JP2001048239A - Cushioning body and method for packaging object to be packaged by using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cushioning body and a method for packaging an object to be packaged by using this cushioning body, which is applicable to plural kinds of objects having similar contours (outer shape) and which is capable of properly protecting the objects at a low cost. SOLUTION: A cushioning body 11D is composed of a main cushioning member 11 and a sub-cushioning member 12. The main cushioning member 11 is applied to a universal shape portion having a common contour among a plurality of objects to be packaged. The sub-cushioning member 12 is fitted to the main cushioning member 11 and is applied to a characteristic shape portion specific to the objects. Plural kinds of the sub-cushioning members 12 are provided in advance so as to correspond to the characteristic shape portions of the objects, and the sub-cushioning members thus provided are properly used according to the kinds of objects.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a buffer which is addressed to a package to protect it from impact when transporting or storing the package, such as an electronic device, and a package using the buffer. The present invention relates to a method for packaging a package.

[0002]

2. Description of the Related Art For example, when transporting and storing an electronic device 1 as shown in FIG. 1A, in order to protect the electronic device 1 from impact, for example, as shown in FIG.
B, 7C, and 7D are generally packaged for the electronic device 1. The buffers 7A and 7B are respectively addressed to the front surface 3a side and the back 3b side edge on the upper surface 2a of the electronic device 1, and the buffers 7C and 7D are
Are respectively addressed to the front 3a side and the back 3b side edge on the lower surface 2b of the.

The electronic device 1 has a rectangular parallelepiped shape as shown in the figure, and a cooling fan 4, terminals 5a, 5
b, components such as the connector terminal 6 are arranged. The arrangement position, the quantity, and the like of these components are specific to the electronic device 1. On the other hand, each of the buffers 7A to 7D is molded by a mold, and has recesses 7a, 7b, 7c, and 7d corresponding to each shape portion of the contour (outer shape) of the electronic device 1 (see FIG. 9). ).

As shown in FIG. 1B, for example, an electronic device 1 'similar in shape and size to the electronic device 1 and different only in the arrangement of components provided on the back surface 3b is packaged as shown in FIG. Sometimes you want to. This electronic device 1 ′ has two cooling fans 4, and has a configuration different from that of the above-described electronic device 1 in the arrangement position of the terminals 5 a and 5 b and the like. Therefore, when packaging the electronic device 1, the buffers used for the electronic device 1 (particularly, the buffers 7 </ b> B and 7 </ b> D addressed to the rear surface 3 b of the device 1) are addressed to the rear surface 3 b of the electronic device 1 ′. It is often impossible to scramble due to mismatched shapes (recesses). Therefore, conventionally,
The buffer was designed in advance so that it could be applied to different types of devices 1 and 1 'with one type of buffer, and the electronic device 1' was packaged using this.

[0005]

However, when designing a buffer applicable to different kinds of similar electronic devices as described above, it is necessary to allocate a necessary amount of buffer members in order to make the buffer common. In other words, there is a case in which parts such as the equipment back part 3b having different outer shapes due to the difference in terminal configuration are packaged while avoiding them, which has been a cause of damage to the terminal parts during transportation.

[0006] If it is determined that they cannot be shared,
Separate buffers must be provided for each device. However, in this case, a mold dedicated to each buffer is required, so that an increase in cost due to the fabrication of the mold becomes a problem. Even if it is not a molding die, it is possible to manufacture the dedicated buffer by punching and bonding, and to reduce the cost, but in this case, the raw material with mechanical strength etc. suitable for the processing method However, it is expensive, and the shock of the shock absorber itself cannot be avoided.

In addition, for example, when the device 1 shown in FIG. 1A is a general-purpose device and the device 1 'shown in FIG. 1B is required for a special purpose, the latter generally has a smaller production volume than the former, so this is the case. It is not preferable from the viewpoint of cost to exclusively manufacture a mold for a buffer of a small-volume product.

The present invention has been made in view of the above problems, and can be applied to different types of devices having similar contours (outer shapes).
It is another object of the present invention to provide a buffer capable of appropriately protecting equipment at low cost and a method for packaging a package using the buffer.

[0009]

In order to solve the above problems, a shock absorber according to a first aspect of the present invention is provided with a main shock absorbing member, an electronic device fitted to the main shock absorbing member and cooperating with the main shock absorbing member. And a sub-buffer member for protecting a packaged object such as a device. In other words, a universally shaped portion presenting a contour common to different types of packaged objects is protected by the main cushioning member, and a characteristic shape portion exhibiting a profile unique to the packaged object is defined by the sub-buffer member having the main buffering member. And cooperate to protect. This sub cushioning member is manufactured in a process different from that of the main cushioning member, and can be formed in a smaller volume than the main cushioning member, and is made of a material satisfying various characteristics such as mechanical strength suitable for punching and storage. Also, it can be manufactured at a lower cost than manufacturing a mold.

Therefore, when wrapping the package using the main buffer member and the sub buffer member,
The sub-buffer members provided with the recesses corresponding to the shapes of the characteristic shape portions of the similar different types of packages are prepared by the number of the different types of packages, and the sub-buffers are provided in accordance with the type of the package. Appropriate protection of the packaged object can be realized by the method according to claim 4 of the present invention in which a member is selected and fitted to the main cushioning member to package the packaged object.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. In the present embodiment, a case will be described in which the electronic devices 1 and 1 ′ shown in FIG. 1 are used as a packaged object, but, of course, the present invention is not limited to this.

FIG. 2 shows a shock absorber according to an embodiment of the present invention. More specifically, the electronic device 1 shown in FIG.
A buffer 11D (corresponding to the buffer 7D in FIG. 9) simultaneously addressed to the edge between the lower surface 2b and the back 3b of 1 '.
Is shown. This shock absorber 11D is composed of two members, a main shock absorber 11 and a sub shock absorber 12.

In the present embodiment, the main cushioning member 11 is molded by a mold using styrene resin (PS) as a raw material, and forms an edge between the lower surface 2b and the rear surface 3b of the electronic devices 1, 1 'and both side surfaces thereof. A concave portion 11a corresponding to the contour (outer shape) of a portion common to the portions 1 and 1 '(hereinafter, referred to as a universal shape portion), a fitting protrusion 11b fitted to the sub-buffer member 12, And a fitting portion 11c in which the sub cushioning member 12 is accommodated.

The main cushioning member 11 is a cushioning body 11C (corresponding to the cushioning body 7C in FIG. 9) addressed to the edge between the lower surface 2b and the front surface 3a of the electronic device 1 which is the packaged body.
At the same time, as shown in FIG. 4 to FIG. 7, when the electronic device 1 is packaged,
C and 11D are split.

In the present embodiment, the sub-buffer member 12 is formed by stamping a plate material made of polypropylene resin (PP). The sub-buffer member 12 for the electronic device 1 (see FIG. 2) and the electronic device A sub cushioning member 14 for 1 '(see FIG. 8) is provided.

Sub-buffer 1 for electronic device 1 shown in FIG.
2 is a cooling fan 4 and a terminal 5 on the back surface 3 b of the electronic device 1.
The recesses 12a and 12c corresponding to the unique shape portions (hereinafter, referred to as characteristic shape portions) of the device 1 determined according to the arrangement of the a and 5b, and the fitting protrusion 1 of the main cushioning member 11.
1b is fitted with a fitting hole 12b. Here, the recess 12 a is at least the cooling fan 4 of the electronic device 1 protruding from the recess 11 a of the main buffer member 11 toward the fitting portion 11 c.
Is formed in accordance with the width of. Also, the recess 12
“c” is formed in accordance with the arrangement of the lower terminals 5 b of the electronic device 1 protruding from the recess 11 a of the main buffer member 11 toward the fitting portion 11 c.

In the sub-buffer member 14 for the electronic device 1 'shown in FIG. 8, recesses 14a and 14c corresponding to the characteristic shapes of the electronic device 1' are formed, and the main buffer member 1 is formed.
In order to share 1 with one sub-buffer member 12, a fitting hole 14 b into which the fitting protrusion 11 b of the main buffer member 11 fits is formed at the same location as the fitting hole 12 b of the sub-buffer member 12.

The projections 12d, 12e, 14d, and 14e that define the recesses 12a, 12c, 14a, and 14c of the sub-buffers 12 and 14 are formed with a cut line S except a part thereof. The projections 12d, 12e, 14d, and 14e are separated as necessary, and are configured to be able to cope with a change in the number and position of the terminals 5b arranged on the back surface 3b of the electronic devices 1 and 1 'to some extent. Have been.

The shock absorber 11D is used by fitting the main shock absorber 11 and the sub shock absorber 12 or 14 to each other. That is, the fitting protrusion 11b of the main buffer member 11 is
2 or 14 is fitted into the fitting hole 12b or 14b, and FIG.
As shown in (1), the sub-buffer member 12 or 14 is arranged at the fitting portion 11c of the main buffer member 11.

Here, when packaging the electronic device 1, one sub-buffer member 12 is fitted to the main buffer member 11, and the buffer 11 D is addressed to the electronic device 1 in this state, whereby the electronic device 1 is packed. The main cushioning member 11
Of the electronic device 1 is protected by being housed in the recess 11a of the electronic device 1.
The characteristic shape portion in FIG.
a and 12c, and are cooperatively protected by the main and sub cushioning members 11, 12. Specifically, the cooling fan 4 and several lower terminals 5b adjacent to the cooling fan 4 are housed in the recess 12a, and the other terminals 5b are housed in the recesses 12c, 12c.

When the electronic device 1 'is to be packaged, the other sub-buffer member 14 is fitted to the main buffer member 11, and the buffer 11D is addressed to the electronic device 1' in this state. The universally shaped portion of the device 1 'is housed and protected in the recess 11a of the main shock absorber 11, and the characteristic shape of the back surface 3b of the electronic device 1' is housed in the recesses 14a and 14c of the sub shock absorber 14. And the main and sub cushioning members 11, 1
Protect in collaboration with 4. Specifically, the two cooling fans 4, 4 are housed in the recesses 14a, and the terminals 5b are housed in the recesses 14c, 14c, respectively.

The buffer 11C integrally formed with the main buffer member 11 is addressed to a region between the lower surface 2b and the front surface 3a of the electronic device 1, and the region is common to both devices 1, 1 '. Therefore, at this time, members corresponding to the sub-buffers 12 and 14 are unnecessary, and the buffer 11C formed integrally with the main buffer 11 is used alone.

Although not shown, a buffer (corresponding to the buffer 7B in FIG. 9) addressed to the edge between the upper surface 2a and the rear surface 3b of the electronic device 1, 1 'is also the buffer 11D. The main buffer member and the sub-buffer member are formed in the same manner as described above, and one of the main buffer members is a buffer (see FIG. 9) addressed to the edge between the upper surface 2a and the front surface 3a of the electronic device 1, 1 '. And the other sub-buffer member is punched out into a shape corresponding to the number, arrangement, etc. of the cooling fan 4 and the upper terminal 5a on the back surface 3b of the electronic device 1, 1 '. The main and sub cushioning members are fitted together and addressed to the electronic devices 1 and 1 '. Similarly, the buffer formed integrally with the main buffer member is directed to the edge between the upper surface 2a and the front surface 3a of the electronic device 1, 1 '.

As described above, according to the present embodiment, the universally shaped portion common between two similar electronic devices 1 and 1 'is protected by the main shock absorber 11 formed by a mold. The main shock absorber 11 is selectively fitted with the sub shock absorbers 12 and 14 corresponding to the respective characteristic shapes of the two devices 1 and 1 ′, and both the main and sub shock absorbers 11, 12 or 11,
Since the portion is protected at 14, it is possible to provide an inexpensive buffer with a single type of mold for a plurality of products of a small variety of other products, and to always properly use these different products. It becomes possible to protect.

Also, for product switching and inventory adjustment due to production adjustment or the like, a plurality of sub-buffer members corresponding to the characteristic shapes of these products are prepared, and the sub-buffer members selected according to the form of the product to be packed are prepared. Just replace it with the member,
Available.

Further, as the sub-buffer members 12 and 14,
Even if the raw material (PP) that is more expensive than the raw material (PS) of the main buffer member 11 is used, the amount of the raw material (PP) used is small, so that cost improvement can be suppressed. Rather, by using such a raw material, the workability of the punching process is improved by utilizing the advantage of the resilience in elongation and compression, and the work of fitting into the main cushioning member 11 is facilitated. . In addition, since the punching dies required to form the sub cushioning members 12 and 14 can be raised in a shorter time than the molding dies, the number of parts such as terminals increases due to a sudden model change or version upgrade. , It is possible to take a quick response.

Although the embodiment of the present invention has been described above, the present invention is, of course, not limited to this, and various modifications can be made based on the technical idea of the present invention.

For example, in the above embodiment, one buffer member is formed by fitting one sub-buffer member 12 or 14 to one main buffer member 11, but two buffer members are formed for one buffer member. The buffer member described above may be fitted to form one buffer.

The main cushioning member 11 addressed to the edge between the lower surface 2b and the back surface 3b of the electronic device 1, 1 ', which is the packaged object, is connected to the upper surface 2a and the back surface 3b of the electronic device 1, 1'. This may be used as long as it can be applied as a main cushioning member addressed to the edge between.

In the above embodiment, the rear surface 3
Although the description has been made by taking as an example the packaged objects 1 and 1 ′ having a characteristic shape portion only on the b side, the present invention is also applicable to a packaged material having a characteristic shape portion at a plurality of locations.

In the above embodiment, the packaged object 1,
Although a total of four buffers are used to partially address 1 ′, each buffer may be partially addressed. For example, one buffer may be directed to the entire package to protect it. Good.
In this case, the main buffer member is formed in a box shape or a container shape,
A configuration is conceivable in which a sub-buffer member corresponding to a characteristic shape portion of the packaged object is selectively arranged to accommodate the packaged object.

[0032]

As described above, according to the present invention, the following effects can be obtained.

In other words, according to the shock absorber of the first aspect of the present invention, the universally shaped portion presenting a common contour among a plurality of similar objects to be packaged is protected by the main shock-absorbing member formed by molding, and the object to be packaged is protected. The characteristic shape portion that presents a body-specific contour is designed so that the sub-buffer member manufactured by a low-cost processing method such as punching is fitted to the main buffer member to protect the two members in cooperation. The buffer can be always properly addressed to the plurality of packages to be protected while suppressing an increase in the manufacturing cost of the buffer.

According to the second aspect of the present invention, the fitting means between the main buffer member and the sub-buffer member can be configured in conformity with each processing method, thereby contributing to the manufacture of a low-cost buffer body. be able to. Further, according to the invention of claim 3, it is possible to easily change one sub-buffer member to another form, and it is possible to suppress an increase in the types of sub-buffer members to be prepared.

According to the method of packaging a packaged object according to a fourth aspect of the present invention, each one of a plurality of similar packaged objects is selected.
One buffer body is constituted by selectively fitting the sub-buffer member prepared in accordance with one of the sub-buffer members to the main buffer member. It becomes possible to apply a simple buffer.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic device as a package to be applied in an embodiment of the present invention, in which A indicates one electronic device, and B indicates another electronic device similar thereto. I have.

FIG. 2 is an exploded perspective view of a buffer applied to one electronic device according to the embodiment of the present invention.

FIG. 3 is a perspective view showing a state where a sub-buffer member is fitted to a main buffer member.

FIG. 4 is a plan view showing the appearance of the main cushioning member according to the present invention after the molding.

FIG. 5 is a sectional view taken along line [5]-[5] in FIG.

FIG. 6 is a sectional view taken along line [6]-[6] in FIG.

FIG. 7 is a sectional view taken along the line [7]-[7] in FIG.

FIG. 8 is an exploded perspective view of a buffer applied to another electronic device according to the embodiment of the present invention.

FIG. 9 is a perspective view illustrating a conventional packaging method for a packaged object.

[Explanation of symbols]

1, 1 ': electronic device, 3b: rear surface, 4: cooling fan, 5
a, 5b terminal, 11 main buffer member, 11a recess, 1
1b: fitting projection, 12, 14 ... sub cushioning member, 12a, 1
2c, 14a, 14c: recess, 12b, 14b: fitting hole.

Claims (4)

[Claims] 1. A cushioning body having a recess corresponding to the outer shape of a part or the entire periphery of a packaged object, and protecting the packaged object by being addressed to the periphery of the packaged object. And a sub-buffer member fitted to the main buffer member and cooperating with the main buffer member to protect the packaged object. 2. The shock absorber according to claim 1, wherein the main shock absorbing member is formed by molding, and the sub shock absorbing member is formed by blanking. 3. The buffer according to claim 1, wherein a cut line is formed in the sub-buffer member so that a partial area thereof can be separated. 4. A packaging method for a package to protect the package by applying a buffer to a part or the entire periphery of the package, and protecting a universally shaped portion of the package. And a plurality of types of sub-buffer members fitted with the main buffer member and cooperating with the main buffer member to protect a characteristic shape portion of the packaged object. A method of packaging an object to be packaged, wherein the sub-buffer member selected according to the form of the characteristic shape portion is fitted to the main buffer member to protect the characteristic shape portion.