JP2001011684A - Production of electrolytic copper foil - Google Patents
Production of electrolytic copper foilInfo
- Publication number
- JP2001011684A JP2001011684A JP18352899A JP18352899A JP2001011684A JP 2001011684 A JP2001011684 A JP 2001011684A JP 18352899 A JP18352899 A JP 18352899A JP 18352899 A JP18352899 A JP 18352899A JP 2001011684 A JP2001011684 A JP 2001011684A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- electrolytic
- copper foil
- scrap
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Manufacture And Refinement Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品の回路や
リチウム二次電池の負極に好適に用いられる電解銅箔の
製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an electrolytic copper foil suitably used for a circuit of an electronic component or a negative electrode of a lithium secondary battery.
【０００２】[0002]
【従来の技術】電解銅箔の製造工程は、銅原料を電解液
に溶解させる溶解工程と銅原料を溶解した電解液を用い
て電気分解により銅を析出させる銅析出工程とからなる
複合工程であり、析出する銅に見合うだけの銅原料を電
解液に溶解させる必要がある。銅原料としては安価であ
り、表面積の大きな銅くずが使用されている。銅くずと
しては、スクラップ銅線を細断したものを用いるのが一
般的であるが、その他、溶融押出品を細断したものなど
も用いられている。これらの銅くずは、押出加工時の伸
線油や被覆材料由来の不純物、スクラップ化及び細断時
に付着した不純物により汚染されている。2. Description of the Related Art An electrolytic copper foil manufacturing process is a composite process comprising a dissolving step of dissolving a copper raw material in an electrolytic solution and a copper depositing step of electrolytically depositing copper using the electrolytic solution in which the copper raw material is dissolved. Therefore, it is necessary to dissolve a copper raw material in an amount corresponding to the copper to be deposited in the electrolytic solution. As the copper raw material, inexpensive and large-surface-area copper scrap is used. As the copper scrap, it is common to use scrap copper wire that has been shredded. In addition, those obtained by shredding a melt extruded product have also been used. These copper scraps are contaminated by impurities derived from wire drawing oil and coating materials during extrusion processing and impurities attached during scrapping and shredding.
【０００３】近年、高密度電子回路を実現するため、微
細回路形成に適した薄い電解銅箔が望まれている。銅原
料を硫酸水溶液に溶解させた硫酸銅水溶液にゼラチンな
ど有機物や塩化物などを添加した電解液を用い、電気分
解により薄い電解銅箔を製造する方法が知られている
が、この方法により得られた電解銅箔は引張強度が小さ
く、剛性に乏しいため取扱が難しいという難点があっ
た。また、この製造方法で得られた電解銅箔は銅箔析出
面側の表面粗さが比較的大きく、厚さが不均一であるた
め、薄銅箔ではしわなどの原因となる傾向があった。さ
らに、表面粗さが大きいことはオーバーエッチングの原
因となり、微細回路の形成に支障をきたすという問題が
あった。In recent years, in order to realize a high-density electronic circuit, a thin electrolytic copper foil suitable for forming a fine circuit has been desired. A method of producing a thin electrolytic copper foil by electrolysis using an electrolytic solution obtained by adding an organic substance such as gelatin or a chloride to a copper sulfate aqueous solution obtained by dissolving a copper raw material in a sulfuric acid aqueous solution is known. The obtained electrolytic copper foil had a drawback that it was difficult to handle because of its low tensile strength and poor rigidity. In addition, the electrolytic copper foil obtained by this manufacturing method has a relatively large surface roughness on the copper foil deposition surface side and a non-uniform thickness, so thin copper foil tends to cause wrinkles and the like. . Further, there is a problem that the large surface roughness causes over-etching and hinders the formation of a fine circuit.
【０００４】[0004]
【発明が解決しようとする課題】本発明の目的は、従来
から使用されている安価な銅くずから得られる電解液を
用いて、薄くて引張強度が大きく、剛性が高いことから
取扱性に優れ、両面が平滑で同等の表面粗さを有し、伸
び率に優れた電解銅箔を製造することができる電解銅箔
の製造方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a thin, high tensile strength, high rigidity and excellent handleability by using an inexpensive electrolytic solution obtained from inexpensive copper chips. It is another object of the present invention to provide a method for producing an electrolytic copper foil capable of producing an electrolytic copper foil having both surfaces smooth and equivalent surface roughness and excellent in elongation.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、前記目的
を達成するために鋭意研究を重ねた結果、電解液に溶解
する銅原料として銅くずを用い、銅くずを焼成処理した
後、酸洗処理して得られた処理銅くずを用いることによ
り、薄くて引張強度が大きく、剛性が高いことから取扱
性に優れ、両面が平滑で同等の表面粗さを有し、伸び率
に優れた電解銅箔を製造することができることを見出
し、この知見に基づいて本発明を完成するに至った。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have used copper scrap as a copper raw material to be dissolved in an electrolytic solution, and fired the copper scrap. By using the treated copper scrap obtained by pickling treatment, it is thin, has high tensile strength, and has high rigidity, so it is excellent in handleability, both surfaces are smooth and has the same surface roughness, and it has excellent elongation It has been found that an electrolytic copper foil can be produced, and the present invention has been completed based on this finding.
【０００６】すなわち、本発明は、銅くずを焼成処理し
た後、酸洗処理して得られた処理銅くずを硫酸水溶液に
溶解して電解液を作製し、得られた電解液を用いて電気
分解により銅析出を行うことを特徴とする電解銅箔の製
造方法を提供するものである。That is, according to the present invention, an electrolytic solution is produced by dissolving the treated copper scrap obtained by baking copper scrap and then pickling it in an aqueous solution of sulfuric acid, and using the obtained electrolyte to produce an electric solution. An object of the present invention is to provide a method for producing an electrolytic copper foil, wherein copper is deposited by decomposition.
【０００７】本発明により得られた電解銅箔は、薄くて
引張強度が大きく、微細回路の形成に適し、伸び率に優
れていることから、例えば、内層回路として用いた場合
に熱膨張に基づく断線不良を防止することができ、電子
回路用銅箔として極めて優れた特性を有している。さら
に、両面が平滑で同等の表面粗さを有し、剛性が高いこ
とから二次電池用活物質合剤の両面塗工が容易であり、
また、伸び率に優れることから、リチウムイオン二次電
池の負極板用銅箔としても極めて有用な銅箔である。The electrolytic copper foil obtained according to the present invention is thin, has a large tensile strength, is suitable for forming a fine circuit, and has an excellent elongation. Disconnection failure can be prevented, and it has extremely excellent characteristics as copper foil for electronic circuits. Furthermore, since both surfaces are smooth and have the same surface roughness, and the rigidity is high, it is easy to apply both surfaces of the active material mixture for a secondary battery,
Further, since it has excellent elongation, it is an extremely useful copper foil as a copper foil for a negative electrode plate of a lithium ion secondary battery.
【０００８】[0008]
【発明の実施の形態】本発明において用いられる銅くず
としては、好ましくは、異物、異材を混入しない銅分が
９９％以上のものが用いられる。より好ましくは、ＪＩ
Ｓ Ｈ ２１０９に規定される１号ナゲット銅が用いら
れる。これは、安価に入手できる銅くずで、銅線又は銅
より線をナゲット加工した（短切線）純良なもので、銅
分が９９．９％以上のものである。また、銅覆鋼線など
異材及び異物が混入していないものである。また、ＪＩ
Ｓ Ｈ ２１０９に規定される１号銅線くずも使用可能
である。本発明においては、この銅くずに焼成処理と酸
洗処理を行って得られた処理銅くずを硫酸に溶解して電
解液を作製する。BEST MODE FOR CARRYING OUT THE INVENTION The copper scrap used in the present invention is preferably one having a copper content of 99% or more which does not contain foreign matter and foreign materials. More preferably, JI
No. 1 nugget copper specified in SH 2109 is used. This is inexpensive copper swarf, which is a copper wire or a copper stranded wire nugget-processed (short cut wire), and has a copper content of 99.9% or more. In addition, a foreign material such as a copper-coated steel wire and a foreign material are not mixed. Also, JI
No. 1 copper wire scrap specified in SH 2109 can also be used. In the present invention, an electrolytic solution is prepared by dissolving the treated copper scrap obtained by subjecting the copper scrap to a baking treatment and an acid washing treatment in sulfuric acid.
【０００９】焼成処理を行うことにより、銅くずの表面
付着物が酸化・燃焼するとともに、酸化された表面が酸
で容易に浸食されるため、酸洗効率が向上し、油分など
の付着物が容易に除去できるようになる。焼成処理の条
件は銅くずの表面に薄い酸化銅層が形成される条件が適
切であり、好ましくは銅くずを５００℃〜８００℃の酸
化雰囲気に、好ましくは１分〜３０分間さらすことによ
り行われる。この操作を繰り返し行ってもよい。具体的
には被処理物に５００〜８００℃の熱風を１分〜３０分
送風することにより行われる。焼成処理に用いられる焼
成処理装置の形式は問わないが、内部で銅くずを流動さ
せることで酸化が進むため、適切な揺動機構や撹拌機構
を有するものが好ましく用いられる。By performing the calcination treatment, the surface deposits of copper chips are oxidized and burnt, and the oxidized surface is easily eroded by the acid, so that the pickling efficiency is improved and the deposits such as oils are removed. It can be easily removed. The conditions for the baking treatment are suitably such that a thin copper oxide layer is formed on the surface of the copper scrap, and the firing is preferably performed by exposing the copper scrap to an oxidizing atmosphere at 500 ° C to 800 ° C, preferably for 1 minute to 30 minutes. Will be This operation may be repeated. Specifically, it is performed by blowing hot air of 500 to 800 ° C. to the object to be processed for 1 to 30 minutes. The type of the baking treatment apparatus used for the baking treatment is not limited. However, since the oxidation proceeds by flowing copper scrap inside, a device having an appropriate rocking mechanism or stirring mechanism is preferably used.
【００１０】焼成処理を行った後、焼成処理された銅く
ずに酸洗処理を行う。酸洗処理において、酸洗液として
は０．１〜２．０ｍｏｌ／ｌの硫酸水溶液が好ましく用
いられる。硫酸水溶液のほか、電気分解に用いる電解液
を用いることもできる。その他の無機酸や有機酸の水溶
液は、電解液の汚染原因となることから好ましくない。
水洗装置も形式を問わないが、銅くずと十分に接触する
ための機構を有することが好ましい。このような装置
は、酸洗液の循環機構を設けて被処理物を揺動させるな
どによって実現可能である。酸洗処理は硫酸水溶液中で
被処理物を好ましくは１０℃〜６０℃の温度で、１分〜
３０分間揺動させることにより行われる。酸洗処理後に
純水を用いて処理銅くずを十分に洗浄し、付着物を除去
する。After the baking treatment, the baking-treated copper scrap is subjected to a pickling treatment. In the pickling treatment, a 0.1 to 2.0 mol / l aqueous sulfuric acid solution is preferably used as the pickling solution. In addition to the sulfuric acid aqueous solution, an electrolytic solution used for electrolysis can also be used. An aqueous solution of another inorganic acid or organic acid is not preferable because it causes contamination of the electrolytic solution.
Although the type of the washing device is not limited, it is preferable that the washing device has a mechanism for making sufficient contact with copper scrap. Such an apparatus can be realized by, for example, providing a pickling liquid circulation mechanism to swing the workpiece. The pickling treatment is performed at a temperature of 10 ° C to 60 ° C in an aqueous solution of sulfuric acid, preferably for 1 minute
This is done by rocking for 30 minutes. After the pickling treatment, the treated copper chips are sufficiently washed with pure water to remove deposits.
【００１１】次に、上記で得られた処理銅くずを硫酸水
溶液に溶解する。この硫酸水溶液としては、濃度が０．
１〜５ｍｏｌ／ｌのものが好ましく、０．５〜３ｍｏｌ
／ｌのものがより好ましい。銅くずの溶解は硫酸水溶液
に空気を送り込みながら行うことが好ましい。次いで得
られた電解液を用いて電気分解を行い、陰極に銅を析出
させる。電気分解の条件は特に限定されず、通常の電解
銅箔製造の電解条件で行われる。好ましくは、電流密度
５〜１５０Ａ／ｄｍ2、電解時間１〜３０分間の条件で
行われ、厚さ２μｍ以上の電解銅箔が得られる。薄い、
すなわち、２〜１０μｍの電解銅箔を得るためには、電
流と電解時間適宜制御して行う。更に必要ならば、銅箔
面に粗化処理や防錆処理を行うことができる。Next, the treated copper scrap obtained above is dissolved in an aqueous sulfuric acid solution. This sulfuric acid aqueous solution has a concentration of 0.1.
1 to 5 mol / l is preferable, and 0.5 to 3 mol
/ L is more preferred. The dissolution of copper scrap is preferably performed while blowing air into the aqueous sulfuric acid solution. Next, electrolysis is performed using the obtained electrolytic solution to deposit copper on the cathode. The conditions for the electrolysis are not particularly limited, and the electrolysis is carried out under the electrolysis conditions for producing an ordinary electrolytic copper foil. Preferably, it is performed under the conditions of a current density of 5 to 150 A / dm 2 and an electrolysis time of 1 to 30 minutes to obtain an electrolytic copper foil having a thickness of 2 μm or more. thin,
That is, in order to obtain an electrolytic copper foil of 2 to 10 μm, current and electrolysis time are appropriately controlled. If necessary, the copper foil surface may be subjected to a roughening treatment or a rust-preventive treatment.
【００１２】[0012]
【実施例】以下、本発明の実施例及びその比較例によっ
て本発明を更に具体的に説明するが、本発明はこれらの
実施例に限定されるものではない。EXAMPLES Hereinafter, the present invention will be described more specifically with reference to Examples of the present invention and Comparative Examples thereof, but the present invention is not limited to these Examples.
【００１３】実施例１ ＪＩＳ Ｈ ２１０９に規定される１号ナゲット銅（平
均重量０．２ｇ／個）５００ｇを白金製金網に入れ、下
から７００℃の熱風を１分間送風した。ナゲット銅を十
分に混合した後、再度７００℃の熱風を１分間送風し
た。この送風操作を１０回繰り返して行うことで、焼成
処理を行った。Example 1 500 g of No. 1 nugget copper (average weight: 0.2 g / piece) specified in JIS H 2109 was put in a platinum wire net, and hot air at 700 ° C. was blown from below for 1 minute. After sufficiently mixing the nugget copper, hot air at 700 ° C. was blown again for one minute. By repeating this blowing operation ten times, a baking treatment was performed.
【００１４】試薬硫酸から調製した１ｍｏｌ／ｌの硫酸
水溶液に焼成処理されたナゲット銅を投入し、硫酸水溶
液中で３分間揺動させた。次いでナゲット銅を純水中に
移して３分間揺動させた。この二つの操作を三回繰り返
した。The calcined nugget copper was added to a 1 mol / l sulfuric acid aqueous solution prepared from the reagent sulfuric acid, and was shaken in the sulfuric acid aqueous solution for 3 minutes. Next, the nugget copper was transferred into pure water and rocked for 3 minutes. These two operations were repeated three times.
【００１５】試薬硫酸から調製した２ｍｏｌ／ｌの硫酸
水溶液に酸洗処理したナゲット銅を投入し、空気を送り
込みながらナゲット銅を完全に溶解させた。なお、空気
は硫酸水溶液、水酸化ナトリウム水溶液とシリカゲルと
を通気させた後、０．５μｍフィルタを介してゴミや不
純物の混入を防止したものを用いた。The nugget copper, which had been pickled, was added to a 2 mol / l sulfuric acid aqueous solution prepared from the reagent sulfuric acid, and the nugget copper was completely dissolved while sending air. The air used was one in which a sulfuric acid aqueous solution, a sodium hydroxide aqueous solution and silica gel were aerated, and dust and impurities were prevented from being mixed through a 0.5 μm filter.
【００１６】次いで硫酸と純水とで硫酸銅２８０ｇ／
ｌ、硫酸８０ｇ／ｌに濃度を調節し、電解液とした。Next, 280 g of copper sulfate is mixed with sulfuric acid and pure water.
1 and sulfuric acid at a concentration of 80 g / l to prepare an electrolytic solution.
【００１７】陰極として、径５ｃｍのチタン製円筒状電
極を用い、表面を２０００番の研磨紙を用いて研磨を行
った。表面粗さはＲａで０．２０μｍであった。陽極板
には円筒状の鉛板を用い、上記の電解液を用いて液温４
０℃、電流密度１０Ａ／ｄｍ 2で５分間電気分解を行
い、銅箔を析出させた。ただし円筒状電極の回転数は３
００ｒｐｍとした。銅箔は両面ともに光沢を有し、重量
法により求めた厚さは１２μｍであった。機械特性の測
定結果を表１に示す。As a cathode, a 5 cm diameter titanium cylindrical electrode is used.
Using a pole, the surface is polished using # 2000 abrasive paper.
Was. The surface roughness was 0.20 μm in Ra. Anode plate
A cylindrical lead plate is used for the liquid temperature of 4 using the above-mentioned electrolytic solution.
0 ° C, current density 10A / dm TwoElectrolysis for 5 minutes
A copper foil was deposited. However, the rotation speed of the cylindrical electrode is 3
00 rpm. Copper foil has gloss on both sides, weight
The thickness determined by the method was 12 μm. Measurement of mechanical properties
The results are shown in Table 1.
【００１８】比較例１ 焼成処理を行わないほかは実施例１と同様に銅箔を調製
し、機械特性を評価した。結果を表１に示した。Comparative Example 1 A copper foil was prepared and the mechanical properties were evaluated in the same manner as in Example 1 except that the baking treatment was not performed. The results are shown in Table 1.
【００１９】比較例２ 酸洗処理を行わないほかは実施例１と同様に銅箔を調製
し、機械特性を評価した。結果を表１に示した。Comparative Example 2 A copper foil was prepared and the mechanical properties were evaluated in the same manner as in Example 1 except that no pickling treatment was performed. The results are shown in Table 1.
【００２０】比較例３ 焼成処理と酸洗処理を行わないほかは実施例１と同様に
銅箔を調製し、機械特性を評価した。結果を表１に示し
た。Comparative Example 3 A copper foil was prepared and the mechanical properties were evaluated in the same manner as in Example 1 except that the baking treatment and the pickling treatment were not performed. The results are shown in Table 1.
【００２１】[0021]
【表１】 表面粗さはＪＩＳ Ｂ ０６５１に基づいて測定した。
引張強度は常態（２３℃）及び１８０℃で１時間加熱後
の引張強度をＪＩＳ Ｃ６５１５に基づいて測定した。
伸び率は常態（２３℃）及び１８０℃で１時間加熱後の
引張強度をＪＩＳ Ｃ６５１５に基づいて測定した。[Table 1] The surface roughness was measured based on JIS B 0651.
The tensile strength was measured at normal temperature (23 ° C.) and after heating at 180 ° C. for 1 hour based on JIS C6515.
The elongation was measured based on JIS C6515 by measuring the tensile strength after heating at normal temperature (23 ° C.) and 180 ° C. for 1 hour.
【００２２】[0022]
【発明の効果】本発明の製造方法により得られた電解銅
箔は、薄くて引張強度が大きく、剛性が高いことから取
扱性に優れ、両面が平滑で同等の表面粗さを有し、伸び
率に優れた、微細回路を有する電子回路用銅箔やリチウ
ムイオン二次電池の負極板用銅箔として極めて有用であ
る。The electrolytic copper foil obtained by the production method of the present invention is thin, has high tensile strength, and has high rigidity, so that it has excellent handleability, has smooth surfaces on both sides, has the same surface roughness, and has an elongation. It is extremely useful as a copper foil for an electronic circuit having a fine circuit and a negative electrode plate of a lithium ion secondary battery having an excellent efficiency.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小林 勝己 茨城県下館市下江連1226番地 日本電解株 式会社下館工場内 (72)発明者 成島 良一 茨城県下館市下江連1226番地 日本電解株 式会社下館工場内 (72)発明者 阿曽 和義 茨城県下館市下江連1226番地 日本電解株 式会社下館工場内 Ｆターム(参考） 4K001 AA09 BA22 CA07 CA09 DB03 DB17 4K023 AA19 BA06 DA02 DA06 4K058 AA23 BA21 BA38 CA04 CA11 CA13 CA25 CA28 EB04 EB16 ED04 FA01 FA06 ──────────────────────────────────────────────────続 き Continued on front page (72) Inventor Katsumi Kobayashi 1226 Shimoedashiri, Shimodate City, Ibaraki Pref. Inside Shimodate Plant of Nippon Electrolysis Co., Ltd. Inside the Shimodate Plant (72) Inventor Kazuyoshi Aso 1226 Shimoe-ren, Shimodate City, Ibaraki Pref. CA25 CA28 EB04 EB16 ED04 FA01 FA06
Claims (4)
得られた処理銅を硫酸水溶液に溶解して電解液を作製
し、得られた電解液を用いて電気分解により銅析出を行
うことを特徴とする電解銅箔の製造方法。After sintering copper scrap, the treated copper obtained by pickling is dissolved in an aqueous sulfuric acid solution to prepare an electrolytic solution, and copper deposition is performed by electrolysis using the obtained electrolytic solution. A method for producing an electrolytic copper foil.
の熱風を１〜３０分間送風することにより行われる請求
項１記載の電解銅箔の製造方法。2. A sintering treatment is performed at 500 to 800 ° C.
The method for producing an electrolytic copper foil according to claim 1, wherein the hot air is blown for 1 to 30 minutes.
１〜２．０ｍｏｌ／ｌの硫酸水溶液中で揺動させること
により行われる請求項１又は２記載の電解銅箔の製造方
法。3. The pickling treatment removes the calcined copper waste to a concentration of 0.1%.
The method for producing an electrolytic copper foil according to claim 1, wherein the method is performed by rocking in a 1 to 2.0 mol / l sulfuric acid aqueous solution.
れる１号ナゲット銅である請求項１、２又は３記載の電
解銅箔の製造方法。4. The method for producing an electrolytic copper foil according to claim 1, wherein the copper scrap is No. 1 nugget copper specified in JIS H 2109.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18352899A JP4349690B2 (en) | 1999-06-29 | 1999-06-29 | Method for producing electrolytic copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18352899A JP4349690B2 (en) | 1999-06-29 | 1999-06-29 | Method for producing electrolytic copper foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001011684A true JP2001011684A (en) | 2001-01-16 |
| JP4349690B2 JP4349690B2 (en) | 2009-10-21 |
Family
ID=16137423
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18352899A Expired - Lifetime JP4349690B2 (en) | 1999-06-29 | 1999-06-29 | Method for producing electrolytic copper foil |
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| WO2002058442A1 (en) * | 2001-01-22 | 2002-07-25 | Sony Chemicals Corp. | Flexible printed wiring board |
| JP2006152420A (en) * | 2004-12-01 | 2006-06-15 | Mitsui Mining & Smelting Co Ltd | Electrolytic copper foil and method for producing the same |
| KR100919947B1 (en) * | 2007-10-18 | 2009-10-01 | (주)한두패키지 | Gravure Printer-cylinder |
| US9457541B2 (en) | 2010-07-15 | 2016-10-04 | Ls Mtron Ltd. | Copper foil for current collector of lithium secondary battery with improved wrinkle characteristics |
| US9549471B2 (en) | 2010-07-15 | 2017-01-17 | Jx Nippon Mining & Metals Corporation | Copper foil composite |
| JP2017088943A (en) * | 2015-11-06 | 2017-05-25 | Ｊｘ金属株式会社 | Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic device |
| US9955574B2 (en) | 2012-01-13 | 2018-04-24 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| JP2018080384A (en) * | 2016-11-15 | 2018-05-24 | エル エス エムトロン リミテッドＬＳ Ｍｔｒｏｎ Ｌｔｄ． | Production method of electrolytic copper foil with minimized curl, electrode including the same, secondary battery including the same, and method of producing the same |
| US9981450B2 (en) | 2012-01-13 | 2018-05-29 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| EP3316363A4 (en) * | 2015-06-24 | 2018-11-14 | KCF Technologies Co., Ltd. | Electrolytic copper foil, current collector including same electrolytic copper foil, electrode including same current collector, secondary battery including same electrode, and method for manufacturing same |
| US10178816B2 (en) | 2011-05-13 | 2019-01-08 | Jx Nippon Mining & Metals Corporation | Copper foil composite, copper foil used for the same, formed product and method of producing the same |
| CN111286745A (en) * | 2018-12-06 | 2020-06-16 | 湖北工程学院 | Additive for high-tensile electrolytic copper foil, preparation method of electrolytic copper foil and lithium ion battery |
-
1999
- 1999-06-29 JP JP18352899A patent/JP4349690B2/en not_active Expired - Lifetime
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|---|---|---|---|---|
| WO2002058442A1 (en) * | 2001-01-22 | 2002-07-25 | Sony Chemicals Corp. | Flexible printed wiring board |
| US6835442B2 (en) | 2001-01-22 | 2004-12-28 | Sony Chemicals Corp. | Flexible printed wiring board |
| JP2006152420A (en) * | 2004-12-01 | 2006-06-15 | Mitsui Mining & Smelting Co Ltd | Electrolytic copper foil and method for producing the same |
| JP4583149B2 (en) * | 2004-12-01 | 2010-11-17 | 三井金属鉱業株式会社 | Electrolytic copper foil and method for producing the same |
| KR100919947B1 (en) * | 2007-10-18 | 2009-10-01 | (주)한두패키지 | Gravure Printer-cylinder |
| US9457541B2 (en) | 2010-07-15 | 2016-10-04 | Ls Mtron Ltd. | Copper foil for current collector of lithium secondary battery with improved wrinkle characteristics |
| US9549471B2 (en) | 2010-07-15 | 2017-01-17 | Jx Nippon Mining & Metals Corporation | Copper foil composite |
| US10283778B2 (en) | 2010-07-15 | 2019-05-07 | Kcf Technologies Co., Ltd. | Copper foil for current collector of lithium secondary battery with improved wrinkle characteristics |
| US10178816B2 (en) | 2011-05-13 | 2019-01-08 | Jx Nippon Mining & Metals Corporation | Copper foil composite, copper foil used for the same, formed product and method of producing the same |
| US9981450B2 (en) | 2012-01-13 | 2018-05-29 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| US9955574B2 (en) | 2012-01-13 | 2018-04-24 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| EP3316363A4 (en) * | 2015-06-24 | 2018-11-14 | KCF Technologies Co., Ltd. | Electrolytic copper foil, current collector including same electrolytic copper foil, electrode including same current collector, secondary battery including same electrode, and method for manufacturing same |
| US10480090B2 (en) | 2015-06-24 | 2019-11-19 | Kcf Technologies Co., Ltd. | Electrolytic copper foil, current collector comprising the same, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same |
| JP2017088943A (en) * | 2015-11-06 | 2017-05-25 | Ｊｘ金属株式会社 | Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic device |
| JP2018080384A (en) * | 2016-11-15 | 2018-05-24 | エル エス エムトロン リミテッドＬＳ Ｍｔｒｏｎ Ｌｔｄ． | Production method of electrolytic copper foil with minimized curl, electrode including the same, secondary battery including the same, and method of producing the same |
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