JP2001050730A - Soldering inspection method and device for both-side mounting board - Google Patents
Soldering inspection method and device for both-side mounting boardInfo
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- JP2001050730A JP2001050730A JP11227561A JP22756199A JP2001050730A JP 2001050730 A JP2001050730 A JP 2001050730A JP 11227561 A JP11227561 A JP 11227561A JP 22756199 A JP22756199 A JP 22756199A JP 2001050730 A JP2001050730 A JP 2001050730A
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- circuit board
- printed circuit
- board
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はプリント基板の両面
にＩＣ等の実装部品を半田付けした実装基板にＸ線を照
射して、該Ｘ線の透過画像から両面の電子部品の半田付
け状態を検査するための方法およびその装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of irradiating a mounting board, in which mounting parts such as ICs are soldered to both sides of a printed circuit board, with X-rays, and determining a soldering state of the electronic parts on both sides from a transmission image of the X-rays. A method and apparatus for testing.
【０００２】[0002]
【従来の技術】近年、基板の高密度化に伴い、プリント
基板の面積を有効に利用するために、ＩＣのリードに代
えて本体の裏面にボール端子を備えたボールグリッドア
レイ型やリードを本体の内方に折曲したＪリード型のＩ
Ｃが開発され、このＩＣをプリント基板に半田付け実装
したものが開発されている。2. Description of the Related Art In recent years, in order to make effective use of the area of a printed circuit board as the density of a printed circuit board increases, a ball grid array type or a lead having ball terminals on the back surface of the main body is used instead of an IC lead. J-lead type I bent inward
C has been developed, and this IC has been developed by soldering and mounting it on a printed circuit board.
【０００３】このようなＩＣは外部からボール端子やリ
ードが見えないため、テレビカメラやレーザ光を掃引す
る従来の方法では検査ができない。そこで、このような
実装部品の半田付け状態を検査する方法としては、Ｘ線
をプリント基板に照射して透過画像を得、この透過画像
から半田付けの良否を判断する方法がある。[0003] Such an IC cannot be inspected by a television camera or a conventional method of sweeping a laser beam because the ball terminals and leads are not visible from the outside. Therefore, as a method for inspecting the soldering state of such a mounted component, there is a method of irradiating a printed circuit board with X-rays to obtain a transmission image, and judging the quality of the soldering from the transmission image.
【０００４】ところで、最近は更なる高密度化が進み、
プリント基板の両面にＩＣ等の部品を半田付けするよう
になった。このような両面に半田付けがされたプリント
基板の半田付け状態の検査を行うには、前記したような
Ｘ線を利用しても半田部分が重なっていると半田付け状
態を判断することができなくなる。By the way, recently, the density has been further increased,
Components such as ICs have been soldered to both sides of a printed circuit board. In order to inspect the soldering state of such a printed circuit board soldered to both sides, it is possible to judge the soldering state that the solder portions are overlapped by using the X-ray as described above. Disappears.
【０００５】そこで、このような両面実装基板の半田付
け状態を検査する方法として、例えば、特開平８−５１
２７６号公報に開示されたものがある。この方法は、プ
リント基板の片面（Ａ面）に部品を実装した状態でのＸ
線画像を得、次いで、他の面（Ｂ面）にも部品を実装し
た状態でのＸ線画像を得、この画像からＡ面の画像を差
し引きすることによりＢ面の画像を得ている。Therefore, as a method for inspecting the soldering state of such a double-sided mounting board, for example, Japanese Patent Laid-Open No. 8-51
There is one disclosed in Japanese Patent Publication No. 276. This method uses the X in a state where components are mounted on one side (A side) of a printed circuit board.
A line image is obtained, then an X-ray image is obtained in a state where components are mounted on another surface (surface B), and an image of surface B is obtained by subtracting an image of surface A from this image.
【０００６】[0006]
【発明が解決しようとする課題】ところで、前記Ｂ面の
画像からＡ面の画像を差し引き、Ｂ面の画像を得るのに
画像全体の位置ずれ量から求めているので、プリント基
板が部分的に歪んでいる場合には、この歪みが大きな誤
差となる。その歪みが発生する理由としては、プリント
基板に部品を実装するには、Ａ面に部品を載置した状態
でリフロー炉内を通過させ加熱して実装し、さらに、Ｂ
面に部品を載置した状態でもう一度リフロー炉内を通過
させるために、熱によりプリント基板が歪む原因によ
る。By the way, since the image on the surface A is subtracted from the image on the surface B and the image on the surface B is obtained from the displacement of the entire image, the printed circuit board is partially If distorted, this distortion becomes a large error. The reason why the distortion occurs is that, in order to mount the component on the printed circuit board, the component is placed on the surface A, passed through a reflow furnace, heated, and mounted.
This is because the printed circuit board is distorted by heat because the component is placed on the surface and passed through the reflow furnace again.
【０００７】本発明は前記した問題点を解決せんとする
もので、その目的とするところは、熱によるプリント基
板の歪みを検出し、この歪み分を補正した後に両面実装
画像から片面実装画像を差し引くことにより、プリント
基板の歪みによる半田付け状態を誤差なく検査が行える
両面実装基板の半田付け検査方法を提供せんとするにあ
る。SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to detect a distortion of a printed circuit board due to heat, correct the distortion, and convert a single-sided mounted image from a double-sided mounted image. It is an object of the present invention to provide a method for inspecting the soldering of a double-sided mounting board by which the state of soldering due to the distortion of the printed board can be inspected without error by subtracting.
【０００８】[0008]
【課題を解決するための手段】本発明の両面実装基板の
半田付け検査方法は前記した目的を達成せんとするもの
で、その手段は、一面に部品実装されたプリント基板に
Ｘ線を照射して得られた第１の画像と、該プリント基板
の他面にも部品実装されたプリント基板にＸ線を照射し
て得られた第２の画像とを画像メモリに記憶させ、前記
第１、第２の画像から位置ずれ量を求め、該求められた
位置ずれ量分だけ前記第１あるいは第２の画像を歪み補
正し、第２の画像から第１の画像を差し引いて他面側の
画像を得、半田付け状態を判定するようにしたことを特
徴とする。SUMMARY OF THE INVENTION A method for inspecting the soldering of a double-sided mounting board according to the present invention is intended to achieve the above-mentioned object, and the means for irradiating a printed board having components mounted on one side with X-rays. Storing the first image obtained by the irradiation and the second image obtained by irradiating the printed board on which components are mounted on the other side of the printed board with X-rays, in an image memory; A position shift amount is obtained from the second image, the first or second image is distortion-corrected by the obtained position shift amount, and the first image is subtracted from the second image to obtain an image on the other surface. And the state of soldering is determined.
【０００９】また、前記位置ずれ量の判定は、第１、第
２の画像を一部において重ねられた状態で小領域に分割
し、該小領域内での第１および第２の画像の歪みベクト
ルを求め、得られた歪みベクトルを小領域中心画素の歪
みベクトルとし、それ以外の画素の歪みベクトルは、隣
接する小領域の歪みベクトルを用いて２次元補間により
求めるようにすることが望ましく、また、前記第１、第
２の画像として、波長分布の異なる２種類のＸ線をプリ
ント基板に照射して２枚の画像を撮像し、２枚の画像の
差分演算により前記画像からプリント基板に含まれる半
田成分を抽出した画像を用いることを特徴とする。Further, the determination of the amount of displacement is performed by dividing the first and second images into small areas in a state where the first and second images are partially overlapped, and distorting the first and second images in the small areas. It is desirable to obtain a vector, set the obtained distortion vector as a distortion vector of a small area central pixel, and obtain distortion vectors of other pixels by two-dimensional interpolation using distortion vectors of adjacent small areas, Further, as the first and second images, two types of X-rays having different wavelength distributions are irradiated on the printed circuit board to capture two images, and a difference operation between the two images is performed to convert the images to the printed circuit board. It is characterized by using an image in which the contained solder component is extracted.
【００１０】さらに、両面実装基板の半田付け検査は、
一面に部品実装されたプリント基板にＸ線を照射して得
られた第１の画像および該プリント基板の他面にも部品
実装されたプリント基板にＸ線を照射して得られた第２
の画像とを記憶する画像メモリと、前記画像メモリに記
憶された第１および第２の画像との位置ずれ量を求める
位置ずれ量判定手段と、該位置ずれ量判定手段によって
得られたずれ量分だけ前記第１あるいは第２の画像を歪
み補正する画像補正手段と、前記第２の画像から第１の
画像を差し引いてプリント基板の他面の画像を得る差分
処理手段と、前記プリント基板の前記他面の半田付け状
態を検査する良否判定手段とを具備したものである。[0010] Further, the soldering inspection of the double-sided mounting board is performed as follows.
A first image obtained by irradiating a printed circuit board with components mounted on one surface with X-rays and a second image obtained by irradiating X-rays on a printed circuit board with components mounted on the other surface of the printed circuit board
An image memory for storing the images of the first and second images, a position shift amount determining unit for obtaining a position shift amount between the first and second images stored in the image memory, and a shift amount obtained by the position shift amount determining unit. Image correction means for correcting distortion of the first or second image by an amount, difference processing means for subtracting a first image from the second image to obtain an image of the other surface of the printed circuit board, A pass / fail determination means for inspecting the soldering state of the other surface.
【００１１】[0011]
【発明の実施の形態】以下、本発明に係る両面実装基板
の半田付け検査方法およびその装置を図面と共に説明す
る。図１は本発明の装置を示す回路ブロック図を示し、
１はＸ線発生器、２はＸ線透過画像読取装置、３はＡ／
Ｄ変換器、４は片面（以下、Ａ面という）に部品を実装
して得たＡ画像と、他面（以下、Ｂ面という）にも部品
を実装して得たＡＢ画像を記憶する画像メモリ、５はＡ
画像とＡＢ画像とのずれ量を判定する位置ずれ量判定手
段、６はＣＰＵ、７は位置ずれ量判定手段５によって得
られた位置ずれ量からＡＢ画像を補正する画像補正手
段、８は補正したＡＢ画像からＡ画像を差し引く差分処
理手段、９は該差分処理手段８によって得られたＢ画像
から半田付け状態の良否を判定する良否判定手段であ
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS A method and an apparatus for inspecting soldering of a double-sided mounting board according to the present invention will be described below with reference to the drawings. FIG. 1 shows a circuit block diagram illustrating the device of the present invention,
1 is an X-ray generator, 2 is an X-ray transmission image reader, 3 is A /
The D converter 4 stores an A image obtained by mounting components on one side (hereinafter referred to as A side) and an AB image obtained by mounting components on the other side (hereinafter referred to as B side). Memory, 5 is A
A positional shift amount determining means 6 for determining a shift amount between the image and the AB image, 6 is a CPU, 7 is an image correcting means for correcting the AB image from the positional shift amount obtained by the positional shift amount determining means 5, and 8 is a corrected image. Difference processing means 9 for subtracting the A image from the AB image is a pass / fail judgment means for judging the quality of the soldering state from the B image obtained by the difference processing means 8.
【００１２】なお、図１において１１は多層プリント基
板、１２，１３は該プリント基板１１に半田付けして実
装されたボールグリッド型のＩＣであり、プリント基板
１１の両面に重なった状態で実装されている。In FIG. 1, reference numeral 11 denotes a multilayer printed circuit board, and reference numerals 12 and 13 denote ball grid type ICs which are mounted on the printed circuit board 11 by soldering. ing.
【００１３】以下、前記した構成に基づく動作を図２の
フローチャートと共に説明する。先ず、プリント基板１
１のＡ面のみにＩＣ１２を実装した状態において、Ｘ線
発生器１からＸ線を照射するとＩＣ１２のボールグリッ
ドと図示しないプリント基板１１の回路パターンとから
なるＸ線透過画像が読取装置２において受光される。そ
して、該読取装置２において受光された画像はＡ／Ｄ変
換器３を介して画像メモリ４に記憶される（ステップＳ
１）。Hereinafter, the operation based on the above configuration will be described with reference to the flowchart of FIG. First, the printed circuit board 1
When the X-ray generator 1 irradiates X-rays in a state where the IC 12 is mounted only on the A-side surface of the IC card 1, an X-ray transmission image composed of the ball grid of the IC 12 and the circuit pattern of the printed board 11 (not shown) is received by the reading device 2. Is done. Then, the image received by the reading device 2 is stored in the image memory 4 via the A / D converter 3 (Step S).
1).
【００１４】次いで、前記プリント基板１１のＢ面にも
ＩＣ１３を実装した状態において、Ｘ線発生器１からＸ
線を照射するとＩＣ１２，ＩＣ１３およびプリント基板
１１の回路パターンとからなるＸ線透過画像が読取装置
２において受光される。そして、前記したと同様に読取
装置２において受光された画像はＡ／Ｄ変換器３を介し
て画像メモリ４に記憶される（ステップＳ２）。Next, in a state where the IC 13 is also mounted on the B side of the printed board 11, the X-ray generator 1
When the line is irradiated, an X-ray transmission image including the ICs 12 and 13 and the circuit pattern of the printed circuit board 11 is received by the reading device 2. Then, as described above, the image received by the reading device 2 is stored in the image memory 4 via the A / D converter 3 (step S2).
【００１５】なお、前記画像メモリ４に記憶する画像
Ａ，画像ＡＢとして、本出願人会社が出願した特開平１
０−２５３５５０号公報に開示したエネルギーサブトラ
クション処理により、プリント基板に含まれる半田部分
を抽出した画像を用いることができる。The image A and the image AB stored in the image memory 4 are described in Japanese Patent Application Laid-Open No.
An image obtained by extracting a solder portion included in a printed circuit board by the energy subtraction processing disclosed in Japanese Patent Application Laid-Open No. 0-253550 can be used.
【００１６】このエネルギーサブトラクション処理と
は、電子部品に対して少なくとも２種類の波長分布を有
するＸ線を照射して撮像し、それらの相互演算により被
検査対象中の半田を抽出しようとするものである。そし
て、このエネルギーサブトラクション処理を行なえば、
被検査対象に含まれる半田以外の成分を除去し，特定物
質のみが存在する画像を得ることができるものである。The energy subtraction process is a process of irradiating an electronic component with X-rays having at least two types of wavelength distributions and capturing an image thereof, and trying to extract a solder in a test object by a mutual operation thereof. is there. And if this energy subtraction process is performed,
This removes components other than solder contained in the inspection object, and can obtain an image in which only a specific substance is present.
【００１７】次に、前記画像メモリ４に記憶されたＡ画
像とＡＢ画像では、ＩＣの実装時におけるリフロー炉通
過時においてプリント基板１１に歪みが生じて位置ずれ
が生じているので、位置ずれ量判定手段５において位置
ずれ量を検出する。すなわち、Ａ画像とＡＢ画像を小領
域に多数個に分割すると共に各小領域が重なるように分
割する。Next, in the A image and the AB image stored in the image memory 4, since the printed board 11 is distorted when passing through the reflow furnace when the IC is mounted, the displacement is caused. The determination means 5 detects the amount of positional deviation. That is, the A image and the AB image are divided into a plurality of small areas, and the respective small areas are overlapped.
【００１８】そして、小領域内でのＡ画像とＡＢ画像の
歪みベクトル（位置ずれ）を求める。得られた歪みベク
トルを小領域中心画素の歪みベクトルとし、それ以外の
画素の歪みベクトルは、隣接する小領域の歪みベクトル
を用いて歪みベクトルを算出する。すなわち、図３に示
すように、実線で示す歪みベクトルから点線で示す歪み
ベクトルを予測して画像中の全体的な位置ずれ量を求め
る（ステップＳ３）。Then, a distortion vector (position shift) between the A image and the AB image in the small area is obtained. The obtained distortion vector is used as the distortion vector of the small region center pixel, and the distortion vectors of the other pixels are calculated using the distortion vectors of the adjacent small regions. That is, as shown in FIG. 3, the distortion vector indicated by the dotted line is predicted from the distortion vector indicated by the solid line, and the overall displacement amount in the image is obtained (step S3).
【００１９】次に、前記した如く求められた位置ずれ量
から、ＡＢ画像をＡ画像との位置ずれ量分だけ歪ませた
補正画像である歪み補正画像ＡＢ′を得る（ステップＳ
４）。ここで、代表的に求められた小領域の歪みベクト
ルから各画素の歪みベクトルを求める際に利用する補間
方法としては、近接する４点の歪みベクトルを用いた線
形補間を用いてもよいし、さらに高精度な補間が必要で
あればスプライン補間などを利用してもよい。Next, a distortion-corrected image AB ', which is a corrected image obtained by distorting the AB image by the amount of positional deviation from the A image, is obtained from the positional deviation amount obtained as described above (step S).
4). Here, as an interpolation method used when obtaining a distortion vector of each pixel from a distortion vector of a small region typically obtained, linear interpolation using distortion vectors of four adjacent points may be used, If higher-precision interpolation is required, spline interpolation or the like may be used.
【００２０】次いで、歪み補正画像ＡＢ′からＡ画像を
差し引いてＢ面に実装されたＩＣ１３のボールグリッド
およびプリント基板１１における回路パターンとの画像
を得る（ステップＳ５）。そして、前記前記した如く得
られたＢ面の画像から公知のＸ線検査方法によって半田
付け状態を判定を行う（ステップＳ６）。なお、前記最
初に得られたＡ面の画像の半田付け状態の判定は、前記
Ｂの画像の半田付け状態の判定とは別個に公知のＸ線検
査方法によって行うことにより、Ａ，Ｂ面両方の半田付
け検査は終了するものである。Next, the image A is subtracted from the distortion corrected image AB 'to obtain an image of the ball grid of the IC 13 mounted on the surface B and the circuit pattern on the printed circuit board 11 (step S5). Then, the soldering state is determined from the B-side image obtained as described above by a known X-ray inspection method (step S6). Note that the determination of the soldering state of the image of the first side A obtained separately is performed by a known X-ray inspection method separately from the determination of the soldering state of the image of the B side. Is completed.
【００２１】なお、前記した動作説明において、歪み補
正画像の作成をＡＢ画像によって行った場合を示した
が、該歪み補正画像の作成をＡ画像によって作成しても
よいことは勿論のことである。In the above description of the operation, the case where the distortion-corrected image is created by using the AB image has been described. However, the distortion-corrected image may be created by using the A image. .
【００２２】[0022]
【発明の効果】本発明は前記したように、片面実装時と
両面実装時とのＸ線画像を記憶しておき、その後に半田
付け時の熱によるプリント基板の位置ずれ量を検出し、
この位置ずれ量分を一方の画像において補正し、その後
に両面実装画像から片面実装画像を差し引いて反対面の
画像を得るようにしたので、プリント基板の歪みによる
半田付け状態を誤差なく検査することができる等の効果
を有するものである。また、片面実装後のＸ線画像と両
面実装後のＸ線画像に対しサブトラクション処理を行う
ことで、基板に含まれる半田接続部を高精度に検査する
ことができる。According to the present invention, as described above, the X-ray images of the single-sided mounting and the double-sided mounting are stored, and thereafter, the amount of displacement of the printed circuit board due to heat during soldering is detected.
This displacement was corrected in one image, and then the one-sided mounted image was subtracted from the two-sided mounted image to obtain an image on the opposite side.Therefore, the soldering state due to the distortion of the printed circuit board should be inspected without error. This has the effect of, for example, Further, by performing a subtraction process on the X-ray image after the single-sided mounting and the X-ray image after the double-sided mounting, the solder connection portion included in the substrate can be inspected with high accuracy.
【図１】本発明に係る両面実装基板の半田付け検査装置
を示す回路ブロック図である。FIG. 1 is a circuit block diagram showing a soldering inspection apparatus for a double-sided mounting board according to the present invention.
【図２】同上の動作を説明するためのフローチャートで
ある。FIG. 2 is a flowchart for explaining the operation of the above.
【図３】位置ずれ量を求めるための説明図である。FIG. 3 is an explanatory diagram for obtaining a displacement amount.
１ Ｘ線発生器 ２ Ｘ線透過画像読取装置 ３ Ａ／Ｄ変換器 ４ 画像メモリ ５ 位置ずれ量判定手段 ６ ＣＰＵ ７ 画像補正手段 ８ 差分処理手段 ９ 良否判定手段 １１ プリント基板 １２，１３ ＩＣ DESCRIPTION OF SYMBOLS 1 X-ray generator 2 X-ray transmission image reading device 3 A / D converter 4 Image memory 5 Position shift amount judging means 6 CPU 7 Image correcting means 8 Difference processing means 9 Pass / fail judgment means 11 Printed circuit boards 12, 13 IC
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2F067 AA62 AA67 CC14 DD10 GG06 GG09 HH04 KK06 LL16 RR12 RR24 RR30 RR35 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F067 AA62 AA67 CC14 DD10 GG06 GG09 HH04 KK06 LL16 RR12 RR24 RR30 RR35
Claims (4)
線を照射して得られた第１の画像と、該プリント基板の
他面にも部品実装されたプリント基板にＸ線を照射して
得られた第２の画像とを画像メモリに記憶させ、前記第
１、第２の画像から位置ずれ量を求め、該求められた位
置ずれ量分だけ前記第１あるいは第２の画像を補正し、
第２の画像から第１の画像を差し引いて他面側の画像を
得、半田付け状態を判定するようにしたことを特徴とす
る両面実装基板の半田付け検査方法。1. A printed circuit board on which components are mounted on one side has an X
A first image obtained by irradiating the X-ray and a second image obtained by irradiating the X-ray to a printed board on which components are mounted on the other side of the printed board; Calculating a displacement amount from the first and second images, correcting the first or second image by the determined displacement amount,
A method for inspecting soldering on a double-sided mounting board, characterized in that an image on the other side is obtained by subtracting a first image from a second image to determine a soldering state.
画像を一部において重ねられた状態で小領域に分割し、
該小領域内での第１および第２の画像の歪みベクトルを
求め、得られた歪みベクトルを小領域中心画素の歪みベ
クトルとし、それ以外の画素の歪みベクトルは、隣接す
る小領域の歪みベクトルを用いて２次元補間により求め
るようにしたことを特徴とする請求項１記載の両面実装
基板の半田付け検査方法。2. The method according to claim 1, wherein the first and second images are divided into small areas in a state where the first and second images are partially overlapped.
The distortion vectors of the first and second images in the small area are obtained, and the obtained distortion vector is set as the distortion vector of the central pixel of the small area. The distortion vectors of the other pixels are the distortion vectors of the adjacent small areas. 2. The method for inspecting soldering of a double-sided mounting board according to claim 1, wherein the method is obtained by two-dimensional interpolation using the following.
の異なる２種類のＸ線をプリント基板に照射して２枚の
画像を撮像し、２枚の画像の差分演算により前記画像か
らプリント基板に含まれる半田成分を抽出した画像を用
いることを特徴とする請求項１あるいは２に掲載の両面
実装基板の半田付け検査方法。3. The printed circuit board is irradiated with two types of X-rays having different wavelength distributions as the first and second images to capture two images, and the difference between the two images is calculated from the images. 3. The method according to claim 1, wherein an image obtained by extracting a solder component contained in the printed board is used.
線を照射して得られた第１の画像および該プリント基板
の他面にも部品実装されたプリント基板にＸ線を照射し
て得られた第２の画像とを記憶する画像メモリと、 前記画像メモリに記憶された第１および第２の画像との
位置ずれ量を求める位置ずれ量判定手段と、 該位置ずれ量判定手段によって得られたずれ量分だけ前
記第１あるいは第２の画像を歪み補正する画像補正手段
と、 前記第２の画像から第１の画像を差し引いてプリント基
板の他面の画像を得る差分処理手段と、 前記プリント基板の前記他面の半田付け状態を検査する
良否判定手段と、 を具備したことを特徴とする両面実装基板の半田付け検
査装置。4. A printed circuit board on which components are mounted on one side
An image memory for storing a first image obtained by irradiating the X-ray and a second image obtained by irradiating the X-ray to a printed board on which components are mounted on the other surface of the printed board; Position shift amount determining means for obtaining a position shift amount between the first and second images stored in the image memory; and converting the first or second image by the shift amount obtained by the position shift amount determining means. Image correction means for correcting distortion, difference processing means for subtracting the first image from the second image to obtain an image on the other surface of the printed circuit board, and inspecting the soldering state of the other surface of the printed circuit board A device for inspecting soldering of a double-sided mounting board, comprising: a determination unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11227561A JP2001050730A (en) | 1999-08-11 | 1999-08-11 | Soldering inspection method and device for both-side mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11227561A JP2001050730A (en) | 1999-08-11 | 1999-08-11 | Soldering inspection method and device for both-side mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001050730A true JP2001050730A (en) | 2001-02-23 |
Family
ID=16862849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11227561A Pending JP2001050730A (en) | 1999-08-11 | 1999-08-11 | Soldering inspection method and device for both-side mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001050730A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001281169A (en) * | 2000-03-28 | 2001-10-10 | Matsushita Electric Ind Co Ltd | Joint inspecting device and its method, and storage medium stored with program for executing same joint inspecting method |
| EP1578186A2 (en) * | 2004-03-01 | 2005-09-21 | Omron Corporation | Inspection method and system and production method of mounted substrate |
| EP1612546A1 (en) | 2004-06-30 | 2006-01-04 | Omron Corporation | Inspection method and system for and method of producing component mounting substrate |
| JP2006177888A (en) * | 2004-12-24 | 2006-07-06 | Saki Corp:Kk | Visual inspection device for object to be inspected |
| WO2007057144A2 (en) * | 2005-11-16 | 2007-05-24 | Matrix Technologies Gmbh | X-ray testing method and x-ray testing device |
| US7590279B2 (en) | 2004-12-24 | 2009-09-15 | Saki Corporation | Appearance inspection apparatus for inspecting inspection piece |
| CN113508651A (en) * | 2019-03-05 | 2021-10-15 | 株式会社富士 | Correction amount calculation device, component mounting machine, and correction amount calculation method |
-
1999
- 1999-08-11 JP JP11227561A patent/JP2001050730A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001281169A (en) * | 2000-03-28 | 2001-10-10 | Matsushita Electric Ind Co Ltd | Joint inspecting device and its method, and storage medium stored with program for executing same joint inspecting method |
| EP1578186A3 (en) * | 2004-03-01 | 2007-10-24 | Omron Corporation | Inspection method and system and production method of mounted substrate |
| EP1578186A2 (en) * | 2004-03-01 | 2005-09-21 | Omron Corporation | Inspection method and system and production method of mounted substrate |
| EP1612546A1 (en) | 2004-06-30 | 2006-01-04 | Omron Corporation | Inspection method and system for and method of producing component mounting substrate |
| US7310406B2 (en) | 2004-06-30 | 2007-12-18 | Omron Corporation | Inspection method and system for and method of producing component mounting substrate |
| JP2006177888A (en) * | 2004-12-24 | 2006-07-06 | Saki Corp:Kk | Visual inspection device for object to be inspected |
| US7590279B2 (en) | 2004-12-24 | 2009-09-15 | Saki Corporation | Appearance inspection apparatus for inspecting inspection piece |
| JP4714462B2 (en) * | 2004-12-24 | 2011-06-29 | 株式会社サキコーポレーション | Device for inspecting appearance of object |
| WO2007057144A3 (en) * | 2005-11-16 | 2007-07-05 | Matrix Technologies Gmbh | X-ray testing method and x-ray testing device |
| WO2007057144A2 (en) * | 2005-11-16 | 2007-05-24 | Matrix Technologies Gmbh | X-ray testing method and x-ray testing device |
| US8411818B2 (en) | 2005-11-16 | 2013-04-02 | Matrix Technologies Gmbh | X-ray testing method and X-ray testing device |
| CN113508651A (en) * | 2019-03-05 | 2021-10-15 | 株式会社富士 | Correction amount calculation device, component mounting machine, and correction amount calculation method |
| CN113508651B (en) * | 2019-03-05 | 2022-09-20 | 株式会社富士 | Correction amount calculation device, component mounting machine, and correction amount calculation method |
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