JP2000511632A - Reusable die carrier for burn-in and burn-in methods - Google Patents

Abstract

(57) Abstract: A re-hold for temporarily holding an integrated circuit (12) during burn-in and electrical testing, having a base (14) and a lid (16) attached to the base (14). Usable carrier (10). A flexible substrate (19) is attached to the base (14). The alignment post (20) has a tapered surface (22) which engages the corners (24) of the integrated circuit (12) and integrates on the upper surface (26) of the substrate (19). Position the circuit (12) accurately. A spring-loaded latch (28) engages the protrusion (30) of the hole (32) in the base (14) to hold the lid (16) closed on the integrated circuit (12). . The conductive traces (34) on the upper surface (26) of the substrate (19) engage the contact pads on the lower surface of the integrated circuit (12) to bring the integrated circuit (12) to the edge (40) of the substrate (19). ) Around the peripheral contact pads (38). When the lid (16) is in the closed position on the integrated circuit (12), the spring (42) engages the upper surface (43) of the integrated circuit (12) and presses the contact pads against the conductive traces (34). The pressing force to be applied.

Description

Description: Reusable die carrier for use in burn-in and burn-in methods 1. Field of the invention The present invention relates generally to fixtures and methods for use during evaluation of integrated circuits and other semiconductor devices. More specifically, the present invention relates to a reusable carrier for temporarily holding a semiconductor device as an unpackaged die or chip-scale package while the semiconductor device is tested and / or burned-in. And burn-in and / or electrical test methods using reusable carriers. 2. Description of the prior art When the manufacture of integrated circuits and other semiconductor devices such as memory devices and individual power transistors is completed, Semiconductor devices Before shipping to consumers, To identify and eliminate defective semiconductor devices, Take burn-in and electrical test. The term "burn-in" The temperature at which the semiconductor device is controlled (generally, (High temperature in the oven) While the semiconductor device is maintained at a high temperature, A procedure for supplying certain electrical actuation biases and / or electrical signals to a semiconductor device. Using high temperature, Stress applied to the semiconductor device during burn-in is promoted, For this reason, Marginal devices that might otherwise cause immediate failure are: Breakdown during burn-in, Therefore, it is eliminated before shipment. In electrical testing, To get a full evaluation of the device's capabilities, A more complete set of operating bias and electrical signals is provided to the device. In current practice, Until the semiconductor device is inserted into the package when it is inserted into the circuit board, Neither burn-in nor full electrical testing is performed. For burn-in, The packaged device is Special burn-in board (the board is (E.g., a circuit trace containing a sufficient number of contact pins or pads) of the package to obtain the electrical activation bias and / or signals used during burn-in. For some burn-in applications, Contact is Only a certain number of pins or pads of the packaged integrated circuit need be performed. For electrical tests to verify performance, The integrated circuit is removed from the burn-in board, It is located in a fixture that allows electrical contact to all pins or pads of the packaged integrated circuit. The packaged integrated circuit If you find any defects during burn-in or electrical testing, The integrated circuit must be discarded. In addition to defective dies, The integrated circuit package itself must be discarded. Therefore, Integrated circuit testing and burn-in It has been desirable for many years to be performed at the die level before being packaged. Also, Multi-chip modules: MCM) A new need has arisen to actually ship devices in die form where several dies are assembled into an MCM. MCM is difficult and expensive to repair, The die must be tested and burned in before assembling into the MCM. There have been many suggestions for this, Neither is universal. A major factor that hinders burn-in and / or electrical testing at the die level is: No fixtures to support and protect the die during burn-in; And / or there is no electrical test that meets the stringent requirements for such carriers. Also, The die is Packages are packaged using chip-scale packaging where the package is slightly larger than the die. in this case, The contacts are still very small, And since the package follows the outline of the die, Standard sockets are not available for this small device. Therefore, There is a need for a carrier that performs burn-in and testing of chip-scale package dies. SUMMARY OF THE INVENTION Accordingly, The purpose of the present invention is It is an object of the present invention to provide a new reusable carrier for temporarily holding a semiconductor die (including a semiconductor die in a chip scale package). Another object of the invention is to provide It is an object of the present invention to provide a reusable carrier for temporarily holding a burn-in semiconductor die suitable for use in an electrical test of the semiconductor die. Another object of the invention is to provide It is to provide a method of using a reusable carrier for burn-in evaluation of a semiconductor die. Another object of the invention is to provide Reusable carrier, It is an object of the present invention to provide a method that can be used for electrical testing of a semiconductor die. Another object of the invention is to provide In the above method, Can be used for conventional burn-in systems and burn-in boards, It is to provide a reusable carrier for temporarily holding a semiconductor die. Another object of the invention is to provide It is an object of the present invention to provide a reusable carrier for temporarily holding semiconductor dies which can be easily made in different sizes suitable for different sizes of dies and different numbers of pins. Yet another object of the present invention is to provide Can protect semiconductor dies from the environment, It is to provide a reusable carrier for temporarily holding a semiconductor die. The above and related purposes are: This is achieved by using the novel reusable die carriers and burn-in and / or electrical test methods disclosed herein. The reusable die carrier according to the present invention comprises: A reusable carrier has a base with a plurality of carrier contacts for making electrical connections to a semiconductor die outside the reusable carrier. Multiple conductive traces on the base A first end connected to the carrier contact; A second end positioned to engage a die contact of the semiconductor die. Means on the base for positioning the semiconductor die with die contacts engaging the second ends of the plurality of conductive traces can be used. The lid is It is configured to be removably positionable on a base to cover the semiconductor die and also functions as a heat sink. A force application system is provided for applying a force to the semiconductor die when the die is placed in the carrier. The force application system It can also be configured to distribute the force evenly over the surface of the die. The reusable die carrier of the present invention comprises: There is also means for securing the lid in place on the base. The method of the present invention for performing burn-in and / or electrical testing of an unpackaged semiconductor die comprises: Providing a reusable carrier for a semiconductor die and a plurality of contacts provided on the carrier. Semiconductor die Inserted into a reusable carrier. Semiconductor die Heated to high temperature. Burn-in input electrical bias (and optionally, Signal) From an external source on the reusable carrier, It is provided to at least some of the contacts and to the semiconductor die via a reusable carrier. When a burn-in input electric signal is supplied, a burn-in output electric signal responsive to the burn-in input electric signal is: From the semiconductor die And from at least some of the plurality of contacts via a reusable carrier. The burn-in output electric signal is Can be used to evaluate semiconductor dies. For example, Semiconductor die Based on the signal It can be classified as good or defective. The electrical test is Providing an electrical test input signal and an electrical test output signal, wherein the signal comprises: (Which can be used to evaluate semiconductor dies). The above objects of the present invention and their related objects, The advantages and features are If you are skilled in the art, BRIEF DESCRIPTION OF THE DRAWINGS The invention will be more readily apparent from a reading of the following more detailed description of the invention when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 2 is an exploded perspective view showing a reusable carrier according to the present invention for temporarily holding a semiconductor die. Fig. 2 FIG. 2 is a cross-sectional view showing a reusable carrier for temporarily holding the semiconductor die of FIG. 1 assembled for use. FIG. FIG. 3 is a plan view showing a reusable carrier for temporarily holding the semiconductor dies of FIGS. 1 and 2; FIG. FIG. 3 is a cross-sectional view similar to FIG. 2 showing a reusable carrier for temporarily holding a semiconductor die in an open position; FIG. FIG. 3 is a sectional view similar to FIG. 2 showing a second embodiment of a reusable carrier according to the invention for temporarily holding a semiconductor die. FIG. FIG. 4 is a cross-sectional view similar to FIG. 3 showing the embodiment of FIG. 5 of a reusable carrier for temporarily holding a semiconductor die. FIG. 6A shows FIG. 6 is a plan view showing a substrate portion of the reusable carrier of FIG. 5 for making temporary contact with a semiconductor die. FIG. 6B FIG. 6B is a sectional view of a portion of a region 6B in FIG. 6A. FIG. FIG. 9 is a plan view showing a third embodiment of a reusable carrier according to the present invention for temporarily holding a semiconductor die. FIG. FIG. 8 is a plan view showing the reusable carrier of FIG. 7 used for a test fixture. Fig. 9 FIG. 9 is a sectional view taken along lines 9-9 in FIG. FIG. FIG. 9 is a plan view showing a part of another embodiment of the reusable carrier according to the present invention. FIG. FIG. 11 is a side view showing the die carrier part of FIG. FIG. FIG. 4 is a perspective view showing a reusable carrier with a two-piece balancing pressure system. FIG. FIG. 13 is a perspective view showing the reusable carrier of FIG. 12 in an open state. FIG. 12. The reusable carrier of FIG. 12, with the die in place and in the closed position, FIG. 15 is a sectional view taken along the line 14-14 in FIG. 12; FIG. FIG. 13 is a sectional view showing the reusable carrier of FIG. 12 in an open state. FIG. 16A shows 12 shows the top of the reusable carrier of FIG. 12, FIG. 16 is a sectional view taken along the line 16A-16A in FIG. FIG. 16B 12 shows the top of the reusable carrier of FIG. 12, FIG. 16 is a sectional view taken along the line 16A-16A in FIG. 15, 9 shows the Z-axis joint connection of the balancing block. FIG. 16C shows 12 shows the top of the reusable carrier of FIG. 12, FIG. 16 is a sectional view taken along the line 16A-16A in FIG. 15, It shows the articulation of the balancing blocks around the X axis. FIG. 16D shows 12 shows the top of the reusable carrier of FIG. 12, FIG. 16B is a cross-sectional view taken along the line 16D-16D in FIG. 16A; 9 shows the joint connection of the balancing blocks around the Y axis. FIG. FIG. 3 is a perspective view showing a reusable carrier with a four-piece balancing pressure system. FIG. FIG. 18 is a perspective view showing the reusable carrier of FIG. 17 in an open state. FIG. 17. The reusable carrier of FIG. 17, with the die in place and in the closed position, FIG. 19 is a cross-sectional view of FIG. 17 taken along the line 19-19. FIG. FIG. 18 is a cross-sectional view showing the reusable carrier of FIG. 17 in an open state. FIG. 21A shows 17 shows the top of the reusable carrier of FIG. 20 is a sectional view taken along the line 21A-21A in FIG. 20, 9 shows the Z-axis joint connection of the balancing block. FIG. 21B 17 shows the top of the reusable carrier of FIG. 20 is a sectional view taken along the line 21B-21B in FIG. 20, It shows the articulation of the balancing blocks around the X axis. FIG. 21C is 17 shows the top of the reusable carrier of FIG. 21C is a sectional view taken along the line 21C-21C in FIG. 21A; 9 shows the joint connection of the balancing blocks around the Y axis. FIG. FIG. 3 is a perspective view showing a reusable carrier with a ball bearing point contact pressure system. FIG. FIG. 23 is a perspective view showing the reusable carrier of FIG. 22 in an open state. FIG. FIG. 23 is a cross-sectional view showing the reusable carrier of FIG. 22 in a closed state. FIG. FIG. 23 is a cross-sectional view showing the reusable carrier of FIG. 22 in an open state. FIG. 26A shows FIG. 22 shows the top of the reusable carrier of FIG. 22, FIG. 26 is a cross-sectional view of FIG. 25 taken along the line 26A-26A. FIG. 26B FIG. 22 shows the top of the reusable carrier of FIG. 22, FIG. 26 is a sectional view taken along the line 26A-26A in FIG. 25, 9 shows the X-axis joint connection of the balancing block. FIG. 26C shows FIG. 22 shows the top of the reusable carrier of FIG. 22, FIG. 26 is a sectional view taken along the line 26A-26A in FIG. 25, It shows the articulation of the balancing blocks around the X axis. FIG. 26D FIG. 22 shows the top of the reusable carrier of FIG. 22, FIG. 26B is a sectional view taken along the line 26D-26D of FIG. 26A; 9 shows the joint connection of the balancing blocks around the Y axis. FIG. FIG. 3 is a perspective view showing a reusable carrier with a ball bearing loading pressure plate. FIG. 27A shows FIG. 28 is a perspective view of the reusable carrier lid of FIG. 27; Fig. 4 illustrates a latch surface for use in an improved latch mechanism. FIG. 27B shows FIG. 28 is a perspective view showing the latch of the reusable carrier of FIG. 27. FIG. 27C shows FIG. 9 is an enlarged sectional view showing the improved latch mechanism. FIG. FIG. 28 is a perspective view showing the reusable carrier of FIG. 27 in an open state. FIG. 29 shows 27 of the reusable carrier of FIG. 27 with the die in place with the die closed. FIG. 29 is a cross-sectional view of FIG. 27 taken along the line 29-29. FIG. FIG. 28 is a cross-sectional view showing the reusable carrier of FIG. 27 in an open state. FIG. 31A shows FIG. 27 shows the top of the reusable carrier of FIG. 27; FIG. 31 is a cross-sectional view of FIG. 30 taken along the line 31A-31A. FIG. 31B shows FIG. 27 shows the top of the reusable carrier of FIG. 27; 30 is a cross-sectional view of FIG. 30 taken along the line 31A-31A, 9 shows the Z-axis joint connection of the balancing block. FIG. 31C shows FIG. 27 shows the top of the reusable carrier of FIG. 27; 30 is a cross-sectional view of FIG. 30 taken along the line 31A-31A, It shows the articulation of the balancing blocks around the X axis. FIG. 31D shows FIG. 28 is a cross-sectional view of the top of the reusable carrier of FIG. 27; 9 shows the joint connection of the balancing blocks around the Y axis. FIG. 32 shows FIG. 5 is an exploded perspective view of the base assembly of the reusable carrier as viewed from below. FIG. FIG. 33 is a cross-sectional view showing the assembled base assembly of FIG. 32. FIG. 34 FIG. 6 is a cross-sectional view showing a part of another embodiment of the reusable carrier according to the present invention. DETAILED DESCRIPTION OF THE INVENTION With particular reference to FIGS. 1 to 4, A reusable carrier 10 is shown for temporarily holding the integrated circuit 12 during burn-in and / or electrical testing. The reusable carrier 10 A base 14, And a lid 16 attached to the base 14 by a hinge 18. On the base 14, A flexible substrate 19 formed of a suitable polymer material (eg, polyimide) Attached with a suitable adhesive or fastener. Also, The substrate 19 is For use in certain types of flip chips, for example C4 or other flip chip bonding, It can also be formed of a rigid, inflexible material such as ceramic or silicon. The four alignment posts 20 have a tapered surface 22, The tapered surface 22 engages the corner 24 of the integrated circuit 12, The integrated circuit 12 is accurately positioned on the upper surface 26 of the substrate 19. A spring-loaded latch engages with the projection 30 of the hole 32 in the base 14, The lid 16 is kept closed on the integrated circuit 12. As a complement to the matching column 20 having a function of matching the integrated circuit 12, Or, instead of the alignment support 20, A visual matching system (not shown) may be provided with a window for viewing the position of the integrated circuit 12 on the substrate 19. The conductive traces 34 provided on the upper surface 26 of the substrate 19 include: Contacts that engage the contact pads (not shown) of the integrated circuit 12 or C4 or other conductive bumps (not shown) of the integrated circuit 12 to connect the integrated circuit 12 to peripheral contact pads 38 around the periphery of the substrate 19. Bumps (not shown) can be provided. As another configuration, Bumps, Instead of being provided on the trace 34, it may be provided on the integrated circuit 12. When the lid 16 is in the closed position on the integrated circuit 12, The spring 42 is connected to the upper surface 43 of the integrated circuit 12 (the upper surface 43 (Forming the back surface of the integrated circuit 12) Applying a pressing force for pressing the contact pad against the conductive trace 34 with a sufficient force; Ensure reliable electrical connections. A thin layer of rubber or other suitable flexible material is provided between the flexible substrate 19 and the base 14, bump, It can be configured to compensate for height differences between the die and the base. When a solder bump (not shown) is provided on the integrated circuit 12, Even if you omit the flexible material, The soft solder bump has the advantage of flexibility. This allows Improved solder bump deformation and coplanarity after burn-in and testing. As shown in FIGS. 32 and 33, The flexible material 200 Placed under the flexible substrate 19 only in the area of the contact bumps (not shown), It may be adapted such that when the integrated circuit 12 is placed in the carrier, there is no flexible material 200 under the area 201 where the center of the integrated circuit 12 (see also FIG. 1) is located. This allows The force on the integrated circuit 12 is concentrated in the area of the contact bump, Therefore, With less force, The contact pads of the integrated circuit can be brought into sufficient contact with the contact bumps. Also, Under each contact bump is an individual flexible piece (eg, By placing a flexible material 200 consisting of individual pieces of silicone rubber) Flexibility can be further concentrated. This allows More concentrated in the area of the contact bumps, And the force that must be applied to the integrated circuit 12 to ensure sufficient contact with the contact bumps is reduced, In addition, pressing other areas of the die is prevented. This is also shown in FIGS. 32 and 33, The upper plate 202 It has a cavity 204 for receiving the integrated circuit 12. This upper plate 202 It is made of a suitable material such as Alloy 42 (available from Computer Technology Corporation) and is placed on the substrate 19. When the integrated circuit 12 is received in the carrier, The upper plate 202 The contact pads of the integrated circuit and the contact bumps of the substrate 19 are mechanically aligned. Also, The upper plate 202 When the flexible substrate 19 is used, the substrate 19 is flattened. The upper plate 202 is used to align the integrated circuit 12, It is replaced with the matching column 20 of the embodiment shown in FIGS. The material of the upper plate 202 (Alloy 42 in this embodiment) is Thermal coefficient of expansion: TCE). because, When the carrier and die are heated, This is because the TCE of the carrier and the TCE of the die must be quite strictly identical. otherwise, During burn-in, the contacts and contact bumps no longer align with each other, Therefore, the mutual electrical connection will be lost. The TCE of polyimide (used for flexible substrate 19) is: It is very different from TCE of silicon. on the other hand, Alloy 42 TCE is very close to silicon TCE. Sandwiching a flexible substrate 19 between two Alloy 42 plates or bases, Preferably, the flexible substrate is bonded to the Alloy 42 base or matching plate using a suitable adhesive, Thereby, the movement of the flexible substrate 19 due to the thermal expansion is restrained so as to more closely coincide with the movement due to the thermal expansion of the semiconductor die. Thus, As a base plate 206 for sandwiching the flexible substrate 19 in cooperation with the upper plate 202, Another Alloy 42 plate is used. This allows There is no need to make the base 208 with Alloy 42. Thus, The base 28 can be formed from an inexpensive material such as plastic. Similarly, By using the upper plate 202 of Alloy 42, The need to make the upper base or hinge block 210 from Alloy 42 is eliminated. Also, Alloy 42 sandwiches make it even stronger. An upper base or hinge block 210; Base 208 (as described above, These hinge block 210 and base 208 Metal (Alloy 42) or can be made of any suitable material such as plastic) The screws 212 are integrally fixed. FIG. 2, As shown in FIGS. 4 and 5, Base 14, A vacuum port 46 is provided through the substrate 19 and the flexible material; A vacuum for holding the integrated circuit 12 on the substrate 19 can be supplied. actually, The substrate 19 is Substrates commercially available from several manufacturers using different technologies are preferred. For example, Substrate, Can be made with ASMAT available from Nitto Denko. Naturally, the reusable carrier 10 is protected from the environment, For this reason, no longer, It is not necessary to handle the unpackaged integrated circuit 12 in a clean room. now, The reusable carrier 10 can be used in a standard burn-in or test system. To burn in, A temporary package 10 containing the integrated circuit 12 is loaded into a socket 48 on the burn-in board 50, The socket 48 is then loaded into the burn-in system, Here, standard burn-in is performed. Pads 38 on substrate 19 (now, (Which is part of the temporary package 10) contacts the leads 52 of the burn-in socket 48. As is customary, Burn-in, By applying only the operating potential to the integrated circuit, Working potential, Applying both an activation signal provided to activate the integrated circuit 12; Alternatively, it can be performed by applying both the operating potential and the operating signal and detecting the output signal from the integrated circuit 12 during burn-in. In FIGS. 5 and 6B, Another reusable carrier 60 for use in a memory integrated circuit 62 is shown. Accepting integrated circuits 62 of various shapes in precise locations, A tapered alignment strut 64 is arranged to allow the contact pads of the integrated circuit 62 to engage the contact bumps on the substrate 70. As in the embodiment of FIGS. 1 to 4, The copper trace 72 of the flexible polyimide substrate 70 Engage with the contact pads of integrated circuit 62 to connect integrated circuit 62 to peripheral contact pads 68 around edge 77 of substrate 70. Except as shown and described, The structure and operation of the embodiment of FIGS. 5-6B of the present invention are as follows: The structure and operation of FIGS. 1 to 4 are the same. In FIG. A reusable carrier 80 with a substrate 84 provided with additional contact pads 82 for testing is shown. Exam (The exam is often, Requiring more contacts than burn-in) The reusable carrier 80 is loaded into a probe card 86 (FIGS. 8 and 9) of a tester (not shown). The probe card 86 Having a plurality of conductive traces 88 on an epoxy or polyimide board 89; Each conductive trace 88 It is connected to the probe tip 90 and the tester connection part 92 which contact the additional pad 82 for the test. For clarity, Only twelve traces 88 are shown. actually, The probe card 86 may have hundreds of conductive traces 88 and probe tips 90. The additional pad 82 With conductive traces 93 on substrate 84, Used for additional contacts connected to the integrated circuit under test and required for testing. This structure of the substrate 84 The number of pins of the socket 48 (FIG. 1) used for burn-in It is possible to significantly reduce the number required for the test, Generally, a burn-in socket that is several thousand times more than the probe card is required, Saves on burn-in costs. The electrical test is Performed before or after burn-in. 10 and 11 show a part of the die carrier 100, In this die carrier 100, The combination of the fixed post 102 and the spring 104 forms a die carrier alignment mechanism. Posts 102 and springs 104 are attached to base 106 and extend through flexible substrate 108. The fixed strut 102 has two adjacent sides 110 of the die 114, Fix the position of 112, Ensure that the die is properly positioned on the substrate 108. The taper at the base of the support 102 is When the die 114 is pressed against the strut 102, the two adjacent sides 110, It acts to hold down 112. The pressing force for holding the die 114 against the column 102 is applied by two springs 104, These springs 104 It is configured to apply a slight downward pressure to the two edges 118 of the die that contact the spring. The downward pressure acting on the die 114 is A die positioning mechanism (not shown) releases the die and holds the die 114 in place as it separates from the die 114; Overcome any electrostatic or molecular attraction between the die and the die positioning mechanism. This pressure is When the carrier lid (not shown) is opened after burn-in or testing, Serves the same function as holding the die 114 in place. Except as shown and described, The structure and operation of the embodiment of FIGS. 10 and 11 of the present invention The structure and operation are the same as those shown in FIGS. 1 to 6B. The spring 42 of FIG. 4, which engages with the upper surface 43 of the integrated circuit 12 to apply a pressing force, It can be replaced by another force applying mechanism that applies a force to the surface 43 symmetrically or uniformly. One such force application system is in the form of a surface contact pressure system, Some of these embodiments are described below. 12 to 16D, A reusable die carrier 220 with a two-piece balancing pressure system that evenly distributes forces along the Z and X axes is shown. As shown, The two-piece balancing pressure system With a balancing block 222, A rotating pin 224 to which the balancing block 222 is attached. The rotation pin 224 is It is mounted so as to be rotatable along the Y-axis within a flange 226 extending from both sides of the lid 228, and in a direction perpendicular to the main plane of the lid 228 (the Z-axis direction in FIG. 12). You can also move. Thus, The balancing block 222, which functions as a pressure plate for directly applying a force to the semiconductor die 230, Pivot about the Y axis, The force can be evenly distributed along the X axis. The compression spring 232 is The movement of the rotating pin 224 and the balancing block 222 along the Z axis perpendicular to the main plane of the lid 228 is controlled. This spring 232 Pressing force A balancing block 222 via a rotating pin 224, Therefore, it is added to the semiconductor die 230. Mounting another pressure plate in contact with the semiconductor die 230 on the lower surface of the balancing block 222; The balancing block 222 itself can also be used as a pressure plate. As shown in FIGS. 16A and 16B, The spring 232 Press the balancing block 222, The balancing block 222 can be moved along the Z axis. FIG. 16D shows The balancing block 222 pivots around the Y axis, This indicates that the balancing block 222 distributes the force evenly along the X axis. As shown in FIG. 16C, The spring 232 Some movement due to its deflection, The balancing block 222 can also be pivoted about the X axis. In operation, Semiconductor die 230 is placed in carrier 220. The lid 228 is It is moved from the open position as shown in FIGS. When the lid 228 is closed, The balancing block 222 comes into contact with the semiconductor die 230. Since the balancing block 222 is pivoted to distribute the force along the X axis, The force applied to the semiconductor die 230 by the balancing block 222 is The semiconductor die 230 is more evenly distributed along the X-axis. This allows Excessive pressure is applied to one end of die 230 (eg, The tendency of the lid 228 to be added to the hinge (the end closest to the hinge) is reduced. Such excessive local pressure This can cause direct damage to the semiconductor die 230. Also, Excessive pressure can cause the die 230 to “flip” (the end near the hinge 236 drops, The other end goes up) For this reason, Incorrect positioning of the die 230 within the carrier 220 and movement of the lid 228 to the fully closed position will cause damage. The spring 232 also Controlling and pressing the magnitude of the force acting on the balancing block 222 and thus the die 230, It also contributes to more evenly dispersing the force. When the lid 228 is almost closed, The corner of the lid 228 engages the latch 238, The inclined surface 240 of the latch 238 applies a lateral force to the latch 238. This causes the latch 238 to It moves in a direction away from the lid 228 to a position indicated by a virtual line. When the lid 228 is closed, Reach a position substantially parallel to the base, Latch 238 (the latch 238 is Spring biased by torsion spring 242) moves in the direction of lid 228. Latches 238 engage with corresponding latch surfaces 244 of lid 228, The lid 228 is fixed. The reusable die carrier 250 shown in FIGS. Z axis, It has a four-piece balancing pressure system that distributes forces evenly along the X and Y axes. The 4-piece balancing pressure system With a balancing block 252, A rotating pin 254, And two pressure plates 256. The rotating pin 254 is pivotally attached to a flange 257 extending from the lid 258 and can move in a direction perpendicular to the main plane of the lid 258 (the Z-axis direction in FIG. 17). The balancing block 252 is mounted on the rotating pin 254 and pivots about the axis of the rotating pin 254 (corresponding to the Y axis in FIG. 17). A compression spring 262 is arranged between the lid 258 and the rotation pin 254, The movement of the rotation pin 254 is controlled and a pressing force is applied to the semiconductor die 230. Two pads 261 are attached to the lower surface of the balancing block 252. Two pressure plates 256 are pivotally attached to the two pads 261, These pressure plates 256 It can move around an axis that crosses the axis of the rotating pin 254 (the axis corresponding to the X axis in FIG. 17). By pivoting the balancing block 252 about the Y axis, Can distribute the force along the X axis, on the other hand, By pivoting the pressure plate 256 about the X axis, The pressure plate 256 can distribute the force along the Y axis. As shown in FIG. 21A, The spring 262 is The rotation pin 254 and the balancing block 252 are pressed so as to move along the Z axis. The rotating pin 254 can slide within the flange 257, The movement of the balancing block 252 is enabled. In FIG. 21B, Pressure plate 256 pivots about the Z axis, Dispersing the force along the Y axis is shown. FIG. 21C is The balancing block 252 pivots about the Y axis, It shows that the force is distributed along the X axis. After the semiconductor die 260 is placed in the carrier 250, The lid 258 is As shown in FIGS. 20 and 19, Moved from the open position to the closed position. When the lid 258 is closed, The pressure plate 256 comes into contact with the semiconductor die 260. As aforementioned, The pressure plate 256 can pivot about the X axis, A balancing block 252 holding the pressure plate 256 is pivotable about the Y axis. Thus, The articulation between the balancing block 252 and the pressure plate 256 Power Uniformly distributed along the Y axis and the X axis, This reduces the likelihood of the die 260 being out of position, ie, causing damage due to uneven force distribution. The spring 262 also Controlling the magnitude of the force acting on the die 260 and compressing it, And it provides flexibility between the balancing pressure system and the die 260. When the lid 258 reaches the closed position, Latch 264 engages latch surface 266 of lid 258, The lid 258 is fixed. This 4-piece system Especially effective for large area dies, The entire surface contacts to prevent the above-described posture shift of the die 260. FIG. 22 to FIG. FIG. 17 shows a reusable die carrier 270 with a point contact pressure system; The illustrated die carrier 270 is A pressure plate 272 having a hole 271 formed in the surface 273; The pressure plate 272 is attached to the lid 278 via a pivot pin 274. The hole 271 is Counterbore from the inside to receive the ball bearings 276, Ball bearing 276 protrudes from surface 273 of pressure plate 272. The counterbore 271 is It has a function of restraining the lateral movement of the ball bearing 276 with respect to the surface 273 of the pressure plate 272. The lateral movement of the ball bearing 276 is Control can also be provided by other means, such as a protrusion (not shown) from the wall of the pressure plate 272. A compression spring 280 disposed between the ball bearing 276 and the lid 278 The ball bearing 276 is pressed against the pressure plate 272. In this spot pressure system, The ball bearing 276 Used to apply force to semiconductor die 282. As shown in FIGS. 23 and 24, The surface 273 of the pressure plate 272 is tapered. This allows The possibility that the pressure plate 272 itself applies an uneven force to the die 282 is eliminated. The taper of the surface 273 of the pressure plate 272 is Ensure that the ball bearing 276 is the first point of contact between the force application system and the semiconductor die 282. In operation, Semiconductor die 282 is placed in carrier 270, The lid 278 is moved from the open position to the closed position. Due to the offset pivot and the tapered surface 273 of the pressure plate 272, Ball bearing 276 first contacts semiconductor die 282. Because the ball bearing 276 has a curved surface 273, Surface 273 can adapt to any slope, Compression spring 280 provides flexibility along the Z axis. The pressure plate 272 can pivot on the ball bearing 276, Generally, the pressure plate 272 does not contact the semiconductor die 282, The magnitude of the required articulation (magnitude of articulation) Should be smaller than for the surface contact design. This point contact pressure system Over the entire area of the semiconductor die, That is, in order to improve the symmetry of the force distribution along both the X axis and the Y axis, Can be used for solder bump dies or other integrated circuits. Also, The contact area between the semiconductor die and the pressure plate is reduced, For this reason, The surface attraction and vacuum between the die and the pressure plate are reduced. "Stuck" such as surface attraction and vacuum is not preferred. because, When opening the lid for removal, The die sticks to the surface of the pressure plate, This is because it causes improper positioning of the die. As another configuration, The above or below mentioned surface contact pressure systems include: A pressure plate configured to reduce the contact area can be provided. this is, On the surface of the pressure plate, Sharp point, groove, This can be achieved by roughening the surface by providing intersection lines or other irregularities. 27 to 31D, Another surface contact pressure system in the form of a reusable carrier 290 with a ball bearing mounted pressure plate 292 is shown. The flange 291 extending from the lid 298 includes A pressure plate 292 is movably mounted. The pressure plate 292 Attached to a pivot pin 294 in the form of two screws. The pivot pin 294 is It is also possible to press fit in a predetermined position. These pins 294 extend through slots 293 in flange 291 and Further, it can be fixed from the inside of the flange 291 by a nut or other tightening tool (not shown). Slot 293 is It allows pin 294 to pivot and move across surface 295 of pressure plate 292 (along the Z axis). A concave portion 296 is formed in the pressure plate 292, The recess 296 is shown in the form of a counterbore in FIG. The ball bearing 300 is in contact with the pressure plate 292 near the concave portion 296, The recess 296 is The movement of the bearing 300 parallel to the surface of the pressure plate 292 is controlled. The pressure plate 292 is It can pivot about the ball bearing 300 in any direction. The bearing 300 is It is spring-pressed by a compression spring 302 disposed between the bearing 300 and the lid 298, Thereby, it is pressed against the pressure plate 292. In this embodiment, A pivot pin 294 is offset in the direction of the hinge 304 of the lid 298. The compression spring 302 Acting on the ball bearing 300 and the pressure plate 292 through an axis away from the pivot point, The pressure plate 292 Incline toward base 306 as shown in FIGS. 30 and 31D. Thus, When the lid 298 is closed, The incident angle of the pressure plate 292 with respect to the semiconductor die 308 is reduced, The surface of the pressure plate 292 is substantially parallel to the surface of the semiconductor die 308. Due to this decrease in approach angle, The force can be applied more uniformly to the die 308, The likelihood of die movement, ie, misalignment, is reduced. The pivot pin 294 is located on the center line of the pressure plate 292 (accordingly, Offset). The effect in this case is The approach angle of the pressure plate 292 to the semiconductor die 308 increases. When the semiconductor die 308 is placed in the carrier 290 and the lid 298 is closed, The pressure plate 292 It approaches the surface of the die 308 oriented in a substantially parallel manner. The pressure plate 292 pivots about the ball bearing 300 to evenly distribute the force on the surface of the die 308, The spring 302 is compressed, A controlled force is applied to die 308. When the lid 298 reaches the closed position, Latch 310 operates to secure lid 298. In this embodiment, The latch surface 311 of the latch 310 and the lid 298 It has an improved shape as shown in FIGS. 27A to 27C. The latch surface 311 is When the latch surface 311 engages the latch 310, The latch 310 has an inclined portion 312 projecting upward. For example, in the latch structure shown in the embodiment of FIG. The upward force applied to the lid 298 causes the latch 310 to pivot in a direction to release, Lid 298 tends to open with a spring. this is, It increases the tendency of the die carrier to open unexpectedly due to jarring. In the improved structure shown, With the upward force applied to the lid 298, Until the ramp portion 312 engages the upper surface 314 of the latch 310, The lid is lifted slightly. At this point, The sloped portion 312 exerts a downward force on the latch 310, To prevent the latch 310 from continuing its circular motion, The lid 298 is kept closed q The latch surface 316 below the lid 298 It is inclined at the same angle as the corresponding latch surface 318 of the latch 310. this is, Any force generated by lifting the lid 298, It tends to orient away from the arc of the latch 310. this is, Providing the advantage of increasing the resistance of the carrier to sudden opening from being subjected to vibration or being dropped, It can be used with any reusable carrier, including the carriers disclosed herein. FIG. 34 FIG. 27 shows another configuration of the surface contact pressure system different from that shown in FIGS. 27 to 31; This configuration is designed to minimize package height. The slot 350 to which the shaft 352 is attached is It is located on the pressure foot 354, not on the lid 356. The spring 358 It is located below the shaft 352 between the shaft 352 and the bottom 360 of the pressure foot 354. In addition to what is shown and described here, The structure and operation of the embodiment of FIG. The structure and operation of the embodiment of FIGS. 27 to 31D of the present invention are the same. The force applying system is It can be designed as a heat sink for heat dissipation purposes of the die. For example, Pressure plate, Ball bearings and other components Can be made of metal such as zinc or aluminum, which provides better heat transfer capability and backside biasing, This allows A bias voltage can be applied to the back of the die. Also, The system of the present invention X axis, Although described with respect to the Y axis and the Z axis, One can also envision systems that do not necessarily operate along mutually orthogonal axes. From the above, It will be readily appreciated that there has been provided a novel reusable die carrier for burn-in and electrical testing that can achieve the foregoing objects of the invention. The reusable carrier temporarily holds the semiconductor die. In one form, Reusable carriers are Temporarily hold the semiconductor die for burn-in, Also suitable for use in electrical testing of semiconductor dies. This form of the invention Special contact pads can be provided on the reusable carrier for contacting the integrated circuit in the test carrier, Significant savings in burn-in sockets where only a few pins are required. The method of the present invention comprises: A reusable carrier is used for burn-in evaluation of the semiconductor die (and, optionally, electrical testing of the semiconductor die). Different sizes of reusable carriers suitable for different sizes of dies and different numbers of pins can easily be provided. One burn-in board design is The redesign of the substrate can be used for various integrated circuit dies in the carrier. The proper orientation of signals to various integrated circuits is This is achieved by using various substrates in the carrier. This ability This means that you can move in the direction of the universal burn-in board. For reusable carriers, The semiconductor die is protected from the environment. If you are skilled in the art, It will be apparent that various changes in the form and details of the invention shown and described may be made. For example, The unevenness is formed on the surface of the balancing block and the pressure plate in contact with the die surface Sticking between the pressure plate and the die can be reduced. Such a change It is intended to fall within the spirit and scope of the appended claims.

[Procedure amendment] [Submission date] June 7, 1999 (1999.6.7) [Correction contents]                             The scope of the claims 1. In carriers for semiconductor dies,     A base, the base being electrically connected to a semiconductor die outside the reusable carrier.   A plurality of carrier contacts for making a positive connection, a rigid member having an upper surface,   A flexible substrate of a semiconductor die and a plurality of individual flexible members between the flexible substrate and the base.   With a layer of elastic flexible material consisting of pieces,     A plurality of conductive traces on the base, wherein the conductive traces are   A first end connected to the semiconductor contact and arranged to engage the die contact of the semiconductor die   A second end portion,     Cover the semiconductor die and apply pressure to ensure reliable electrical connection   A lid configured to be removably placed on the base,   Both are attached to the base by one hinge,     The semiconductor device has at least one alignment member on the base, the alignment member being one of   And the die contacts contact the first of the traces before the lid is placed on the base.   Alignment for automatic and accurate alignment of semiconductor dies to engage two ends   With a surface,     A lid is arranged to cover the semiconductor die or exerts a pressing force on the semiconductor die   With the semiconductor die while being moved out of position or while the semiconductor die is engaged with the alignment member.   A vacuum port extending through the base to engage;       A fixture for fixing the lid at a predetermined position on the base.   Reusable carrier. 2. A fixture for fixing the lid in place on the base holds the base engaged   2. The latch according to claim 1, comprising a latch configured as follows.   Reusable carrier. 3. The lid has an inner surface and presses between the inner surface of the lid and the semiconductor die.   The second ends of the plurality of conductive traces by providing a spring disposed at   2. The semiconductor device according to claim 1, wherein the semiconductor die is pressed by pressing.   A reusable carrier as described in. 4. The plurality of conductive traces engage an integrated circuit die contact with a semiconductor die.   The reuse according to claim 1, characterized in that the reuse is performed.   Possible carrier. 5. The alignment member comprises a plurality of columns extending from the base, each column engaging a die.   Claim 4 characterized by having a surface configured to   The reusable carrier as described. 6. The alignment member includes a hole having a size and shape for engaging a plurality of surfaces of the die.   5. The reusable carrier according to claim 4, wherein said carrier comprises a plate.   Ya. 7. The plate is made of a material having a coefficient of thermal expansion that closely matches the coefficient of thermal expansion of the die   The reusable carrier according to claim 4, wherein the carrier is a carrier. 8. Means for securing the lid in place on the base may maintain the engagement of the base.   2. The latch according to claim 1, further comprising a latch configured as follows.   Usable carrier. 9. Wherein the lid has a pressure plate with a die contact surface having irregularities   A reusable carrier according to claim 1. Ten. Base and     A lid that is detachably arranged on the base to cover the die,     Along at least one axis in the major plane of the die received in the carrier   Means for uniformly applying a force to the die, the force applying means comprising   A balancing block attached to the transfer pin, wherein the balancing block is   In particular, it is configured to pivot about the axis of the rotating pin when engaged.   The carrier that holds the semiconductor die. 11． The base is     A plurality of carrier contacts for making electrical connections to the die external to the carrier;     A first end connected to the carrier contact; and a first end connected to the die contact of the die.   A plurality of conductive traces having a second end with a plurality of conductive traces.   A carrier according to claim 10, wherein 12． In the carrier holding the semiconductor die,     Having a base, the base comprising:     A plurality of carrier contacts for making electrical connections to the die external to the carrier;     A first end connected to the carrier contact; and a first end connected to the die contact of the die.   A plurality of conductive traces having a spaced second end;     A lid that is detachably arranged on the base to cover the die,     Along at least one axis in the major plane of the die received in the carrier   Means for evenly applying force to the die,     Automatically and accurately align the die so that the die contacts engage the second end of the trace   At least one alignment member for mating, wherein the alignment member is   A surface having a plurality of extending struts, each strut configured to engage a die   A carrier comprising: 13. In the carrier holding the semiconductor die,     Having a base, the base comprising:     A plurality of carrier contacts for making electrical connections to the die external to the carrier;     A first end connected to the carrier contact; and a first end connected to the die contact of the die.   A plurality of conductive traces having a spaced second end;     A lid that is detachably arranged on the base to cover the die,     Along at least one axis in the major plane of the die received in the carrier   Means for evenly applying force to the die,     Automatically and accurately align the die so that the die contacts engage the second end of the trace   At least one alignment member for mating, wherein the alignment member   A plate made of a material having a coefficient of thermal expansion that closely matches the coefficient of expansion;   The plate has holes sized and shaped to engage multiple sides of the die   A carrier for holding a semiconductor die. 14. When the die is received in the base and place the die in place   Vacuum port extending through the base to secure the die when it is opened   12. The carrier according to claim 11, further comprising a carrier. 15． The apparatus further comprises means for fixing the lid at a predetermined position on the base.   A carrier according to claim 11. 16． The rotating pin is slidably attached to the lid, and the force applying means includes:   A spring configured to press the rotating pin in a direction away from the lid;   Block applies force to die when is moved to closed position on base   The carrier according to claim 10, wherein the carrier is formed. 17． When the lid is moved to the closed position on the base, the axis of the rotating pin moves to the main position of the die.   17. The carrier according to claim 16, wherein the carrier is parallel to a plane.   Ya. 18． The apparatus further comprises means for fixing the lid at a predetermined position on the base.   A carrier according to claim 17. 19. The balancing block is provided with a pressure plate for contacting the die.   A carrier according to claim 10, characterized in that: 20. Wherein the pressure plate has a die contact surface with irregularities.   20. The carrier according to claim 19, wherein twenty one. The force applying means includes at least one pressure plate pivotally attached to the balancing block.   The carrier according to claim 10, further comprising: twenty two. At least one pressure plate when the lid is moved to a closed position on the base;   Is pivoted about the axis of the pressure plate parallel to the main plane of the die.   22. The carrier of claim 21 wherein twenty three. The axis of the pressure plate extends in a direction crossing the axis of the rotating pin.   The carrier according to claim 21, wherein: twenty four. The force applying means comprises at least two pressure plates, and these pressure plates   24. The cap according to claim 23, wherein the cap can be independently articulated.   Rear. twenty five. The rotating pin is slidably attached to the lid, and the force applying means includes:   A spring configured to press the rotating pin in a direction away from the lid;   Pressure plate exerts force on the die as it is moved to the closed position on the base   The carrier according to claim 24, characterized in that: 26. When the lid is moved to the closed position on the base, the axis of the rotating pin moves to the main position of the die.   26. The carrier according to claim 25, wherein the carrier is parallel to a plane.   Ya. 27. The apparatus further comprises means for fixing the lid at a predetermined position on the base.   A carrier according to claim 26. 28. Wherein the pressure plate has a die contact surface with irregularities.   The carrier of claim 21. 29. The force applying means is pivotally attached to the lid so as to be movable in at least one direction.   11. The carrier according to claim 10, further comprising a pressure plate.   . 30. The pressure plate is pivotally connected via a bearing, and a pressure plate is provided around the bearing.   30. The carrier of claim 29, wherein the force plate articulates. 31. 32. The bearing of claim 30, wherein said bearing is substantially spherical.   A carrier according to claim 1. 32. The force applying means is configured to press the rotating pin in a direction away from the lid.   And the pressure plate is closed when the lid is moved to the closed position on the base.   31. The carrier according to claim 30, wherein the carrier is applied with a force. 33. The pressure plate is slidable relative to the lid via at least one pivot pin.   33. The device according to claim 32, wherein the device is rotatably mounted.   Carrier. 34. The force applying means engages the die when the lid is moved to a closed position on the base.   Means for inclining the pressure plate so that the approach angle of the pressure plate is reduced.   34. The carrier according to claim 33, wherein 35. The axis of the pivot pin defines the vector of the force applied to the bearing by the spring.   34. The key according to claim 33, wherein the key crosses but does not cross.   Kariya. 36. Wherein the pressure plate has a die contact surface with irregularities.   The carrier of claim 29. 37. The carrier further comprises a layer of an elastic flexible material between the lid and the base.   The carrier according to claim 10, wherein the carrier is formed. 38. Wherein said layer of elastic flexible material comprises a plurality of individual flexible pieces.   38. The carrier of claim 37, wherein the carrier is characterized in that: 39. Base and     A lid that is detachably arranged on the base to cover the die,     Means for symmetrically applying a force to the die, said means being applied to the lid by a pressure plate.   With bearings mounted, the pressure plate has holes for bearings   The bearing is a bearing whose lid projects from the hole to contact the die.   Positioned to engage the die when moved to a closed position on the base by the   Said means further comprising a spring for pressing the bearing against the pressure plate;   The ring applies force to the die when the lid is moved to the closed position on the base,   The plate is slidably and rotatably mounted on the lid by at least one pivot pin.   A carrier for holding a semiconductor, which is characterized by being attached. 40. The pressure plate has a tapered die configured to prevent the pressure plate from contacting the die.   40. The carrier according to claim 39, wherein said carrier has an opposing surface.   . 41. The means for applying the force symmetrically is that when the lid is moved to a closed position on the base.   Hand, tilt the pressure plate so that the approach angle of the pressure plate to the die is small.   40. The carrier of claim 39, further comprising a step. 42. The axis of the pivot pin defines the vector of the force applied to the bearing by the spring.   42. The key according to claim 41, wherein the key crosses but does not cross.   Kariya.

────────────────────────────────────────────────── ─── Continuation of front page    (72) Inventor Rapi Rally             United States California             94043 Mountain View Plymouth               Street 1667 (72) Inventor Len James             United States California             94301 Palo Alto Santa Rita A             Venue 239 (72) Inventor One Ernie             United States California             94404 Foster City Cento             Las Lane 807 (72) Inventor Burke Paul             United States California             94545 Hayward Capri Avenue               27046 (72) Inventor back curl             United States California             95014 Couperino South Tanta             W Avenue 10320

Claims (1)

[Claims] 1. In reusable carriers for semiconductor dies,     A plurality of carriers for making electrical connections to the semiconductor die outside the reusable carrier   Base with a contact     A plurality of conductive traces on the base, wherein the conductive traces are   A first end connected to the semiconductor contact and arranged to engage the die contact of the semiconductor die   A second end portion,     The semiconductor device includes at least one alignment member of the base, the alignment member including a semiconductor die.   To engage the die contact so that the die contact engages the second end of the trace.   Equipped with an alignment surface to automatically and accurately align the body die,     The base is engaged to engage the semiconductor die while the semiconductor die is engaged with the alignment member.   A vacuum port extending therethrough;     Lid configured to be removably placed on the base to cover the semiconductor die   When,     Means for fixing the lid at a predetermined position on the base.   Reusable carrier. 2. The base is rigid with an upper surface and a flexible substrate for the semiconductor die on the upper surface.   The reusable carrier according to claim 1, wherein the carrier comprises a member.   . 3. The reusable carrier has an elastic flexibility between the flexible substrate and the base.   3. The reusable article according to claim 2, further comprising a layer of material.   Carrier. 4. The elastic flexible material comprises a plurality of individual flexible pieces.   The reusable carrier according to claim 3, wherein 5. The lid is attached to the base by at least one hinge   The reusable carrier according to claim 1, characterized in that: 6. Means for securing the lid in place on the base may maintain the engagement of the base.   The latch according to claim 5, comprising a latch configured as follows.   Usable carrier. 7. A lid is provided on the lid for pressing a semiconductor die against a second end of the trace.   2. The reuse of claim 1 further comprising means for cutting.   Possible carrier. 8. The lid has an inner surface and is semiconductive relative to a second end of the plurality of conductive traces.   The means for pressing the body die comprises a spring arranged to press on the inner surface of the lid   A reusable carrier according to claim 7, characterized in that: 9. The plurality of conductive traces engage an integrated circuit die contact with a semiconductor die.   The reuse according to claim 1, characterized in that the reuse is performed.   Possible carrier. Ten. The alignment member may be configured such that the die contact is at a second end before the lid is placed on the base.   2. The die of claim 1, wherein the die is aligned to engage with the die.   Reusable carrier. 11． The alignment member comprises a plurality of columns extending from the base, each column engaging a die.   11. The surface of claim 10, wherein the surface is configured to:   A reusable carrier as described in. 12． The alignment member includes a hole having a size and shape for engaging a plurality of surfaces of the die.   The reusable carrier according to claim 10, wherein the reusable carrier is made of   Rear. 13. The plate is made of a material having a coefficient of thermal expansion that closely matches the coefficient of thermal expansion of the die.   13. The reusable carrier according to claim 12, wherein the carrier is a reusable carrier. 14. The base is rigid with an upper surface and a flexible substrate for the semiconductor die on the upper surface.   The reusable carrier according to claim 10, comprising a member.   Ya. 15． The reusable carrier has an elastic flexibility between the flexible substrate and the base.   The reusable article according to claim 14, further comprising a layer of material.   Noh carrier. 16． The lid is attached to the base by at least one hinge   The reusable carrier according to claim 10, characterized in that: 17． Means for securing the lid in place on the base may maintain the engagement of the base.   17. A latch according to claim 16, comprising a latch configured as follows.   Reusable carrier. 18． A lid is provided on the lid for pressing a semiconductor die against a second end of the trace.   11. The method of claim 10, further comprising the step of:   Available carrier. 19. The lid has an inner surface and presses the semiconductor die against the second end of the trace   Wherein the means for removing comprises a spring mounted on the inner surface of the lid.   19. A reusable carrier according to claim 18, wherein the carrier is a reusable carrier. 20. The plurality of conductive traces engage an integrated circuit die contact with a semiconductor die.   11. The re-use device according to claim 10, wherein   Available carrier. twenty one. Wherein the lid has a pressure plate with a die contact surface having irregularities   A reusable carrier according to claim 1. twenty two. Base and     A lid that is detachably arranged on the base to cover the die,     Along at least one axis in the major plane of the die received in the carrier   Holding a semiconductor die characterized by having a means for uniformly applying a force to the die.   Carrier to do. twenty three. The base is     A plurality of carrier contacts for making electrical connections to the die external to the carrier;     A first end connected to the carrier contact; and a first end connected to the die contact of the die.   A plurality of conductive traces having a second end with a plurality of conductive traces.   23. The carrier according to claim 22. twenty four. Automatically and accurately position the die so that the die contacts engage the second end of the trace   Further comprising at least one alignment member for aligning   A carrier according to claim 23. twenty five. The alignment member comprises a plurality of columns extending from the base, each column engaging a die.   25. The method according to claim 24, further comprising a surface configured to   A carrier according to claim 1. 26. The alignment member includes a hole having a size and shape for engaging a plurality of surfaces of the die.   25. The carrier according to claim 24, wherein the carrier is formed of a plate. 27. The plate is made of a material having a coefficient of thermal expansion that closely matches the coefficient of thermal expansion of the die.   27. The carrier of claim 26, wherein 28. When the die is received in the base and place the die in place   Vacuum port extending through the base to secure the die when it is opened   The carrier according to claim 23, further comprising a carrier. 29. The apparatus further comprises means for fixing the lid at a predetermined position on the base.   A carrier according to claim 23. 30. The force applying means is attached to the lid and the lid is in a closed position on the base.   23. The key according to claim 22, wherein the key engages with the die when moved.   Kariya. 31. The force applying means is attached to a rotating pin pivotally attached to the lid, and   When the lock engages the die, the balancing block pivots about the axis of the rotating pin.   23. The carrier of claim 22, wherein the carrier is movable. 32. The rotating pin is slidably attached to the lid, and the force applying means includes:   A spring configured to press the rotating pin in a direction away from the lid;   Block applies force to die when is moved to closed position on base   The carrier according to claim 31, wherein the carrier is used. 33. When the lid is moved to the closed position on the base, the axis of the rotating pin moves to the main   33. The carrier according to claim 32, wherein the carrier is parallel to a plane.   Ya. 34. The apparatus further comprises means for fixing the lid at a predetermined position on the base.   A carrier according to claim 33. 35. The balancing block is provided with a pressure plate for contacting the die.   32. The carrier of claim 31, wherein the carrier is a carrier. 36. Wherein the pressure plate has a die contact surface with irregularities.   The carrier of claim 35. 37. The force applying means includes at least one pressure plate pivotally attached to the balancing block.   32. The carrier of claim 31, further comprising: 38. At least one pressure plate when the lid is moved to a closed position on the base;   Is pivoted about the axis of the pressure plate parallel to the main plane of the die.   38. The carrier of claim 37, wherein 39. The axis of the pressure plate extends in a direction crossing the axis of the rotating pin.   The carrier according to claim 37, wherein: 40. The force applying means comprises at least two pressure plates, and these pressure plates   40. The cap according to claim 39, wherein the cap can be independently articulated.   Rear. 41. The rotating pin is slidably attached to the lid, and the force applying means includes:   A spring configured to press the rotating pin in a direction away from the lid;   Pressure plate exerts force on the die as it is moved to the closed position on the base   41. The carrier of claim 40, wherein: 42. When the lid is moved to the closed position on the base, the axis of the rotating pin moves to the main position of the die.   42. The carrier according to claim 41, wherein the carrier is parallel to a plane.   Ya. 43. The apparatus further comprises means for fixing the lid at a predetermined position on the base.   A carrier according to claim 42. 44. Wherein the pressure plate has a die contact surface with irregularities.   The carrier of claim 37. 45. The force applying means is pivotally attached to the lid so as to be movable in at least one direction.   23. The carrier of claim 22, further comprising a pressure plate.   . 46. The pressure plate is pivotally connected via a bearing, and a pressure plate is provided around the bearing.   46. The carrier of claim 45, wherein the force plate articulates. 47. 47. The bearing of claim 46, wherein said bearing is substantially spherical.   A carrier according to claim 1. 48. The force applying means is configured to press the rotating pin in a direction away from the lid.   And the pressure plate is closed when the lid is moved to the closed position on the base.   47. The carrier according to claim 46, wherein a force is applied to a. 49. The pressure plate is slidable relative to the lid via at least one pivot pin.   49. The device according to claim 48, wherein the device is rotatably mounted.   Carrier. 50. The force applying means engages the die when the lid is moved to a closed position on the base.   Means for inclining the pressure plate so that the approach angle of the pressure plate is reduced.   50. The carrier according to claim 49, wherein 51. The axis of the pivot pin defines the vector of the force applied to the bearing by the spring.   50. The key according to claim 49, wherein the key crosses but does not cross.   Kariya. 52. Wherein the pressure plate has a die contact surface with irregularities.   The carrier of claim 45. 53. The carrier further comprises a layer of an elastic flexible material between the lid and the base.   23. The carrier according to claim 22, wherein the carrier is used. 54. Wherein said layer of elastic flexible material comprises a plurality of individual flexible pieces.   54. The carrier of claim 53, wherein the carrier is characterized in that: 55. Base and     A lid that is detachably arranged on the base to cover the die,     Holding means for applying a force to the die symmetrically.   Carrier to do. 56. The means for applying the force symmetrically comprises a bearing mounted on the lid.   The bearing engages the die when the lid is moved to a closed position on the base.   55. The carrier according to claim 55, wherein   Ya. 57. The means for applying the force symmetrically comprises a pressure plate attached to the lid,   The pressure plate has a hole for receiving the bearing.   57. The carrier of claim 56. 58. That the bearing protrudes through the hole so that it can contact the die   58. The carrier according to claim 57, wherein the carrier is characterized in that: 59. The pressure plate has a tapered die configured to prevent the pressure plate from contacting the die.   59. The carrier according to claim 58, wherein the carrier has an opposing surface.   . 60. The means for applying the force symmetrically is provided by pressing the bearing against the pressure plate.   The bearing further presses the die when the lid is moved to the closed position on the base.   59. The carrier according to claim 58, wherein the carrier is provided. 61. The pressure plate is slidable relative to the lid via at least one pivot pin.   61. The device according to claim 60, wherein the device is rotatably mounted.   Carrier. 62. The means for applying the force symmetrically is that when the lid is moved to a closed position on the base.   Hand, tilt the pressure plate so that the approach angle of the pressure plate to the die is small.   62. The carrier of claim 61, further comprising a step. 63. The axis of the pivot pin defines the vector of the force applied to the bearing by the spring.   63. A key according to claim 62, wherein the key crosses but does not cross.   Kariya. 64. In a method for performing burn-in of a packaged semiconductor die,     Reusable carrier for semiconductor die with lid and provided on the carrier   Prepared multiple contacts,     Insert the semiconductor die into the reusable carrier,     Automatically align the semiconductor die with the reusable carrier,     Move the lid to the closed position on the die,     Ensuring that the semiconductor die is at the desired temperature,     At least some burn-in electrical input from sources external to the reusable carrier   Supply to a few contacts and to a semiconductor die via a reusable carrier,     Maintaining the semiconductor die at a desired temperature during burn-in;     Removes semiconductor dies from reusable carriers after burn-in   how to. 65. The burn-in electrical input includes an actuation input signal to a semiconductor die;   The method according to claim 64, characterized in that: 66. A burn-in input electrical signal from the semiconductor die and a small number of the plurality of contacts.   Burn-in input electricity via reusable carrier from at least some contacts   Receiving the burn-in output electric signal in response to the   Additional process to evaluate and classify semiconductor dies as good or defective   66. The method of claim 65, wherein: 67. Remove semiconductor dies classified as good from reusable carriers   Further comprising the step of packaging the body die in a semiconductor die package.   67. The method according to claim 66, wherein the method comprises: 68. An electrical test input electrical signal and a plurality of contacts from the semiconductor die;   From the additional set of contacts to the input electrical signal of the electrical test via the reusable carrier   In response, receive the output electrical signal of the electrical test and evaluate the electrical output signal of the electrical test.   Further includes a step of classifying the semiconductor die as good or defective according to its value.   65. The method of claim 64, wherein: 69. Remove semiconductor dies classified as good from reusable carriers   Further comprising the step of packaging the body die in a semiconductor die package.   70. The method according to claim 68, wherein the method is characterized in that: 70. A step of supplying an input signal of the electrical test and a step of receiving an output signal of the electrical test   Evaluates the output electrical signals of electrical and electrical tests, allowing semiconductor die to be reused   Performed after insertion into the carrier and before burn-in   70. The method according to claim 68. 71. A step of supplying an input signal of the electrical test and a step of receiving an output signal of the electrical test   And evaluating the output electrical signal of the electrical test is performed after burn-in.   71. The method of claim 70 wherein the method is performed. 72. A step of supplying an input signal of the electrical test and a step of receiving an output signal of the electrical test   And evaluating the output electrical signal of the electrical test is performed after burn-in.   70. The method according to claim 68, wherein the method is performed.