KR200205314Y1 - Impact absorbed member - Google Patents

Abstract

The present invention relates to an impact buffer member for directly fabricating an impact buffer member for shock absorbing an electronic product without a separate process, and is rotated about a hinge while being integrally connected with the impact buffer member 200 to the outside. At least one supporting member is formed so as to protrude into the support member, and the supporting member is formed on the one side of the electronic product 100 such that the first supporting member 210 is formed so as to protrude from the hinge. The second support member 220 is formed to protrude from the hinge to the outside of the first support member 210, and the third support is formed to protrude from the hinge to the outside of the second support member 220. The member 230 and the fourth supporting member 240 is formed so as to protrude around the hinge on the outside of the third supporting member 230.

Description

Impact Shock Absorber {IMPACT ABSORBED MEMBER}

The present invention relates to an impact buffer member for packaging an electronic product, and in particular, a pedestal attached to a lower side of a packaging member (hereinafter, referred to as an impact buffer member) for cushioning the impact of the electronic product without a separate processing process. An impact buffer member for manufacturing directly from a mold.

In the conventional shock absorbing member, a plurality of pedestals are attached to the lower side of the shock absorbing member in order to further cushion shocks after cutting a basic shape suitable for a case of an electronic product into a mold.

However, in the method of attaching the pedestal, the workability is reduced by attaching a plurality of pedestals by using a heater to the lower side of the impact buffer member by hand, and after the work, the pedestal protrudes below the impact buffer member. There is a problem that the volume is increased, the transportation cost during transportation increases.

The present invention is to solve the problems as described above, the production of the shock absorbing member is completed by a single mold operation without a separate processing process, thereby improving the productivity as well as attaching the pedestal to the lower side of the shock absorbing member in the factory There is no need to provide a shock absorbing member that can be reduced in transportation volume to reduce transportation costs.

The shock absorbing member of the present invention for achieving the above object, the shock absorbing member is disposed on the upper and lower sides of the electronic product is configured as an impact buffer member for protecting the electronic product from the impact, such as when the electronic product is transported. In the member, at least one supporting member is formed to protrude outwardly by being rotated about the hinge while being integrally connected with the impact buffer member.

And the support member of the shock-absorbing member of the present invention is a first support member formed to protrude about the hinge on one side of the electronic product and is formed to protrude around the hinge on the outside of the first support member A second supporting member, a third supporting member formed to protrude about the hinge on the outside of the second supporting member, and a fourth supporting member protruding about the hinge to the outside of the third supporting member. It is characterized by consisting of a supporting member.

1 is a state showing a state in which the shock absorbing member of the present invention is used,

2 is a plan view of the shock absorbing member of the present invention,

3 is a perspective view of an impact buffer member of the present invention,

4 is a cross-sectional view taken along line A-A of FIG.

5 is a perspective view of another embodiment of the present invention,

6 is a view illustrating another embodiment of the present invention.

<Description of the code | symbol about the principal part of drawing>

100: electronic product 200: shock absorber

210: first support member 211: first intermediate support portion

212: first concave incision 213: first support member support

214: recessed support portion 216: first hinge binding portion

218: first bottom support portion 220: second support member

221: second intermediate support 222: second concave incision

223: second support member support 226: second hinge binding portion

228: second bottom support 230: third supporting member

231: third intermediate support 232: third concave incision

233: third support member support 236: third hinge binding portion

238: third floor support 240: fourth supporting member

241: the fourth intermediate support 242: the fourth concave incision

243: fourth supporting member support portion 246: fourth hinge binding portion

248: fourth bottom support portion 250: fifth supporting member

252: round part 260: impact support part

Specific configuration of the shock absorbing member of the present invention is described as follows through the accompanying drawings.

1 is a state diagram illustrating a state in which the present invention is used, for example, in one electronic product, and FIGS. 2 to 4 are views of one embodiment of the present invention, and 100 is a schematic diagram of one typical electronic product. It is shown as, and is disposed on the upper and lower side of the electronic product 100 is composed of an impact buffer member 200 for protecting the electronic product 100 from the impact, such as when the electronic product 100 is transported. .

The electronic product 100 refers to various conventional electronic products, for example, a computer, a DVD, a CD-ROM driver, or the like.

The shock absorbing member 200 has a plurality of pedestals integrally formed with the shock absorbing member 200, the first supporting member is formed to protrude around the hinge on one side of the electronic product 100 ( 210, a second support member 220 formed to protrude from the center of the hinge to the outside of the first support member 210, and a protrusion to protrude from the outside of the second support member 220 to the center. The third supporting member 230 is formed, and the fourth supporting member 240 is formed so as to protrude around the hinge on the outside of the third supporting member 230.

The first supporting member 210 has a first intermediate support portion 211 which is formed to protrude from side to side, and an incision is formed so as to be cut on one side of the first supporting member 210, so that the electronic product 100 can be used. For example, when a protrusion such as switching is formed, the first recess support part 214 and the first supporting member (214) are formed according to the size and position of the protrusion so that the protrusion of the electronic product 100 can be inserted. As shown in FIG. 4, when the shock absorbing member 200 is disposed below the shock absorbing member 200, the first support member 210 is connected to the integrally maintained body without being separated from the shock absorbing member 200. The first hinge fastening portion 216 is formed to protrude to the central portion of the first support member 210, so that the impact buffer member 200 does not directly touch the bottom surface as shown in FIG. It is composed of a first bottom support 218 to absorb.

As shown in FIG. 4, the second intermediate support part 221 and the second support member 220 are formed to protrude from side to side in the second support member 220. The second hinge member 226 and the second support member 220 are connected to each other so that the second support member 220 is integrally maintained without being separated from the impact buffer member 200 when disposed below. It is formed to protrude to the central portion of the shock absorbing member 200 as shown in Figure 4 is composed of a second floor support portion 228 that absorbs the impact so as not to directly contact the bottom surface.

As shown in FIG. 4, the third intermediate support part 231 and the third support member 230 are formed to protrude from side to side in the third support member 230, and thus, the impact buffer member 200 may be formed. The third hinge member 236 and the third support member 230 are connected to each other so that the third support member 230 is integrally maintained without being separated from the impact buffer member 200 when disposed below. It is formed to protrude to the central portion of the shock absorbing member 200 as shown in Figure 4 is composed of a third floor support portion 238 to absorb the impact so as not to directly contact the bottom surface.

The fourth supporting member 240 has a fourth intermediate support part 241 which is formed to protrude from side to side, and an incision is formed so as to be cut on one side of the fourth supporting member 240, such as the electronic product 100. For example, when a protrusion such as switching is not shown, the fourth recess supporting part 244 is formed according to the size and position of the protrusion so that the protrusion of the electronic product 100 can be inserted, and the fourth As shown in FIG. 4, when the supporting member 240 is disposed below the impact buffer member 200, the fourth supporting member 240 is integrally maintained without being separated from the impact buffer member 200. It is formed so as to protrude to the fourth hinge fastening portion 246 and the central portion of the fourth support member 240 is connected to the impact buffer member 200 as shown in FIG. To the fourth floor support 248 that absorbs the shock Consists of.

And when the first support member 210 is installed as shown in Figure 4 is the first support member support portion 213 formed in the impact buffer member 200 does not rise to the upper side When the second support member 220 is installed as shown in FIG. 4, the second support member support part 223 supports the second support member 220 so as not to rise upward. The supporting member supporting part 233 supports the third supporting member 230 so that the third supporting member 230 does not rise upward when the third supporting member 230 is installed as shown in FIG. 4, and the fourth supporting member supporting part 243 is When the fourth support member 240 is installed as shown in FIG. 4, the fourth support member 240 is formed so as not to rise upward.

As such, when the impact buffer member 200 is used in the electronic product 100, the first to fourth support member support parts 213, 223, 233, and 243 of the impact buffer member 200 may use the first to fourth intermediate support parts 211, 221, 231, 241. Supported from the upper side is the impact buffers (t1 to t4) of the cutting width of the first intermediate support portion 211, the second intermediate support portion 221, the third intermediate support portion 231 and the fourth intermediate support portion 241 Since the thickness of the member 200 is smaller than t5, for example, when the first support member 210 is rotated about the first hinge binding portion 216, as shown in FIG. 4, the first support member 210 is rotated. One side of the first intermediate support part 211 is supported by being caught by the first concave cutout 212.

In this case, the second to fourth supporting members 220, 230, and 240 have the same principle and work the same.

And another embodiment of the present invention is shown in Figure 5, the difference with the embodiment described above is the first and the first and the second formed on the inner surface of the support member 210 and the fourth support member 240 and Instead of the fourth recesses 214 and 244, the first and fourth outer recesses 215 and 245 are formed such that cutouts are formed outside the first and second support members 210 and 240.

Such a case is for use when a protrusion such as a switch is formed to the outside according to the type of the electronic product 100.

In addition, another embodiment of the present invention is shown in FIG. 7, and the difference from the above-described embodiment is different from the above-described embodiment in order to cope with the case when the electronic device 100 has various shapes. A round part 252 having a round shape formed on one or both sides of the member 250 and an intermediate part of the shock absorbing member 200 in order to cushion external shocks while carrying the electronic product 100. At least one impact support portion 260 is formed.

In addition, the round part 252 and the impact support part 260 illustrated in FIG. 6 are applied to the case of FIGS. 1 to 5, and the shape of the round part 252 varies according to the type of the electronic product 100. For example, it may be formed in a polygon, such as a semi-circular, trapezoid, etc., the impact support 260 may also be varied in shape and number depending on the use and importance of the electronic product 100 in the present invention. It is included.

Reference numerals 221, 231, 241 are intermediate supports.

Referring to the operation and effects of the present invention described above with reference to the accompanying drawings as follows.

Typically, when shipped from the factory for manufacturing the shock absorbing member 200, as shown in Figure 2, is shipped in a state cut into a mold, the shock absorbing member 200 shipped as described above is an electronic product (100) ) Is moved to the packaging process at the factory.

That is, in order to package the electronic product 100 in a factory producing the electronic product 100, first, the first supporting member 210 and the second of the shock absorbing member 200 transported as shown in FIG. 2. The supporting member 220, the third supporting member 230 and the fourth supporting member 240 is pushed downward by applying a force.

Then, the first to fourth floor support parts 218, 228, 238 and 248 are pushed while rotating downward, as shown in FIG. 4.

As such, when the first to fourth floor support parts 218, 228, 238 and 248 are pushed downward, the first to fourth floor support parts 218, 228, 238 and 248 are supported by the first to fourth hinge fastening parts 216, 226, 236 and 246 connected to the impact buffer member 200. Will be maintained.

Then, as shown in FIG. 1, the electronic product 100 is placed thereon, and then packaged with the impact buffer member 200 on the upper side of the electronic product 100.

That is, during transportation, the vehicle is transported in the state as shown in FIG. 2, and in use, the first support member 210, the second support member 220, the third support member 230 and the fourth support member without additional manipulation. If the 240 is pushed downward, while being supported by the first to fourth hinge binding parts 216, 226, 236, 246 connected to the impact buffer member 200, the impact buffer member 200 may be simply completed. .

Since the shock absorbing member of the present invention configured as described above can package electronic products by using the shock absorbing member shipped from a mold without any separate operation, the manufacturing cost can be greatly reduced, and the transportation volume can be reduced even during transportation. It is designed to reduce the transportation cost by saving.

Claims (7)

In the shock absorbing member which is disposed on the upper side and the lower side of the electronic product 100, the electronic product 100 is composed of an impact buffer member 200 for protecting the electronic product 100 from shocks or the like during transportation, Shock shock member, characterized in that one or more support members are formed so as to be integrally connected with the shock buffer member 200 to protrude outward by rotating about the hinge. The method of claim 1, wherein the support member is formed on the one side of the electronic product 100, the first support member 210 and protruded around the hinge, the outer side of the first support member 210 A second support member 220 formed to protrude from the hinge, a third support member 230 formed to protrude from the hinge to the outside of the second support member 220, and the third Shock absorbing member, characterized in that consisting of the fourth supporting member 240 is formed to protrude around the hinge on the outside of the supporting member 230. The method of claim 2, wherein the first and fourth supporting members 210 and 240 are cut in one side of the first and fourth intermediate supporting parts 211 and 241 which protrude to both sides, and the first and fourth supporting members 210 and 240, respectively. The first and fourth support members 214 and 244 having cutouts formed therebetween, and the first and fourth support members 210 and 240 when the first and fourth support members 210 and 240 are disposed below the impact buffer member 200 are provided. ) Is formed to protrude to the central portion of the first and fourth hinge fastening portions 216 and 246 which are connected to be maintained integrally without being separated from the impact buffer member 200 and the first and fourth support members 210 and 240. Shock absorbing member, characterized in that the shock absorbing member 200 is composed of a first, fourth floor support (218, 248) to absorb the impact so as not to directly contact the bottom surface. According to claim 2, The second and third support members 220 and 230, the second and third intermediate support parts (221, 231) formed to protrude from side to side and the second support members (220, 230) is the shock absorbing member 200 The second and third hinge binding parts 226 and 236 connected to be maintained integrally with each other without being separated from each other, and protrude toward the central portions of the second and third support members 220 and 230 so that the impact buffer member 200 is formed. Shock absorbing member, characterized in that consisting of the second and third floor support (228,238) that absorbs the impact so as not to directly contact the floor. The shock absorbing member according to claim 3 or 4, wherein the thicknesses (t1 to t4) of the first to fourth intermediate support parts (211,221,231,241) are smaller than the thickness (t5) of the shock absorbing member (200). 4. The shock absorbing member according to claim 3, wherein first and fourth outer concave portions (215, 245) are formed on outer surfaces of the first supporting member (210, 240). The method of claim 3, wherein the round portion 252 is formed on the outer surface of the first support member (210, 240) and one or more impact support portion 260 in the central portion of the impact buffer member 200 Shock absorbing member, characterized in that.