JP2001024037A - Method and apparatus for detecting wire bonding failure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable continuous production without detecting bonding failure troubles, even when the bonding process is applied to unconnected pads. SOLUTION: A potential difference between the top end of a bonding tool 22 and a ground GND of a wire bonder 20 in a normal pad bonding process is held beforehand as a normal voltage. If the potential difference between the top end of the bonding tool 22 and the ground GND of the wire bonder 20 disagrees with the normal voltage in the bonding process, a decision circuit 13 cannot receive a normal voltage detect signal outputted from a normal board detector circuit 11 during the bonding process, hence a cancel instruction is sent to a bonding failure detector circuit 12. According to this cancel instruction, the bonding failure detector circuit 12 omits for the pads a bonding failure detection process of wire bonding which is to be executed, whenever the bonding process ends and the tool leaves the pads.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding non-bonding detection method and apparatus for inspecting wire bonding non-bonding through a wire bonded to a pad and a wire bonding apparatus, and more particularly to an IC.
Wire bonding non-bonding detection method that can detect the non-bonding of wire bonding and prevent continuous processing of wire bonding when wire bonding is performed to a non-connection (non-connection) pad that is not connected to the internal circuit of the chip And its device.

[0002]

2. Description of the Related Art Conventionally, as this kind of wire bonding non-attachment detecting device, for example, there is one as shown in FIG. In FIG. 5, the bonding non-attachment detection device 100
However, on the other hand, it is electrically connected to the wire 21 from the power supply 28 via the cut clamp 27, and the tip of the wire 21 is further held by the bonding tool 22. On the other hand, the bonding failure detection device 100 is connected to the ground (GND).

During the bonding process, the tip of the wire 21 is attached to the IC chip 24 by the bonding tool 22.
In contact with the electrode pad 23 of the first embodiment. Therefore, the wire 21
Of the bonding plate is connected to the electrode pad 23 connected to the circuit inside the IC chip 24 from the heat plate 26 of the bonding apparatus.
An electric circuit is formed on the ground (GND) through the circuit.

Normally, a voltage of about 1 volt to 3 volts is applied to the wire 21 by the power supply 28. Therefore, in the bonding non-adhesion detecting device 100, the voltage is generated during the bonding process in which the tip of the wire 21 contacts the electrode pad 23. Voltage can be detected. When the voltage detected during the bonding process is held as a normal voltage in the case of the normal electrode pad 23 connected to the internal circuit of the IC chip 24, the voltage at each scene in the bonding process is set to this normal voltage. Can be compared. For example,
After bonding is completed, the tool 22 is moved to the normal electrode pad 2
Even when the wire 21 is separated, since the circuit is formed until the wire 21 is cut, the normal voltage is detected by the bonding / non-bonding detection device 100.

Next, a wire bonding step will be described with reference to FIG.

As shown in FIG. 6, in a wire bonding step in an assembling step which is a post-process of semiconductor manufacturing, an IC chip 24 manufactured in a diffusion process which is a pre-process is performed.
In order to electrically connect the electrode pads 23 and the internal terminals of the lead frame 25 forming the external terminals of the IC package, for example, wires 21 such as high-purity gold (Au) wire or aluminum (Al) wire are used. The connection is made by using.

[0007] The wire bonding process for one wire 21 includes processes such as primary bonding (B), wiring (C), secondary bonding (D), and wire cutting (E). The primary bonding (B) is a process of bonding the wire 21 to the electrode pad 23 on the IC chip 24. Wiring (C) is a process in which, after the primary bonding (B), the wires 21 are passed over the internal terminals of the lead frame 25. Also,
The secondary bonding (D) is a process of bonding the wire 21 to an internal terminal of the lead frame 25, and the wire 21 is cut by the wire cutting (E). In this series of processes, the bonding to one wire 21 is completed, the bonding process is performed for the number of input / output leads required for each type of IC, and the wire bonding process for one IC is completed.

[0008] A defect which is chronically generated in the wire bonding step is a non-bonding (disconnection) defect in the primary or secondary bonding step. In the assembling process, this defect can be found only in the next appearance process or the screening process based on the final electrical characteristic check. Therefore, the detection of the defect is delayed, and in some cases, the defect is produced in a large amount. In order to solve this problem, it has been required to provide an inspection process for detecting a defect during the bonding process and to provide feedback to the manufacturing conditions at an early stage to prevent the formation of the defect. As a solution to this, a wire bonding non-attachment detection device has been developed.

Conventionally, as this kind of wire bonding non-attachment detecting device, for example, there is one as shown in FIG. In FIG. 7, the normal voltage detection circuit 111 of the bonding non-attachment detection device 110 electrically connects the wire 21 to be bonded to the bonding wire 21 via the cut clamp 27 (see FIG. 5) in the state of the bonding process with reference to FIGS. The tip of the wire 21 held by the bonding tool 22 forms an electric circuit with the ground (GND) of the bonding apparatus 20. In the state in the middle of the bonding process, the wire 21 is bonded to the electrode pad 23 (see FIG. 5), and the normal voltage detection circuit 111 applies a reference voltage to detect a normal voltage obtained through the wire bonding apparatus 20. To detect.

That is, as shown in FIG. 8, in the case of a normal pad, the normal voltage detecting circuit 111 detects a normal voltage during each of the primary bonding and the secondary bonding. Further, when the bonding process is completed normally, since the wire 21 is adhered to the electrode pad 23 (see FIG. 5), the normal voltage detection circuit 111 performs the non-bonding performed during the wiring process or until the wire cutting. Normal voltage is also detected at the time of detection.

However, when the bonding in the bonding process is incomplete and the wires are not bonded, the normal voltage is detected between the wire 21 at the tip of the bonding tool 22 and the ground (GND) of the wire bonding apparatus 20 in the circuit. Circuit is disconnected, the normal voltage detection circuit 11
No. 1 cannot detect the above normal voltage value. Therefore, the non-attachment detection circuit 112 of the bonding non-attachment detection device 110 performs the non-attachment inspection during the non-attachment detection time during the wiring process in which the primary bonding or the secondary bonding process is completed or until the wire cutting, and the normal voltage detection circuit 111 If the detection notification of the normal voltage value is not received, it is determined that the wire bonding is not attached,
Send a non-delivery notice to suspend production.

Some types of ICs do not necessarily use all inputs and outputs, but use only the inputs and outputs necessary for each user. However, in the case of an IC that uses only necessary inputs and outputs, a connection coordinate program for wire bonding may be created for each type of IC for a small number of inputs and outputs.
However, since a large number of design steps or costs are required for a program for each type of IC, a common program that is somewhat unified is used. For this reason, bonding may be performed to unconnected pads that are not actually used as inputs and outputs.

For example, in FIG.
In the case of the primary bonding (B) and the wiring (C), the normal voltage detection circuit 111 of the wire bonding non-bonding detection device 110 shown in FIG. To be connected through the ground (GN
Normal voltage cannot be detected for D).

On the other hand, since the non-attachment detection circuit 112 performs the non-attachment inspection immediately after the completion of the bonding process shown in FIG. 8, the non-attachment detection is erroneously determined irrespective of whether the bonding process is normal. Therefore, a non-delivery failure notification is sent out due to this erroneous determination, so that a temporary stoppage of production occurs, making practical continuous production impossible.

[0015]

The above-described conventional method for detecting non-bonding of wire bonding and the apparatus therefor have a problem in that a temporary stop of production occurs and a state in which continuous production is virtually impossible occurs. .

The reason for this is that when performing bonding processing on pads, non-bonding detection is performed immediately after the bonding process. In such a configuration,
If there is a disconnection pad in the input / output of the wire bonding target and the bonding process is also performed on the disconnection pad according to the common program, a non-return failure is detected in a non-return inspection immediately after the bonding process. This is because stoppage occurs.

An object of the present invention is to solve such a problem and to provide a wire bonding non-bonding detection method and apparatus capable of continuous production without detecting a non-bonding failure even when bonding processing is performed to a non-connection pad. To provide.

[0018]

According to the present invention, there is provided a wire bonding non-bonding detecting method for performing a wire bonding non-bonding inspection with a wire bonding apparatus via a wire bonded to a pad. A potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus is previously held as a normal voltage in a bonding process in which the bonding tool is in contact with the connected normal pad, and the bonding tool makes contact with the pad. During the bonding process, the potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus is compared with the normal voltage to determine a match / mismatch. are doing. Specifically, the wire bonding non-bonding detection processing is executed only when the collation matches when the bonding tool is separated from the pad, or when the collation does not match, the wire bonding non-bonding detection processing is performed. Is preferable. .

Further, the wire bonding non-attachment detecting device according to the present invention is for inspecting wire bonding non-bonding with a wire bonding device via a wire bonded to a pad, and an internal circuit is connected. Normally, a potential difference between the tip of the bonding tool and the ground of the wire bonding device in a bonding process in which the bonding tool is in contact with the pad is held as a normal voltage in advance, and the tip of the bonding tool and the wire bonding device are held. A normal voltage detection circuit that compares a potential difference between the normal voltage with the normal voltage and outputs a match / mismatch check result;
During the bonding process in which the bonding tool contacts the pad, the first matching result is received from the normal voltage detection circuit. If the first matching result matches, it is determined to be normal. A determination circuit that determines the connection and outputs this determination result, and when the determination result received from the determination circuit is normal, receives a second comparison result from the normal voltage detection circuit after the bonding process ends,
This wire bonding is determined to be normal if the second collation result is coincident, and if not, it is determined that a non-attachment failure has been detected and a non-attachment detection process of notifying the outside is performed. And a non-attachment detection circuit for canceling the non-attachment detection process when the received judgment result indicates a non-connection.

According to this method or configuration, the non-bonding inspection is performed only on the normal pads without performing the non-bonding inspection on the bonding of the non-connected pads. Therefore, the bonding of the non-connected pads is performed in a continuous bonding process. However, the bonding to the normal non-connection pad is not erroneously detected as non-bonding. Therefore, it is possible to prevent a situation in which a temporary stoppage of production occurs due to notification of an erroneous non-delivery failure, thereby making practical continuous production impossible.

Further, as a specific configuration, the above-described normal voltage detection circuit is provided when the matching information is received as a first comparison result from the normal voltage detection circuit during a bonding process in which a bonding tool contacts a pad. A determination circuit for outputting a non-attachment detection execution signal; and a second circuit from the normal voltage detection circuit after the bonding process is completed only when the non-adhesion detection execution signal is received from the determination circuit.
And a non-attachment detection circuit for judging that the second collation result is normal when the second collation result matches, and for notifying the non-delivery failure detection and notifying the outside when the second collation result does not match. A determination circuit for outputting a cancellation signal for non-attachment detection to the non-attachment detection circuit when receiving non-coincidence information as a first comparison result from the normal voltage detection circuit during a bonding process in which a bonding tool contacts a pad. The non-attachment detection circuit may be configured to omit the non-attachment detection process after the completion of the bonding process when receiving the cancel signal from the determination circuit.

[0022]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a functional block diagram showing an embodiment of the present invention. The wire bonding non-attachment detection device 10 shown in FIG. 1 includes a normal voltage detection circuit 11, a non-attachment detection circuit 12, and a determination circuit 13. The difference from FIG. 7 that describes the related art is that a determination circuit 13 is added and the determination information is sent to the non-attachment detection circuit 12.
Therefore, the wire-bonding non-bonding detection device 10 shown in FIG. 1 is replaced with the wire-bonding non-bonding detection device 100 in FIG. It is assumed that the wire bonding apparatus 20, the wire 21, the bonding tool 22, and the like shown in FIG. 1 have the same configuration as that shown in FIG.

FIG. 2 is a diagram obtained by adding a state of a non-connection pad to FIG.

The components in FIG. 1 will be described with reference to FIGS. 1 and 2 and FIGS. 5 and 6 together.

The normal voltage detecting circuit 11 of the bonding non-attachment detecting device 10 electrically connects the wire 21 to be bonded to the tip of the bonding tool 22 via the cut clamp 27 as a state of the bonding process. 20 grounds (GN
D) to detect the potential difference with respect to the ground (GND) at the tip of the bonding tool 22. In the state of the bonding process, the wire 21 is adhered to a normal electrode pad 23 connected to the internal circuit of the IC chip 24, and the normal voltage detection circuit 11 outputs a predetermined normal voltage value obtained by adding a reference voltage. And outputs a normal voltage detection signal to the non-attachment detection circuit 12 and the determination circuit 13.

That is, as shown in FIG. 2, the normal voltage detecting circuit 11 detects a normal voltage with respect to the normal pad during each of the primary bonding and the secondary bonding. Further, when the processing of the bonding process is completed normally, since the wire 21 is adhered to the electrode pad 23, the normal voltage detection circuit 11 detects the non-attachment performed during the wiring process or until the wire cutting. Also, a normal voltage is detected and a normal voltage detection signal is transmitted.

However, the electrode pads 23 are
In the case of a non-connected pad not connected to the internal circuit of FIG. 5, in the process of the primary bonding (B) and the wiring (C), there is no circuit formation inside the IC chip 24 shown in FIG. The normal voltage detecting circuit 11 cannot detect the normal voltage. Also, at the time of non-bonding detection after the normal bonding process is completed, the normal voltage detection circuit 11 of the bonding non-bonding detection device 10 detects the predetermined normal voltage value as in the case where the bonding by the bonding process is incomplete. Since it cannot be detected, a normal voltage detection signal cannot be transmitted.

The non-attachment detection circuit 12, as in the prior art, is used when a predetermined normal voltage detection signal is obtained from the normal voltage detection circuit 11 at the time of non-adhesion detection after the completion of bonding obtained from the bonding process information of the wire bonding apparatus 20. Outputs a non-delivery failure when a normal voltage detection signal is not obtained. The difference from the related art is that when the non-delivery detection circuit 12 receives a cancel instruction from the determination circuit 13, the non-delivery inspection is omitted at the non-delivery detection time and is not executed.

When a predetermined normal voltage detection signal is obtained from the normal voltage detection circuit 11 during the bonding process obtained from the bonding process information of the wire bonding apparatus 20, the judgment circuit 13 determines that the bonding to the normal pad has been performed. "Normal", and when no normal voltage detection signal is obtained, each of "non-connection" is determined as bonding to the non-connection pad, and in the non-connection determination of bonding to the non-connection pad, cancellation is instructed to the non-attachment detection circuit 12. .

With this configuration, when the bonding partner is determined to be a non-connection pad during the bonding process, the non-attachment detection circuit receives an instruction to cancel the non-attachment detection. As described above, no non-delivery detection is performed at the non-delivery detection time. Therefore, there is no non-delivery failure notification sent to the outside, so that a temporary stop of production can be avoided for bonding to a non-connection pad, and continuous bonding processing can be performed.

Next, referring to FIG. 3 and FIG. 1 and FIG.
Will be described.

In the wire bonding non-bonding detecting device 10, the normal voltage detecting circuit 11 measures a potential difference between the tip of the wire 21 to be bonded and the ground (GND) of the wire bonding device 20, and performs a bonding process for a normal pad. Is held internally as a predetermined normal voltage, and the above-mentioned potential difference value measured at each progress of the bonding process is compared with the above normal voltage and output as a normal voltage detection signal when they match. .

First, when a signal indicating the start of the bonding process (step S1) is obtained from the wire bonding apparatus 20,
In the wire bonding non-bonding detection device 10, the determination circuit 1
3 checks the normal voltage detection signal of the normal voltage detection circuit 11 (step S2). As a result, when a normal voltage detection signal is obtained (YES in step S3), the bonding target pad is a normal pad, and the determination circuit 13 does not take any action, so that the procedure is the same as the conventional one.

Accordingly, the non-attachment detection circuit 12 waits for the end of the bonding process (step S4) to wait for the normal voltage detection circuit 1
By checking the output of No. 1, a non-bonding inspection for bonding (step S5) is performed. As a result of the non-attachment inspection in step S5, if the normal voltage detection signal is not obtained in the output of the normal voltage detection circuit 11, the non-attachment detection circuit 12 detects the non-attachment failure (YES in step S6), (Procedure S7), and proceed to a predetermined process such as a stop of production.

If the normal voltage detection signal is obtained at the output of the normal voltage detection circuit 11 when the above-mentioned step S6 is "NO", and no non-connection failure is detected, the wire bonding non-attachment detection device 10 receives from the wire bonding device 20. The state of each circuit is reset after waiting for a wire cutting signal (YES in step S8) (step S9).

If the step S8 is "NO" and the step S1 is "YES" before the wire cutting signal arrives and the next bonding process is started, the procedure proceeds to the step S2.

If the determination in step S3 is "NO" and the judgment circuit 13 checks the normal voltage detection signal of the normal voltage detection circuit 11 and finds that the normal voltage detection signal is not obtained, the pad to be bonded is invalid. The connection pad is determined, and the procedure according to the present invention is executed. That is, the determination circuit 13 sends a non-delivery inspection cancel instruction to the non-delivery detection circuit 12. Therefore, the non-attachment detection circuit 12 prohibits the non-attachment inspection process and ends the bonding process (step S1).
In step 2), the process waits for the arrival of the wire cutting signal in step S8 or the start of the bonding process in step S1.
Subsequent procedures sequentially proceed as described above.

In the above description, normal pads or unconnected pads are detected for each wire bonding process, and this is an operation procedure for a plurality of continuous bonding processes up to wire cutting.

However, usually, as shown in FIG. 2 or FIG. 6, a bonding process is performed for each input / output lead. In such a case, the above procedure counts the number of bonding steps and returns to step S1 at the first end, but waits for a wire cutting signal at the second end. Also, in the case of one lead, if one is a non-connection pad, the other is also usually a non-connection pad, and a normal voltage cannot be detected during the primary bonding process. It is also possible to omit the above-mentioned procedure of the process after the wiring after the wiring and immediately proceed to the procedure of waiting for wire cutting.

Next, detection of a normal voltage different from that of FIG. 5 described above with reference to FIG. 4 will be described.

As shown in the figure, on the other hand, the bonding non-adhesion detecting device 40 is electrically connected to the wire 41 via the wire case 47, and the tip of the wire 41 further extends to the tip of the bonding tool 42. On the other hand, the bonding failure detection device 40 is connected to the same ground (GND) as the heat plate 26 of the bonding device.

An AC induced voltage V is always generated between the tip of the bonding tool 42 and the ground (GND) of the heat plate 46. Bonding non-attachment detection device 40
Can detect and determine whether the bonding is normal or not by knowing in advance the AC induction voltage V generated in each step of the bonding process.

As described above, as long as the AC induction voltage V generated in each step of the bonding process can be known in advance,
The non-bonding detection can be omitted by the bonding non-bonding detection device selecting an appropriate timing and detecting the voltage. Therefore, no matter what kind of wire-bonding non-bonding detection method and device, if the configuration is based on the above description, it is possible to avoid a production stoppage for bonding of the non-connecting pad.

In the above description, reference is made to figures showing functional blocks or procedures. However, a memory for holding a normal voltage may be separated, and a circuit for detecting a potential difference at the tip of a bonding tool and a circuit for detecting the potential difference Match with /
A configuration change of a functional block by merging of circuits for checking mismatch, or a change of a procedure by a parallel operation of a procedure or a rearrangement of a procedure can be freely performed as long as the above function is satisfied, and the above description does not limit the present invention. Absent.

[0046]

As described above, according to the present invention, even when wire bonding is performed to a non-connection (non-connection) pad that is not connected to the internal circuit, the wire bonding can be performed without detecting the wire bonding failure. The effect that continuous processing is possible is obtained.

The reason is that the potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus is previously held as a normal voltage in the bonding process in which the bonding tool is in contact with the normal pad to which the internal circuit is connected. Then, during a bonding process in which the bonding tool contacts the pad, the potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus is compared with the normal voltage to determine match / mismatch. This is because when the bonding tool moves away from the pad, the process of detecting the non-bonding of the wire bonding to the pad is canceled. That is, the mismatch determination is a determination that the bonding target pad is a non-connection pad, and it is possible to avoid a non-bonding determination due to the non-connection pad.

[Brief description of the drawings]

FIG. 1 is a functional block diagram showing an embodiment of the present invention.

FIG. 2 is a time chart illustrating a normal voltage detection state with respect to a bonding step in FIG. 1;

FIG. 3 is a flowchart showing an embodiment of a main operation procedure in FIG. 1;

FIG. 4 is an explanatory diagram showing an example of a connection system in a bonding failure detection device.

FIG. 5 is an explanatory diagram showing an example of a connection system in a bonding failure detection device different from FIG. 4;

FIG. 6 is an explanatory diagram showing an example of a process in a bonding step.

FIG. 7 is a functional block diagram showing an example of the related art.

FIG. 8 is a time chart illustrating a normal voltage detection state with respect to the bonding step in FIG. 7;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Wire bonding non-attachment detection apparatus 11 Normal voltage detection circuit 12 Non-attachment detection circuit 13 Judgment circuit 20 Wire bonding apparatus 21 Wire 22 Bonding tool

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Masahiro Ueno 184-1 Arashi Sozawa, Sagamiko-cho, Tsukui-gun, Kanagawa F-term (reference) 5F044 AA01 BB00 CC00

Claims (6)

[Claims] 1. A wire bonding non-bonding detection method for performing wire bonding non-bonding inspection with a wire bonding apparatus via a wire bonded to a pad, wherein a bonding tool is in contact with a normal pad to which an internal circuit is connected. The potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus in a bonding process in the state of is held in advance as a normal voltage, and the tip of the bonding tool and the tip of the bonding tool during the bonding process in which the bonding tool contacts the pad. A wire bonding non-attachment detection method, comprising: comparing a potential difference between the ground of the wire bonding apparatus with the normal voltage to determine coincidence / non-coincidence; 2. A wire bonding non-bonding detection process according to claim 1, wherein only when the collation is determined to be a match, the wire bonding non-bonding detection process is performed on the pad when the bonding tool is separated from the pad. Detection method. 3. The wire bonding non-attachment detection according to claim 1, wherein when the collation is determined to be inconsistent, the wire bonding non-attachment detection processing for the pad is omitted when the bonding tool is separated from the pad. Method. 4. A wire bonding non-bonding detection device for performing a wire bonding non-bonding inspection with a wire bonding device via a wire bonded to a pad, wherein a bonding tool is in contact with a normal pad to which an internal circuit is connected. The potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus in the bonding process in the state of is held in advance as a normal voltage, and the potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus is determined. A normal voltage detection circuit that outputs a match / mismatch check result by checking with the normal voltage; and a first check result from the normal voltage detection circuit during a bonding process in which a bonding tool contacts a pad. Normal if the matching result of 1 matches On the other hand, if the judgment result is a mismatch, the judgment circuit outputs a judgment result by judging that the connection is not established. If the judgment result received from the judgment circuit is normal, the normal voltage detection is performed after the bonding process is completed. When the second matching result is received from the circuit, the wire bonding is determined to be normal when the second matching result matches, while when the second bonding result does not match, the wire bonding is determined to be a non-delivery failure detection and notified to the outside. A non-attachment detection circuit that executes a detection process and cancels the non-attachment detection process when the judgment result received from the judgment circuit is non-connection. 5. A wire bonding non-bonding detection device for performing a wire bonding non-bonding inspection with a wire bonding device via a wire bonded to a pad, wherein a bonding tool is in contact with a normal pad to which an internal circuit is connected. The potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus in the bonding process in the state of is held in advance as a normal voltage, and the potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus is determined. A normal voltage detection circuit that outputs a match / mismatch check result by comparing with the normal voltage; and receives matching information as a first check result from the normal voltage detection circuit during a bonding process in which a bonding tool contacts a pad. The execution of non-delivery detection And a second comparison result from the normal voltage detection circuit after the bonding process is completed only when a non-attachment detection execution signal is received from the determination circuit. A wire bonding non-attachment detection device, comprising: a non-attachment detection circuit for judging normal if the result is coincident and judging non-attachment fault detection when the result is not coincident and outputting the same to the outside. 6. A wire bonding non-bonding detection device for performing a wire bonding non-bonding inspection with a wire bonding device via a wire bonded to a pad, wherein a bonding tool is in contact with a normal pad to which an internal circuit is connected. The potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus in the bonding process in the state of is held in advance as a normal voltage, and the potential difference between the tip of the bonding tool and the ground of the wire bonding apparatus is determined. A normal voltage detection circuit that outputs a match / mismatch check result by checking with the normal voltage; and a pad when matching information is received from the normal voltage detection circuit after the bonding process is completed. Is determined to be normal On the other hand, a wire bonding non-attachment detection device that includes a non-attachment detection circuit that performs non-attachment detection processing for notifying a non-attachment failure detection and notifying the outside in the case of non-coincidence. A determination circuit that outputs a non-delivery detection cancel signal to the non-delivery detection circuit when the non-coincidence information is received as a collation result from the normal voltage detection circuit during the bonding process, and the non-delivery detection circuit is A wire bonding non-attachment detection device, wherein upon receipt of a cancel signal, the non-attachment detection process after the completion of the bonding process is omitted.