JP2001040177A - Phenolic resin molding material - Google Patents

Phenolic resin molding material

Info

Publication number
JP2001040177A
JP2001040177A JP11207023A JP20702399A JP2001040177A JP 2001040177 A JP2001040177 A JP 2001040177A JP 11207023 A JP11207023 A JP 11207023A JP 20702399 A JP20702399 A JP 20702399A JP 2001040177 A JP2001040177 A JP 2001040177A
Authority
JP
Japan
Prior art keywords
molding material
phenolic resin
weight
molecular weight
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11207023A
Other languages
Japanese (ja)
Inventor
Yasutaka Kimura
康孝 木村
Masayuki Inagaki
昌幸 稲垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd, Sumitomo Durez Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP11207023A priority Critical patent/JP2001040177A/en
Publication of JP2001040177A publication Critical patent/JP2001040177A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a phenolic resin molding material having an excellent mechanical strength at heating and having only a small amt. of burrs. SOLUTION: This phenolic resin molding material comprises, as indispensable components, (a) a high mol.wt. novolak type phenolic resin having a wt. average mol.wt. of >50,000 based on a polystyrene as a control material, (b) hexamethylenetetramine as a curing agent and (c) an org. filler and/or inorg. filler. Based on the whole molding material, it pref. comprises (a) 30-60 wt.% of a high mol.wt. novolak type phenolic resin having a wt. average mol.wt. of >=50,000 based on a polystyrene as a control material, (b) 3-18 wt.% of hexamethylenetetramine as a curing agent and (c) 40-60 wt.% of an org. filler such as wood powder and/or an inorg. filler such as calcium carbonate.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、熱時の機械的強度
に優れバリ発生量の少ないフェノール樹脂成形材料を提
供するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a phenolic resin molding material which has excellent mechanical strength when heated and generates less burrs.

【0002】[0002]

【従来技術】フェノール樹脂は熱硬化性樹脂のなかでも
耐熱性、機械的強度、電気的特性等種々の点において優
れており、成形材料、積層材など様々な用途に使用され
ている。特に成形材料の用途では、金属部品をガラス繊
維で強化したフェノール樹脂成形材料に置換することで
大幅なコストダウンが計れることから、自動車分野をは
じめとする各種金属部品の代替材料としての需要が高ま
ってきている。年々、フェノール樹脂成形材料に対して
特性の向上が求められているが、特に、自動車部品など
の基幹部品の分野では常温での強度だけでなく熱時での
強度向上が必要となってきている。
2. Description of the Related Art Phenolic resins are excellent among thermosetting resins in various points such as heat resistance, mechanical strength, and electrical characteristics, and are used for various applications such as molding materials and laminates. Especially for molding materials, the cost can be significantly reduced by replacing metal parts with phenolic resin molding materials reinforced with glass fiber.Therefore, demand for alternative materials for various metal parts such as the automotive field has increased. Is coming. Each year, phenolic resin molding materials are required to have improved properties.In particular, in the field of core parts such as automobile parts, it is necessary to improve not only the strength at room temperature but also the strength at hot time. .

【0003】また、成形性に関しても成形サイクルの短
縮とともに、成形時に金型のゲート部やパーティング部
等から成形材料の流れた出た部分(バリと呼ばれる)が
多いと成形材料コストの増大や金型への付着などで金型
内に残りやすく成形品の特性低下や外観不良、金型破損
を引き起こすことがあるためバリ発生量の低減が求めら
れている。
With respect to the moldability, the molding cycle is shortened, and if there are many portions (called burrs) where the molding material has flowed out of the gate portion or parting portion of the mold during molding, the molding material cost increases, The adhesion to the mold or the like easily causes the molded article to remain in the mold, which may cause deterioration in the characteristics of the molded product, poor appearance, and damage to the mold.

【0004】[0004]

【発明が解決しようとする課題】本発明は、従来のフェ
ノール成形材料に比べて熱時の強度に優れた成形品を得
ることができ、かつ成型時にバリの発生量の少ないフェ
ノール樹脂成形材料を提供するものである。
DISCLOSURE OF THE INVENTION The present invention provides a phenolic resin molding material which can provide a molded article having a higher strength when heated as compared with a conventional phenolic molding material and which generates less burrs during molding. To provide.

【0005】[0005]

【課題を解決するための手段】本発明は、フェノール樹
脂成形材料において、(a)ポリスチレンを基準物質と
したときの重量平均分子量が 50,000以上である高
分子量ノボラック型フェノール樹脂、(b)硬化剤とし
てヘキサメチレンテトラミン、及び(c)有機充填材及
び又は無機充填材を必須成分として含有することを特徴
とするフェノール樹脂成形材料であり、好ましくは、成
形材料全体に対して、(a)ポリスチレンを基準物質と
したときの重量平均分子量が 50,000以上である高
分子量ノボラック型フェノール樹脂30〜60重量%、
(b)硬化剤としてヘキサメチレンテトラミン3〜18
重量%、及び(c)木粉などの有機充填材及び又は炭酸
カルシウムなどの無機充填材30〜60重量%を含有す
るフェノール樹脂成形材料である。
According to the present invention, there is provided a phenolic resin molding material comprising: (a) a high molecular weight novolak type phenolic resin having a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance; A phenolic resin molding material characterized by containing hexamethylenetetramine as a curing agent, and (c) an organic filler and / or an inorganic filler as an essential component. Preferably, (a) A high molecular weight novolak type phenol resin having a weight average molecular weight of 50,000 or more based on polystyrene as a reference substance, 30 to 60% by weight;
(B) Hexamethylenetetramine 3 to 18 as a curing agent
It is a phenol resin molding material containing 30% to 60% by weight of an organic filler such as wood flour and / or an inorganic filler such as calcium carbonate.

【0006】本発明に用いられる高分子量ノボラック型
フェノール樹脂(a)は3官能フェノール類とホルムア
ルデヒドの重縮合物であり、ポリスチレンを基準物質と
したときの重量平均分子量が 50,000以上のもので
ある。そして、成形材料を速硬化性にするためにはフェ
ノール水酸基に対してオルソ−オルソ位でのメチレン結
合が全メチレン結合の60%以上であるものが好まし
い。更に、成形材料化の際の作業性から 50,000〜
200,000のものが好ましい。
The high molecular weight novolak type phenol resin (a) used in the present invention is a polycondensate of a trifunctional phenol and formaldehyde, and has a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance. is there. In order to make the molding material quick-curing, it is preferable that the methylene bond at the ortho-ortho position relative to the phenolic hydroxyl group is 60% or more of all methylene bonds. Furthermore, from the workability at the time of forming a molding material, 50,000-
200,000 are preferred.

【0007】本発明においては、フェノール樹脂とし
て、ポリスチレンを基準物質としたときの重量平均分子
量が50,000 以上である高分子量ノボラック型フェ
ノール樹脂を使用するが、かかる高分子量のフェノール
樹脂を使用することにより、成形材料の溶融時の粘度を
高くして成形時のバリ発生を防止するとともに、高分子
量フェノール樹脂の特長である耐熱性を向上させること
ができる。高分子量ノボラック型フェノール樹脂の配合
割合は、成形材料全体に対して30〜60重量%である
ことが好ましい。30重量%未満では、成形時の流動性
が十分でなく、かすれ等の成形不良が生じやすく、60
重量%を越えると、バリの発生を十分に抑えることがで
きない。なお、この高分子量ノボラック型フェノール樹
脂に加えて、通常のフェノール樹脂成形材料に使用され
るフェノール樹脂を少量、例えば成形材料全体に対して
5重量%以下配合してもよい。このフェノール樹脂はノ
ボラック型フェノール樹脂でもレゾール型フェノール樹
脂でも使用することができる。
In the present invention, a high molecular weight novolak type phenol resin having a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance is used as the phenol resin, and such a high molecular weight phenol resin is used. This makes it possible to increase the viscosity of the molding material at the time of melting to prevent the occurrence of burrs at the time of molding, and to improve the heat resistance, which is a feature of the high molecular weight phenol resin. The compounding ratio of the high molecular weight novolak type phenol resin is preferably 30 to 60% by weight based on the whole molding material. If it is less than 30% by weight, the fluidity during molding is not sufficient, and molding defects such as blurring tend to occur.
If the amount exceeds 100% by weight, the generation of burrs cannot be sufficiently suppressed. In addition, in addition to the high molecular weight novolak type phenolic resin, a small amount of phenolic resin used for a general phenolic resin molding material, for example, 5% by weight or less based on the whole molding material may be blended. This phenol resin can be used as a novolak phenol resin or a resol phenol resin.

【0008】本発明において、硬化剤としてヘキサメチ
レンテトラミン(b)を、成形材料全体に対して3〜1
8重量%使用する。3重量%未満では、硬化が不十分と
なり、18重量%を越えて配合しても硬化性はこれ以上
良くなることはなく、逆に分解ガス等により成形不良の
原因となりやすい。好ましい範囲は3〜12重量%であ
る。
In the present invention, hexamethylenetetramine (b) is used as a curing agent in an amount of 3 to 1 with respect to the whole molding material.
Use 8% by weight. If the amount is less than 3% by weight, the curing will be insufficient, and if the amount exceeds 18% by weight, the curability will not be further improved, and conversely, decomposition gas or the like tends to cause molding failure. The preferred range is 3 to 12% by weight.

【0009】本発明に用いる有機充填材及び又は無機充
填材(c)については、有機充填材には木粉、合板粉、
熱硬化性樹脂硬化物粉末、粉砕布などがあり、無機充填
材にはガラス繊維、炭酸カルシウム、タルク、水酸化ア
ルミニウムなどがあるが、これらに限定されるものでは
ない。配合割合は、通常のフェノール樹脂成形材料と同
様に、成形材料全体に対して30〜60重量%であるこ
とが好ましい。30重量%未満であると、フェノール樹
脂の割合が多くてバリの発生を抑えにくく、60重量%
より多いと成形時の流動性が十分でなく、かすれ等の成
形不良が生じやすい。
Regarding the organic filler and / or the inorganic filler (c) used in the present invention, wood powder, plywood powder,
Thermosetting resin powder, crushed cloth, etc., and inorganic fillers include, but are not limited to, glass fiber, calcium carbonate, talc, aluminum hydroxide, and the like. The compounding ratio is preferably 30 to 60% by weight based on the whole molding material as in the case of a general phenol resin molding material. If it is less than 30% by weight, the proportion of the phenol resin is so large that it is difficult to suppress the generation of burrs,
If the amount is larger, the fluidity at the time of molding is not sufficient, and molding defects such as blurring tend to occur.

【0010】[0010]

【実施例】以下、実施例により本発明を説明する。The present invention will be described below with reference to examples.

【0011】実施例1 フェノール22.0Kgを熱交換器、加熱装置及び同径
の2段タービン型攪拌羽根を有した容量50Lの高圧反
応器内に入れ180℃まで加熱し、窒素ガスにて0.8
MPa迄加圧した後、ダイアフラム式高圧定量ポンプに
て予めイオン交換樹脂処理により蟻酸含有量をを50P
PMまで低減した40%ホルマリン13.3Kgを60
分間掛けて反応器下部より逐次添加し付加縮合反応をさ
せた。この間の反応温度が180〜200℃となるよう
に反応器のジャケット部の温度及び添加速度を調整し
た。添加終了後5分間その温度を保ち自己発熱が起こら
ないことを確認後、更に220〜230℃を保つように
加熱しながら、熱交換器経由で30分間掛けて常圧に戻
しながら脱水反応を行った。更にこの後1.3KPaま
で減圧し30分間未反応フェノールの除去を行い、冷却
バット上に取り出しポリスチレン換算で重量平均分子量
が 52,000のノボラック型フェノール樹脂20.0
Kgを得た。
EXAMPLE 1 22.0 kg of phenol was placed in a 50 L high-pressure reactor having a heat exchanger, a heating device and a two-stage turbine type stirring blade of the same diameter, heated to 180 ° C., and heated to 0 ° C. with nitrogen gas. .8
After pressurizing to MPa, the formic acid content was previously reduced to 50P by ion exchange resin treatment with a diaphragm type high pressure metering pump.
13.3Kg of 40% formalin reduced to PM to 60
The mixture was added sequentially from the lower part of the reactor over a period of minutes to cause an addition condensation reaction. The temperature and the addition rate of the jacket of the reactor were adjusted so that the reaction temperature during this time was 180 to 200 ° C. After completion of the addition, the temperature was maintained for 5 minutes, and after confirming that self-heating did not occur, a dehydration reaction was performed while returning to normal pressure over 30 minutes via a heat exchanger while heating to further maintain the temperature at 220 to 230 ° C. Was. Thereafter, the pressure was reduced to 1.3 KPa, and unreacted phenol was removed for 30 minutes. The unreacted phenol was taken out on a cooling vat, and a novolak type phenol resin having a weight average molecular weight of 52,000 in terms of polystyrene 20.0%
Kg was obtained.

【0012】この重量平均分子量 52,000のノボラ
ック型フェノール樹脂、充填材、ヘキサメチレンテトラ
ミン、硬化助剤、滑剤、着色剤等を表1の割合にて配合
し、加熱ロールにて溶融混練し成形材料を得た。
The novolak-type phenol resin having a weight average molecular weight of 52,000, a filler, hexamethylenetetramine, a curing aid, a lubricant, a coloring agent, and the like are blended in the proportions shown in Table 1, and are melt-kneaded with a heating roll and molded. The material was obtained.

【0013】実施例2 反応器内にフェノール20.0Kgを入れ、アルデヒド
類として88%パラホルムアルデヒド8.9Kgを使用
し、更にこのパラホルムアルデヒドは8.0Kgのフェ
ノールと事前に混合し、懸濁状態液となったものをプラ
ンジャー式高圧定量ポンプにて反応器下部より供給する
ことと減圧での未反応フェノール除去を行わない事、反
応温度が200〜220℃である事以外は、すべて実施
例1と同様の方法で反応を行いれたポリスチレン換算で
重量平均分子量が102,000のノボラック型フェノ
ール樹脂27.0Kgを得た。
Example 2 20.0 kg of phenol was placed in a reactor, 8.9 kg of 88% paraformaldehyde was used as aldehydes, and this paraformaldehyde was previously mixed with 8.0 kg of phenol to form a suspension. Except that the liquid was supplied from the lower part of the reactor with a plunger-type high-pressure metering pump, unreacted phenol was not removed under reduced pressure, and the reaction temperature was 200 to 220 ° C. 27.0 Kg of a novolak phenol resin having a weight average molecular weight of 102,000 in terms of polystyrene reacted in the same manner as in Example 1 was obtained.

【0014】この重量平均分子量 102,000のノボ
ラック型フェノール樹脂、充填材、ヘキサメチレンテト
ラミン、硬化助剤、滑剤、着色剤等を表1の割合にて配
合し、加熱ロールにて溶融混練し成形材料を得た。
This novolak type phenol resin having a weight average molecular weight of 102,000, a filler, hexamethylenetetramine, a curing aid, a lubricant, a coloring agent, and the like are blended in the proportions shown in Table 1, and are melt-kneaded with a heating roll and molded. The material was obtained.

【0015】比較例1 ポリスチレン換算で重量平均分子量が 8,000のノボ
ラック型フェノール樹脂、充填材、ヘキサメチレンテト
ラミン、硬化助剤、滑剤、着色剤等を表1の割合にて配
合し、加熱ロールにて溶融混練し成形材料を得た。
Comparative Example 1 A novolak-type phenol resin having a weight average molecular weight of 8,000 in terms of polystyrene, a filler, hexamethylenetetramine, a curing aid, a lubricant, a coloring agent, and the like were blended in the proportions shown in Table 1 and heated. To obtain a molding material.

【0016】得られた成形材料について、移送成形(成
形条件:温度175℃,時間3分間)にて試験片を成形
し、25℃及び120℃における曲げ強度(JIS K
6911)を評価した。この曲げ強度は、試験片を上記
温度で30分放置した後測定した。また、図1に示す移
送成形用金型を用いてバリの発生状態を測定した。これ
らの結果を表1に示す。
A test piece was formed from the obtained molding material by transfer molding (molding conditions: temperature: 175 ° C., time: 3 minutes), and the bending strength at 25 ° C. and 120 ° C. (JIS K)
6911) was evaluated. The bending strength was measured after the test piece was left at the above temperature for 30 minutes. Further, the occurrence of burrs was measured using the transfer mold shown in FIG. Table 1 shows the results.

【0017】[0017]

【表1】 [Table 1]

【0018】[0018]

【発明の効果】以上の実施例及び比較例により得られた
結果から明らかなように、本発明のフェノール樹脂成形
材料は、従来のフェノール樹脂成形材料に比べ熱時の強
度に優れ、また成形時に発生するバリが少ない成形材料
であるので、各種の耐熱性を要求される成形品用として
好適に使用される。
As is evident from the results obtained by the above Examples and Comparative Examples, the phenolic resin molding material of the present invention is superior in heat strength to conventional phenolic resin molding materials, Since it is a molding material that generates few burrs, it is suitably used for molded articles requiring various heat resistances.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 実施例で成形時バリの発生を測定する際に使
用する移送成形金型の概略断面図
FIG. 1 is a schematic cross-sectional view of a transfer molding die used when measuring the generation of burrs during molding in an embodiment.

【図2】 図1のA−A断面図FIG. 2 is a sectional view taken along line AA of FIG.

【符号の説明】[Explanation of symbols]

1 円形キャビティ 2 エアベント(厚み100μm) 3 エアベント(厚み 50μm) 4 エアベント(厚み 30μm) 5 エアベント(厚み 10μm) 6 ポット 7 プランジャ 1 circular cavity 2 air vent (thickness 100 μm) 3 air vent (thickness 50 μm) 4 air vent (thickness 30 μm) 5 air vent (thickness 10 μm) 6 pot 7 plunger

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4J002 AA02X AH00X CC04W DE147 DJ047 DL007 EN046 FA047 FA08X FD01X FD017 FD146 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J002 AA02X AH00X CC04W DE147 DJ047 DL007 EN046 FA047 FA08X FD01X FD017 FD146

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 フェノール樹脂成形材料において、
(a)ポリスチレンを基準物質としたときの重量平均分
子量が 50,000以上である高分子量ノボラック型フ
ェノール樹脂、(b)硬化剤としてヘキサメチレンテト
ラミン、及び(c)有機充填材及び又は無機充填材を必
須成分として含有することを特徴とするフェノール樹脂
成形材料。
1. A phenolic resin molding material,
(A) a high molecular weight novolak phenol resin having a weight average molecular weight of 50,000 or more when polystyrene is used as a reference substance, (b) hexamethylenetetramine as a curing agent, and (c) an organic filler and / or an inorganic filler. A phenolic resin molding material, characterized by containing as an essential component.
【請求項2】 成形材料全体に対して、(a)ポリスチ
レンを基準物質としたときの重量平均分子量が 50,0
00以上である高分子量ノボラック型フェノール樹脂3
0〜60重量%、(b)硬化剤としてヘキサメチレンテ
トラミン3〜18重量%、及び(c)有機充填材及び又
は無機充填材30〜60重量%を含有する請求項1記載
のフェノール樹脂成形材料。
2. The weight average molecular weight of (a) polystyrene as a reference substance is 50,0 based on the whole molding material.
High molecular weight novolak type phenolic resin 3 having a molecular weight of 00 or more
The phenolic resin molding material according to claim 1, comprising 0 to 60% by weight, (b) 3 to 18% by weight of hexamethylenetetramine as a curing agent, and (c) 30 to 60% by weight of an organic filler and / or an inorganic filler. .
JP11207023A 1999-05-26 1999-07-22 Phenolic resin molding material Pending JP2001040177A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11207023A JP2001040177A (en) 1999-05-26 1999-07-22 Phenolic resin molding material

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14718199 1999-05-26
JP11-147181 1999-05-26
JP11207023A JP2001040177A (en) 1999-05-26 1999-07-22 Phenolic resin molding material

Publications (1)

Publication Number Publication Date
JP2001040177A true JP2001040177A (en) 2001-02-13

Family

ID=26477808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11207023A Pending JP2001040177A (en) 1999-05-26 1999-07-22 Phenolic resin molding material

Country Status (1)

Country Link
JP (1) JP2001040177A (en)

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