JP2001021412A - 音圧検知装置 - Google Patents

音圧検知装置

Info

Publication number
JP2001021412A
JP2001021412A JP11196981A JP19698199A JP2001021412A JP 2001021412 A JP2001021412 A JP 2001021412A JP 11196981 A JP11196981 A JP 11196981A JP 19698199 A JP19698199 A JP 19698199A JP 2001021412 A JP2001021412 A JP 2001021412A
Authority
JP
Japan
Prior art keywords
sound pressure
probe
pressure sensor
monitor
amplification factor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11196981A
Other languages
English (en)
Japanese (ja)
Inventor
Osamu Sato
佐藤　　修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP11196981A priority Critical patent/JP2001021412A/ja
Priority to KR1020000039388A priority patent/KR100654696B1/ko
Publication of JP2001021412A publication Critical patent/JP2001021412A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP11196981A 1999-07-12 1999-07-12 音圧検知装置 Pending JP2001021412A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11196981A JP2001021412A (ja) 1999-07-12 1999-07-12 音圧検知装置
KR1020000039388A KR100654696B1 (ko) 1999-07-12 2000-07-10 음압검지장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11196981A JP2001021412A (ja) 1999-07-12 1999-07-12 音圧検知装置

Publications (1)

Publication Number Publication Date
JP2001021412A true JP2001021412A (ja) 2001-01-26

Family

ID=16366862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11196981A Pending JP2001021412A (ja) 1999-07-12 1999-07-12 音圧検知装置

Country Status (2)

Country Link
JP (1) JP2001021412A (ko)
KR (1) KR100654696B1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017212786A1 (ja) * 2016-06-07 2017-12-14 株式会社テイエルブイ センサ装置及びセンサの補正方法
JP2018168655A (ja) * 2017-03-30 2018-11-01 公立大学法人大阪市立大学 土質判定方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10185676A (ja) * 1996-12-24 1998-07-14 Shibaura Eng Works Co Ltd 超音波洗浄装置用音圧センサ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017212786A1 (ja) * 2016-06-07 2017-12-14 株式会社テイエルブイ センサ装置及びセンサの補正方法
JPWO2017212786A1 (ja) * 2016-06-07 2018-06-14 株式会社テイエルブイ センサ装置及びセンサの補正方法
JP2018168655A (ja) * 2017-03-30 2018-11-01 公立大学法人大阪市立大学 土質判定方法

Also Published As

Publication number Publication date
KR20010049753A (ko) 2001-06-15
KR100654696B1 (ko) 2006-12-07

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