JP2001040176A - Phenolic resin molding material - Google Patents

Phenolic resin molding material

Info

Publication number
JP2001040176A
JP2001040176A JP11207022A JP20702299A JP2001040176A JP 2001040176 A JP2001040176 A JP 2001040176A JP 11207022 A JP11207022 A JP 11207022A JP 20702299 A JP20702299 A JP 20702299A JP 2001040176 A JP2001040176 A JP 2001040176A
Authority
JP
Japan
Prior art keywords
molding material
weight
phenolic resin
polystyrene
molecular weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11207022A
Other languages
Japanese (ja)
Inventor
Yasutaka Kimura
康孝 木村
Masayuki Inagaki
昌幸 稲垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd, Sumitomo Durez Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP11207022A priority Critical patent/JP2001040176A/en
Publication of JP2001040176A publication Critical patent/JP2001040176A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a phenolic resin molding material having an excellent mechanical strength at heating and having only a small amt. of burrs. SOLUTION: This phenolic resin molding material comprises, as indispensable components, (a) a high mol.wt. novolak type phenolic resin having a wt. average mol.wt. of >=50,000 based on a polystyrene as a control material, (b) a phenolic resin having a wt. average mol.wt. of <50,000 based on a polystyrene as a control material, (c) hexamethylenetetramine as a curing agent and (d) an org. filler and/or inorg. filler. Based on the whole molding material, it pref. comprises (a) 20-45 wt.% of a high mol.wt. novolak resin having a wt. average mol.wt. of >=50,000 based on a polystyrene as a control material, (b) 5-40 wt.% of a phenolic resin having a wt. average mol.wt. of <50,000 based on a polystyrene as a control material, (c) 3-12 wt.% of hexamethylenetetramine as a curing agent and (d) 30-60 wt.% of an org. filler such as wood powder and/or an inorg. filler such as calcium carbonate.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、熱時の機械的強度
に優れバリ発生量の少ないフェノール樹脂成形材料を提
供するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a phenolic resin molding material which has excellent mechanical strength when heated and generates less burrs.

【0002】[0002]

【従来技術】フェノール樹脂は熱硬化性樹脂のなかでも
耐熱性、機械的強度、電気的特性等種々の点において優
れており、成形材料、積層材など様々な用途に使用され
ている。特に成形材料の用途では、金属部品をガラス繊
維で強化したフェノール樹脂成形材料に置換することで
大幅なコストダウンが計れることから、自動車分野をは
じめとする各種金属部品の代替材料としての需要が高ま
ってきている。年々、フェノール樹脂成形材料に対して
特性の向上が求められているが、特に、自動車部品など
の基幹部品の分野では常温での強度だけでなく熱時での
強度向上が必要となってきている。
2. Description of the Related Art Phenolic resins are excellent among thermosetting resins in various points such as heat resistance, mechanical strength, and electrical characteristics, and are used for various applications such as molding materials and laminates. Especially for molding materials, the cost can be significantly reduced by replacing metal parts with phenolic resin molding materials reinforced with glass fiber.Therefore, demand for alternative materials for various metal parts such as the automotive field has increased. Is coming. Each year, phenolic resin molding materials are required to have improved properties.In particular, in the field of core parts such as automobile parts, it is necessary to improve not only the strength at room temperature but also the strength at hot time. .

【0003】また、成形性に関しても成形サイクルの短
縮とともに、成形時に金型のゲート部やパーティング部
等から成形材料の流れた出た部分(バリと呼ばれる)が
多いと成形材料コストの増大や金型への付着などで金型
内に残りやすく成形品の特性低下や外観不良、金型破損
を引き起こすことがあるためバリ発生量の低減が求めら
れている。
With respect to the moldability, the molding cycle is shortened, and if there are many portions (called burrs) where the molding material has flowed out of the gate portion or parting portion of the mold during molding, the molding material cost increases, The adhesion to the mold or the like easily causes the molded article to remain in the mold, which may cause deterioration in the characteristics of the molded product, poor appearance, and damage to the mold.

【0004】[0004]

【発明が解決しようとする課題】本発明は、従来のフェ
ノール成形材料に比べて熱時の強度に優れた成形品を得
ることができ、かつ成型時にバリの発生量の少ないフェ
ノール樹脂成形材料を提供するものである。
DISCLOSURE OF THE INVENTION The present invention provides a phenolic resin molding material which can provide a molded article having a higher strength when heated as compared with a conventional phenolic molding material and which generates less burrs during molding. To provide.

【0005】[0005]

【課題を解決するための手段】本発明は、フェノール樹
脂成形材料において、(a)ポリスチレンを基準物質と
したときの重量平均分子量が 50,000以上である高
分子量ノボラック型フェノール樹脂(以下、「ノボラッ
ク型フェノール樹脂」を「ノボラック樹脂」という)、
(b)ポリスチレンを基準物質としたときの重量平均分
子量が 50,000未満のフェノール樹脂、(c)硬化
剤としてヘキサメチレンテトラミン、及び(d)有機充
填材及び又は無機充填材を必須成分として含有すること
を特徴とするフェノール樹脂成形材料である。
According to the present invention, there is provided a phenolic resin molding material comprising: (a) a high molecular weight novolak type phenolic resin (hereinafter referred to as "a") having a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance; Novolak type phenolic resin ”is called“ Novolak resin ”),
(B) a phenol resin having a weight average molecular weight of less than 50,000 based on polystyrene as a reference substance, (c) hexamethylenetetramine as a curing agent, and (d) an organic filler and / or an inorganic filler as essential components. It is a phenolic resin molding material characterized by doing.

【0006】好ましくは、成形材料全体に対して、
(a)ポリスチレンを基準物質としたときの重量平均分
子量が 50,000以上である高分子量ノボラック樹脂
20〜45重量%、(b)ポリスチレンを基準物質とし
たときの重量平均分子量が 50,000未満のフェノー
ル樹脂5〜40重量%、(c)硬化剤としてヘキサメチ
レンテトラミン3〜12重量%、及び(d)木粉などの
有機充填材及び又は炭酸カルシウムなどの無機充填材3
0〜60重量%を含有するフェノール樹脂成形材料であ
る。
Preferably, for the entire molding material,
(A) 20 to 45% by weight of a high molecular weight novolak resin having a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance, and (b) a weight average molecular weight of less than 50,000 when polystyrene is used as a reference substance. 5 to 40% by weight of a phenolic resin, (c) 3 to 12% by weight of hexamethylenetetramine as a curing agent, and (d) an organic filler such as wood flour and / or an inorganic filler 3 such as calcium carbonate.
It is a phenolic resin molding material containing 0 to 60% by weight.

【0007】本発明に用いられる高分子量ノボラック樹
脂(a)は3官能フェノール類とホルムアルデヒドの重
縮合物であり、ポリスチレンを基準物質としたときの重
量平均分子量が 50,000以上のものである。そし
て、成形材料を速硬化性にするためにはフェノール水酸
基に対してオルソ−オルソ位でのメチレン結合が全メチ
レン結合の60%以上であるものが好ましい。更に、成
形材料化の際の作業性から重量平均分子量50,000
〜200,000のものが好ましい。
The high molecular weight novolak resin (a) used in the present invention is a polycondensate of a trifunctional phenol and formaldehyde, and has a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance. In order to make the molding material quick-curing, it is preferable that the methylene bond at the ortho-ortho position relative to the phenolic hydroxyl group is 60% or more of all methylene bonds. Further, from the viewpoint of workability in forming a molding material, the weight average molecular weight is 50,000.
~ 200,000 are preferred.

【0008】一方、本発明に用いられるポリスチレンを
基準物質としたときの重量平均分子量が 50,000未
満のフェノール樹脂(b)はノボラック樹脂、レゾール
樹脂のどちらでも使用することができ、両者を併用する
こともできる。レゾール樹脂を使用する場合は、ヘキサ
メチレンテトラミンの配合量を適宜少なく調節する。好
ましい重量平均分子量は成形材料化の際の作業性から
1,500〜30,000である。
On the other hand, the phenol resin (b) having a weight-average molecular weight of less than 50,000 based on polystyrene used in the present invention can be used as either a novolak resin or a resol resin, and both can be used in combination. You can also. When a resole resin is used, the blending amount of hexamethylenetetramine is appropriately adjusted to be small. The preferred weight average molecular weight is from 1,500 to 30,000 from the viewpoint of workability in forming a molding material.

【0009】本発明においては、ポリスチレンを基準物
質としたときの重量平均分子量が50,000以上であ
る高分子量ノボラック樹脂(a)と、50,000未満
のフェノール樹脂(b)とを使用するが、かかる分子量
の異なるフェノール樹脂を併用することにより、成形材
料の溶融時の粘度を大幅に高めることなく、高分子量フ
ェノール樹脂の特長である耐熱性及び成形時のバリ防止
効果を良好にすることができる。
In the present invention, a high molecular weight novolak resin (a) having a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance and a phenol resin (b) having a weight average molecular weight of less than 50,000 are used. By using such phenolic resins having different molecular weights together, it is possible to improve the heat resistance and the burr prevention effect at the time of molding, which are the features of the high molecular weight phenolic resin, without significantly increasing the viscosity of the molding material at the time of melting. it can.

【0010】有機充填材及び又は無機充填材は、通常成
形材料全体に対して30〜60重量%配合される。そし
て硬化剤として配合されるヘキサメチレンテトラミンの
量を考慮すると、両フェノール樹脂の配合量は、好まし
くは成形材料全体に対して、(a)高分子量ノボラック
樹脂20〜45重量%、及び(b)重量平均分子量5
0,000 未満のフェノール樹脂5〜40重量%であ
る。前者が20重量%未満あるいは後者が40重量%を
越える場合、耐熱性及び成形時のバリ発生防止の効果が
小さくなり、前者が45重量%を越える場合あるいは後
者が5重量%未満の場合、成形材料の溶融時の粘度が高
くなり、成形性が低下することがある。
The organic filler and / or the inorganic filler is usually blended in an amount of 30 to 60% by weight based on the whole molding material. Considering the amount of hexamethylenetetramine compounded as a curing agent, the compounding amount of both phenolic resins is preferably (a) 20 to 45% by weight of a high molecular weight novolak resin, and (b) Weight average molecular weight 5
It is 5 to 40% by weight of phenolic resin of less than 10,000. When the former is less than 20% by weight or the latter exceeds 40% by weight, the heat resistance and the effect of preventing the generation of burrs during molding are reduced, and when the former exceeds 45% by weight or the latter is less than 5% by weight, In some cases, the viscosity of the material at the time of melting increases, and the moldability decreases.

【0011】本発明において、通常、硬化剤としてヘキ
サメチレンテトラミン(c)を、成形材料全体に対して
3〜12重量%使用する。3重量%未満では、硬化が不
十分となり、12重量%を越えて配合しても硬化性はこ
れ以上良くなることはなく、逆に分解ガス等により成形
不良の原因となりやすい。本発明に用いる有機充填材及
び又は無機充填材(d)については、有機充填材には木
粉、合板粉、熱硬化性樹脂硬化物粉末、粉砕布などがあ
り、無機充填材にはガラス繊維、炭酸カルシウム、タル
ク、水酸化アルミニウムなどがあるが、これらに限定さ
れるものではない。配合割合は、通常のフェノール樹脂
成形材料と同様に、成形材料全体に対して30〜60重
量%であることが好ましい。30重量%未満であると、
フェノール樹脂の割合が多くてバリの発生を抑えにく
く、60重量%より多いと成形時の流動性が十分でな
く、かすれ等の成形不良が生じやすい。
In the present invention, generally, hexamethylenetetramine (c) is used as a curing agent in an amount of 3 to 12% by weight based on the whole molding material. If the amount is less than 3% by weight, the curing will be insufficient, and if the amount exceeds 12% by weight, the curability will not be further improved, and conversely, decomposition gas or the like tends to cause molding failure. Regarding the organic filler and / or inorganic filler (d) used in the present invention, the organic filler includes wood powder, plywood powder, thermosetting resin powder, and crushed cloth, and the inorganic filler includes glass fiber. , Calcium carbonate, talc, aluminum hydroxide and the like, but are not limited thereto. The compounding ratio is preferably 30 to 60% by weight based on the whole molding material as in the case of a general phenol resin molding material. If it is less than 30% by weight,
When the proportion of the phenolic resin is large, it is difficult to suppress the generation of burrs, and when it is more than 60% by weight, the fluidity during molding is not sufficient, and molding defects such as blurring tend to occur.

【0012】[0012]

【実施例】以下、実施例により本発明を説明する。The present invention will be described below with reference to examples.

【0013】実施例1及び2 フェノール22.0Kgを熱交換器、加熱装置及び同径
の2段タービン型攪拌羽根を有した容量50Lの高圧反
応器内に入れ180℃まで加熱し、窒素ガスにて0.8
MPa迄加圧した後、ダイアフラム式高圧定量ポンプに
て予めイオン交換樹脂処理により蟻酸含有量をを50P
PMまで低減した40%ホルマリン13.3Kgを60
分間掛けて反応器下部より逐次添加し付加縮合反応をさ
せた。この間の反応温度が180〜200℃となるよう
に反応器のジャケット部の温度及び添加速度を調整し
た。添加終了後5分間その温度を保ち自己発熱が起こら
ないことを確認後、更に220〜230℃を保つように
加熱しながら、熱交換器経由で30分間掛けて常圧に戻
しながら脱水反応を行った。更にこの後1.3KPaま
で減圧し30分間未反応フェノールの除去を行い、冷却
バット上に取り出しポリスチレン換算で重量平均分子量
が 52,000のノボラック樹脂20.0Kgを得た。
Examples 1 and 2 22.0 kg of phenol was placed in a 50 L high-pressure reactor having a heat exchanger, a heating device and a two-stage turbine-type stirring blade of the same diameter and heated to 180 ° C. 0.8
After pressurizing to MPa, the formic acid content was previously reduced to 50P by ion exchange resin treatment with a diaphragm type high pressure metering pump.
13.3Kg of 40% formalin reduced to PM to 60
The mixture was added sequentially from the lower part of the reactor over a period of minutes to cause an addition condensation reaction. The temperature and the addition rate of the jacket of the reactor were adjusted so that the reaction temperature during this time was 180 to 200 ° C. After completion of the addition, the temperature was maintained for 5 minutes, and after confirming that self-heating did not occur, a dehydration reaction was performed while returning to normal pressure over 30 minutes via a heat exchanger while heating to further maintain the temperature at 220 to 230 ° C. Was. Thereafter, the pressure was reduced to 1.3 KPa, and the unreacted phenol was removed for 30 minutes. The unreacted phenol was taken out on a cooling vat to obtain 20.0 kg of a novolak resin having a weight average molecular weight of 52,000 in terms of polystyrene.

【0014】この重量平均分子量 52,000のノボラ
ック樹脂とポリスチレン換算で重量平均分子量が 8,0
00のノボラック樹脂、ヘキサメチレンテトラミン、充
填材、硬化助剤、滑剤、着色剤等を表1の割合にて配合
し、2軸ロールにて溶融混練し成形材料を得た。
The novolak resin having a weight average molecular weight of 52,000 and a weight average molecular weight of 8.0 in terms of polystyrene were used.
Novolak resin No. 00, hexamethylenetetramine, filler, curing aid, lubricant, colorant, etc. were blended in the proportions shown in Table 1 and melt-kneaded with a biaxial roll to obtain a molding material.

【0015】実施例3及び4 反応器内にフェノール20.0Kgを入れ、アルデヒド
類として88%パラホルムアルデヒド8.9Kgを使用
し、更にこのパラホルムアルデヒドは8.0Kgのフェ
ノールと事前に混合し、懸濁状態液となったものをプラ
ンジャー式高圧定量ポンプにて反応器下部より供給する
ことと減圧での未反応フェノール除去を行わない事、反
応温度が200〜220℃である事以外は、すべて実施
例1と同様の方法で反応を行いれたポリスチレン換算で
重量平均分子量が102,000のノボラック樹脂2
7.0Kgを得た。
Examples 3 and 4 20.0 kg of phenol was placed in a reactor, 8.9 kg of 88% paraformaldehyde was used as aldehydes, and this paraformaldehyde was previously mixed with 8.0 kg of phenol, and Except for supplying the turbid liquid from the lower part of the reactor with a plunger-type high-pressure metering pump, not removing unreacted phenol under reduced pressure, and having a reaction temperature of 200 to 220 ° C, all A novolak resin 2 having a weight average molecular weight of 102,000 in terms of polystyrene which was reacted in the same manner as in Example 1
7.0 kg was obtained.

【0016】この重量平均分子量 102,000のノボ
ラック樹脂とポリスチレン換算で重量平均分子量が 8,
000のノボラック樹脂、ヘキサメチレンテトラミン、
充填材、硬化助剤、滑剤、着色剤等を表1の割合にて配
合し、2軸ロールにて溶融混練し成形材料化を得た。
A novolak resin having a weight average molecular weight of 102,000 and a weight average molecular weight of 8,8
000 novolak resin, hexamethylenetetramine,
Fillers, curing aids, lubricants, coloring agents, etc. were blended in the proportions shown in Table 1 and melted and kneaded with a biaxial roll to obtain a molding material.

【0017】比較例1 ポリスチレン換算で重量平均分子量が 8,000のノボ
ラック樹脂、充填材、ヘキサメチレンテトラミン、硬化
助剤、滑剤、着色剤等を表1の割合にて配合し、2軸ロ
ールにて溶融混練し成形材料を得た。
COMPARATIVE EXAMPLE 1 A novolak resin having a weight average molecular weight of 8,000 in terms of polystyrene, a filler, hexamethylenetetramine, a curing aid, a lubricant, a colorant, and the like were blended in the proportions shown in Table 1 and mixed on a biaxial roll. The mixture was melt-kneaded to obtain a molding material.

【0018】得られた成形材料について、移送成形(成
形条件:温度175℃,時間3分間)にて試験片を成形
し、25℃及び120℃における曲げ強度(JIS K
6911)を評価した。この曲げ強度は、試験片を上記
温度で30分放置した後測定した。また、図1に示す移
送成形用金型を用いてバリの発生状態を測定した。これ
らの結果を表1に示す。
A test piece was formed from the obtained molding material by transfer molding (molding conditions: temperature: 175 ° C., time: 3 minutes), and the bending strength at 25 ° C. and 120 ° C. (JIS K)
6911) was evaluated. The bending strength was measured after the test piece was left at the above temperature for 30 minutes. Further, the occurrence of burrs was measured using the transfer mold shown in FIG. Table 1 shows the results.

【0019】[0019]

【表1】 [Table 1]

【0020】[0020]

【発明の効果】以上の実施例及び比較例により得られた
結果から明らかなように、本発明のフェノール樹脂成形
材料は、従来のフェノール樹脂成形材料に比べ熱時の強
度に優れ、また成形時に発生するバリが少ない成形材料
であるので、各種の耐熱性を要求される成形品用として
好適に使用される。
As is evident from the results obtained by the above Examples and Comparative Examples, the phenolic resin molding material of the present invention is superior in heat strength to conventional phenolic resin molding materials, Since it is a molding material that generates few burrs, it is suitably used for molded articles requiring various heat resistances.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 実施例で成形時バリの発生を測定する際に使
用する移送成形金型の概略断面図、
FIG. 1 is a schematic cross-sectional view of a transfer molding die used when measuring the generation of burrs during molding in Examples.

【図2】 図1のA−A断面図FIG. 2 is a sectional view taken along line AA of FIG.

【符号の説明】[Explanation of symbols]

1 円形キャビティ 2 エアベント(厚み100μm) 3 エアベント(厚み 50μm) 4 エアベント(厚み 30μm) 5 エアベント(厚み 10μm) 6 ポット 7 プランジャ 1 circular cavity 2 air vent (thickness 100 μm) 3 air vent (thickness 50 μm) 4 air vent (thickness 30 μm) 5 air vent (thickness 10 μm) 6 pot 7 plunger

フロントページの続き Fターム(参考) 4J002 AA02Y AH00Y CC03X CC04W CC06W DE147 DE237 DJ047 DL007 EU186 FA047 FD01Y FD017 FD146 GN00 Continued on the front page F-term (reference) 4J002 AA02Y AH00Y CC03X CC04W CC06W DE147 DE237 DJ047 DL007 EU186 FA047 FD01Y FD017 FD146 GN00

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 フェノール樹脂成形材料において、
(a)ポリスチレンを基準物質としたときの重量平均分
子量が 50,000以上である高分子量ノボラック型フ
ェノール樹脂、(b)ポリスチレンを基準物質としたと
きの重量平均分子量が 50,000未満のフェノール樹
脂、(c)硬化剤としてヘキサメチレンテトラミン、及
び(d)有機充填材及び又は無機充填材を必須成分とし
て含有することを特徴とするフェノール樹脂成形材料。
1. A phenolic resin molding material,
(A) a high molecular weight novolak type phenol resin having a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance; and (b) a phenol resin having a weight average molecular weight of less than 50,000 when polystyrene is used as a reference substance. A phenolic resin molding material comprising (c) hexamethylenetetramine as a curing agent, and (d) an organic filler and / or an inorganic filler as essential components.
【請求項2】 成形材料全体に対して、(a)ポリスチ
レンを基準物質としたときの重量平均分子量が 50,0
00以上である高分子量ノボラック型フェノール樹脂2
0〜45重量%、(b)ポリスチレンを基準物質とした
ときの重量平均分子量が 50,000未満のフェノール
樹脂5〜40重量%、(c)硬化剤としてヘキサメチレ
ンテトラミン3〜12重量%、及び(d)有機充填材及
び又は無機充填材30〜60重量%を含有する請求項1
記載のフェノール樹脂成形材料。
2. The weight average molecular weight of (a) polystyrene as a reference substance is 50,0 based on the whole molding material.
High molecular weight novolak type phenolic resin 2 having a molecular weight of 00 or more
0 to 45% by weight, (b) 5 to 40% by weight of a phenol resin having a weight average molecular weight of less than 50,000 based on polystyrene, (c) 3 to 12% by weight of hexamethylenetetramine as a curing agent, and (D) An organic filler and / or an inorganic filler is contained in an amount of 30 to 60% by weight.
The phenolic resin molding material according to the above.
JP11207022A 1999-05-26 1999-07-22 Phenolic resin molding material Pending JP2001040176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11207022A JP2001040176A (en) 1999-05-26 1999-07-22 Phenolic resin molding material

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14718299 1999-05-26
JP11-147182 1999-05-26
JP11207022A JP2001040176A (en) 1999-05-26 1999-07-22 Phenolic resin molding material

Publications (1)

Publication Number Publication Date
JP2001040176A true JP2001040176A (en) 2001-02-13

Family

ID=26477810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11207022A Pending JP2001040176A (en) 1999-05-26 1999-07-22 Phenolic resin molding material

Country Status (1)

Country Link
JP (1) JP2001040176A (en)

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