルール6をフェルール保持部
材5に固定してピッグテイル型としたり、あるいはフェ
ルール6をフェルール保持部材5に着脱可能としてリセ
プタクル型とすることができる。
Here, although the ferrule holding member 5 is merely a cylindrical member in FIG. 1, it is actually a ferrule 6.
It includes a sleeve for inserting, a ferrule stopper for axial positioning, a body for holding these, and the like. Further, the ferrule 6 can be fixed to the ferrule holding member 5 to form a pigtail type, or the ferrule 6 can be attached to and detached from the ferrule holding member 5 to form a receptacle type.

【0016】なお、光電変換素子1に対する光信号伝送
系統とは、光信号を光電変換素子1に伝送するための一
連の部材のことであり、図1ではレンズ4、フェルール
保持部材5、フェルール6を指す。また、上記レンズ4
の代わりに光ファイバを埋設したフェルール(ファイバ
スタブ)を備えたり、あるいは光コネクタ側のフェルー
ル6をそのまま延ばした構造として光信号伝送系統とす
ることもできる。
The optical signal transmission system for the photoelectric conversion element 1 is a series of members for transmitting an optical signal to the photoelectric conversion element 1. In FIG. 1, the lens 4, the ferrule holding member 5, and the ferrule 6 are shown. Refers to. In addition, the lens 4
Instead of the above, a ferrule (fiber stub) in which an optical fiber is embedded may be provided, or the ferrule 6 on the optical connector side may be extended as it is to form an optical signal transmission system.

【0017】一方、電気回路を構成したセラミックス製
の基板8上にICチップ等の電気素子9を電気的に接続
して搭載し、周囲をシリコンペーストやレジン等の樹脂
からなる湿度封止用の封止材10で覆っている。この基
板8上に、上記光電変換素子1を固定した光学系フレー
ム3を固定し、さらに金属又はセラミックス製のケース
7で覆うことによって、光電変換素子1及び電気素子9
を気密に封止するパッケージを構成してある。
On the other hand, an electric element 9 such as an IC chip is electrically connected and mounted on a ceramic substrate 8 forming an electric circuit, and the periphery thereof is made of resin such as silicon paste or resin for humidity sealing. It is covered with the sealing material 10. The photoelectric conversion element 1 and the electric element 9 are fixed on the substrate 8 by fixing the optical system frame 3 to which the photoelectric conversion element 1 is fixed and further covering with a case 7 made of metal or ceramics.
To form an airtight package.

【0018】上記光電変換素子1と電気素子9は電気的
に接続され、電気回路を構成した基板8に備えたリード
部(不図示)から電気信号を入出力できるようになって
いる。そのため、光コネクタ側のフェルール6に備えた
光ファイバによって導入・導出される光信号を光電変換
素子1によって電気信号に変換することができ、光通信
用モジュールとして作動させることができる。
The photoelectric conversion element 1 and the electric element 9 are electrically connected to each other, and an electric signal can be inputted / outputted from a lead portion (not shown) provided on a substrate 8 forming an electric circuit. Therefore, the optical signal introduced / derived by the optical fiber provided in the ferrule 6 on the optical connector side can be converted into an electrical signal by the photoelectric conversion element 1, and the optical communication module can be operated.

【0019】次に、本発明の光通信用モジュールの製造
方法を説明する。
Next, a method of manufacturing the optical communication module of the present invention will be described.

【0020】まず、図2(A)に示すように、光学系フ
レーム3の水平部3aに光電変換素子1と素子ステム2
を結合した後、光学系フレーム3の垂直部3bにフェル
ール保持部材5及びレンズ4を光軸の位置合わせを行い
ながら固定する。この際には、フェルール保持部材5の
レンズ4と反対側の端部に、光ファイバを備えたフェル
ール6を挿入保持しておいて、この光ファイバから光信
号を出射させながら、光電変換素子1に対する光学結合
が最大となるように、位置を調整しながら接合固定すれ
ば良い。この作業は、パッケージ内の狭い空間で行う必
要がないため、容易に行うことができる。
First, as shown in FIG. 2A, the photoelectric conversion element 1 and the element stem 2 are provided on the horizontal portion 3a of the optical system frame 3.
After coupling, the ferrule holding member 5 and the lens 4 are fixed to the vertical portion 3b of the optical system frame 3 while aligning the optical axes. At this time, the ferrule 6 having an optical fiber is inserted and held at the end of the ferrule holding member 5 opposite to the lens 4, and the photoelectric conversion element 1 is emitted while emitting an optical signal from the optical fiber. The position may be adjusted so that the optical coupling with respect to is maximized. This work does not have to be performed in a narrow space inside the package, and can be easily performed.

【0021】次に、図2(B)に示すように、電気回路
を構成した基板8上に電気素子9を搭載して封止材10
で覆った後、この基板上に上記光学系フレーム3を接合
し、さらに、ケース7で覆って気密封止を行う。この
時、電気素子9の搭載は基板8上で行えば良いことから
容易に作業することができ、基板8と光学系フレーム3
とケース7は単に接合するだけで良いため、容易に組み
立て作業を行うことができる。
Next, as shown in FIG. 2B, an electric element 9 is mounted on a substrate 8 forming an electric circuit, and a sealing material 10 is formed.
Then, the optical system frame 3 is bonded onto this substrate and further covered with a case 7 to hermetically seal. At this time, since the electric element 9 may be mounted on the substrate 8, the electric device 9 can be easily worked, and the substrate 8 and the optical system frame 3 can be mounted.
Since the case 7 and the case 7 need only be joined, the assembling work can be easily performed.

【0022】なお、上記実施例では、光学系フレーム3
としてL字状のものを用いたが、この形状はモジュール
の構造等に応じて自由に変更することができる。
In the above embodiment, the optical system frame 3
Although an L-shaped one is used as this, this shape can be freely changed according to the structure of the module and the like.

【0023】また、本発明では、基板8と電気素子9と
の接合構造も重要である。即ち、従来の構造では、図3
に示すように基板8上に電気素子9を密着させて載置
し、ワイヤボンディングによる接続部材11で電気回路
と接続して、封止材10で覆っていた。そのため、電気
素子9の近傍はセラミックス製の基板8や樹脂製の封止
材10などの誘電率が高い材質からなっており、高周波
信号が減衰しやすかった。
In the present invention, the joint structure between the substrate 8 and the electric element 9 is also important. That is, in the conventional structure, as shown in FIG.
As shown in FIG. 3, the electric element 9 was placed in close contact with the substrate 8 and connected to the electric circuit by the connection member 11 by wire bonding, and covered with the sealing material 10. Therefore, the vicinity of the electric element 9 is made of a material having a high dielectric constant such as the ceramic substrate 8 and the resin sealing material 10, and the high frequency signal is easily attenuated.

【0024】これに対し、本発明では、図4のように、
基板8上の所定位置にボールボンダー等の接続部材11
によって、電気素子9を電気的に接続するとともに保持
し、この電気素子9と基板8の間に幅が80μm程度の
空間層12を形成してある。なお、この電気素子9を封
止材10で覆う際には、上記空間層12に封止材10が
入り込まないようにする。
On the other hand, in the present invention, as shown in FIG.
A connecting member 11 such as a ball bonder is provided at a predetermined position on the substrate 8.
The electrical element 9 is electrically connected and held by the space layer 12 having a width of about 80 μm formed between the electrical element 9 and the substrate 8. When the electric element 9 is covered with the sealing material 10, the sealing material 10 is prevented from entering the space layer 12.

【0025】このため、電気素子9と基板8の間には誘
電率が低い空気が存在することになり、高周波信号の減
衰を防止するとができるのである。
Therefore, air having a low dielectric constant exists between the electric element 9 and the substrate 8, and it is possible to prevent the attenuation of the high frequency signal.

【0026】[0026]

【発明の効果】以上のように本発明によれば、光電変換
素子及び電気素子をパッケージに内蔵し、上記光電変換
素子への光信号伝送系統を備えた光通信用モジュールに
おいて、上記光信号伝送系統と光電変換素子とを光学系
フレームを介して接合したことによって、上記光通信用
モジュールを製造する際に、まず最初に光信号伝送系統
と光電変換素子とを光学系フレームを介して互いの光軸
を一致させて接合することによって、パッケージ内の狭
い空間内で作業を行う必要がないことから、光軸を一致
させて接合する作業を容易に行うことができ、次に別途
電気素子を備えた基板に対して、上記光電変換素子を固
定しケースで覆うことによって、容易に製造することが
できる。
As described above, according to the present invention, in the optical communication module including the photoelectric conversion element and the electric element in the package and including the optical signal transmission system to the photoelectric conversion element, the optical signal transmission is performed. By bonding the system and the photoelectric conversion element via the optical system frame, when manufacturing the optical communication module, first, the optical signal transmission system and the photoelectric conversion element are mutually connected via the optical system frame. By aligning and joining the optical axes, there is no need to work in a narrow space inside the package, so the aligning and aligning the optical axes can be easily performed, and then a separate electric element can be added. It can be easily manufactured by fixing the photoelectric conversion element to the provided substrate and covering it with a case.

【0027】さらに本発明によれば、上記電気素子を、
電気回路を構成する基板上に空間層を介して接合したこ
とによって、電気素子と基板間に誘電率の低い空間層を
介在させて、高周波信号の損失を防止することができ
る。
Further, according to the present invention, the above electric element is
Since the space layer having the low dielectric constant is interposed between the electric element and the substrate through the space layer, it is possible to prevent the loss of the high frequency signal.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の光通信用モジュールを示す縦断面図で
ある。
FIG. 1 is a vertical cross-sectional view showing an optical communication module of the present invention.

【図2】(A)(B)は本発明の光通信用モジュールの
製造工程を説明するための断面図である。
2A and 2B are cross-sectional views for explaining a manufacturing process of the optical communication module of the present invention.

【図3】従来の光通信用モジュールにおける電気素子の
固定構造を示す縦断面図である。
FIG. 3 is a vertical cross-sectional view showing a structure for fixing an electric element in a conventional optical communication module.

【図4】本発明の光通信用モジュールにおける電気素子
の固定構造を示す縦断面図である。
FIG. 4 is a vertical sectional view showing a fixing structure of an electric element in the optical communication module of the present invention.

【符号の説明】[Explanation of symbols]

1:光電変換素子 2:素子ステム 3:光学系フレーム 4:レンズ 5:フェルール保持部材 6:フェルール 7:ケース 8:基板 9:電気素子 10:封止材 11:接続部材 12:空間層 1: Photoelectric conversion element 2: Element stem 3: Optical system frame 4: Lens 5: Ferrule holding member 6: Ferrule 7: Case 8: Substrate 9: Electric element 10: Sealing material 11: Connection member 12: Space layer

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】光電変換素子及び電気素子をパッケージに
内蔵し、上記光電変換素子への光信号伝送系統を備えた
光通信用モジュールにおいて、上記光信号伝送系統と光
電変換素子とを光学系フレームを介して接合してなる光
通信用モジュール。
1. An optical communication module comprising a photoelectric conversion element and an electric element in a package, and an optical signal transmission system to the photoelectric conversion element, wherein the optical signal transmission system and the photoelectric conversion element are an optical system frame. A module for optical communication that is bonded via
【請求項2】上記電気素子を、電気回路を構成する基板
上に空間層を介して搭載したことを特徴とする請求項1
記載の光通信用モジュール。
2. The electric element is mounted on a substrate forming an electric circuit via a space layer.
The optical communication module described.
【請求項3】まず予め光軸合わせを行った光信号伝送系
統と光電変換素子とを光学系フレームを介して互いの光
軸を一致させて接合し、次に上記光電変換素子を電気素
子を備えた基板上に固定し、ケースで覆って気密封止す
る工程からなる光通信用モジュールの製造方法。
3. An optical signal transmission system and a photoelectric conversion element, which have been previously adjusted in optical axis, are joined together by aligning their optical axes with each other through an optical system frame, and then the photoelectric conversion element is connected to an electric element. A method for manufacturing an optical communication module, which comprises the steps of fixing on a provided substrate, covering with a case and hermetically sealing.
JP25776195A 1995-10-04 1995-10-04 Module for optical communication and its manufacture Pending JPH09101434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25776195A JPH09101434A (en) 1995-10-04 1995-10-04 Module for optical communication and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25776195A JPH09101434A (en) 1995-10-04 1995-10-04 Module for optical communication and its manufacture

Publications (1)

Publication Number Publication Date
JPH09101434A true JPH09101434A (en) 1997-04-15

Family

ID=17310737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25776195A Pending JPH09101434A (en) 1995-10-04 1995-10-04 Module for optical communication and its manufacture

Country Status (1)

Country Link
JP (1) JPH09101434A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359486A (en) * 2001-02-28 2002-12-13 Sumitomo Electric Ind Ltd Optical data link

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359486A (en) * 2001-02-28 2002-12-13 Sumitomo Electric Ind Ltd Optical data link

Similar Documents

Publication Publication Date Title
US6795461B1 (en) Optoelectric module
CN100479197C (en) Optical receiver package
US7751659B2 (en) Optical apparatus
JP2533637B2 (en) Method for manufacturing device comprising optoelectronic device and optical waveguide coupled thereto
US5233426A (en) Reduced diameter camera head for solid-state image pickup device and method of producing same
JPH10227953A (en) Optical coupling system and mount structure using gelled resin
US20040146304A1 (en) Optical transceiver modules
US7527441B2 (en) Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module
JP4153310B2 (en) Transistor outline covering parts with lead frames
US6646291B2 (en) Advanced optical module which enables a surface mount configuration
JPS60180183A (en) Hermetically sealing package for optical semiconductor element
JP2000180669A (en) Optical connector plug
JPH09101434A (en) Module for optical communication and its manufacture
JP4728625B2 (en) Optical semiconductor device and optical module using the same
JPH059689Y2 (en)
JP2009054938A (en) Light-receiving module
JP2800760B2 (en) Optical semiconductor module
JP3452120B2 (en) Optical module and optical transceiver
JPH0515009U (en) Optical link
JPH10213723A (en) Photosemiconductor module and its manufacture
JPH11154772A (en) Semiconductor module device and manufacture thereof
EP1953577B1 (en) Package for optoelectronic device on wafer level
JPS5916435A (en) Optical transmission module
JP2002014260A (en) Planar mounting optical module and transmission substrate using such module
KR970011147B1 (en) Method of manufacturing high speed light receiving module

Legal Events

Date Code Title Description
A02 Decision of refusal

Effective date: 20040120

Free format text: JAPANESE INTERMEDIATE CODE: A02