EP0990163A4 - Reusable die carrier for burn-in and burn-in process - Google Patents

Reusable die carrier for burn-in and burn-in process

Info

Publication number
EP0990163A4
EP0990163A4 EP97924660A EP97924660A EP0990163A4 EP 0990163 A4 EP0990163 A4 EP 0990163A4 EP 97924660 A EP97924660 A EP 97924660A EP 97924660 A EP97924660 A EP 97924660A EP 0990163 A4 EP0990163 A4 EP 0990163A4
Authority
EP
European Patent Office
Prior art keywords
burn
die carrier
reusable die
reusable
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97924660A
Other languages
German (de)
French (fr)
Other versions
EP0990163A1 (en
Inventor
See-Hack Foo
Rhea Posedel
Larry Lape
James Wrenn
Ernie Wang
Paul Burke
Carl Buck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aehr Test Systems Inc
Original Assignee
Aehr Test Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aehr Test Systems Inc filed Critical Aehr Test Systems Inc
Publication of EP0990163A4 publication Critical patent/EP0990163A4/en
Publication of EP0990163A1 publication Critical patent/EP0990163A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
EP97924660A 1996-05-13 1997-05-12 Reusable die carrier for burn-in and burn-in process Withdrawn EP0990163A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US64534396A 1996-05-13 1996-05-13
US645343 1996-05-13
PCT/US1997/007940 WO1997043658A1 (en) 1996-05-13 1997-05-12 Reusable die carrier for burn-in and burn-in process

Publications (2)

Publication Number Publication Date
EP0990163A4 true EP0990163A4 (en) 2000-04-05
EP0990163A1 EP0990163A1 (en) 2000-04-05

Family

ID=24588636

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97924660A Withdrawn EP0990163A1 (en) 1996-05-13 1997-05-12 Reusable die carrier for burn-in and burn-in process

Country Status (4)

Country Link
EP (1) EP0990163A1 (en)
JP (1) JP3928979B2 (en)
CN (1) CN1107232C (en)
WO (1) WO1997043658A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001183415A (en) * 1999-12-28 2001-07-06 Molex Inc Ic socket for bare chip
CN100397962C (en) * 2004-10-26 2008-06-25 赵建铭 Semiconductor component package and its packaging method
CN102072974A (en) * 2010-11-11 2011-05-25 嘉兴斯达微电子有限公司 Clamp for power module reliability experiment
CN103419205B (en) * 2012-05-22 2015-07-22 中国科学院物理研究所 Vacuum mechanical arm grabbing and releasing sample support
JP2017096864A (en) * 2015-11-27 2017-06-01 三菱電機株式会社 Test specimen holding mechanism
CN110235002B (en) * 2017-03-09 2022-03-29 伊斯梅卡半导体控股公司 Test assembly and method for testing electrical components

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995002196A1 (en) * 1993-07-09 1995-01-19 Aehr Test Systems, Inc. Reusable die carrier for burn-in and burn-in process
US5397245A (en) * 1993-10-29 1995-03-14 Texas Instruments Incorporated Non-destructive interconnect system for semiconductor devices

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402077A (en) * 1992-11-20 1995-03-28 Micromodule Systems, Inc. Bare die carrier
US5523696A (en) * 1993-06-14 1996-06-04 International Business Machines Corp. Method and apparatus for testing integrated circuit chips

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995002196A1 (en) * 1993-07-09 1995-01-19 Aehr Test Systems, Inc. Reusable die carrier for burn-in and burn-in process
US5517125A (en) * 1993-07-09 1996-05-14 Aehr Test Systems, Inc. Reusable die carrier for burn-in and burn-in process
US5397245A (en) * 1993-10-29 1995-03-14 Texas Instruments Incorporated Non-destructive interconnect system for semiconductor devices

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO9743658A1 *
UENO T ET AL: "MEMBRANE PROBE TECHNOLOGY FOR MCM KNOWN-GOOD-DIE", PROCEEDINGS OF THE INTERNATIONAL TEST CONFERENCE,US,NEW YORK, IEEE, 2 October 1994 (1994-10-02), pages 22-29, XP000519960, ISBN: 0-7803-2103-0 *

Also Published As

Publication number Publication date
CN1107232C (en) 2003-04-30
JP3928979B2 (en) 2007-06-13
JP2000511632A (en) 2000-09-05
CN1222976A (en) 1999-07-14
EP0990163A1 (en) 2000-04-05
WO1997043658A1 (en) 1997-11-20

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Free format text: ORIGINAL CODE: EPIDOSNIGR1

RTI1 Title (correction)

Free format text: DIE CARRIER WITH BALANCE BLOCK FOR UNIFORM FORCE DELIVERY TO THE DIE

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20050621