JP2001023773A - Manufacture of organic el element and device therefor - Google Patents
Manufacture of organic el element and device thereforInfo
- Publication number
- JP2001023773A JP2001023773A JP11194177A JP19417799A JP2001023773A JP 2001023773 A JP2001023773 A JP 2001023773A JP 11194177 A JP11194177 A JP 11194177A JP 19417799 A JP19417799 A JP 19417799A JP 2001023773 A JP2001023773 A JP 2001023773A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- mask
- transparent electrode
- light emitting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 238000007740 vapor deposition Methods 0.000 claims abstract description 9
- 239000007772 electrode material Substances 0.000 claims abstract description 8
- 239000010409 thin film Substances 0.000 claims abstract description 7
- 238000000151 deposition Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000003086 colorant Substances 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 239000011368 organic material Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 5
- 230000002411 adverse Effects 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 229910001148 Al-Li alloy Inorganic materials 0.000 abstract description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 abstract 1
- 230000005525 hole transport Effects 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- ZMLPKJYZRQZLDA-UHFFFAOYSA-N 1-(2-phenylethenyl)-4-[4-(2-phenylethenyl)phenyl]benzene Chemical group C=1C=CC=CC=1C=CC(C=C1)=CC=C1C(C=C1)=CC=C1C=CC1=CC=CC=C1 ZMLPKJYZRQZLDA-UHFFFAOYSA-N 0.000 description 1
- 229910018134 Al-Mg Inorganic materials 0.000 description 1
- 229910018467 Al—Mg Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- -1 aluminum chelate complex Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- DCZNSJVFOQPSRV-UHFFFAOYSA-N n,n-diphenyl-4-[4-(n-phenylanilino)phenyl]aniline Chemical class C1=CC=CC=C1N(C=1C=CC(=CC=1)C=1C=CC(=CC=1)N(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 DCZNSJVFOQPSRV-UHFFFAOYSA-N 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000006617 triphenylamine group Chemical group 0.000 description 1
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、平面光源やディ
スプレイ、その他所定のパターン等の発光表示に用いら
れる有機ＥＬ素子の製造方法と装置に関する。[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for manufacturing an organic EL element used for light-emitting display of a flat light source, a display, and other predetermined patterns.
【０００２】[0002]
【従来の技術】従来、有機ＥＬ（エレクトルミネッセン
ス）素子は、ガラス等からなる透明な基板に、透光性の
ＩＴＯ膜を一面に形成し、所定のストライプ状にエッチ
ングして透明電極を形成していた。透明電極には発光層
が積層され、発光層は、有機ＥＬ材料が通常２〜３層に
わたって、５００Å〜１５００Å程度の厚さに形成され
ていた。さらに発光層の表面には、蒸着等により背面電
極材料を設けて、背面電極を形成していた。2. Description of the Related Art Conventionally, an organic EL (electroluminescence) element is formed by forming a translucent ITO film on one surface of a transparent substrate made of glass or the like and etching it into a predetermined stripe to form a transparent electrode. I was A light-emitting layer was laminated on the transparent electrode, and the light-emitting layer was formed of an organic EL material usually in two to three layers to a thickness of about 500 ° to 1500 °. Further, a back electrode material is provided on the surface of the light emitting layer by vapor deposition or the like to form a back electrode.
【０００３】ここで、発光層を構成する有機ＥＬ材料
は、トリフェニルアミン誘導体（ＴＰＤ）等のホール輸
送材料と、発光材料であるアルミキレート錯体（Ａｌｑ
３）等の電子輸送材料からなる。発光層は、ホール輸送
材料の上に電子輸送材料を積層したものや、これらの混
合層からなる。Here, an organic EL material constituting a light emitting layer includes a hole transport material such as a triphenylamine derivative (TPD) and an aluminum chelate complex (Alq) as a light emitting material.
3 ) The electron transporting material as described above. The light emitting layer is composed of a layer in which an electron transporting material is laminated on a hole transporting material, or a mixed layer thereof.
【０００４】[0004]
【発明が解決しようとする課題】上記従来の技術の場
合、複色表示やフルカラー表示のために発光層が複数併
設される場合があった。この場合、発光層は、所定パタ
ーンのマスクを用いて有機ＥＬ材料を蒸着するものであ
り、各色毎にそのマスクを真空蒸着装置中で交換してい
た。このマスクは、金属薄板をエッチングして形成して
いるものであり、たるみやすいことから、磁石で吸引し
て所定位置に密着させ蒸着を行っていた。In the case of the above-mentioned prior art, a plurality of light-emitting layers may be provided in parallel for multi-color display or full-color display. In this case, the light emitting layer is to deposit the organic EL material using a mask having a predetermined pattern, and the mask is replaced in a vacuum deposition apparatus for each color. This mask is formed by etching a thin metal plate and is easily sagged. Therefore, the mask is attracted by a magnet and closely adhered to a predetermined position to perform vapor deposition.
【０００５】しかしながら、このマスクは、基板に対し
て密着して、所定位置に有機物等を蒸着させるものであ
り、基板よりも蒸着源側に位置して蒸着源にさらされる
ので、基板よりもマスクの方が高温となる。これによ
り、すでに蒸着された有機物にこのマスクが接するとそ
の熱で有機物が劣化し、さらにはマスクの移動とともに
その有機物が剥離してしまう場合もあった。However, this mask is for adhering an organic substance or the like to a predetermined position in close contact with the substrate, and is located closer to the evaporation source than the substrate and is exposed to the evaporation source. Will be hotter. As a result, when the mask comes into contact with an organic substance that has already been deposited, the heat degrades the organic substance, and the organic substance may peel off as the mask moves.
【０００６】そこで、このマスクが基板に付着しないよ
うに基板表面にレジスト等で凸部を形成することも行わ
れているが、このレジストにより、基板表面に付いた有
機物の汚染物質の除去が難しく、さらには、レジストの
残査渣等も汚染物質となるという問題があった。また、
基板に突起物を形成する工程は、ＩＣ製造と同様の７工
程程度の工程を要し、製造コストの上昇原因となってい
た。In order to prevent the mask from adhering to the substrate, a projection is formed on the substrate surface with a resist or the like. However, the resist makes it difficult to remove organic contaminants attached to the substrate surface. Further, there is a problem that the residue residue of the resist also becomes a contaminant. Also,
The process of forming the protrusions on the substrate requires about seven processes similar to IC manufacturing, and has caused an increase in manufacturing cost.
【０００７】この発明は、上記従来の技術の問題点に鑑
みてなされたものであり、マスクを用いて発光層の蒸着
を行う際に、他の発光材料等に悪影響を与えることがな
い有機ＥＬ素子の製造方法と装置を提供することを目的
とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and an organic EL device which does not adversely affect other luminescent materials when depositing a luminescent layer using a mask. An object of the present invention is to provide a method and an apparatus for manufacturing an element.
【０００８】[0008]
【課題を解決するための手段】この発明の有機ＥＬ素子
の製造方法は、ガラスや樹脂等の透明な基板表面にＩＴ
Ｏ等の透明な電極材料により所定の形状となるように透
明電極を形成し、この透明電極に有機ＥＬ材料からなる
発光層を蒸着等の真空薄膜形成技術により積層し、上記
発光層の表面に、上記透明電極に対向した所定形状のＡ
ｌ−Ｌｉ等の背面電極を形成するものである。そして、
上記発光層を形成する際に、上記発光層の形状に開口し
た開口部を有したマスクを用い、このマスクの上記透明
な基板側の面には、この基板側の表面に当接する凸部が
形成され、この凸部は上記基板のアルミ導体パターン等
の非発光部に対応して位置させ、この凸部間に形成され
た開口部から蒸着材料を上記基板に付着させ、所望の発
光層を形成する有機ＥＬ素子の製造方法である。上記発
光層は、複数の発光色毎に同様に形成され、上記マスク
を順次移動させて複数の発光色の発光層を順に形成する
ものである。また、上記ＥＬ材料の形成に際して、上記
マスクの凸部は、上記ＥＬ素子の上記透明電極に沿った
非発光部分である導体パターンに対応させるものであ
る。According to a method of manufacturing an organic EL device of the present invention, an IT device is provided on a transparent substrate surface such as glass or resin.
A transparent electrode is formed so as to have a predetermined shape by a transparent electrode material such as O, and a light emitting layer made of an organic EL material is laminated on the transparent electrode by a vacuum thin film forming technique such as vapor deposition. A of a predetermined shape facing the transparent electrode
A back electrode such as l-Li is formed. And
When forming the light emitting layer, a mask having an opening that is opened in the shape of the light emitting layer is used, and the transparent substrate side surface of the mask has a convex portion in contact with the substrate side surface. Formed, the convex portions are positioned corresponding to the non-light-emitting portions such as the aluminum conductor pattern of the substrate, and a vapor deposition material is adhered to the substrate from the opening formed between the convex portions to form a desired light-emitting layer. This is a method for manufacturing an organic EL element to be formed. The light emitting layer is formed in the same manner for each of a plurality of luminescent colors, and the mask is sequentially moved to form luminescent layers of a plurality of luminescent colors in order. In the formation of the EL material, the projections of the mask correspond to the conductor pattern which is a non-light emitting portion along the transparent electrode of the EL element.
【０００９】またこの発明は、有機ＥＬ素子の製造装置
であって、上記発光層の形状に開口した開口部を有した
マスクを備え、このマスクの上記透明な基板側の面に
は、この基板側の表面に当接する凸部が形成され、この
凸部間に上記基板表面の所定位置に蒸着材料を付着させ
る開口部が形成されている有機ＥＬ素子の製造装置であ
る。上記凸部は、上記マスクを形成する金属板の上記凸
部形成箇所以外をエッチングして形成されたもの、また
は上記マスクを構成する金属板の開口部周縁部に有機材
料を印刷して硬化させて形成したものである。上記マス
クの上記開口部は、等ピッチでストライプ状に形成され
ている。上記凸部は平面状に形成され、上記凸部も鋭角
状でなく、鈍角またはなめらかなものである。The present invention is also an apparatus for manufacturing an organic EL device, comprising a mask having an opening formed in the shape of the light emitting layer, wherein the transparent substrate side surface of the mask is provided with the substrate. This is an organic EL device manufacturing apparatus in which a convex portion is formed in contact with the surface on the side, and an opening for adhering a deposition material is formed at a predetermined position on the substrate surface between the convex portions. The convex portion is formed by etching a portion other than the convex portion forming portion of the metal plate forming the mask, or an organic material is printed and cured on the periphery of the opening of the metal plate forming the mask. It was formed. The openings of the mask are formed in stripes at an equal pitch. The convex portion is formed in a flat shape, and the convex portion is not acute but obtuse or smooth.
【００１０】[0010]
【発明の実施の形態】以下、この発明の実施形態につい
て図面に基づいて説明する。この実施形態の有機ＥＬ素
子は、ガラスや石英、樹脂等の透明な基板１０の一方の
表面に、ＩＴＯやＳｎＯ２等の透明な電極材料による透
明電極１２がストライプ状に等ピッチで形成されてい
る。この透明電極１２の表面側または基板１０側に、透
明電極１２の両側縁部に沿って細いストライプ状のアル
ミ導体パターン１４が形成されている。透明電極１２の
表面全面には、５０〜５００Å程度の厚さにＣｕＰｃ
（銅フタロシアン）のバッファ層１６が形成され、さら
にその表面に５０〜１０００Å程度のホール輸送材料１
８が形成されている。Embodiments of the present invention will be described below with reference to the drawings. In the organic EL device of this embodiment, transparent electrodes 12 made of a transparent electrode material such as ITO or SnO 2 are formed on one surface of a transparent substrate 10 made of glass, quartz, resin, or the like at a constant pitch in a stripe shape. I have. On the front surface side of the transparent electrode 12 or the substrate 10 side, a thin striped aluminum conductor pattern 14 is formed along both side edges of the transparent electrode 12. CuPc is formed on the entire surface of the transparent electrode 12 to a thickness of about 50 to 500 °.
(Copper phthalocyanine) buffer layer 16 is formed, and a hole transport material 1 of about 50 to 1000 °
8 are formed.
【００１１】さらに、ホール輸送材料１８の表面には、
光の３原色の赤（Ｒ）、緑（Ｇ）、青（Ｂ）の発光色を
有する発光材料を有した電子輸送材料２０Ｒ，２０Ｇ，
２０Ｂが透明電極１２に対応して各々ストライプ状に形
成されている。電子輸送材料２０Ｒ，２０Ｇ，２０Ｂ
は、この３本を一組として順に形成され、有機ＥＬ材料
からなる発光層２２が形成されている。そして電子輸送
材料２０Ｒ，２０Ｇ，２０Ｂの表面には、Ｌｉを０．０
１〜０．０５％程度含む純度９９％程度のＡｌ−Ｌｉ合
金、その他Ａｌ−Ｍｇ等の陰極材料による背面電極２４
が、適宜の３００Å〜１０００Å程度の厚みで積層され
る。この背面電極２４は、透明電極１２と直交して対向
し、ストライプ状に形成されている。背面電極２４は上
記以外に、Ａｌ，Ｌｉ，Ａｇ，Ｍｇ，Ｉｎ，Ｃｓ等を含
む金属薄膜でもよい。Further, on the surface of the hole transport material 18,
Electron transporting materials 20R, 20G having light emitting materials having emission colors of three primary colors of light, red (R), green (G), and blue (B).
20B are formed in stripes corresponding to the transparent electrodes 12, respectively. Electron transport materials 20R, 20G, 20B
Are sequentially formed as a set of these three, and a light emitting layer 22 made of an organic EL material is formed. Then, on the surface of the electron transporting materials 20R, 20G, and 20B, Li was added to 0.0.
Back electrode 24 made of a cathode material such as Al-Li alloy having a purity of about 99% containing about 1 to 0.05% and other Al-Mg.
Are laminated at an appropriate thickness of about 300 to 1000 °. The back electrode 24 faces the transparent electrode 12 at right angles and is formed in a stripe shape. In addition to the above, the back electrode 24 may be a metal thin film containing Al, Li, Ag, Mg, In, Cs, or the like.
【００１２】ここで発光層２２は、ホール輸送材料１８
としては、α−ＮＰＤ、トリフェニルジアミン誘導体
（ＴＰＤ）、ヒドラゾン誘導体、アリールアミン誘導体
等がある。また、赤色発光電子輸送材料２０ＲのＥＬ材
料としてはＤＣＭ、青色発光電子輸送材料２０ＢのＥＬ
材料としては、ジスチリルビフェニル誘導体（ＤＰＶＢ
ｉ）、緑色発光電子輸送材料２０ＧのＥＬ材料としては
アルミキノリール錯体（Ａｌｑ３）等の有機ＥＬ発光材
料を使用する。さらに適宜の発光材料を混合しても良
い。Here, the light emitting layer 22 is formed of the hole transport material 18.
Examples thereof include α-NPD, triphenyldiamine derivative (TPD), hydrazone derivative, arylamine derivative and the like. The EL material of the red light-emitting electron transport material 20R is DCM, and the EL material of the blue light-emitting electron transport material 20B is EL.
As the material, distyrylbiphenyl derivatives (DPVB
i) As the EL material of the green light-emitting electron transport material 20G, an organic EL light-emitting material such as an aluminum quinolyl complex (Alq 3 ) is used. Further, an appropriate light emitting material may be mixed.
【００１３】この有機ＥＬ素子の発光画素は、例えば、
３３０μｍ角を一画素として、３０μｍの間隔をおいて
並べられ、この１画素の中に３本の光の３原色の赤
（Ｒ）、緑（Ｇ）、青（Ｂ）の光を発光する電子輸送材
料２０Ｒ，２０Ｇ，２０Ｂのパターンが各々位置する。
従って、電子輸送材料２０Ｒ，２０Ｇ，２０Ｂは各々９
０μｍ幅で約１０μｍ間隔で配置されている。これによ
り、１ｍｍ角の中に９画素が配置されることになる。The light emitting pixel of this organic EL element is, for example,
Electrons that emit light of three primary colors, red (R), green (G), and blue (B), in one pixel are arranged at intervals of 30 μm with a 330 μm square as one pixel. The patterns of the transport materials 20R, 20G, and 20B are respectively located.
Therefore, each of the electron transporting materials 20R, 20G, and 20B has 9
They are arranged at intervals of about 10 μm with a width of 0 μm. As a result, nine pixels are arranged in a 1 mm square.
【００１４】この有機ＥＬ素子の各電子輸送材料２０
Ｒ，２０Ｇ，２０Ｂを形成するマスク３０は、図４に示
すように、例えば０．０５ｍｍ厚のステンレス板等の材
料からなり、図示しないマスクフレームに磁石で固定可
能な材料である。このマスク３０は、図１，図２に示す
ように、３３０μｍ角を一画素とするため、図２におい
て、３０μｍの間隔を開けて約３００μｍの長さの長方
形の開口部３２が、長方形の長手方向に等間隔で設けら
れるとともに、長方形の幅方向に幅９０μｍで開口部３
２が２００μｍ程度の間隔をおいて等間隔に設けられて
いる。Each electron transport material 20 of this organic EL device
As shown in FIG. 4, the mask 30 for forming the R, 20G, and 20B is made of a material such as a 0.05 mm thick stainless steel plate, and is a material that can be fixed to a mask frame (not shown) with a magnet. As shown in FIG. 1 and FIG. 2, the mask 30 has a rectangular opening 32 having a length of about 300 μm and an interval of 30 μm. The openings 3 are provided at regular intervals in the width direction and have a width of 90 μm in the width direction of the rectangle.
2 are provided at equal intervals with an interval of about 200 μm.
【００１５】また、マスク３０の基板１０側の面には、
ストライプ状の透明電極１２の電極間及びアルミ導体パ
ターン１４に沿って凸部３６がストライプ状に平行に等
間隔で形成されている。凸部３６は、アルミ導体パター
ン１４と対向し、電子輸送材料２０Ｒ，２０Ｇ，２０Ｂ
の間の部分で基板１０に対向するように設けられてい
る。On the surface of the mask 30 on the substrate 10 side,
Convex portions 36 are formed at regular intervals in parallel with the stripe shape between the stripe-shaped transparent electrodes 12 and along the aluminum conductor pattern 14. The convex portion 36 is opposed to the aluminum conductor pattern 14, and is provided with the electron transport materials 20R, 20G, and 20B.
Are provided so as to oppose the substrate 10 in a portion between them.
【００１６】このマスク３０の製造方法は、５００μｍ
程度の厚さのステンレス板等に開口部３２を上記の所定
ピッチで形成する。開口部３２の形成は、フォトレジス
トを塗布し、所定の開口部３２のパターンを露光して、
開口部３２を形成する部分のレジストを除去し、エッチ
ングを行う。また、マスク３０の一方の面には、マスク
部３０の開口部３２の側縁部及びその中間部に沿って凸
部３６が形成され、その凸部３６間の厚さは例えばステ
ンレス板のマスク３０の約半分の厚さまでエッチングを
行って調整する。The manufacturing method of the mask 30 is 500 μm
The openings 32 are formed at a predetermined pitch in a stainless steel plate or the like having a thickness as small as possible. The opening 32 is formed by applying a photoresist, exposing a predetermined pattern of the opening 32,
The resist at the portion where the opening 32 is to be formed is removed, and etching is performed. Further, on one surface of the mask 30, a convex portion 36 is formed along the side edge of the opening portion 32 of the mask portion 30 and an intermediate portion thereof, and the thickness between the convex portions 36 is, for example, a stainless plate mask. It is adjusted by performing etching to a thickness of about half of 30.
【００１７】この発明の有機ＥＬ素子の一実施形態の製
造方法は、ガラスや石英、樹脂等の透明な基板１０の表
面全面に、ＩＴＯ等の透明な電極材料を蒸着等により設
ける。このとき、所定ピッチのストライプ状の開口部が
形成されたワイヤマスク等を用いて透明電極１２を基板
１０上に真空蒸着する。In the manufacturing method according to one embodiment of the organic EL device of the present invention, a transparent electrode material such as ITO is provided on the entire surface of a transparent substrate 10 made of glass, quartz, resin or the like by vapor deposition or the like. At this time, the transparent electrode 12 is vacuum-deposited on the substrate 10 using a wire mask or the like in which stripe-shaped openings of a predetermined pitch are formed.
【００１８】次に透明電極１２の表面に、バッファ層１
６を全面に真空蒸着し、さらにホール輸送材料１８を全
面に真空蒸着する。この後、マスク３０を用いて、電子
輸送材料２０Ｒ，２０Ｇ，２０Ｂやその他発光材料から
なる層を、真空蒸着やスパッタリング、その他真空薄膜
形成技術により積層する。Next, the buffer layer 1 is formed on the surface of the transparent electrode 12.
6 is vacuum-deposited on the entire surface, and a hole transport material 18 is further vacuum-deposited on the entire surface. Thereafter, using the mask 30, layers made of the electron transporting materials 20R, 20G, and 20B and other light emitting materials are stacked by vacuum deposition, sputtering, or another vacuum thin film forming technique.
【００１９】電子輸送材料２０Ｒ，２０Ｇ，２０Ｂの蒸
着に際して、図１に示すように、発光層１２の所定の色
例えば赤色発光する電子輸送材料２０Ｒを、その発光層
のストライプの幅に開口した大きさの開口部３２を有し
たマスク３０を用いて、その発光色の蒸発源から真空蒸
着を行う。マスク３０は、凸部３６を透明基板１０側に
当接させるように配置する。When the electron transporting materials 20R, 20G, and 20B are deposited, as shown in FIG. 1, the electron transporting material 20R that emits a predetermined color, for example, red light, of the light emitting layer 12 has a size that is opened to the width of the stripe of the light emitting layer. Vacuum deposition is performed from the evaporation source of the emission color using the mask 30 having the opening 32 of the mask. The mask 30 is arranged so that the convex portions 36 are in contact with the transparent substrate 10 side.
【００２０】次に、図３（Ａ）に示すように、緑色発光
有機ＥＬ材料を蒸発源から蒸発させて電子輸送材料２０
Ｇを透明基板１０の所定表面に蒸着させる。このとき、
マスク３０は、電子輸送材料２０Ｒのストライプ幅の分
だけ位置を平行移動して固定する。このとき、マスク３
０を一旦基板１０の表面から離して平行移動させる。こ
れにより、赤色発光有機ＥＬ材料の隣りに緑色発光有機
ＥＬ材料のストライプが形成される。このときマスク３
０は凸部３６により、先に蒸着された赤色発光ＥＬ材料
の電子輸送材料２０Ｒに接触しないで対面する。また凸
部３６が当接している位置は、非発光部である。Next, as shown in FIG. 3A, the green light-emitting organic EL material is evaporated from an evaporation source to form an electron transport material 20.
G is deposited on a predetermined surface of the transparent substrate 10. At this time,
The position of the mask 30 is translated and fixed by an amount corresponding to the stripe width of the electron transport material 20R. At this time, the mask 3
0 is once moved away from the surface of the substrate 10 and translated. As a result, a stripe of the green light emitting organic EL material is formed next to the red light emitting organic EL material. At this time, mask 3
0 faces the convex portion 36 without contacting the electron-transporting material 20R of the red light-emitting EL material previously deposited. The position where the convex portion 36 is in contact is the non-light emitting portion.
【００２１】さらに、図３（Ｂ）に示すように、青色発
光有機ＥＬ材料を蒸発源から蒸発させて透明基板１０の
所定表面に蒸着させる。このとき、マスク３０は、緑色
発光有機ＥＬ材料の電子輸送材料２０Ｇのストライプ幅
の分だけ位置をさらに上記と同様に平行移動して固定す
る。これにより、緑色発光有機ＥＬ材料の隣りに青色発
光有機ＥＬ材料の電子輸送材料２０Ｂのストライプが形
成される。そして、電子輸送材料２０Ｂは電子輸送材料
２０Ｒのストライプと隣り合って形成される。このとき
も、マスク３０は、先に蒸着された電子輸送材料２０
Ｒ，２０Ｇに接触しないで対面する。また凸部３６が当
接している位置は、非発光部である。Further, as shown in FIG. 3B, the blue light-emitting organic EL material is evaporated from an evaporation source and is deposited on a predetermined surface of the transparent substrate 10. At this time, the position of the mask 30 is further translated and fixed by the stripe width of the electron transporting material 20G of the green light emitting organic EL material in the same manner as described above. Thereby, a stripe of the electron transporting material 20B of the blue light emitting organic EL material is formed next to the green light emitting organic EL material. The electron transport material 20B is formed adjacent to the stripe of the electron transport material 20R. Also at this time, the mask 30 is made of the previously deposited electron transport material 20.
R, face without contacting 20G. The position where the convex portion 36 is in contact is the non-light emitting portion.
【００２２】次に、背面電極材料を、発光層２２の表面
に真空蒸着等の真空薄膜形成技術により設ける。このと
きも、ワイヤマスク等を利用して、透明電極１２と直交
する方向に背面電極２４を形成する。背面電極２４は、
適宜約５００Å〜１０００Å程度の厚みで積層する。Next, a back electrode material is provided on the surface of the light emitting layer 22 by a vacuum thin film forming technique such as vacuum deposition. Also at this time, the back electrode 24 is formed in a direction orthogonal to the transparent electrode 12 using a wire mask or the like. The back electrode 24
The layers are appropriately laminated with a thickness of about 500 to 1000 °.
【００２３】この実施形態のＥＬ素子の製造方法によれ
ば、マスク蒸着に際して、マスク３０が先に蒸着した有
機ＥＬ材料の発光部分に全面的に接触せず、凸部３６が
当接するだけであり、発光層２２に損傷を与えることが
ない。また、複数の発光材料を順次蒸着する際に、マス
ク３０を順次移動させて蒸着しても、マスクは蒸着面に
対して凸部３６が当接し、マスク３０の大部分は蒸着面
に接触しないので、発光材料に悪影響を及ぼしにくいも
のである。また、カラー表示のための発光画素の形成も
容易となる。According to the manufacturing method of the EL device of this embodiment, the mask 30 does not entirely contact the light emitting portion of the organic EL material previously deposited at the time of mask deposition, but only the projection 36 abuts. The light emitting layer 22 is not damaged. Also, when a plurality of light emitting materials are sequentially deposited, even when the mask 30 is sequentially moved and deposited, the mask has the convex portions 36 in contact with the deposition surface, and most of the mask 30 does not contact the deposition surface. Therefore, the light emitting material is hardly affected. Further, the formation of luminescent pixels for color display is also facilitated.
【００２４】なお、マスク３０の開口部３２の形状は、
発光表示させるパターンに合わせて適宜設定できるもの
である。またマスク３０は、図５に示すように、エッチ
ングや打ち抜きにより金属板に開口部３２を形成し、こ
の開口部３２に沿って有機材料の凸部３６を印刷により
形成しても良い。この場合、凸部３６は例えばＵＶ硬化
樹脂等を用いる。また、凸部３６を形成する樹脂中に、
凸部３６の高さを揃えるために、例えば数十μｍ程度の
一定直径の粒子３８を混合させても良い。The shape of the opening 32 of the mask 30 is as follows.
It can be set appropriately according to the pattern to be displayed. Alternatively, as shown in FIG. 5, the mask 30 may have an opening 32 formed in a metal plate by etching or punching, and a projection 36 made of an organic material may be formed along the opening 32 by printing. In this case, the convex portion 36 uses, for example, a UV curable resin or the like. Further, in the resin forming the convex portion 36,
In order to make the heights of the protrusions 36 uniform, particles 38 having a constant diameter of, for example, about several tens of μm may be mixed.
【００２５】また、この発明のマスクの開口部の形状は
適宜の形状に形成することが可能であり、円形やその他
任意形状の開口部を形成し、この開口部に対応する透明
電極、発光層及び背面電極を形成することにより、任意
形状の発光表示が可能となる。また、導体パターンは、
アルミの他、他の銅やニッケル等の金属により設けても
良い。The opening of the mask of the present invention can be formed in an appropriate shape. A circular or other arbitrary opening is formed, and a transparent electrode and a light emitting layer corresponding to the opening are formed. In addition, by forming the back electrode, light-emitting display of an arbitrary shape can be performed. The conductor pattern is
It may be provided by other metals such as copper and nickel other than aluminum.
【００２６】[0026]
【発明の効果】この発明のＥＬ素子の製造方法と装置に
よれば、マスクの表面に凸部を形成して蒸着面に接触す
る部分を少なくしたので、蒸着面に与える悪影響が少な
い。また、基板に凸部を形成する場合と比較して、全体
としての工程数を削減可能であり、歩留まりの良い製造
が可能となる。According to the method and the apparatus for manufacturing an EL element of the present invention, since the convex portion is formed on the surface of the mask to reduce the portion in contact with the deposition surface, the adverse effect on the deposition surface is small. Further, the number of processes as a whole can be reduced as compared with a case where a convex portion is formed on a substrate, and manufacturing with a high yield can be achieved.
【図１】この発明の一実施形態の有機ＥＬ素子の製造工
程を示す縦断面図である。FIG. 1 is a longitudinal sectional view showing a manufacturing process of an organic EL device according to one embodiment of the present invention.
【図２】この実施形態の有機ＥＬ素子の製造工程に用い
るマスクの平面図である。FIG. 2 is a plan view of a mask used in a manufacturing process of the organic EL device of this embodiment.
【図３】この実施形態の有機ＥＬ素子の製造工程
（Ａ），（Ｂ），（Ｃ）を示す縦断面図である。FIG. 3 is a longitudinal sectional view showing manufacturing steps (A), (B), and (C) of the organic EL device of this embodiment.
【図４】この実施形態の有機ＥＬ素子の製造工程に用い
るマスクの部分斜視図である。FIG. 4 is a partial perspective view of a mask used in a manufacturing process of the organic EL device of this embodiment.
【図５】この発明の他の実施形態のマスクの部分斜視図
である。FIG. 5 is a partial perspective view of a mask according to another embodiment of the present invention.
１０ 透明基板 １２ 透明電極 １４ アルミ導体パターン １６ バッファ層 １８ ホール輸送材料 ２０Ｒ 赤色発光電子輸送材料 ２０Ｇ 緑色発光電子輸送材料 ２０Ｂ 青色発光電子輸送材料 ２２ 発光層 ３０ マスク ３２ 開口部 ３６ 凸部 DESCRIPTION OF SYMBOLS 10 Transparent substrate 12 Transparent electrode 14 Aluminum conductor pattern 16 Buffer layer 18 Hole transport material 20R Red light emitting electron transport material 20G Green light emitting electron transport material 20B Blue light emitting electron transport material 22 Light emitting layer 30 Mask 32 Opening 36 Convex
───────────────────────────────────────────────────── フロントページの続き (72)発明者 丹保 哲也 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 (72)発明者 佐藤 好雄 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 Ｆターム(参考） 3K007 AB18 CA01 CA02 CA05 CB01 DA00 DB03 EB00 FA00 FA01 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tetsuya Tanbo 3158, Shimo-Okubo, Osawano-machi, Kamishinkawa-gun, Toyama Prefecture Inside Hokuriku Electric Industry Co., Ltd. F term in the corporation (reference) 3K007 AB18 CA01 CA02 CA05 CB01 DA00 DB03 EB00 FA00 FA01
Claims (6)
所定の形状となるように透明電極を形成し、この透明電
極に有機ＥＬ材料からなる発光層を真空薄膜形成技術に
より積層し、上記発光層の表面に、上記透明電極に対向
した所定形状の背面電極を形成する有機ＥＬ素子の製造
方法において、上記発光層を形成する際に、上記発光層
の形状に開口した開口部を有したマスクを用い、このマ
スクの上記基板側の面にはこの基板表面に対向する凸部
が形成され、この凸部は上記基板の非発光部に対応して
位置させ、この凸部間に形成された開口部から蒸着材料
を上記基板に付着させ、所望の発光層を形成することを
特徴とする有機ＥＬ素子の製造方法。1. A transparent electrode is formed on a transparent substrate surface with a transparent electrode material so as to have a predetermined shape, and a light emitting layer made of an organic EL material is laminated on the transparent electrode by a vacuum thin film forming technique. In the method for manufacturing an organic EL device, wherein a back electrode of a predetermined shape facing the transparent electrode is formed on the surface of a layer, a mask having an opening opened in the shape of the light emitting layer when forming the light emitting layer A convex portion facing the substrate surface is formed on the surface of the mask on the substrate side, the convex portion is positioned corresponding to the non-light emitting portion of the substrate, and formed between the convex portions. A method for manufacturing an organic EL device, comprising: depositing a deposition material on the substrate through an opening to form a desired light emitting layer.
形成され、上記マスクを順次移動させて複数の発光色の
発光層を順に形成することを特徴とする請求項１記載の
有機ＥＬ素子の製造方法。2. The organic light-emitting device according to claim 1, wherein the light-emitting layer is formed similarly for each of a plurality of light-emitting colors, and the mask is sequentially moved to form light-emitting layers of a plurality of light-emitting colors in order. Manufacturing method of EL element.
クの凸部は、上記ＥＬ素子の上記透明電極に沿った非発
光部分である導体パターンに対応させることを特徴とす
る請求項１または２記載の有機ＥＬ素子の製造方法。3. The method according to claim 1, wherein, when forming the EL material, the convex portion of the mask corresponds to a conductor pattern which is a non-light emitting portion along the transparent electrode of the EL element. A method for manufacturing an organic EL device.
所定の形状となるように透明電極を形成し、この透明電
極に有機ＥＬ材料からなる発光層を真空薄膜形成技術に
より積層し、上記発光層の表面に、上記透明電極に対向
した所定形状の背面電極を形成する有機ＥＬ素子の製造
装置において、上記発光層の形状に各画素毎に開口した
開口部を有したマスクを備え、このマスクの上記透明基
板側の面には、この透明基板側の表面に対向する凸部が
形成され、この凸部間に上記基板表面の所定位置に蒸着
材料を付着させる開口部が形成されていることを特徴と
する有機ＥＬ素子の製造装置。4. A transparent electrode is formed on the surface of a transparent substrate with a transparent electrode material so as to have a predetermined shape, and a light emitting layer made of an organic EL material is laminated on the transparent electrode by a vacuum thin film forming technique. An apparatus for manufacturing an organic EL device, in which a back electrode having a predetermined shape facing the transparent electrode is formed on a surface of a layer, comprising a mask having an opening formed for each pixel in the shape of the light emitting layer; On the surface on the transparent substrate side, a convex portion facing the surface on the transparent substrate side is formed, and between the convex portions, an opening for attaching a vapor deposition material to a predetermined position on the substrate surface is formed. An apparatus for manufacturing an organic EL device, comprising:
板の上記凸部形成箇所以外をエッチングして形成された
ものであることを特徴とする請求項４記載の有機ＥＬ素
子の製造装置。5. The organic EL device manufacturing apparatus according to claim 4, wherein the convex portion is formed by etching a portion of the metal plate forming the mask other than the convex portion forming portion. .
板の上記開口部形成箇所以外に、有機材料を印刷して硬
化させて形成したものであることを特徴とする請求項４
記載の有機ＥＬ素子の製造装置。6. The method according to claim 4, wherein the convex portion is formed by printing and curing an organic material in a portion other than the opening forming portion of the metal plate forming the mask.
An apparatus for producing an organic EL device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11194177A JP2001023773A (en) | 1999-07-08 | 1999-07-08 | Manufacture of organic el element and device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11194177A JP2001023773A (en) | 1999-07-08 | 1999-07-08 | Manufacture of organic el element and device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001023773A true JP2001023773A (en) | 2001-01-26 |
Family
ID=16320221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11194177A Pending JP2001023773A (en) | 1999-07-08 | 1999-07-08 | Manufacture of organic el element and device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001023773A (en) |
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