JP2001000043A - Light source for cultivation - Google Patents
Light source for cultivationInfo
- Publication number
- JP2001000043A JP2001000043A JP17250299A JP17250299A JP2001000043A JP 2001000043 A JP2001000043 A JP 2001000043A JP 17250299 A JP17250299 A JP 17250299A JP 17250299 A JP17250299 A JP 17250299A JP 2001000043 A JP2001000043 A JP 2001000043A
- Authority
- JP
- Japan
- Prior art keywords
- panel
- light source
- cultivation
- optical semiconductor
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Cultivation Of Plants (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、栽培用光源に関するも
のであり、詳しくは、光半導体素子を利用したパネル状
の光源であって、照射効率を一層高めることが出来かつ
製造コストをより低減できる栽培用光源に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source for cultivation, and more particularly, to a panel-shaped light source using an optical semiconductor element, which can further increase the irradiation efficiency and reduce the production cost. The present invention relates to a cultivation light source that can be used.
【０００２】[0002]
【従来の技術】植物栽培装置は、光、温度、湿度、炭酸
ガス濃度、水耕液濃度などの種々の植物成長条件を制御
し、農作物や苗などを計画的に生産する植物工場、野菜
工場、育苗装置などに使用される。植物栽培装置の本格
的な実用化のためには、設備コスト及び運転コストの低
減が重要な要素である。2. Description of the Related Art A plant cultivation apparatus controls various plant growth conditions such as light, temperature, humidity, carbon dioxide concentration, and hydroponic solution concentration, and is a plant factory or a vegetable factory for producing crops and seedlings in a planned manner. Used for seedling raising equipment. For full-scale practical use of a plant cultivation apparatus, reduction of equipment cost and operation cost is an important factor.
【０００３】特開平９−９８６６５号公報には、発光ダ
イオード等の光半導体素子が多数配列されたパネル状の
光源装置（半導体ユニット）と植物栽培ボード（培地）
とを交互に積み重ねることにより、より省スペースで収
穫量を高め得る植物栽培装置が開示されている。上記の
光源装置を構成する光半導体素子は、植物に必要な波長
を自由に選択でき、かつ、赤外線や熱線を全く含まない
ため、葉焼け等の障害がなく、植物に対して光を近接照
射ができる。Japanese Patent Application Laid-Open No. 9-98665 discloses a panel-like light source device (semiconductor unit) in which a large number of optical semiconductor elements such as light emitting diodes are arranged, and a plant cultivation board (medium).
A plant cultivation apparatus that can increase the yield in a more space-saving manner by alternately stacking と and と is disclosed. The optical semiconductor element constituting the above light source device can freely select a wavelength required for the plant, and does not include infrared rays or heat rays at all, so that there is no obstacle such as leaf burning, and the plant is irradiated with light in proximity. Can be.
【０００４】[0004]
【発明が解決しようとする課題】ところで、上記の様な
パネル状の光源装置における個々の光半導体素子は、光
量が極めて少なく、また、全方向に光を照射するため、
パネル面に略平行な光が培地に照射されないと言う問題
がある。従って、運転コストの低減と言う観点からは、
各光半導体素子の光のより有効な利用方法が望まれる。The individual optical semiconductor elements in the panel-like light source device described above have extremely small light amounts and emit light in all directions.
There is a problem that light substantially parallel to the panel surface is not irradiated on the culture medium. Therefore, from the viewpoint of reducing operating costs,
A more effective use of light from each optical semiconductor element is desired.
【０００５】光半導体素子の光を効率的に照射する方法
としては、例えば、凹面鏡の様な椀形またはすり鉢形の
反射鏡の内部に１〜３個の光半導体素子を取り付けるこ
とにより、光半導体素子の集合体を作製し、当該集合体
をパネル表面に多数配列することも考えられる。しかし
ながら、光半導体素子自体は、非常に小さな部材である
ため、上記の様な反射鏡と組み合わせる工程を考慮する
と、光源装置の製造コストを十分に低減することが出来
ない。As a method for efficiently irradiating light from an optical semiconductor device, for example, one to three optical semiconductor devices are mounted inside a bowl-shaped or mortar-shaped reflecting mirror such as a concave mirror. It is also conceivable to prepare an assembly of elements and arrange a large number of such assemblies on the panel surface. However, since the optical semiconductor element itself is a very small member, the manufacturing cost of the light source device cannot be sufficiently reduced in consideration of the step of combining the optical semiconductor element with the reflecting mirror as described above.
【０００６】本発明は、上記の実情に鑑みなされたもの
であり、その目的は、光半導体素子を利用したパネル状
の光源であって、照射効率を一層高めることが出来かつ
製造コストをより低減できる栽培用光源を提供すること
にある。The present invention has been made in view of the above circumstances, and has as its object to provide a panel-like light source using an optical semiconductor element, which can further increase the irradiation efficiency and further reduce the manufacturing cost. It is an object of the present invention to provide a light source for cultivation.
【０００７】[0007]
【課題を解決するための手段】上記の課題を解決するた
め、本発明の栽培用光源は、植物栽培に使用される光源
であって、培地に略対向して設置されるパネルと、当該
パネルの表面に配列された複数の板状の発光体と、これ
ら発光体の縁に沿って配置された反射部材とから構成さ
れ、各発光体は、プリント基板上に多数の光半導体素子
を直接取り付け且つこれら光半導体素子を透明性の防湿
材で被覆して成り、前記反射部材は、隣接する発光体の
表面に対する開き角度が１１０〜１５０度に設定された
反射面を備えていることを特徴とする。In order to solve the above-mentioned problems, a light source for cultivation according to the present invention is a light source used for plant cultivation, comprising: a panel installed substantially opposed to a culture medium; A plurality of plate-shaped light-emitting elements arranged on the surface of the light-emitting element, and a reflecting member arranged along the edge of the light-emitting elements. Each light-emitting element directly mounts a large number of optical semiconductor elements on a printed circuit board. In addition, the optical semiconductor element is formed by coating the optical semiconductor element with a transparent moisture-proof material, and the reflection member has a reflection surface whose opening angle with respect to the surface of the adjacent luminous body is set to 110 to 150 degrees. I do.
【０００８】すなわち、上記の栽培用光源において、反
射部材は、発光体の表面に対して特定の開き角度に設定
された反射面を備えており、パネルの表面に平行な光半
導体素子の光を前記反射面によって培地側に反射する。That is, in the cultivation light source described above, the reflecting member has a reflecting surface set at a specific opening angle with respect to the surface of the luminous body, and transmits light of the optical semiconductor element parallel to the surface of the panel. The light is reflected toward the culture medium by the reflection surface.
【０００９】[0009]
【発明の実施の形態】本発明に係る栽培用光源の一実施
形態を図面に基づいて説明する。図１は、本発明に係る
栽培用光源の全体構造を示す一部破断の斜視図である。
図２は、パネルに配置される板状の発光体の平面図であ
る。図３は、発光体における各光半導体素子の取り付け
状態を示す縦断面図である。図４は、反射部材の外形を
示す斜視図である。以下、実施形態の説明においては、
栽培用光源を「光源」と略記する。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a cultivation light source according to the present invention will be described with reference to the drawings. FIG. 1 is a partially broken perspective view showing the entire structure of a cultivation light source according to the present invention.
FIG. 2 is a plan view of a plate-shaped light emitter disposed on the panel. FIG. 3 is a longitudinal sectional view showing a mounting state of each optical semiconductor element in the light emitting body. FIG. 4 is a perspective view showing the outer shape of the reflection member. Hereinafter, in the description of the embodiment,
The light source for cultivation is abbreviated as “light source”.
【００１０】本発明の光源は、植物工場、野菜工場、育
苗装置などで植物栽培に使用される光源であり、図１に
示す様に、培地（図示省略）に略対向して設置されるパ
ネル（１）と、パネル（１）の表面に配列された複数の
板状の発光体（２）と、これら発光体（２）の縁に沿っ
てパネル（１）の表面に配置された反射部材（３）とか
ら主として構成される。植物工場、野菜工場、育苗装置
などにおいて、培地としては、通常、噴霧水耕装置を有
する植物栽培ボードが使用される。The light source of the present invention is a light source used for plant cultivation in a plant factory, a vegetable factory, a seedling raising apparatus, etc., and as shown in FIG. 1, a panel installed substantially opposite to a culture medium (not shown). (1), a plurality of plate-shaped light emitters (2) arranged on the surface of the panel (1), and a reflecting member arranged on the surface of the panel (1) along the edges of the light emitters (2) (3) mainly. In a plant factory, a vegetable factory, a seedling raising device, and the like, a plant cultivation board having a spray hydroponic device is usually used as a medium.
【００１１】パネル（１）は、板状の発光体（２）を配
列するための方形状の支持板であり、後述する構造によ
って発光体（２）の冷却を促進するため、例えば、アル
ミニウム合金や熱伝導率の高いセラミックスによって構
成される。パネル（１）の平面寸法は、発光体（２）の
配置数や育苗装置の大きさ等によって適宜設定し得る
が、通常、５０〜１００ｃｍ×５０〜１００ｃｍ程度、
厚さは３〜１０ｍｍ程度に設定される。The panel (1) is a rectangular support plate for arranging the plate-shaped light-emitting members (2). The panel (1) is made of, for example, an aluminum alloy to promote cooling of the light-emitting members (2) by a structure described later. And ceramics with high thermal conductivity. The plane dimensions of the panel (1) can be appropriately set depending on the number of luminous bodies (2) arranged, the size of the seedling raising device, and the like. Usually, the size is about 50 to 100 cm × 50 to 100 cm,
The thickness is set to about 3 to 10 mm.
【００１２】各発光体（２）は、図２に示す様に、方形
状のプリント基板（２１）上に多数の光半導体素子（２
４）を直接取り付けて構成される。プリント基板（２
１）の基板素材としては、後述する様に、光半導体素子
（２４）の冷却を促進するため、熱伝導率の高いセラミ
ックス等が好ましい。すなわち、プリント基板（２１）
は、セラミックス基板の表面に銅、アルミニウム又は銀
の電送路（２２）を印刷して構成される。また、電送路
（２２）は、ニッケルやクロムのメッキをプリント基板
（２１）に施すことによって設けられてもよい。プリン
ト基板（２１）の回路は、例えば、数個の光半導体素子
（２４）が直列接続された１０〜１５の回路を並列に接
続して構成される。１枚のプリント基板（２１）の平面
寸法は、５０〜２００ｍｍ×５０〜１００ｍｍ程度、厚
さは１〜３ｍｍ程度に設定される。As shown in FIG. 2, each light emitter (2) has a large number of optical semiconductor elements (2) on a rectangular printed circuit board (21).
4) is directly attached. Printed circuit board (2
As the substrate material of 1), as described later, ceramics or the like having a high thermal conductivity is preferable in order to promote cooling of the optical semiconductor element (24). That is, the printed circuit board (21)
Is formed by printing a copper, aluminum or silver transmission path (22) on the surface of a ceramic substrate. Further, the transmission path (22) may be provided by plating the printed circuit board (21) with nickel or chromium. The circuit of the printed circuit board (21) is configured by, for example, connecting in parallel 10 to 15 circuits in which several optical semiconductor elements (24) are connected in series. The plane dimensions of one printed circuit board (21) are set to about 50 to 200 mm × 50 to 100 mm, and the thickness is set to about 1 to 3 mm.
【００１３】また、光半導体素子（２４）は、全方向に
向けて発光するが、プリント基板（２１）の方向（後
方）への光を培地側（前方）へ無駄なく反射させるた
め、光半導体素子（２４）の直下の電送路（２２）やプ
リント基板（２１）は、鏡面化されているのが好まし
い。斯かる鏡面化の方法としては、例えば、研磨加工、
反射率の高い金属によるメッキ等が挙げられる。更に、
光半導体素子（２４）の後方への光を前方へ反射させる
方法としては、電送路（２２）自体が光反射率の一層高
い金属によって構成されていてもよい。The optical semiconductor element (24) emits light in all directions, but reflects light in the direction of the printed circuit board (21) (backward) without waste to the culture medium side (forward). The transmission path (22) and the printed circuit board (21) immediately below the element (24) are preferably mirror-finished. As a method of such mirror finishing, for example, polishing,
Plating with a metal having a high reflectance may be used. Furthermore,
As a method of reflecting light to the rear of the optical semiconductor element (24) forward, the transmission path (22) itself may be made of a metal having a higher light reflectance.
【００１４】光半導体素子（２４）としては、例えば、
Ｚｎ−ＯドープＧａＰ、ＧａＡｌＡｓ系材料から成る発
光ダイオード（ＬＥＤ）や半導体レーザ（ＬＥ）等の所
定波長の光を発光可能な半導体が挙げられる。光半導体
素子（２４）のピーク波長は、十分な電照効果および新
葉展開効果を得るためには６３０〜７００ｎｍの範囲が
好適である。As the optical semiconductor device (24), for example,
Semiconductors capable of emitting light of a predetermined wavelength, such as light-emitting diodes (LEDs) and semiconductor lasers (LEs), made of Zn-O-doped GaP or GaAlAs-based materials, may be used. The peak wavelength of the optical semiconductor element (24) is preferably in the range of 630 to 700 nm in order to obtain a sufficient lighting effect and a new leaf development effect.
【００１５】また、発光体（２）の構造を一層簡単にす
るため、光半導体素子（２４）は、図３に示す様に、予
備加工されることなく、プリント基板（２１）に直接取
り付けられる。そして、プリント基板（２１）上の各光
半導体素子（２４）は、水分による光半導体素子（２
４）の劣化を防止するため、透明性の防湿材（２６）で
気密に被覆される。防湿材（２６）としては、接着性が
高く且つ透明性、耐候性に優れたエポキシ樹脂、シリコ
ン樹脂などの樹脂が使用され、光半導体素子（２４）
は、前記の樹脂によって半球のレンズ状に被覆される。In order to further simplify the structure of the luminous body (2), the optical semiconductor element (24) is directly mounted on the printed circuit board (21) without being pre-processed, as shown in FIG. . Each optical semiconductor element (24) on the printed circuit board (21) is an optical semiconductor element (2)
In order to prevent the deterioration of 4), it is airtightly covered with a transparent moisture-proof material (26). As the moisture proof material (26), a resin such as an epoxy resin or a silicone resin having high adhesiveness and excellent transparency and weather resistance is used.
Is covered with the resin in a hemispherical lens shape.
【００１６】特に、防湿材（２６）によりプリント基板
（２１）に対して垂直な方向に盛り上がった状態で光半
導体素子（２４）を被覆した場合は、光半導体素子（２
４）の光を効率良く取り出すことが出来る。更に、防湿
材（２６）として好適な樹脂は、光半導体素子（２４）
の屈折率に出来る限り近い屈折率を有する樹脂、具体的
には、屈折率ｎ25 Dが１．４以上、好ましくは１．５以
上の樹脂である。In particular, when the optical semiconductor element (24) is covered with the moisture proof material (26) in a state of being raised in the direction perpendicular to the printed circuit board (21), the optical semiconductor element (2)
The light of 4) can be efficiently extracted. Further, a resin suitable as the moisture proof material (26) is an optical semiconductor element (24).
A resin having a refractive index as close as possible to the refractive index, specifically, a resin having a refractive index n 25 D of 1.4 or more, preferably 1.5 or more.
【００１７】図１に示す反射部材（３）は、各発光体
（２）の光半導体素子（２４）から照射される光をより
効率的に利用するために設けられた部材である。反射部
材（３）は、隣接する発光体（２）の表面に対する開き
角度（θ）（図４参照）が特定の角度に設定された反射
面（３１）を備えており、斯かる反射面（３１）は、ク
ロムメッキ、銀メッキ、金メッキ等の処理を施されるこ
とにより、反射率の高い反射面に構成される。The reflecting member (3) shown in FIG. 1 is a member provided to more efficiently use the light emitted from the optical semiconductor element (24) of each light emitting body (2). The reflecting member (3) includes a reflecting surface (31) whose opening angle (θ) (see FIG. 4) with respect to the surface of the adjacent luminous body (2) is set to a specific angle. 31) is formed on a reflective surface having a high reflectance by being subjected to processing such as chrome plating, silver plating, and gold plating.
【００１８】具体的には、図４に示す様に、反射部材
（３）は、２側面が反射面（３１）として形成された略
三角柱状の外形を備え、その高さ方向を発光体（２）の
縁に沿わせてパネル（１）に配置される（図１参照）。
図４（ａ）に示す反射部材（３）は、長手方向に直交す
る断面が正三角形に形成された部材であり、断面の一辺
の長さは、約１５〜２０ｍｍに設定される。また、図４
（ｂ）に示す反射部材（３）は、反射面（３１）が幾分
凹没した状態に湾曲している点が図４（ａ）の反射部材
（３）と異なる。More specifically, as shown in FIG. 4, the reflecting member (3) has a substantially triangular prism-like outer shape having two side surfaces formed as reflecting surfaces (31), and its height direction is defined as a light emitting body ( It is arranged on the panel (1) along the edge of 2) (see FIG. 1).
The reflection member (3) shown in FIG. 4A is a member having a cross section orthogonal to the longitudinal direction formed in a regular triangle, and the length of one side of the cross section is set to about 15 to 20 mm. FIG.
The reflecting member (3) shown in (b) is different from the reflecting member (3) in FIG. 4 (a) in that the reflecting surface (31) is curved in a slightly concave state.
【００１９】反射部材（３）における反射面（３１）の
発光体（２）表面に対する開き角度（θ）とは、設置基
準面（パネル（１）の表面）に対する開き角度と同等で
あり、パネル（１）の表面と反射面（３１）とのなす角
度を言う。本発明においては、発光体（２）の表面に略
平行な光半導体素子（２４）の光を前方へ反射させるた
め、上記の開き角度（θ）は、１１０〜１５０度、好ま
しくは１２０〜１３５度に設定される。なお、図４
（ｂ）に示す様な湾曲した反射面（３１）の開き角度
（θ）とは、断面形状において、反射面（３１）の円弧
を結ぶ玄と設置基準面とのなす角度を言う。The opening angle (θ) of the reflecting surface (31) of the reflecting member (3) with respect to the surface of the luminous body (2) is equal to the opening angle with respect to the installation reference plane (the surface of the panel (1)). The angle formed between the surface of (1) and the reflection surface (31). In the present invention, in order to reflect the light of the optical semiconductor element (24) substantially parallel to the surface of the luminous body (2) forward, the opening angle (θ) is 110 to 150 degrees, preferably 120 to 135 degrees. Set to degree. FIG.
The opening angle (θ) of the curved reflecting surface (31) as shown in (b) refers to the angle between the entrance connecting the arc of the reflecting surface (31) and the installation reference surface in the cross-sectional shape.
【００２０】上記の反射部材（３）は、通常、図１に示
す様に、発光体（２）の各辺と略同等の長さに形成さ
れ、かつ、隣接する発光体（２）の辺に長手方向を沿わ
せて各発光体（２）の間に配列される。反射部材（３）
は、発光体（２）の縁に直接取り付けることも出来る
が、図示した様にパネル（１）の表面に取り付けられ、
反射部材（３）の取付基準面を発光体（２）の光半導体
素子（２４）よりも後退した位置（図１の状態では低い
位置）に設定される。The above-mentioned reflecting member (3) is usually formed to have substantially the same length as each side of the luminous body (2), as shown in FIG. Are arranged between the light emitters (2) along the longitudinal direction. Reflective member (3)
Can be attached directly to the edge of the luminous body (2), but it is attached to the surface of the panel (1) as shown,
The mounting reference surface of the reflection member (3) is set at a position (lower position in the state of FIG. 1) of the light emitter (2) retracted from the optical semiconductor element (24).
【００２１】反射部材（３）の取付基準面を発光体
（２）よりも低い位置に設定する理由は次の通りであ
る。すなわち、反射部材（３）を光半導体素子（２４）
と同じ高さに設置した場合は、パネル（１）の表面と平
行な光半導体素子（２４）の一部の光が反射部材（３）
の底面側に進入し、反射効率が低下する。これに対し、
反射部材（３）の取付基準面を上記の様に低いレベルで
設定することにより、光半導体素子（２４）の水平方向
の略全ての光を捕捉できる。なお、パネル（１）の外周
側に配置される反射部材は、内側の１側面だけが反射面
として形成されていればよい。また、反射部材として
は、図１に示す様な複数の反射部材（３）に代え、これ
らを格子状に連続させた一体的な部材を使用することも
出来る。The reason why the reference mounting surface of the reflecting member (3) is set at a position lower than that of the luminous body (2) is as follows. That is, the reflecting member (3) is replaced with the optical semiconductor element (24).
When installed at the same height as (1), a part of light of the optical semiconductor element (24) parallel to the surface of the panel (1) is
And the reflection efficiency is reduced. In contrast,
By setting the mounting reference surface of the reflecting member (3) at the low level as described above, almost all light in the horizontal direction of the optical semiconductor element (24) can be captured. The reflection member disposed on the outer peripheral side of the panel (1) only needs to have only one inner side surface formed as a reflection surface. Further, as the reflecting member, instead of a plurality of reflecting members (3) as shown in FIG. 1, an integral member in which these are connected in a grid pattern can be used.
【００２２】また、本発明の光源においては、発光体
（２）を構成するプリント基板（２）や光半導体素子
（２４）の湿潤化を防止するため、図１に示す様に、パ
ネル（１）の表面側は、透明な保護板（５）で気密に覆
われているのが好ましい。具体的には、パネル（１）の
表面には、その周縁に取り付けたスぺーサー（４）を介
し、厚さが３〜１０ｍｍの透明性の樹脂またはガラス製
の保護板（５）が敷設される。斯かる構造により、プリ
ント基板（２）及び光半導体素子（２４）の劣化を防止
でき、耐久性を向上できる。なお、パネル（１）と保護
板（５）の間の空間には、乾燥空気または乾燥窒素など
を封入することにより、保護板（５）の内部結露を防止
できる。In the light source of the present invention, as shown in FIG. 1, a panel (1) is provided to prevent the printed circuit board (2) and the optical semiconductor element (24) constituting the luminous body (2) from wetting. It is preferable that the surface side of ()) is hermetically covered with a transparent protective plate (5). Specifically, a protective plate (5) made of a transparent resin or glass having a thickness of 3 to 10 mm is laid on a surface of the panel (1) via a spacer (4) attached to a peripheral edge thereof. Is done. With such a structure, deterioration of the printed circuit board (2) and the optical semiconductor element (24) can be prevented, and durability can be improved. The space between the panel (1) and the protection plate (5) is sealed with dry air or dry nitrogen to prevent dew condensation inside the protection plate (5).
【００２３】更に、本発明の光源においては、光半導体
素子（２４）の長時間の発光による発光体（２）の昇温
を防止するため、パネル（１）の背面には、冷媒を供給
可能な冷却空間（８）が設けられるのが好ましい。具体
的には、パネル（１）の背面には、周縁にスぺーサー
（６）が取り付けられ且つ当該スぺーサーを介して裏板
（７）が取り付けられることにより、冷却空間（８）が
形成される。そして、パネル（１）の対角線方向に対向
する角部の近傍には、冷媒の供給・排出口（９）が付設
される。Further, in the light source of the present invention, a coolant can be supplied to the back surface of the panel (1) in order to prevent the temperature of the luminous body (2) from rising due to long-time light emission of the optical semiconductor element (24). Preferably, a cooling space (8) is provided. Specifically, a cooling space (8) is attached to the back surface of the panel (1) by attaching a spacer (6) to the periphery and attaching a back plate (7) via the spacer. It is formed. A coolant supply / discharge port (9) is provided near the corners of the panel (1) that face each other in the diagonal direction.
【００２４】冷却空間（８）に供給される冷媒として
は、通常、空気、水などの一般的な冷媒が使用される。
斯かる構造により、発光体（２）の光半導体素子（２
４）の昇温を防止でき、光半導体素子（２４）の劣化を
有効に防止できる。なお、パネル（１）の背面にフィン
を設置し、放熱効率をより一層高めることも出来る。As the refrigerant supplied to the cooling space (8), a general refrigerant such as air or water is usually used.
With such a structure, the optical semiconductor element (2
The temperature rise of 4) can be prevented, and the deterioration of the optical semiconductor element (24) can be effectively prevented. Note that fins can be provided on the back surface of the panel (1) to further improve the heat radiation efficiency.
【００２５】上記の様に、本発明の光源は、例えば、培
地としての植物栽培ボードに対向して配置される。そし
て、多数の光半導体素子（２４）を備えた各発光体
（２）は、これに電力を供給されることにより、所定波
長の光を培地に照射する。その際、反射部材（３）は、
発光体（２）の表面に対して特定の開き角度（θ）に設
定された反射面（３１）を備えており、パネル（１）の
表面に平行な光半導体素子（２４）の光も反射面（３
１）によって培地側に反射できる。従って、本発明の光
源においては、光半導体素子（２４）の殆ど全ての光を
培地側に照射でき、培地に対する照射効率を一層高める
ことが出来る。As described above, the light source of the present invention is arranged, for example, opposite to a plant cultivation board as a culture medium. Each illuminant (2) having a large number of optical semiconductor elements (24) irradiates the culture medium with light of a predetermined wavelength by being supplied with electric power. At that time, the reflecting member (3)
It has a reflecting surface (31) set at a specific opening angle (θ) with respect to the surface of the luminous body (2), and reflects light of the optical semiconductor element (24) parallel to the surface of the panel (1). Face (3
The light can be reflected toward the culture medium by 1). Therefore, in the light source of the present invention, almost all the light of the optical semiconductor element (24) can be irradiated on the culture medium side, and the irradiation efficiency on the culture medium can be further improved.
【００２６】しかも、本発明の光源は、プリント基板
（２１）上に光半導体素子（２４）を直接取り付けて発
光体（２）が構成され、そして、発光体（２）の縁に沿
って反射部材（３）が配置された構造を備えているた
め、簡単な工程で製造でき、椀形の反射鏡に光半導体素
子を組込んだ様な光源に比べ、製造コストをより低減で
きる。Moreover, in the light source of the present invention, the light emitting element (2) is constituted by directly mounting the optical semiconductor element (24) on the printed board (21), and the light is reflected along the edge of the light emitting element (2). Since it has a structure in which the member (3) is arranged, it can be manufactured by a simple process, and the manufacturing cost can be further reduced as compared with a light source in which an optical semiconductor element is incorporated in a bowl-shaped reflecting mirror.
【００２７】[0027]
【実施例】実施例１；図１に示す様な光源を製作した。
発光体（２）には、平面寸法が１００ｍｍ×２００ｍ
ｍ、厚さが２ｍｍのセラミックス基板にプリント配線さ
れた図２に示すプリント基板（２１）を使用し、光半導
体素子（２４）を６０個取り付けた。光半導体素子（２
４）としては、ピーク波長が６６０ｎｍのＤＤＨ型超高
輝度光半導体素子を使用し、プリント基板（２１）上の
各光半導体素子（２４）は、エポキシ樹脂の防湿材（２
６）で被覆した。パネル（１）としては、平面寸法が４
７５ｍｍ×６２０ｍｍ、厚さが７ｍｍのセラミックス製
のパネルを使用し、斯かるパネルに上記の発光体（２）
を１０枚配置した。Example 1 A light source as shown in FIG. 1 was manufactured.
The luminous body (2) has a plane dimension of 100 mm × 200 m.
A printed circuit board (21) shown in FIG. 2 was printed and wired on a ceramic substrate having a thickness of 2 mm and a thickness of 2 mm, and 60 optical semiconductor elements (24) were mounted. Optical semiconductor device (2
As 4), a DDH type ultra-high-brightness optical semiconductor device having a peak wavelength of 660 nm is used, and each optical semiconductor device (24) on the printed circuit board (21) is made of an epoxy resin moisture-proof material (2).
6). The panel (1) has a plane dimension of 4
A ceramic panel having a size of 75 mm × 620 mm and a thickness of 7 mm is used, and the luminous body (2) is used for such a panel.
Were arranged.
【００２８】パネル（１）の表面には、透明なガラス製
の保護板（５）を付設し、パネル（１）の背面側に冷却
空間（８）を設けた。そして、各発光体（２）の周囲に
は、図４（ａ）に示す様な反射部材（３）を図１に示す
状態で配置した。反射部材（３）の反射面（３１）はク
ロムメッキ処理を施し、反射面（３１）の開き角度
（θ）は１２０°に設定した。A protective plate (5) made of transparent glass was provided on the surface of the panel (1), and a cooling space (8) was provided on the back side of the panel (1). Then, a reflection member (3) as shown in FIG. 4 (a) is arranged around each light emitting body (2) in a state shown in FIG. The reflecting surface (31) of the reflecting member (3) was subjected to chrome plating, and the opening angle (θ) of the reflecting surface (31) was set to 120 °.
【００２９】上記の光源から得られる光量を確認するた
め、光半導体素子（２４）の１個あたり５０ｍＡに相当
する直流電流を供給して発光させると共に、冷却空間
（８）に２０℃の冷却水をクールサーキュレーターによ
って０．６リットル／分の流量で循環させた。パネル
（１）の表面中央部から４０ｃｍ離れた位置の光出力を
測定した。そして、ＮＦＴ式水耕栽培式装置に上記の光
源を３ユニット取り付け、リーフレタス（品種：レッド
ファイヤー）の栽培試験を行った。栽培室の温度は２０
℃の保持し、２４時間連続して光を照射し、３０日間栽
培した。光源の光出力の測定結果ならびに栽培試験の結
果を表１に示す。In order to confirm the amount of light obtained from the above light source, a direct current corresponding to 50 mA is supplied to each optical semiconductor element (24) to emit light, and cooling water (20 ° C.) is supplied to the cooling space (8). Was circulated through a cool circulator at a flow rate of 0.6 l / min. The light output at a position 40 cm away from the center of the surface of the panel (1) was measured. Then, three units of the above light source were attached to an NFT type hydroponic cultivation type apparatus, and a cultivation test of leaf lettuce (variety: Red Fire) was performed. The cultivation room temperature is 20
C., and continuously irradiated with light for 24 hours, and cultivated for 30 days. Table 1 shows the measurement results of the light output of the light source and the results of the cultivation test.
【００３０】比較例；反射部材（３）を取り付けていな
い点を除き、上記の実施例と同様の構造の光源を作製し
た。そして、上記の実施例と同様に、水耕栽培式装置に
光源を３ユニット取り付け、実施例と同様の条件のもと
に光出力を測定し、栽培試験を行った。光源の光出力の
測定結果ならびに栽培試験の結果を表１に示す。Comparative Example A light source having the same structure as that of the above-mentioned embodiment was manufactured except that the reflecting member (3) was not attached. Then, as in the above example, three light sources were attached to the hydroponic cultivation type apparatus, the light output was measured under the same conditions as in the example, and a cultivation test was performed. Table 1 shows the measurement results of the light output of the light source and the results of the cultivation test.
【００３１】表１に示す通り、光出力を測定した結果、
実施例の光源は、比較例の光源に対して１．５倍以上の
出力が確認された。また、栽培試験の結果、比較例の光
源による栽培では、地上部新鮮重が小さく徒長症状を示
したのに対し、実施例の光源による栽培では、地上部新
鮮重が大きく、全株が平均して良好な育成状態を示し
た。As shown in Table 1, as a result of measuring the light output,
The output of the light source of the example was 1.5 times or more that of the light source of the comparative example. In addition, as a result of the cultivation test, the cultivation with the light source of the comparative example showed a small fresh weight on the aerial part and showed prolonged symptoms. And showed a good growing condition.
【００３２】[0032]
【表１】 [Table 1]
【００３３】[0033]
【発明の効果】以上説明した様に、本発明の栽培用光源
によれば、特定の開き角度の反射面を備えた反射部材に
より、パネルの表面に略平行な光半導体素子の光も培地
側に反射できるため、光半導体素子の殆ど全ての光を培
地側に照射でき、培地に対する照射効率を一層高めるこ
とが出来る。また、プリント基板上に光半導体素子を直
接取り付けて発光体が構成され、そして、発光体の縁に
沿って反射部材が配置された構造を備えているため、簡
単な工程で製造でき、製造コストをより低減できる。As described above, according to the cultivation light source of the present invention, the light of the optical semiconductor element substantially parallel to the surface of the panel can be reduced by the reflection member provided with the reflection surface having a specific opening angle. Therefore, almost all light of the optical semiconductor element can be irradiated on the culture medium side, and the irradiation efficiency on the culture medium can be further improved. In addition, since the light emitting element is configured by directly mounting the optical semiconductor element on the printed circuit board, and the structure in which the reflecting member is arranged along the edge of the light emitting element, it can be manufactured by a simple process, and the manufacturing cost is reduced. Can be further reduced.
【図１】本発明に係る栽培用光源の全体構造を示す一部
破断の斜視図FIG. 1 is a partially broken perspective view showing the entire structure of a cultivation light source according to the present invention.
【図２】パネルに配置される板状の発光体の平面図FIG. 2 is a plan view of a plate-shaped light emitting body arranged on a panel.
【図３】発光体における各光半導体素子の取り付け状態
を示す縦断面図FIG. 3 is a longitudinal sectional view showing a mounting state of each optical semiconductor element in a light emitting body.
【図４】反射部材の外形を示す斜視図FIG. 4 is a perspective view showing the outer shape of a reflection member.
１ ：パネル ２ ：発光体 ２１：プリント基板 ２４：光半導体素子 ２６：防湿材 ３ ：反射部材 ３１：反射面 ５ ：保護板 ８ ：冷却空間 θ ：開き角度 1: Panel 2: Light emitting body 21: Printed circuit board 24: Optical semiconductor element 26: Moisture proof material 3: Reflective member 31: Reflective surface 5: Protective plate 8: Cooling space θ: Opening angle
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｓ 5/02 Ｈ０１Ｓ 5/02 (72)発明者 渡辺 博之 神奈川県横浜市青葉区鴨志田町1000番地 三菱化学株式会社横浜総合研究所内 (72)発明者 田中 史宏 神奈川県横浜市青葉区鴨志田町1000番地 三菱化学株式会社横浜総合研究所内 Ｆターム(参考） 2B022 AA03 DA01 DA05 DA17 5F041 AA42 CA36 CA37 CA53 CA57 DA07 DA13 DA20 DA44 DA45 DA55 DB08 DC26 EE23 FF16 5F073 AB25 BA09 CA05 EA06 FA15 FA24 FA29 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme court ゛ (Reference) H01S 5/02 H01S 5/02 (72) Inventor Hiroyuki Watanabe 1000 Kamoshita-cho, Aoba-ku, Yokohama-shi, Kanagawa Mitsubishi Chemical Inside Yokohama Research Institute, Inc. (72) Inventor Fumihiro Tanaka 1000 Kamoshita-cho, Aoba-ku, Yokohama-shi, Kanagawa Prefecture Mitsubishi Chemical Corporation Yokohama Research Institute F-term (reference) 2B022 AA03 DA01 DA05 DA17 5F041 AA42 CA36 CA37 CA53 CA57 DA07 DA13 DA20 DA44 DA45 DA55 DB08 DC26 EE23 FF16 5F073 AB25 BA09 CA05 EA06 FA15 FA24 FA29
Claims (4)
地に略対向して設置されるパネル（１）と、パネル
（１）の表面に配列された複数の板状の発光体（２）
と、これら発光体（２）の縁に沿って配置された反射部
材（３）とから構成され、各発光体（２）は、プリント
基板（２１）上に多数の光半導体素子（２４）を直接取
り付け且つこれら光半導体素子を透明性の防湿材（２
６）で被覆して成り、反射部材（３）は、隣接する発光
体（２）の表面に対する開き角度（θ）が１１０〜１５
０度に設定された反射面（３１）を備えていることを特
徴とする栽培用光源。1. A light source used for plant cultivation, comprising: a panel (1) installed substantially opposite to a culture medium; and a plurality of plate-like light emitters (2) arranged on the surface of the panel (1). )
And a reflecting member (3) arranged along the edge of the luminous body (2). Each luminous body (2) has a large number of optical semiconductor elements (24) on a printed circuit board (21). These optical semiconductor elements are directly attached and a transparent moisture-proof material (2
6), and the reflection member (3) has an opening angle (θ) of 110 to 15 with respect to the surface of the adjacent luminous body (2).
A light source for cultivation, comprising a reflecting surface (31) set at 0 degrees.
１）として形成された略三角柱状の外形を備え、その高
さ方向を発光体（２）の縁に沿わせて配置されている請
求項１に記載の栽培用光源。2. The reflection member (3) has two side surfaces on the reflection surface (3).
The cultivation light source according to claim 1, comprising a substantially triangular prism-shaped outer shape formed as 1), wherein the height direction is arranged along an edge of the luminous body (2).
（５）で気密に覆われている請求項１又は２に記載の栽
培用光源。3. The cultivation light source according to claim 1, wherein the front side of the panel is airtightly covered with a transparent protective plate.
能な冷却空間（８）が設けられている請求項１〜３の何
れかに記載の栽培用光源。4. The cultivation light source according to claim 1, wherein a cooling space (8) capable of supplying a cooling medium is provided on a back surface of the panel (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17250299A JP2001000043A (en) | 1999-06-18 | 1999-06-18 | Light source for cultivation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17250299A JP2001000043A (en) | 1999-06-18 | 1999-06-18 | Light source for cultivation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001000043A true JP2001000043A (en) | 2001-01-09 |
Family
ID=15943169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17250299A Pending JP2001000043A (en) | 1999-06-18 | 1999-06-18 | Light source for cultivation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001000043A (en) |
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| WO2010067711A1 (en) * | 2008-12-09 | 2010-06-17 | シーシーエス株式会社 | Plant cultivation device |
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