CN100397962C - Semiconductor component package and its packaging method - Google Patents
Semiconductor component package and its packaging method Download PDFInfo
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- CN100397962C CN100397962C CNB2004100865703A CN200410086570A CN100397962C CN 100397962 C CN100397962 C CN 100397962C CN B2004100865703 A CNB2004100865703 A CN B2004100865703A CN 200410086570 A CN200410086570 A CN 200410086570A CN 100397962 C CN100397962 C CN 100397962C
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Abstract
The present invention provides a packaging body for a semiconductor element and a packaging method thereof, which is used for positioning the semiconductor element on a circuit board in a disassembly mode. The packaging body comprises a frame body, buffer elements, a soft board and a positioning element, wherein the frame body is positioned on the circuit board, and is provided with an opening which enables a bonding pad of the circuit board to be bared. The buffer elements are arranged at two opposite sides of the opening edge of the frame body. The soft board is covered on the buffer elements and the frame body. The positioning element is in compression joint with the semiconductor element, and positions the semiconductor element on the soft board. The upper and the lower surfaces of the soft board are respectively provided with bonding points corresponding to the semiconductor element and the bonding pad of the circuit board, and are provided with a plurality of electric conduction paths corresponding to the bonding points to bond the semiconductor element on the circuit board. The present invention is convenient for people to disassemble and assemble, and can effectively reduce the packaging cost.
Description
Technical field
The present invention relates to a kind of packaging body and method for packing thereof of semiconductor element, particularly relate to a kind of semiconductor element packaging body and method for packing thereof that makes semiconductor element be convenient to separate replacement.
Background technology
In the application of numerous electronic equipments, for example personal computer, communication apparatus and various consumption electronic products etc. are encapsulated in the internal system interelement and are playing the part of important role in electrically connecting mutually.Often to be applied at present the memory module in the various electronic equipments, mostly adopt ball grid array (Ball Grid Array, BGA) encapsulation.
Specifically, as depicted in figs. 1 and 2, a plurality of memories 10 are arranged on the surface of memory module 1.The lower surface of each memory 10 is by a plurality of tin balls 12, with mechanicalness and electric connection memory module 1.
Hence one can see that, and memory 10 is fixedly installed on the memory module 1.Like this, when a memory 10 in the memory module 1 breaks down,, scrap whole piece memory module 1 often, cause the waste of resource because memory 10 is difficult to separate.Moreover along with the progress of semiconductor technology, it is more and more high that the required tin ball density of memory 10 is installed, and volume is more and more little, causes packaging cost significantly to increase.
Summary of the invention
In view of this, one object of the present invention is to provide a kind of and is convenient to dismounting and assembling, and can effectively reduce the semiconductor element packaging body and the method for packing thereof of packaging cost.
Another object of the present invention is to provide a kind of and be convenient to dismounting and assembled semiconductor element, and can effectively reduce the semiconductor element module of packaging cost.
To achieve these goals, the invention provides a kind of packaging body of semiconductor element, in order to removably semiconductor element is positioned on the circuit board, a surface of this semiconductor element is provided with a plurality of connection pads, circuit board is provided with the corresponding connection pad of connection pad a plurality of and semiconductor element, and packaging body comprises a framework, a buffer element, a soft board and a setting element.Framework is fit to be positioned on the circuit board, and has an exposed opening of connection pad that makes circuit board; Buffer element is arranged at the two opposite sides of the opening edge of framework; Soft board is covered on framework and the buffering element, what an one lower surface was provided with that a plurality of and connection pad circuit board connect first connects a little, upper surface is provided with a plurality of corresponding with the connection pad position of semiconductor element second and connects a little, and soft board contains many and connects first and connect a little and second conductive path that connects a little; Setting element is fit to crimping and semiconductor element is positioned on the soft board, on the correspondence second that makes the connection pad of semiconductor element be crimped on soft board connects a little.
The packaging body of semiconductor element of the present invention, described framework is a rectangle framework, described setting element has one from a side of the described framework the first side wall that turnover is extended towards described framework central vertical behind the certain distance vertically upward, and two two ends from another opposite side of described framework extend certain distance vertically upward after the pressing arm that extends to described framework central vertical of turnover.
The packaging body of semiconductor element of the present invention, described setting element also have two limited walls that extend respectively between the two ends of described the first side wall and two pressing arms.
The packaging body of semiconductor element of the present invention, described framework has a base plate that is provided with described opening, and one by the upwardly extending perisporium of described base plate week side, to form a storage tank, for ccontaining described buffer element and described soft board in wherein, described setting element is a lid that is covered in removably on the described framework, the position of the surperficial corresponding described storage tank of a described framework of adjacency also is convexly equipped with a pressing part in the described lid, when described semiconductor element is positioned in the described storage tank, the pressing part of described lid compresses described semiconductor element, and the correspondence of the described soft board of connection pad crimping of described semiconductor element is connected a little.
The packaging body of semiconductor element of the present invention, described buffer element have two support portions that the interval is relative, and the upper surface of each described support portion is upwardly extending gradually from inside to outside inclined-plane.
The packaging body of semiconductor element of the present invention, described buffer element is made by elastomeric material.
The packaging body of semiconductor element of the present invention, each described first connects a little with second to connect a little be metal salient point.
The packaging body of semiconductor element of the present invention, described first material that connects a little is a tin.
The packaging body of semiconductor element of the present invention, described second material that connects a little is a gold.
The packaging body of semiconductor element of the present invention, described second connects the two ends of the upper surface of the described soft board that a little is placed in, and described first middle section that connects the lower surface of the described soft board that a little is placed in.
The packaging body of semiconductor element of the present invention, described soft board is a flexible printed circuit board.
To achieve these goals, the present invention also provides a kind of method for packing of semiconductor element, a surface of described semiconductor element forms a plurality of connection pads, described method for packing may further comprise the steps: A) load bearing seat is positioned on the circuit board, described load bearing seat comprises one first framework, a buffer element and a soft board, described first framework is positioned on the described circuit board and has an opening, make the connection pad that a plurality of and described semiconductor element connection pad is corresponding in the described circuit board exposed, described buffer element is positioned on the two opposite sides of the described first framework opening edge, described soft board is covered on described first framework and the described buffer element, what the connection pad that a lower surface of described soft board is provided with a plurality of and described circuit board connected first connects a little, a upper surface of described soft board is provided with a plurality of corresponding with the connection pad position of described semiconductor element second and connects a little, and described soft board contains many and connects described first and connect a little and second conductive path that connects a little; And B) described semiconductor element is provided with the upper surface of the surface of described connection pad in abutting connection with described soft board with it, and press with setting element and to put and described semiconductor element is positioned on the described soft board, make second the connecting a little of the described soft board of the corresponding crimping of connection pad of described semiconductor element.
The method for packing of semiconductor element of the present invention, first of described soft board connect a little with second to connect a little be metal salient point.
The method for packing of semiconductor element of the present invention, described first connects a little and second connects a little and be formed on the described soft board with mode of printing.
The method for packing of semiconductor element of the present invention, described first material that connects a little is a tin, described second material that connects a little is a gold.
To achieve these goals, the present invention also provides a kind of semiconductor element module, comprising: a plurality of semiconductor elements, and a surface of each described semiconductor element is provided with a plurality of connection pads; A circuit board has a plurality of installation regions, has a plurality of connection pads in each described installation region, and is corresponding with the connection pad of corresponding semiconductor element in described a plurality of semiconductor elements; And a plurality of packaging bodies, be arranged at respectively on the described installation region, in order to ccontaining described semiconductor element removably, each described packaging body comprises: a framework, be fit to be positioned in the described circuit board on the corresponding installation region, and have an exposed opening of connection pad that makes described installation region; A buffer element is arranged at the two opposite sides of the opening edge of described framework; A soft board, be covered on described framework and the described buffer element, what the connection pad that a lower surface of described soft board is provided with a plurality of and described installation region connected first connects a little, a upper surface of described soft board is provided with corresponding second the connecting a little in the connection pad position of the corresponding semiconductor element in a plurality of and described a plurality of semiconductor elements, and described soft board contains many and connects described first and connect a little and second conductive path that connects a little; And a setting element, when described corresponding semiconductor element was positioned on the described soft board, crimping also was positioned described semiconductor element on the described soft board, on the correspondence second that makes the connection pad of described semiconductor element be crimped on described soft board connects a little.
Semiconductor element module of the present invention, each described semiconductor element are memories.
Semiconductor element module of the present invention, in each described packaging body, described framework is a rectangle framework, described setting element has one from a side of the described framework the first side wall that turnover is extended towards described framework central vertical behind the certain distance vertically upward, and two two ends from another opposite side of described framework extend certain distance vertically upward after the pressing arm that extends to described framework central vertical of turnover.
Semiconductor element module of the present invention, setting element described in each described packaging body also have two limited walls that extend respectively between the two ends of described the first side wall and two pressing arms.
Semiconductor element module of the present invention, the framework of described packaging body is integrated into a plate body, and the position of the corresponding described installation region of described plate body is provided with a plurality of storage tanks, to form a plurality of described buffer elements that are used for ccontaining correspondence respectively, described soft board and described semiconductor element are in storage tank wherein, the diapire face of each described storage tank is provided with the exposed opening of connection pad that makes described installation region, the setting element of described packaging body is integrated into a lid that is covered in removably on the described plate body, and described cover plate is convexly equipped with a pressing part respectively on the position of corresponding each the described storage tank in surface of described plate body, in the time of in described semiconductor element is positioned described storage tank, the pressing part of described lid compresses described semiconductor element, and the correspondence of the described soft board of connection pad crimping of described semiconductor element is connected a little.
Semiconductor element module of the present invention, each described buffer element has two support portions that the interval is relative, and the upper surface of each described support portion is upwardly extending gradually from inside to outside inclined-plane.
Semiconductor element module of the present invention, each described buffer element is made by elastomeric material.
Semiconductor element module of the present invention, each described first connects a little with second to connect a little be metal salient point.
Semiconductor element module of the present invention, described first material that connects a little is a tin, described second material that connects a little is a gold.
Semiconductor element module of the present invention, described second connects the two ends of the upper surface of the described soft board that a little is placed in, and described first connects the middle section of the lower surface of the described soft board that a little is placed in.
Semiconductor element module of the present invention, described soft board is a flexible printed circuit board.
The packaging body of semiconductor element provided by the invention and method for packing thereof utilize setting element to make that semiconductor element is revocable to connect to soft board, thereby realize being convenient to the function of dismantling and assembling.In addition, connect semiconductor element to circuit board, thereby realize effectively reducing the function of packaging cost by soft board.
Description of drawings
The present invention is described in detail below by most preferred embodiment and accompanying drawing, in the accompanying drawing:
Fig. 1 is a kind of schematic diagram of memory module in the past;
Fig. 2 is the partial sectional view of Fig. 1;
Fig. 3 is the schematic diagram of memory module first preferred embodiment of the present invention;
Fig. 4 is a partial sectional view embodiment illustrated in fig. 3;
Fig. 5 is the schematic perspective view of middle packaging body embodiment illustrated in fig. 3;
Fig. 6 is the schematic diagram of memory module second preferred embodiment of the present invention;
Fig. 7 is a partial sectional view embodiment illustrated in fig. 6;
Fig. 8 is the schematic diagram of memory module the 3rd preferred embodiment of the present invention.
Embodiment
It should be noted that in following examples, similar components is represented with same tag.
At first explanation is, packaging body of the present invention and method for packing are used for one or more semiconductor elements location and connect to a circuit board.Hereinafter, with the encapsulation of memory module the present invention is described, but it will be appreciated by those skilled in the art that the present invention also can be used to encapsulate the semiconductor element of other kinds, be not limited to the disclosed content of present embodiment.
As shown in Figure 3 and Figure 4, first preferred embodiment of memory module 2 of the present invention comprises 3, circuit boards 4 of a plurality of memories (being semiconductor element) and a plurality of packaging body 5.
The both sides on a surface of each memory 3 are respectively equipped with a plurality of connection pads 31.The memory 3 of present embodiment can be dynamic random access memory (DRAM), static RAM (SRAM) or flash memory (Flash Memory) etc.
A plurality of packaging bodies 5 lay respectively on the corresponding installation region 41, in order to ccontaining memory 3 removably.As shown in Figure 5, each packaging body 5 in the present embodiment has a framework 51, buffer element 52, a soft board 53 and a setting element 54, and wherein, load bearing seat comprises framework 51, buffer element 52 and soft board 53.
According to above-mentioned member and mutual relation, when assembling memory module 2, form packaging body 5 earlier.In the forming process of each packaging body 5, earlier two support portions 521,522 are positioned on opening 511 both sides of framework 51, again the ventricumbent direction of soft board 53 following tables is layed on two support portions 521,522, utilize soft board 53 pliability and can be along the support portion 521,522 inclined-plane lay, and make soft board 53 be provided with second to connect a little that 532 middle section is positioned at opening 511 places, can finish the assembling of packaging body 5.After the assembling of finishing each packaging body 5, each packaging body 5 can be installed on the installation region 41 of circuit board 4, and make first of soft board 53 connect a little 531 to connect and connect to corresponding connection pad 411 with surface installation technique (SMT) mechanical type.Then, can two pressing arms 542 be pulled open so that memory 3 is placed in the packaging body 5 application of force, stop then it being automatically reset, finish assembling pressing arm 542 application of forces.
As shown in Figure 4, come limits storage 3 precisely to be positioned on the packaging body 5 by setting element 54.The elastic reaction of buffer element 52 can support soft board 53 and make progress with memory 3, and utilizes the first side wall 541 and two pressing arms 542 to offset the strength that memory 3 moves up because of buffer element 52, and memory 3 stably is placed in the packaging body 5.Again because the elastic reaction of buffer element 52 can effectively support soft board 53 upwards, the correspondence second that makes the connection pad 31 of memory 3 can be crimped to soft board 53 smoothly connects a little 532.Therefore, memory 3 can connect a little 532 through connection pad 31, second, conductive path 533 and first connects a little and 531 be electrically connected on the connection pad 411 of circuit board 4.
Moreover, connect a little 531 and second and connect 532 employing costs a little and form owing to connect first of usefulness in the present embodiment soft board 53, thereby can effectively reduce packaging cost far below the mode of printing of high precision BGA Package.When separating memory 3, only need the application of force to pull open two pressing arms 542, memory 3 can be taken out, thus the function that realization is convenient to separate and replace memory 3.
In addition, framework 51 also can adopt other shapes to form with setting element 54 among the present invention, only needs to locate buffer element 52, soft board 53 and memory 3 and gets final product, and should not be limited to the disclosed content of present embodiment.For example, as shown in Figure 6 and Figure 7, the framework of all packaging bodies 5 is integrated into a plate body 55, and the position of plate body 55 corresponding installation regions 41 is provided with a storage tank 551, and the diapire face of each storage tank 551 is provided with the exposed opening 552 of connection pad 411 that makes installation region 41.The ccontaining successively buffer element 52 of storage tank 551, soft board 53 and memory 3 are in wherein.The setting element of all packaging bodies 5 also is integrated into a lid 56 that covers removably and be fixed on the plate body 55, and for example screw lock, and cover plate 56 is convexly equipped with a pressing part 561 respectively in abutting connection with the position of corresponding each storage tank 551 in surface of plate body 55.Whereby, in the time of in memory 3 lays respectively at storage tank 551, cover lid 56 after, can utilize the pressing part 561 of lid 56 to compress memory 3 and connect soft board 53.
In addition, the purpose of buffer element 52 only is flexibly to support soft board 53 and upwards connects with memory 3, thereby also can adopt other forms to form, and should not be limited to the disclosed content of present embodiment, as shown in Figure 8, can use two elasticity alar parts 521 ' of diapire face formation of framework 51 to be used as buffer element 52 '.
As previously mentioned, the present invention utilizes packaging body 5 that memory 3 semiconductor elements such as grade are positioned on the circuit board 4, to realize being convenient to dismantling the function with the assembled semiconductor element.In addition, utilize soft board 53 to connect semiconductor element to circuit board 4, effectively reduce packaging cost.
Claims (26)
1. the packaging body of a semiconductor element, in order to removably described semiconductor element is positioned on the circuit board, a surface of described semiconductor element is provided with a plurality of connection pads, described circuit board is provided with the corresponding connection pad of connection pad a plurality of and described semiconductor element, it is characterized in that described packaging body comprises:
A framework that is fit to be positioned on the described circuit board, described framework have an exposed opening of connection pad that makes described circuit board;
A buffer element that is arranged at the opening edge two opposite sides of described framework;
A soft board that is covered on described framework and the described buffer element, what the connection pad that a lower surface of described soft board is provided with a plurality of and described circuit board connected first connects a little, a upper surface of described soft board is provided with a plurality of corresponding with the connection pad position of described semiconductor element second and connects a little, and described soft board contains many and connects described first and connect a little and second conductive path that connects a little; And
Suitable crimping also is positioned described semiconductor element for setting element on the described soft board, on the correspondence second that makes the connection pad of described semiconductor element be crimped on described soft board connects a little.
2. the packaging body of semiconductor element according to claim 1, it is characterized in that described framework is a rectangle framework, described setting element has one from a side of the described framework the first side wall that turnover is extended towards described framework central vertical behind the certain distance vertically upward, and two two ends from another opposite side of described framework extend certain distance vertically upward after the pressing arm that extends to described framework central vertical of turnover.
3. the packaging body of semiconductor element according to claim 2 is characterized in that described setting element also has two limited walls that extend respectively between the two ends of described the first side wall and two pressing arms.
4. the packaging body of semiconductor element according to claim 1, it is characterized in that described framework has a base plate that is provided with described opening, and one by the upwardly extending perisporium of described base plate week side, to form a storage tank, for ccontaining described buffer element and described soft board in wherein, described setting element is a lid that is covered in removably on the described framework, the position of the surperficial corresponding described storage tank of a described framework of adjacency also is convexly equipped with a pressing part in the described lid, when described semiconductor element is positioned in the described storage tank, the pressing part of described lid compresses described semiconductor element, and the correspondence of the described soft board of connection pad crimping of described semiconductor element is connected a little.
5. the packaging body of semiconductor element according to claim 1 is characterized in that described buffer element has two support portions that the interval is relative, and the upper surface of each described support portion is upwardly extending gradually from inside to outside inclined-plane.
6. the packaging body of semiconductor element according to claim 5 is characterized in that described buffer element made by elastomeric material.
7. the packaging body of semiconductor element according to claim 1 is characterized in that each described first connects a little with second to connect a little be metal salient point.
8. according to the packaging body of claim 1 or 7 described semiconductor elements, it is characterized in that described first material that connects a little is a tin.
9. according to the packaging body of claim 1 or 7 described semiconductor elements, it is characterized in that described second material that connects a little is a gold.
10. the packaging body of semiconductor element according to claim 1 is characterized in that described second connects the two ends of the upper surface of the described soft board that a little is placed in, and described first middle section that connects the lower surface of the described soft board that a little is placed in.
11. the packaging body of semiconductor element according to claim 1 is characterized in that described soft board is a flexible printed circuit board.
12. the method for packing of a semiconductor element, a surface of described semiconductor element forms a plurality of connection pads, it is characterized in that described method for packing may further comprise the steps:
A) load bearing seat is positioned on the circuit board, described load bearing seat comprises one first framework, a buffer element and a soft board, described first framework is positioned on the described circuit board and has an opening, make the connection pad that a plurality of and described semiconductor element connection pad is corresponding in the described circuit board exposed, described buffer element is positioned on the two opposite sides of the described first framework opening edge, described soft board is covered on described first framework and the described buffer element, what the connection pad that a lower surface of described soft board is provided with a plurality of and described circuit board connected first connects a little, a upper surface of described soft board is provided with a plurality of corresponding with the connection pad position of described semiconductor element second and connects a little, and described soft board contains many and connects described first and connect a little and second conductive path that connects a little; And
B) described semiconductor element is provided with the upper surface of the surface of described connection pad in abutting connection with described soft board with it, and press with setting element and to put and described semiconductor element is positioned on the described soft board, make second the connecting a little of the described soft board of the corresponding crimping of connection pad of described semiconductor element.
13. the method for packing of semiconductor element according to claim 12 is characterized in that first of described soft board connects a little with second to connect a little be metal salient point.
14. the method for packing of semiconductor element according to claim 13 is characterized in that described first connects a little and second connect a little and be formed on the described soft board with mode of printing.
15. according to the method for packing of claim 12,13 or 14 described semiconductor elements, it is characterized in that described first material that connects a little is a tin, described second material that connects a little is a gold.
16. a semiconductor element module comprises:
A plurality of semiconductor elements, a surface of each described semiconductor element is provided with a plurality of connection pads;
A circuit board has a plurality of installation regions, has a plurality of connection pads in each described installation region, and is corresponding with the connection pad of corresponding semiconductor element in described a plurality of semiconductor elements; And
A plurality of packaging bodies are arranged at respectively on the described installation region, in order to ccontaining described semiconductor element removably, it is characterized in that each described packaging body comprises:
A framework is fit to be positioned in the described circuit board on the corresponding installation region, and has an exposed opening of connection pad that makes described installation region;
A buffer element is arranged at the two opposite sides of the opening edge of described framework;
A soft board, be covered on described framework and the described buffer element, what the connection pad that a lower surface of described soft board is provided with a plurality of and described installation region connected first connects a little, a upper surface of described soft board is provided with corresponding second the connecting a little in the connection pad position of the corresponding semiconductor element in a plurality of and described a plurality of semiconductor elements, and described soft board contains many and connects described first and connect a little and second conductive path that connects a little; And
A setting element, when described corresponding semiconductor element was positioned on the described soft board, crimping also was positioned described semiconductor element on the described soft board, on the correspondence second that makes the connection pad of described semiconductor element be crimped on described soft board connects a little.
17. semiconductor element module according to claim 16 is characterized in that each described semiconductor element is a memory.
18. semiconductor element module according to claim 16, it is characterized in that in each described packaging body, described framework is a rectangle framework, described setting element has one from a side of the described framework the first side wall that turnover is extended towards described framework central vertical behind the certain distance vertically upward, and two two ends from another opposite side of described framework extend certain distance vertically upward after the pressing arm that extends to described framework central vertical of turnover.
19. semiconductor element module according to claim 18 is characterized in that setting element described in each described packaging body also has two limited walls that extend respectively between the two ends of described the first side wall and two pressing arms.
20. semiconductor element module according to claim 16, the framework that it is characterized in that described packaging body is integrated into a plate body, and the position of the corresponding described installation region of described plate body is provided with a plurality of storage tanks, to form a plurality of described buffer elements that are used for ccontaining correspondence respectively, described soft board and described semiconductor element are in storage tank wherein, the diapire face of each described storage tank is provided with the exposed opening of connection pad that makes described installation region, the setting element of described packaging body is integrated into a lid that is covered in removably on the described plate body, and described cover plate is convexly equipped with a pressing part respectively on the position of corresponding each the described storage tank in surface of described plate body, in the time of in described semiconductor element is positioned described storage tank, the pressing part of described lid compresses described semiconductor element, and the correspondence of the described soft board of connection pad crimping of described semiconductor element is connected a little.
21. semiconductor element module according to claim 16 is characterized in that each described buffer element has two support portions that the interval is relative, the upper surface of each described support portion is upwardly extending gradually from inside to outside inclined-plane.
22. semiconductor element module according to claim 21 is characterized in that each described buffer element made by elastomeric material.
23. semiconductor element module according to claim 16 is characterized in that each described first connects a little with second to connect a little be metal salient point.
24. according to claim 16 or 23 described semiconductor element modules, it is characterized in that described first material that connects a little is a tin, described second material that connects a little is a gold.
25. semiconductor element module according to claim 16 is characterized in that described second connects the two ends of the upper surface of the described soft board that a little is placed in, described first connects the middle section of the lower surface of the described soft board that a little is placed in.
26. semiconductor element module according to claim 16 is characterized in that described soft board is a flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100865703A CN100397962C (en) | 2004-10-26 | 2004-10-26 | Semiconductor component package and its packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100865703A CN100397962C (en) | 2004-10-26 | 2004-10-26 | Semiconductor component package and its packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1767723A CN1767723A (en) | 2006-05-03 |
| CN100397962C true CN100397962C (en) | 2008-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100865703A Expired - Fee Related CN100397962C (en) | 2004-10-26 | 2004-10-26 | Semiconductor component package and its packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103855040B (en) * | 2012-12-04 | 2016-12-21 | 讯忆科技股份有限公司 | The forming method connecting circuit of semiconductor die package |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1165401A (en) * | 1996-05-10 | 1997-11-19 | 三星电子株式会社 | Testing apparatus for non-packaged semiconductor chip |
| US5706177A (en) * | 1994-12-24 | 1998-01-06 | Temic Telefunken Microelectronic Gmbh | Multi-terminal surface-mounted electronic device |
| CN1222976A (en) * | 1996-05-13 | 1999-07-14 | 艾尔实验设备公司 | Reusable die carrier for burn-in and burn-in process |
| US20040075091A1 (en) * | 2002-10-18 | 2004-04-22 | Ching-Jung Huang | Semiconductor package device testing apparatus |
-
2004
- 2004-10-26 CN CNB2004100865703A patent/CN100397962C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5706177A (en) * | 1994-12-24 | 1998-01-06 | Temic Telefunken Microelectronic Gmbh | Multi-terminal surface-mounted electronic device |
| CN1165401A (en) * | 1996-05-10 | 1997-11-19 | 三星电子株式会社 | Testing apparatus for non-packaged semiconductor chip |
| CN1222976A (en) * | 1996-05-13 | 1999-07-14 | 艾尔实验设备公司 | Reusable die carrier for burn-in and burn-in process |
| US20040075091A1 (en) * | 2002-10-18 | 2004-04-22 | Ching-Jung Huang | Semiconductor package device testing apparatus |
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| CN1767723A (en) | 2006-05-03 |
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