JP2001033937A - Production of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to efficiently and easily process a large quantity of data and to efficiently and rapidly obtain desired pattern data by simplifying proximity effect correction. SOLUTION: Plural pattern files 30 and one parameter file 31 are stored in one holder by using a GUI. The one parameter file 31 stored in the same holder as the folder of the pattern files 30 is applied to the plural pattern files 30 stored in the folder, by which the optical proximity effect correction is executed. A GDS II stream file 36 is formed by collecting the plural pattern files 33 after the correction subjected to the proximity effect correction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, and more particularly, to a method suitable for application to optical proximity correction of pattern data.

[0002]

2. Description of the Related Art Conventionally, there are roughly two types of processing methods for performing proximity effect correction. That is, there are a method of performing proximity effect correction on a large-scale pattern at once, and a method of correcting a small-scale pattern such as a memory cell.

[0003] Of the two methods, the former method is particularly effective when the correction technique and the intention of the designer are clearly determined, and the pattern can be corrected efficiently.

However, setting parameters in the correction technique is not easy, so it is necessary to confirm whether the corrected pattern obtained by the correction technique is in accordance with the intention of the designer. Is required. This confirmation is indispensable especially for a fine semiconductor element.

Therefore, for example, when manufacturing a memory device or the like, correction of small-scale patterns is repeatedly performed, verification is performed after each pattern is actually formed, and optical proximity correction is performed while fine adjustment is performed. I was going.

[0006]

However, in the conventional optical proximity effect correction, if the correction is performed by using the above-described method, it takes much time and time.

Accordingly, an object of the present invention is to manufacture a semiconductor device capable of efficiently and easily processing a large amount of data and efficiently obtaining desired pattern data for proximity effect correction in a short time. It is to provide a method.

[0008]

In order to achieve the above object, a first aspect of the present invention is to apply parameter data for proximity effect correction to pattern data so that the proximity Creates corrected pattern data by performing effect correction, creates design pattern data by performing format conversion on the corrected pattern data, creates drawing data based on the design pattern data, and creates drawing data. Storing a pattern data in a storage unit, storing parameter data in a storage unit, and storing the semiconductor device in a method of manufacturing a semiconductor device using a photomask manufactured based on the method. Selecting a plurality of pattern data from the pattern data stored in the storage unit; Selecting one parameter data from the extracted parameter data, and performing a proximity effect correction on the plurality of pattern data by applying the one parameter data to obtain a plurality of corrected data corresponding to the plurality of pattern data. And a step of creating pattern data.

In the first invention, typically, in order to select pattern data and / or parameter data, the display means displays pattern data and / or parameter data.
Or, display the parameter data, and
A plurality of pattern data and one parameter data are stored in the same folder and displayed.

According to a second aspect of the present invention, corrected pattern data is created by applying proximity effect correction to pattern data by applying parameter data for proximity effect correction to the pattern data. By performing format conversion on the corrected pattern data, design pattern data is created, drawing data based on the design pattern data is created, and the semiconductor device is fabricated using a photomask manufactured based on the drawing data. In a method of manufacturing a semiconductor device, a step of storing pattern data in a storage unit, a step of storing parameter data in a storage unit, and selecting one pattern data from the pattern data stored in the storage unit. Step and a plurality of parameters from the parameter data stored in the storage means. Selecting a plurality of pattern data and applying a plurality of parameter data to one pattern data to perform a proximity effect correction, thereby generating a plurality of corrected pattern data corresponding to the plurality of parameter data. And characterized in that:

In the second invention, typically, in order to select pattern data and / or parameter data, the display means displays pattern data and / or parameter data.
Or, display the parameter data, and
A plurality of pattern data and one parameter data are stored in the same folder and displayed.

In the present invention, the proximity effect correction is typically the optical proximity effect correction, but the present invention can be applied to other proximity effect corrections.

According to the method of manufacturing a semiconductor device according to the first aspect of the present invention configured as described above, the proximity effect correction is performed by applying one parameter data to a plurality of pattern data. Accordingly, the proximity effect correction can be performed collectively on a large amount of pattern data.

According to the method of manufacturing a semiconductor device according to the second aspect of the present invention, the proximity effect correction is performed by applying a plurality of parameter data to one pattern data. The parameter data optimal for the pattern data can be easily obtained from the above parameter data.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. In all the drawings of the following embodiments, the same or corresponding portions are denoted by the same reference numerals. First, an optical proximity effect correction method according to the first embodiment of the present invention will be described. FIG. 1 shows the configuration of a processing system for performing optical proximity effect correction according to the first embodiment.

As shown in FIG. 1, in the processing system according to the first embodiment, a computer 1 has a system bus 2 for transmitting data, and a central processing unit (CPU) for controlling the computer 1. Three. The system bus 2 includes a ROM 4 and a RAM
5, a storage unit including a VRAM 6 is connected, and a timer 7 for measuring time is connected.

The system bus 2 has a CRT (Catho
de-Ray Tube) an interface for an information output device such as a controller 8 and a printer interface 9;
Hard disk drive (HDD) interface 1
0, a CD-ROM interface 11, and a floppy disk drive (FDD) interface 12
Interface for a data recording / reproducing device, an interface for an information input device such as a mouse interface 13 and a keyboard interface 14, and a network interface 15 are connected to each other, and can transmit data through the system bus 2. It is configured to be able to. Then, via these interfaces, CRT16,
Printer 17, hard disk drive 18, CD-R
OM drive 19, floppy disk drive 20,
A mouse 21, a keyboard 22, and a network line 23 are connected to the system bus 2, respectively.

The CPU 3 is a block for controlling the entire computer 1. The operating system of the computer 1 is stored in the ROM 4, and the uploaded application programs and the like are stored in the RAM 5. When starting up the computer 1, the CPU 3 executes a software program based on the operating system stored in the ROM 4. When executing an application program under this operating system, the CPU 3 first sets the hard disk drive 18
The application program recorded on the hard disk is read and uploaded to the RAM 5, and then the application program is executed.

The VRAM 6 stores image data generated by the CPU 21, for example. This VRAM
6 is displayed on the CRT 16. In this case, the graphic display based on the image data is a graphic display for a GUI (Graphical User Interface). The image data transmitted from the CPU 3 to the VRAM 6 is, for example, image data such as a window, a cursor, a scroll bar, or an icon indicating a device. In this computer 1, these plural types of image data are converted to CRT
By displaying the image on the screen 16, a graphic display for the GUI is obtained.

The printer interface 9 is an interface block for communicating with a printer 17 for printing out desired information such as graphic information and character information on, for example, paper.

The HDD interface 10 is an interface block for communicating with the hard disk drive 18. An application program to be started on the computer 2 is installed in the hard disk drive 18. When the application program is executed, the application program is read from the hard disk drive 18 and uploaded to the RAM 5. When the application program is terminated, various information such as graphic information stored in the RAM 5 is downloaded to the hard disk of the hard disk drive 18 via the HDD interface 10.

The CD-ROM interface 11
Is an interface block for communicating with a CD-ROM drive 19 for reproducing a CD-ROM (Compact Disc Read Only Memory) on which application programs and data are recorded. The FDD interface 12 is an interface block for communicating with the floppy disk drive 20.

The mouse interface 13 is an interface block for receiving information from the mouse 21 connected to the computer 1. The mouse interface 13 is provided with detection information of a two-dimensional rotary encoder provided on the mouse 21 and provided on the mouse 21. For example, it receives click information of left and right buttons from the mouse 21, decodes the received information, and sends it to the CPU 3. Similarly, the keyboard interface 14 is an interface block that receives information from a keyboard connected to the computer 1, receives input information from buttons provided on the keyboard 22, decodes the received input information, and sends the decoded input information to the CPU 3. Send out. Thereby, the CPU 3
Among the GUIs displayed on the CRT 16, it recognizes which command button has been instructed, recognizes various data input from the keyboard 22, and performs control corresponding thereto.

The network interface 15
Is an interface block for performing communication using the network line 23 connected outside the computer 1. The network interface 15 is C
A driver for converting various commands generated by the PU 3 into data of a predetermined communication protocol is provided, and signals indicating the various commands are transmitted to the outside through the network line 23 via the driver.

A processing method for performing the optical proximity effect correction on a predetermined pattern by using the system configured as described above will be described below. FIG. 2 shows a flowchart of the entire process of the optical proximity effect correction according to the first embodiment.

As shown in FIG. 2, in the optical proximity correction according to the first embodiment, a plurality of pattern files 30 (30a, 30b,..., 30i,.
0n), the optical proximity effect correction 32 is performed by applying one parameter file 31. here,
The pattern file 30 includes data such as a pattern used in the LOCOS method, a pattern of the diffusion layer region, or a wiring pattern.

The parameter file 31 includes parameters necessary for the optical proximity effect correction, such as exposure conditions such as resolution and multiple exposure, mask-related parameters such as simulation, and precision and correction-related parameters. Use the same parameter file. In addition, when exposure is performed using the pattern file 30 before correction, the shape of the pattern actually formed and the pattern actually formed when exposure is performed using the pattern file 33 after correction. The result of calculating the shape by simulation is shown in the simulation result file 3
4 obtained. In FIG. 2, only the pattern file 33a after correction and the simulation result file 34a before and after correction are shown, and the pattern file 34 other than the pattern file 34a after correction and the corrected file other than the simulation result file 34a before and after correction are shown. The simulation result file 34 is not shown. The data of the simulation result file 34 before and after the correction is transferred to the CRT controller 8 shown in FIG.
The correction result can be confirmed 35 by displaying on the CRT 16 via.

Then, all the corrected pattern files 33 (33a, 33a,
3b, ..., 33i, ..., 33n) is one GD
It is converted to the SII stream file 36. Thus, CAD data design pattern data corrected by the optical proximity effect correction is obtained.

Next, a GUI for executing the above-described optical proximity effect correction processing will be specifically described below. FIG.
Shows a GUI screen for the user to perform an operation when executing the optical proximity effect correction.

First, when the optical proximity effect correction is performed, an icon of application software (hereinafter, OPC software) for executing the optical proximity effect correction is clicked on the computer 1 shown in FIG. By doing so, the hard disk drive 18
The OPC software is read from the RAM 5, downloaded to the RAM 5, and activated. As a result, a GUI screen 40 for optical proximity effect correction is displayed on the CRT 16 as shown in FIG. The GUI screen 40 has a minimize button 40a for minimizing the display of the window, a maximize button 40b for maximizing the display of the window, and an end button 40c for ending the OPC software.
Is provided.

The GUI screen 40 includes a storage device list display section 41, a folder selection list display section 42, a parameter file list display section 43, a pattern file list display section 44, a selected parameter file list display section 45, and a selected pattern file list. Display section 46, clear button 47, job creation button 48, job command list display section 49, command number display section 50, execution /
It comprises a stop button 51, a stream conversion button 52, and an end button 53.

The storage device list display section 41 includes, for example, the hard disk drive 18 and the CD-ROM drive 1 provided in the system for performing the optical proximity effect correction.
9 is a display unit for selecting a storage device such as a floppy disk drive 20 or the like. In FIG. 3, a hard disk drive named “C” (hereinafter, HDD “C”) is selected as the storage device.

The folder selection list display section 42
This is a display unit for displaying the folder recorded in the storage device selected in the storage device list display unit 41 together with its hierarchical structure. In the folder selection list display section 42, the desired folder is highlighted by clicking and specifying the desired folder, for example, with the mouse 21 in the hierarchical structure of the folder. In FIG. 3, the folder “DATA” is included in the HDD “C”, the folder “S2521” is included in the folder “DATA”, and the folder “S2521” is included.
Contains a folder “LOC”, and the folder “LOC” contains a folder “result”. In FIG. 3, the folder “LOC” is highlighted, and the folder “LOC” in the hierarchical structure of this folder is displayed.
Indicates a selected state.

The parameter file list display section 4
Reference numeral 3 denotes a display unit for displaying a list of parameter files 31 included in the folder selected in the folder selection list display unit 42. In the first embodiment, since the folder “LOC” includes one parameter file “loc.prm”, the parameter file “loc.prm” is displayed in the parameter file list display section 43. Is done. In FIG. 3, this parameter file “loc.pr
"m" is selected and highlighted.

The pattern file list display section 44
Is a display unit for displaying a list of pattern files included in the folder selected in the folder selection list display unit 42. In the pattern file list display section 44, a scroll bar 44a is displayed on the right side. And the folder "LOC"
When the pattern file 30 that cannot be displayed on the pattern file list display section 44 among the pattern files 30 stored in the pattern file 30 is displayed, the scroll bar 44a or the scroll box 44b is
By operating the desired pattern file 30
Can be displayed on the pattern file list display section 44.

The selected parameter file list display section 45 is provided with the parameter file list display section 43 described above.
Is a display unit for displaying the parameter file 31 selected in, together with its detailed hierarchical structure. In FIG. 3, among the hard disk drives 18, H
The parameter file “1ps.prm” included in the folder “1PS” and the folder “LOC” stored in the folder “S2521” in the folder “DATA” recorded on the hard disk of the DD “C” The respective parameter files “loc.prm” are displayed.

The selected pattern file list display section 46 is a display section for displaying the pattern file 30 selected in the pattern file list display section 44 described above.

The clear button 47 is a button for deleting the selected parameter file, pattern file, or created job described later from each folder. That is, for example, the mouse 21
After selecting a desired file by using, the clear button 37 is clicked, so that the selected parameter file, pattern file, or job is
Deleted from each folder.

The job creation button 48 is a button for creating a job from the selected parameter file and a pattern file stored in the same folder as the parameter file. Here, the job is a file indicating execution of the optical proximity effect correction processing by the OPC software based on the parameters in the parameter file.

The job command list display section 49
Is a display unit for displaying the jobs in a list. In the job command list display unit 49, a scroll bar 49a and a scroll box 49b are displayed on the right side. When displaying a job that cannot be displayed on the job command list display unit 49 in the job list, Mouse 21 and keyboard 22
By operating the scroll bar 49a by using, the desired job can be displayed on the job command list display section 49.

The command number display section 50 includes:
When a job is selected, the order (number) of the selected job in the list and the total number of jobs in this job list are displayed. On the other hand, if no job is selected, the command number display section 50
Displays the total number of jobs in the job list.

As shown in FIG. 3, while the job is being executed, the execution / stop button 51
"p" is displayed, and serves as a button for stopping the execution of the job. On the other hand, when the job is not being executed, for example, “Run” is displayed, and this is a button for starting the execution of the job.

The stream creation button 52 is a button for the corrected pattern file 3 obtained as a result of executing the job.
A button for instructing execution of a conversion process for converting 3a to 33n into one and converting it into a GDS II stream file 34 based on the GDS II format.

The end button 53 is a button for ending the execution of the OPC software. The OPC software can be ended by clicking the end button 53 using the mouse 21 or the like. The same operation can be performed by clicking the end button 40c described above.

Next, a processing method for executing the optical proximity effect correction in the above-described GUI will be specifically described below with reference to a flowchart and a GUI screen.
FIG. 4 shows a flowchart when this optical proximity effect correction is executed, and FIGS. 5 to 12 show the state of the GUI screen when this optical proximity effect correction is executed.

As shown in FIG. 4, in the optical proximity effect correction according to the first embodiment, first, in step S1, a plurality of pattern files and one parameter file are prepared. That is, a plurality of pattern files and one parameter file to be applied to the plurality of pattern files are put in one predetermined folder in advance. In the first embodiment, as shown in FIG. 5, the folder “LOC” on the GUI screen is displayed.
For example, a pattern file of a pattern shape used for patterning when executing the LOCOS method and a parameter file in which conditions for performing the optical proximity effect correction on the pattern file are stored. Also, a plurality of pattern files and one parameter file are stored in a folder “1PS” (not shown). Thereafter, the process proceeds to step S2 shown in FIG.

In step S2, a folder in which the prepared files are stored is specified. In the first embodiment, as shown in FIG. 5, on the GUI screen, the folder “S252
1 is selected by clicking on the folder “LOC” included in “1”. As a result, the folder "LOC"
Are highlighted, and the parameter files included in the folder “LOC” are displayed on the parameter file list display section 43. Here, the parameter file “loc.prm” is displayed. Similarly, the folder “1PS” included in the folder “S2521” is selected. As a result, the folder “1”
PS ”is highlighted and the folder“ 1P
The parameter file included in "S" is displayed on the parameter file list display section 43. When the folder “1PS” is selected, the parameter file “1ps.pr” is displayed in the parameter file list display section 43.
m ”(not shown) is displayed. Thereafter, the process proceeds to step S3 shown in FIG.

In step S3, a desired parameter file is specified. In the first embodiment, as shown in FIG. 6, the folder “1P” included in the folder “S2521” is
After clicking "S" to specify, the parameter file "1p" displayed in the parameter file list display section 43 is displayed.
s. Click "prm". As a result, the parameter file “1 ps.prm” is specified, and the specified and selected parameter file is displayed in the selected parameter file list display section 45 in a hierarchical structure from the HDD “C” to the parameter file “1 ps.prm”. Displayed with

Similarly, as shown in FIG. 7, the folder “LO” included in the folder “S2521” is displayed.
After specifying "C", the parameter file list display section 4
Parameter file "loc.prm" displayed in 3
Click. Thereby, the parameter file “l”
oc. "prm" is specified, and the specified and selected parameter file "loc.prm" is displayed in the selected parameter file list display section 45 together with the hierarchical structure from the HDD "C" to the parameter file "loc.prm". You.

At this stage, confirmation and editing of the parameter file can be performed as necessary. That is, for example, by using the mouse 21 and clicking the parameter file “1 ps.prm” displayed in the selection parameter file list display section 45 shown in FIG. 7, the parameters in the optical proximity effect correction are displayed as shown in FIG. An editing window 54 for editing is opened. The editing window 54 displays information on parameters necessary for the optical proximity effect correction, such as exposure conditions such as resolution and multiple exposure, mask-related parameters such as simulation, and precision-related and correction-related parameters. By opening the editing window 54 in this way, the parameter information of the parameter file “1 ps.prm” can be confirmed, and if necessary, the parameters can be changed or corrected to edit them. It can be carried out.

As described above, after the selected parameter file is displayed on the selected parameter file list display section 35, or the parameter file is confirmed and edited in the editing window 54, the process proceeds to step S4 shown in FIG. Transition.

In step S4, for example, the mouse 2
A job is created by clicking the job creation button 48 using 1. That is, as shown in FIG. 9, first, the stream creation button 52 is clicked using the mouse 21, for example. As a result, the selected 1 file displayed on the selection parameter file list display section 45 is displayed.
A job is created by combining one parameter file “1ps.prm” and a plurality of pattern files included in the same folder “1PS” as the parameter file “1ps.prm”. At this time, the created job file is stored in the lower folder “result” included in the folder “1PS” and is displayed on the job command list display section 49.

Subsequently, the selected parameter file “loc.prm” displayed in the selected parameter file list display section 45 and the same folder “LOC” as the parameter file “loc.prm” are included. The job is created by combining a plurality of pattern files. At this time, the created job file is stored in the lower-level folder “result” included in the folder “LOC” and is displayed on the job command list display section 49.

When a job is created, the command number display section 50 displays the total number of created jobs. Thereafter, the process proceeds to step S5 shown in FIG.

In step S5, by executing the job created in step S4, optical proximity correction is performed on a plurality of pattern files included in the folder "1PS" and the folder "LOC". That is, as shown in FIG.
The created job is executed by clicking on the execution / stop button 51 using. This highlights the job being executed, and
The display of the stop button 51 changes from “Run” to “Stop”. At this time, the order of the executed and highlighted jobs in the list is displayed in the command number display section 5.
0 is displayed, and the progress of job execution can be checked. In addition, if necessary, "Sto
By clicking the execution / stop button 41 displayed as "p", the execution of the job can be stopped.

Thereafter, when the execution of the job is completed, the corrected pattern file obtained by applying the parameter file “1 ps.prm” by the optical proximity correction to the plurality of pattern files stored in the folder “1PS” Is created. At the same time, the folder "LOC"
For a plurality of pattern files included in the parameter file “loc.pr
A pattern file to which “m” is applied is created. At this time, the display of the execution / stop button 41 changes from “Stop” to “Run”. Thereafter, step S6 shown in FIG.
Move to

In step S6, the GDS II stream file 36 is created by combining the pattern files that have been subjected to the optical proximity correction by executing the job and converting them into the GDS II format. That is, as shown in FIG.
By clicking the stream creation button 52,
As shown in FIG. 12, a file name setting dialog box 60 is displayed. In the file name setting dialog box 60, a folder display section 61 in which the name of the folder to be saved is displayed, a button 62 for shifting to a folder in an upper layer of the hierarchical structure, a button 63 for creating a new folder, A display unit 64 for displaying lower-level folders and files included in the folder displayed on the folder display unit 61, and a button 65a for specifying a display method of the folders and files displayed on the display unit 64 65b, a file name input section 66 for inputting a file name, a file type input section 67 for specifying a file type, and a save button 68 for storing in a folder displayed on the folder list display section 61 , A cancel button 69 for canceling the save,
And a check box 70 for setting a file to be saved as a read-only file. Then, the setting dialog box 60 thus configured
A desired file name (eg, “S2
521 OPC. “str”) and clicking the save button 68 creates one file “S2521OPC.str” based on the GDS II format. Then, the file “S2521OPC.s
“tr” is stored in the folder “output”.

As described above, the optical proximity correction is performed, and one file “S2521OPC.str” is created as the GDS II stream file 36. The file is then subjected to mask data processing including graphic calculation processing and Perform format conversion processing. Thus, EB drawing data for an electron beam (EB) drawing apparatus for forming a photomask is created.

Thereafter, the EB drawing data is supplied to an EB drawing apparatus, and a photomask having a pattern based on the EB drawing data is manufactured by a conventionally known method. Then, a semiconductor device is manufactured using the photomask manufactured as described above. Accordingly, even when a semiconductor device having a small design rule, for example, a semiconductor device having a 0.18 μm rule is manufactured, a high manufacturing yield can be obtained.

As described above, according to the first embodiment, a plurality of pattern files and one parameter file in which parameters for optical proximity effect correction performed on the plurality of pattern files are recorded. Are stored in the same folder, a plurality of jobs corresponding to the plurality of pattern files 30 are created from the plurality of pattern files 30 and one parameter file 31 stored in this folder, and these jobs are sequentially described. Run,
Since the optical proximity effect correction is performed on a plurality of pattern files, it is not necessary to repeatedly perform the same setting on the pattern file and the parameter file. Therefore, when performing the optical proximity correction, the processing efficiency of a large amount of data can be dramatically improved, and the time required for the development and design of a device pattern and the like can be greatly reduced.

Next, a processing method of optical proximity effect correction according to the second embodiment of the present invention will be described. Note that the configuration of a system used when performing the optical proximity effect correction according to the second embodiment is the same as that of the first embodiment, and thus the description is omitted. A processing method for performing optical proximity correction on a predetermined pattern using the system shown in FIG. 1 will be described below. FIG. 13 shows a flowchart of the entire process of the optical proximity effect correction according to the second embodiment.

As shown in FIG. 13, in the optical proximity effect correction according to the second embodiment, a plurality of parameter files 72 (7
2a, 72b,..., 72i,..., 72n) to perform the optical proximity effect correction 73.

The result when the optical proximity effect correction 73 is performed by applying a plurality of parameter files 72 to one pattern file 71 is obtained as a corrected pattern file 74. Here, the parameter file 72
Is composed of exposure conditions such as resolution and multiple exposure necessary for optical proximity effect correction, and parameters such as mask-related, accuracy-related, and correction-related.

The shape of the pattern actually formed when exposure is performed using the pattern file 71 before correction and the pattern actually formed when exposure is performed using the pattern file 74 after correction. The result of calculating the shape of the pattern by simulation is obtained as a simulation result file 75 before and after correction. By displaying the data of the simulation result file 75 before and after the correction on the CRT 16 via the CRT controller 8 shown in FIG. 1, it is possible to confirm the correction result 76. In FIG. 13, only the pattern file 74a after correction and the simulation result file 75a before and after correction are shown, and the parameter file 74 other than the parameter file 74a and the simulation result after correction other than the simulation result file 75a before and after correction are shown. The file 75 is not shown.

After performing the optical proximity correction by applying the parameter files 72a to 72n to the pattern file 71, all the corrected pattern files 74 (74
a, ..., 74i, ..., 74n) are, for example, GDS
It is converted to an II stream file 77. This allows
The design pattern data for the CAD data corrected by the optical proximity effect correction is obtained.

Next, the optical proximity effect correction according to the second embodiment will be specifically described with reference to a flowchart and a GUI screen. FIG. 14 shows a flowchart when the optical proximity effect correction is executed, and FIGS.
FIG. 22 shows a state of the GUI screen when the optical proximity effect correction is performed. Note that the GUI is the same as in the first embodiment, and a description thereof will be omitted. Also,
In the second embodiment, the pattern to be subjected to the optical proximity correction is, for example, a test pattern having a predetermined shape.

As shown in FIG. 14, in the optical proximity effect correction according to the second embodiment, first, in step ST
In step 1, a plurality of parameter files and one pattern file are prepared. That is, a plurality of parameter files 72 and one pattern file 71 are put in one predetermined folder in advance. In the second embodiment, one pattern file “T” is added to the folder “DATA1” on the GUI screen shown in FIG.
EST. cel "and the pattern file" TES
T. A plurality of parameter files in which parameters for performing the optical proximity effect correction on “cel” are stored in advance. Thereafter, the process proceeds to step ST2.

In step ST2, a folder in which the prepared files are stored is specified. This second
In the embodiment, as shown in FIG. 15, on the GUI screen, the folder “DA” is
Click “TA” to display the folder “DATA1” included in the folder “DATA”, and then click the folder “DATA1”. As a result, the folder “DATA1” is highlighted, and the parameter files included in this folder are displayed on the parameter file list display section 43. Here, 6
One parameter file is displayed. Also, the pattern file “TE” included in the folder “DATA1”
ST1. “cel” is the pattern file list display section 44
Will be displayed. Thereafter, the process proceeds to step ST3 shown in FIG.

In step ST3, a desired pattern file is specified. That is, as shown in FIG. 16, the pattern file “TEST” displayed on the pattern file list
1. cel "and click the pattern file" TE
ST1. cel ". As a result, the selected pattern file is displayed in the selected pattern file list display section 46 from the HDD “C” in the parameter file “TE”.
ST1. It is displayed together with the hierarchical structure up to “cel”.

In the same manner, the folder "DATA"
Specify the folder “DATA2” included in the file and click the pattern file “TEST2.cel”
Specify the pattern file “TEST2.cel”.
After that, the folder “DATA3” included in the folder “DATA” is designated, and the pattern file “TEST” is specified.
3. cel "and click the pattern file" TE
ST3. cel ". By repeatedly performing the click as described above, as shown in FIG.
The selected pattern file “TEST2.cel” and the pattern file “TEST3.cel” are displayed on the selected pattern file list display section 46, respectively, in the HD.
D “C” and these pattern files “TEST2.
cel "and the pattern file" TEST3.ce "
The display is sequentially performed together with the hierarchical structure up to “l”.

At this stage, the pattern file can be checked and edited as needed. That is, for example, the pattern file “TEST” displayed on the selected pattern file list display section 46 shown in FIG.
1. "cel" with the mouse 21, for example, as shown in FIG.
8 is displayed. In the editing window 78, the pattern shape of the data included in the pattern file “TEST1.cel” is displayed. Then, the information of the pattern file “TEST1.cel” is confirmed, and editing such as change or correction of the pattern can be performed.

As described above, after the selected pattern file is displayed in the selected pattern file list display section 46 or the editing window 78 is displayed to confirm or edit the selected pattern file, FIG.
The process proceeds to step ST4 shown in FIG.

In step ST4, a job for optical proximity correction is created. That is, as shown in FIG.
Click. As a result, the selected pattern file “TEST1.cel” displayed on the selected pattern file list display section 46 and the same folder “DATA1” as the pattern file “TEST1.cel”
The job is created by combining a plurality of parameter files included in the job. The created job file is stored in the lower-level folder “result” included in the folder “DATA1” and is displayed on the job command list display section 49.

Also, the selected pattern file “TE
ST2. cel "and the pattern file" TEST
2. The job is created by combining a plurality of parameter files included in the same folder “DATA2” with “cel”. The created job file is stored in a lower folder “r” included in the folder “DATA2”.
esult "and the folder" DAT
Following the job stored in the folder “result” included in “A1”, it is displayed on the job command list display section 49.

Further, the selected pattern file “TE
ST3. cel "and the pattern file" TEST
3. A job is created by combining a plurality of parameter files included in the same folder “DATA3” with “cel”. The created job file is stored in the lower folder “r” included in the folder “DATA3”.
esult "and the folder" DAT
Following the job stored in the folder “result” included in “A2”, it is displayed on the job command list display section 49.

The command number display section 50 displays the total number of created jobs. Thereafter, the process proceeds to step ST5 shown in FIG.

In step ST5, step ST5
The optical proximity effect correction is performed by executing the job created in step 4. That is, as shown in FIG.
For example, by clicking the execution / stop button 51 using the mouse 21, the job command list display section 4 is displayed.
9 is executed. Thereby, the pattern file “TEST1.cel”, the pattern file “TEST2.cel” and the pattern file “TE
ST3. cel "is subjected to the optical proximity correction. At this time, the executed job is highlighted, and the execution / stop button 51 is displayed as “R
un "to" Stop ". The order in the list of executed and highlighted jobs is displayed in the command number display section 50 together with the total number of created jobs.
And the progress of the job execution can be checked. The execution of the job can be stopped by clicking the execution / stop button 51 displayed as “Stop”.

When the execution of the job is completed, the pattern file “TEST1.cel”, the pattern file “TEST3.cel” and the pattern file “TEST1.cel” included in the folder “DATA1”, the folder “DATA2” and the folder “DATA3” are obtained. File "TE
ST3. A corrected pattern file is created by applying a plurality of parameter files stored in the same folder to “cel”. At the same time, the display of the execution / stop button 51 changes from “Stop” to “Run”. Thereafter, step S shown in FIG.
The process moves to T6.

In step ST 6, the pattern files subjected to the optical proximity effect correction by executing the job are combined into one and converted into the format of the GDS II stream file 77. That is, as shown in FIG.
For example, using the mouse 21, a stream creation button 52
By clicking, as shown in FIG.
A file name setting dialog box 60 similar to that in the embodiment is displayed. Then, a desired file name (for example, “test”) is input to the file name input section 66 of the setting dialog box 60 using, for example, the mouse 21 or the keyboard 22. Then, by clicking the save button 68, a file “test.str” is created as a GDS II stream file 77, and is saved in the folder “Output”.

The optical proximity effect correction is performed as described above, and the GDS II format file “test.st”
r ”, then create this file“ test.str ”
By performing mask data processing including graphic operation processing and format conversion processing, EB drawing data for an electron beam (EB) drawing apparatus for forming a photomask is generated.

Thereafter, the EB drawing data is supplied to an EB drawing apparatus, and a photomask having a pattern based on the EB drawing data is manufactured by a conventionally known method. Then, a semiconductor device is manufactured using the photomask manufactured as described above.

As described above, according to the second embodiment, a plurality of parameter files 72 for optical proximity effect correction and a pattern for which optical proximity effect correction is performed based on the plurality of parameter files are recorded. Has been 1
One pattern file 71 is stored in the same folder, a plurality of jobs corresponding to the plurality of parameter files 72 are created from the plurality of parameter files 72 and one pattern file 71, and these jobs are individually executed. Thus, the optical proximity effect correction is performed by applying a plurality of parameter files 72 to one pattern file 71, so that optimum parameters can be easily obtained for a predetermined pattern file. This eliminates the need to repeatedly perform complicated settings. As a result, the processing efficiency of a large amount of data when executing the optical proximity effect correction can be significantly improved, and the time required for the development and design of a device pattern and the like can be greatly reduced.

Although the embodiments of the present invention have been specifically described above, the present invention is not limited to the above embodiments, and various modifications based on the technical concept of the present invention are possible.

For example, the numerical values given in the above embodiments are merely examples, and different numerical values may be used as needed.

For example, in the first embodiment,
LOC is used as a pattern file for optical proximity correction.
Although the pattern file of the pattern used in the OS method was used, it is needless to say that a pattern file such as a wiring pattern and a contact hole pattern can be used as a pattern file for performing the optical proximity effect correction. It can be applied to the pattern files of all the patterns.

In the first and second embodiments, for example, the designation of folders and files and the designation of various buttons are performed using the mouse 21, but the designation of folders and files is performed using the keyboard 22. It is also possible to specify.

Further, for example, in the above-described first and second embodiments, the CRT 16 is used as the display means, but a liquid crystal display or the like may be used. Also, the functions of the display unit such as the CRT 16 and the mouse 2
It is also possible to use a touch panel or the like having both functions of an operation unit such as the keyboard 1 and the keyboard 22.

[0088]

As described above, according to the first aspect of the present invention, the proximity effect correction is performed by applying one parameter data to a plurality of pattern data. When processing a large amount of data, the processing speed can be improved. Therefore, the time required for manufacturing a photomask and developing and designing a layout of a pattern required for manufacturing a semiconductor device can be significantly reduced.

Further, according to the second aspect of the present invention, the proximity effect correction is performed by applying a plurality of parameter data to one pattern data, so that a large amount of data can be processed. The processing speed can be greatly improved, and optimal parameter data can be allocated to predetermined pattern data in a short time. Therefore, the time required for manufacturing a photomask and developing and designing a layout of a pattern required for manufacturing a semiconductor device can be significantly reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a system for executing optical proximity effect correction according to a first embodiment of the present invention.

FIG. 2 is a flowchart for explaining optical proximity effect correction according to the first embodiment of the present invention.

FIG. 3 is a schematic diagram illustrating a configuration of a GUI screen for executing optical proximity effect correction according to the first embodiment of the present invention.

FIG. 4 is a flowchart showing an operation of a GUI for executing optical proximity correction according to the first embodiment of the present invention.

FIG. 5 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the first embodiment of the present invention.

FIG. 6 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the first embodiment of the present invention.

FIG. 7 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the first embodiment of the present invention.

FIG. 8 is a schematic diagram showing an editing window for confirming or editing parameters in a parameter file according to the first embodiment of the present invention.

FIG. 9 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the first embodiment of the present invention.

FIG. 10 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the first embodiment of the present invention.

FIG. 11 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the first embodiment of the present invention.

FIG. 12 is a schematic diagram illustrating a setting dialog box for performing processing for saving a GDS II stream file according to the first embodiment of the present invention.

FIG. 13 is a flowchart for explaining optical proximity effect correction according to the second embodiment of the present invention.

FIG. 14 is a flowchart for explaining a GUI operation for executing optical proximity correction according to the second embodiment of the present invention.

FIG. 15 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the second embodiment of the present invention.

FIG. 16 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the second embodiment of the present invention.

FIG. 17 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the second embodiment of the present invention.

FIG. 18 is a schematic diagram illustrating an editing window in which a pattern shape of a pattern file on which optical proximity correction processing is performed according to the second embodiment of the present invention is displayed.

FIG. 19 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the second embodiment of the present invention.

FIG. 20 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the second embodiment of the present invention.

FIG. 21 is a schematic diagram illustrating a GUI screen for executing optical proximity effect correction according to the second embodiment of the present invention.

FIG. 22 is a schematic diagram illustrating a setting dialog box for performing processing for saving a GDS II stream file according to the second embodiment of the present invention.

[Explanation of symbols]

16 CRT, 21 mouse, 22 keyboard, 30, 30a, 30b, 30i, 30n, 71
... Pattern files, 31, 72, 72a, 72
b, 72i, 72n ... parameter file, 32,
73 ・ ・ ・ Optical proximity effect correction, 36, 77 ・ ・ ・ GDS II stream file

Claims (6)

[Claims] 1. A pattern data after correction is created by applying parameter data for proximity effect correction to the pattern data and performing the proximity effect correction on the pattern data. Performing format conversion on the pattern data to create design pattern data, creating drawing data based on the design pattern data, and manufacturing a semiconductor device using a photomask manufactured based on the drawing data In the method of manufacturing a semiconductor device, a step of storing the pattern data in a storage unit, a step of storing the parameter data in a storage unit, and a step of storing a plurality of pattern data from the pattern data stored in the storage unit Selecting; and the parameters stored in the storage means. From over data 1
Selecting one parameter data; and performing the proximity effect correction on the plurality of pattern data by applying the one parameter data to obtain a plurality of corrected patterns corresponding to the plurality of pattern data. And a step of creating data. 2. The method according to claim 1, wherein the proximity effect correction is an optical proximity effect correction. 3. In order to select said pattern data and / or select said parameter data, said pattern data and / or said parameter data are displayed on a display means, and said plurality of pattern data and / or 2. The method according to claim 1, wherein the one parameter data is stored and displayed in the same folder. 4. Applying parameter data for proximity effect correction to the pattern data and performing the proximity effect correction on the pattern data to create corrected pattern data, Creating design pattern data by performing format conversion on the pattern data, creating drawing data based on the design pattern data, and manufacturing a semiconductor device using a photomask manufactured based on the drawing data. In the method for manufacturing a semiconductor device, the step of storing the pattern data in a storage unit, the step of storing the parameter data in a storage unit, and the step of storing one pattern data from the pattern data stored in the storage unit Selecting; and the parameters stored in the storage means. Selecting a plurality of parameter data from the data, and performing the proximity effect correction by applying the plurality of parameter data to the one pattern data, thereby obtaining a plurality of parameter data corresponding to the plurality of parameter data. Creating a corrected pattern data. 5. The method according to claim 4, wherein said proximity effect correction is optical proximity effect correction. 6. In order to select said pattern data and / or select said parameter data, said pattern data and / or said parameter data are displayed on a display means, and said plurality of pattern data and / or 5. The method according to claim 4, wherein said one parameter data is stored and displayed in the same folder.