JP2001051084A - Heat sink and its production method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink improved in fin structure for responding to the demand for high radiation characteristics. SOLUTION: The heat sink 1 is characterized by that a plate fin parallel body 2 constituted by penetrating an aluminum pipe 22 into a multitude of aluminum made plate fins 21 is soldered to one surface 101 of a steel-made base plate 10 at one edge 211 of each plate fin 21 and constituted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink in which fins having a form in line contact with one surface of a base plate are soldered to one surface of the base plate, and a method for manufacturing the heat sink.

[0002]

2. Description of the Related Art In a heat sink, a fin structure occupies an important part of heat radiation characteristics. However, it is sometimes difficult to meet demands for high heat radiation characteristics with currently known plate fins and pin fins.

[0003] An object of the present invention is to provide a heat sink having an improved fin structure in order to meet the demand for high heat radiation characteristics, and a method of manufacturing the heat sink.

[0004]

According to the first aspect of the present invention,
A plate fin juxtaposed body formed by penetrating an aluminum pipe through a number of aluminum plate fins is formed on one surface of a copper base plate by soldering at one edge of each plate fin. A heat sink characterized in that:

According to a second aspect of the present invention, a large number of aluminum plate fins having a corrugated cross section are soldered to one surface of a copper base plate at one end of each plate fin. A heat sink.

According to a third aspect of the present invention, a spiral fin formed by spirally winding an aluminum wire on one surface of a copper base plate is soldered at a contact point of the spiral fin with the base plate. And a heat sink characterized by the following.

The invention according to claim 4 is characterized in that a large number of aluminum plate fins are formed on one surface of a copper base plate by soldering at one edge of each plate fin. Heat sink.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a heat sink, wherein a fin having a form of line contact with one surface of a copper base plate is soldered to one surface of the base plate at a position where the fin makes line contact. A step of contacting the fin with the line-contacting portion with the solder being jetted in the jet-type solder bath and applying ultrasonic waves to the jetted solder to form solder plating at the line-contacting portion; Immersed in molten solder, applying ultrasonic waves to the base plate or molten solder to form solder plating on one surface of the base plate, and converting the solder plating at the line contact of the fins to solder plating on one surface of the base plate. Contacting, pressurizing both, and applying ultrasonic waves to the abutting portion.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a heat sink, wherein a fin having a form of line contact with one surface of a copper base plate is soldered to one surface of the base plate at a position where the fin makes line contact. A step of contacting the fin with the line-contacting portion with the solder being jetted in the jet-type solder bath and applying ultrasonic waves to the jetted solder to form solder plating at the line-contacting portion; A step of contacting the fins with the line contact with the solder being jetted in the jet-type solder bath, applying ultrasonic waves to the base plate or the jet solder, and forming solder plating on the fins with the line contact. The solder plating at the point where the fins make line contact is in contact with the solder plating where the fins on one side of the base plate make line contact. It is characterized by having a step of applying ultrasonic waves both pressurized and contact points.

[0010]

(Embodiment 1) FIG. 1 is a front view of a heat sink according to the present embodiment, and FIG. 2 is a view taken in the direction of arrow II in FIG. This heat sink 1 is made of a copper base plate 10.
The plate fin juxtaposed body 2 is joined to one surface 101 by soldering. The plate fin juxtaposed body 2 is formed by penetrating an aluminum pipe 22 through a large number of aluminum plate fins 21, and is soldered to one surface 101 of the base plate 10 at one end 211 of each plate fin 21. . Two aluminum pipes 22 are provided in parallel. Note that the one edge 211 of the plate fin 21 is in line contact with the one surface 101 of the base plate 10.

The heat sink 1 having the above structure is manufactured as follows. First, an aluminum pipe 22 is made to penetrate through a large number of plate fins 21 to produce the plate fin juxtaposed body 2. At this time, the periphery of the through hole of each plate fin 21 through which the aluminum pipe 22 has penetrated is swaged.

Next, as shown in FIG. 3, the plate fin juxtaposition body 2 is arranged on the jet-type solder bath 3, and the plate fins 21 are attached to the aluminum solder 31 jetting one edge 211 for each plate fin 21. At the same time, ultrasonic waves are applied to the jet-type solder bath 3, that is, the solder 31.
11 is formed with solder plating 41. The jet-type solder tank 3 includes a fan 33 and a nozzle 34 in a tank 32, and the molten solder 31 is blown up by the fan 33 and jetted upward from the tip of the nozzle 34.

On the other hand, the entire surface of one surface 101 of the base plate 10 is immersed in molten aluminum solder in another solder bath, and ultrasonic waves are applied to the base plate 10 or the solder. Form plating.

Then, as shown in FIG. 4, the solder plating 41 on one edge 211 of all the plate fins 21 of the plate fin juxtaposition body 2 is brought into contact with the solder plating 42 formed on the one surface 101 of the base plate 10. Ultrasonic waves are applied to the base plate 10 while applying pressure from above or below with a pressing machine (not shown), and further applying heat from the side to the contact portion. Thereby, as shown in FIG. 5, the solder platings 41 and 42 are fused and integrated,
One edge 211 of the plate fin 21 and the base plate 1
Thus, the heat sink 1 in which the plate fin juxtaposed body 2 and the base plate 10 are integrated is obtained.

According to such a method, since the jet-type solder bath 3 is used, the solder plating 41 is favorably formed on one end edge 211 of the plate fin 21. That is, since the solder 31 is jetted in the jet type solder bath 3,
No oxide film is formed on the surface of the solder 31, and therefore, the solder 31 in contact with the one edge 211 is always in a good reactivity, and therefore, the solder 31 adheres well to the one edge 211. Thus, the solder plating 41 is formed favorably.

In the heat sink 1 having the above-described structure, since a large number of plate fins 21 are soldered to one surface 101 of the base plate 10, the heat diffusion property of the plate fin juxtaposed body 2 is good, and therefore, the heat radiation characteristic is low. Are better.

In the above manufacturing method, the solder plating 42 is formed on the entire surface 101 of the base plate 10, but as shown in FIG. The solder plating 42 may be formed only at a position where one end edge 211 of each plate fin 21 contacts. In this case, solder plating 4
2 is formed using a jet-type solder bath 3. That is, only the above-mentioned portion of the one surface 101 of the base plate 10 is brought into contact with the jetted solder 31 and an ultrasonic wave is applied to the solder 31. With this, the same operation and effect as in the case of the above-described manufacturing method can be obtained.

(Embodiment 2) FIG. 7 is a plan view of a heat sink of this embodiment, and FIG. 8 is a view taken in the direction of arrow VIII in FIG. In the drawings, the same reference numerals as those in FIGS. 1 to 6 indicate the same or corresponding components. The heat sink 1 </ b> A is configured such that a large number of aluminum plate fins 23 having a corrugated cross section are soldered to one surface 101 of a copper base plate 10 at one end 231 of each plate fin 23. Note that one end edge 231 of the plate fin 23 is in line contact with one surface 101 of the base plate 10.

The heat sink 1A having the above structure is manufactured as follows. First, as shown in FIG. 9, the plate fins 23 are arranged on the jet-type solder bath 3, and one end 231 of the plate fins 23 is brought into contact with the jetted solder 31, and ultrasonic waves are applied to the solder 31. Thereby, the solder plating 43 is formed on one edge 231 of the plate fin 23.

On the other hand, solder plating is formed on one surface 101 of the base plate 10 in the same manner as in the first embodiment.

Then, one edge 23 of the plate fin 23
1 solder plating 43 on one side 1 of base plate 10
01 while applying pressure from above or below by a pressing machine (not shown)
Further, ultrasonic waves are applied to the base plate 10 while applying heat to the contact portions from the side. Thereby, the solder platings are melted and integrated, and one end edge 231 of the plate fin 23 and the one surface 101 of the base plate 10 are soldered. Therefore, a heat sink 1A in which the plate fin 23 and the base plate 10 are integrated is obtained. Can be

According to such a method, the jet plating type solder bath 3 is used as in the case of the first embodiment, so that the solder plating 43 is favorably formed on one end 231 of the plate fin 23.

In the heat sink 1A having the above structure, since the plate fins 23 have a corrugated cross section, the surface area of the plate fins 23 is large, and therefore, the heat diffusion property of the plate fins 23 is good, and therefore, the heat radiation Excellent characteristics.

As in the case of FIG. 6, solder plating may be formed on one surface 101 of the base plate 10 only at a portion where one end edge 231 of the plate fin 23 contacts.

(Embodiment 3) FIG. 10 is a plan view of a heat sink of this embodiment, and FIG. 11 is a sectional view taken along the line XI-XI of FIG. In the drawings, the same reference numerals as those in FIGS. 1 to 6 indicate the same or corresponding components. This heat sink 1B
The spiral fin 24 formed by spirally winding an aluminum wire 241 on the one surface 101 of the copper base plate 10 is solder-bonded at a contact point 242 to the one surface 101 of the spiral fin 24. It is configured. The contact portion 242 of the spiral fin 24 is in line contact with the one surface 101 of the base plate 10.

The heat sink 1B having the above structure is manufactured as follows. First, as shown in FIG. 12, the spiral fin 24 is arranged on the jet-type solder bath 3, and the contact point 242 is brought into contact with the jetted solder 31, and ultrasonic waves are applied to the solder 31. Thereby, solder plating is formed on the contact portion 242 of the spiral fin 24.

On the other hand, solder plating is also formed on one surface 101 of the base plate 10 in the same manner as in the first embodiment.

Then, the contact point 242 of the spiral fin 24
Is applied to the solder plating formed on one surface 101 of the base plate 10, and while applying pressure from above or below by a press (not shown), heat is further applied to the contact portion from the side. While applying the ultrasonic wave to the base plate 10. As a result, the solder platings are melted and integrated, and the contact point 242 of the spiral fin 24 and the one surface 101 of the base plate 10 are soldered.
Is obtained as a heat sink 1B.

According to such a method, as in the case of the first embodiment, since the jet type solder bath 3 is used, the solder plating is favorably formed at the contact portion 242 of the spiral fin 24.

In the heat sink 1B having the above-described structure, the heat dissipating property of the spiral fin 24 is excellent because the heat diffusing property is good.

As in the case of FIG. 6, the contact surface 2 of the spiral fin 24 is
The solder plating may be formed only at the position where the contact 42 contacts.

(Embodiment 4) FIG. 13 is a front view of a heat sink according to the present embodiment, and FIG. 14 is a view taken in the direction of arrow XIV in FIG. This heat sink 1C is made of a copper base plate 1
A large number of plate fins 21 made of aluminum are solder-bonded to one surface 101 of the first plate 101 at one end edge 211 thereof. Note that the one edge 211 of the plate fin 21 is in line contact with the one surface 101 of the base plate 10.

The heat sink 1C having the above structure is manufactured as follows. First, as shown in FIG. 15, using the spacer jig 5, a plate fin juxtaposed body 2A in which a number of plate fins 21 are juxtaposed is produced. The spacer jig 5 includes a large number of spacers 51 and holders 52, and the spacers 51 are adjacent to the plate fins 21.
The holder 52 is sandwiched between the holders, and holds the plate fin juxtaposed body 2A with the spacer 52 interposed therebetween from both sides.

Next, while holding the plate fin juxtaposed body 2A with the holder 52, as shown in FIG. While being in contact with the aluminum solder 31 being applied, ultrasonic waves are applied to the jet type solder bath 3, that is, the solder 31, whereby the plate fin juxtaposed body 2 </ b> A
Is formed on one end 211 of all the plate fins 21.

On the other hand, solder plating is also formed on one surface 101 of the base plate 10 in the same manner as in the first embodiment.

Then, the solder plating on one edge 211 of all the plate fins 21 of the plate fin juxtaposed body 2A is brought into contact with the solder plating formed on one surface 101 of the base plate 10, and the pressure is applied from above or below by a press machine. While applying heat, ultrasonic waves are applied to the base plate 10 while applying heat to the contact portions from the side. Accordingly, the solder plating on one end 211 of the plate fin 21 and the solder plating formed on one surface 101 of the base plate 10 are melted and integrated, and the one end 211 of the plate fin 21 and the one surface 101 of the base plate 10 are joined by soldering. Accordingly, a heat sink 1C in which the plate fin juxtaposed body 2A and the base plate 10 are integrated is obtained.

According to such a method, as in the case of the first embodiment, since the jet-type solder bath 3 is used, the solder plating is favorably formed on one end 211 of the plate fin 21.

In the heat sink 1 having the above-described structure, since the large number of plate fins 21 are soldered to one surface 101 of the base plate 10, the plate fin juxtaposed body 2A
Has good thermal diffusivity and therefore excellent heat dissipation characteristics.

As in the case of FIG. 6, solder plating may be formed on one surface 101 of the base plate 10 only at a portion where one end edge 211 of the plate fin 21 contacts.

[0040]

According to the first aspect of the present invention, the ventilation resistance of the plate fin is small, and the heat conductivity is good because the base plate is made of copper, so that the heat radiation characteristics can be improved.

According to the second aspect of the present invention, since the plate fin has a corrugated cross section, the surface area of the plate fin is large, and since the base plate is made of copper, the heat conductivity is good. it can.

According to the third aspect of the present invention, since the spiral fin has a small ventilation resistance and the base plate is made of copper, the heat conductivity is good, so that the heat radiation characteristics can be improved.

According to the fourth aspect of the present invention, the ventilation resistance of the plate fin is small and the heat conductivity is good because the base plate is made of copper, so that the heat radiation characteristics can be improved.

According to the fifth aspect of the present invention, the heat sink including the copper base plate and the fin having the form of making a line contact with one surface of the base plate is solder-bonded at the line contact of the fin, so that the heat sink is securely connected. Obtainable. Therefore, it is possible to surely obtain a heat sink having a fin improved in a form capable of improving heat radiation characteristics in combination with good heat conductivity of the base plate.

According to the sixth aspect of the present invention, the heat sink including the copper base plate and the fin having the form of making line contact with one surface of the base plate is soldered at the line contact of the fin, so that the heat sink is securely connected. Obtainable. Therefore, it is possible to surely obtain a heat sink having a fin improved in a form capable of improving heat radiation characteristics in combination with good heat conductivity of the base plate. In addition, the amount of solder used for the base plate can be reduced, and the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a front view of a heat sink according to a first embodiment.

FIG. 2 is a view taken in the direction of the arrow II in FIG.

FIG. 3 is a cross-sectional view illustrating one step of a manufacturing method according to the first embodiment.

FIG. 4 is a cross-sectional view showing a step subsequent to the step shown in FIG.

FIG. 5 is an enlarged cross-sectional partial view of the heat sink according to the first embodiment.

FIG. 6 is a cross-sectional view showing a modification of the manufacturing method according to the first embodiment and showing a step corresponding to FIG. 4;

FIG. 7 is a plan view of a heat sink according to a second embodiment.

FIG. 8 is a view taken in the direction of the arrow VIII in FIG. 7;

FIG. 9 is a cross-sectional view showing a step of the manufacturing method according to the second embodiment.

FIG. 10 is a plan view of a heat sink according to a third embodiment.

FIG. 11 is a sectional view taken along the line XI-XI in FIG. 10;

FIG. 12 is a cross-sectional view showing a step of the manufacturing method according to the third embodiment.

FIG. 13 is a front view of a heat sink according to a fourth embodiment.

FIG. 14 is a view taken in the direction of the arrow XIV in FIG. 13;

FIG. 15 is a cross-sectional view showing a step of the manufacturing method according to the fourth embodiment.

[Explanation of symbols]

 1, 1A, 1B, 1C Heat sink 10 Base plate 101 One surface 2, 2A Plate fin juxtaposed body 21, 23 Plate fin 211, 231 One edge 22 Aluminum pipe 24 Spiral fin 241 Aluminum wire 3 Jet type solder bath 31 Solder 41, 42, 43 Solder plating

Claims (6)

[Claims] 1. A plate fin juxtaposed body formed by penetrating an aluminum pipe through a number of aluminum plate fins on one surface of a copper base plate by soldering at one edge of each plate fin. , A heat sink. 2. A plurality of aluminum plate fins having a corrugated cross section are formed on one surface of a copper base plate by soldering at one edge of each plate fin. heatsink. 3. A spiral fin formed by spirally winding an aluminum wire on one surface of a copper base plate and soldered at a contact point of the spiral fin with the base plate. A heat sink, characterized in that: 4. A heat sink, wherein a large number of aluminum plate fins are formed on one surface of a copper base plate by soldering at one edge of each plate fin. 5. A method of manufacturing a heat sink by joining a fin having a form in line contact with one surface of a copper base plate by soldering to a surface of the base plate at a line contact of the fin. The process of contacting the location with the solder being jetted in the jet-type solder bath, applying ultrasonic waves to the jet-flow solder, and forming solder plating at the point of line contact, and immersing one surface of the base plate in the molten solder Then, applying ultrasonic waves to the base plate or the molten solder to form a solder plating on one surface of the base plate, and contacting the solder plating at the line contact of the fins with the solder plating on one surface of the base plate, Pressurizing and applying an ultrasonic wave to the abutting portion. 6. A method of manufacturing a heat sink by soldering a fin having a form in line contact with one surface of a copper base plate to a surface of the base plate at a position where the fin makes line contact. A step of contacting the location with the solder being jetted in the jet-type solder bath, applying ultrasonic waves to the jet solder, and forming a solder plating at a location where the line is in contact, and the fins on one surface of the base plate are in line contact. A step of applying ultrasonic waves to the base plate or the jet solder while contacting the spots with the solder being jetted in the jet-type solder bath to form solder plating at the locations where the fins are in line contact, and the fins are in line contact. The solder plating at the location is brought into contact with the solder plating at the location where the fins on one side of the base plate make line contact,
Pressurizing both of them and applying ultrasonic waves to the abutting portions.