JP2000502509A5 - - Google Patents

Download PDF

Info

Publication number
JP2000502509A5
JP2000502509A5 JP1997523888A JP52388897A JP2000502509A5 JP 2000502509 A5 JP2000502509 A5 JP 2000502509A5 JP 1997523888 A JP1997523888 A JP 1997523888A JP 52388897 A JP52388897 A JP 52388897A JP 2000502509 A5 JP2000502509 A5 JP 2000502509A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997523888A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000502509A (ja
JP3941966B2 (ja
Filing date
Publication date
Priority claimed from US08/577,382 external-priority patent/US5838529A/en
Application filed filed Critical
Publication of JP2000502509A publication Critical patent/JP2000502509A/ja
Publication of JP2000502509A5 publication Critical patent/JP2000502509A5/ja
Application granted granted Critical
Publication of JP3941966B2 publication Critical patent/JP3941966B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP52388897A 1995-12-22 1996-12-20 絶縁性基板のような基板用の低電圧静電クランプ Expired - Lifetime JP3941966B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/577,382 1995-12-22
US08/577,382 US5838529A (en) 1995-12-22 1995-12-22 Low voltage electrostatic clamp for substrates such as dielectric substrates
PCT/US1996/020883 WO1997023945A1 (en) 1995-12-22 1996-12-20 Low voltage electrostatic clamp for substrates such as dielectric substrates

Publications (3)

Publication Number Publication Date
JP2000502509A JP2000502509A (ja) 2000-02-29
JP2000502509A5 true JP2000502509A5 (cg-RX-API-DMAC7.html) 2004-11-11
JP3941966B2 JP3941966B2 (ja) 2007-07-11

Family

ID=24308464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52388897A Expired - Lifetime JP3941966B2 (ja) 1995-12-22 1996-12-20 絶縁性基板のような基板用の低電圧静電クランプ

Country Status (4)

Country Link
US (1) US5838529A (cg-RX-API-DMAC7.html)
EP (1) EP0880818B1 (cg-RX-API-DMAC7.html)
JP (1) JP3941966B2 (cg-RX-API-DMAC7.html)
WO (1) WO1997023945A1 (cg-RX-API-DMAC7.html)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6669653B2 (en) * 1997-05-05 2003-12-30 Trig Medical Ltd. Method and apparatus for monitoring the progress of labor
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
US6444083B1 (en) 1999-06-30 2002-09-03 Lam Research Corporation Corrosion resistant component of semiconductor processing equipment and method of manufacturing thereof
US6408786B1 (en) 1999-09-23 2002-06-25 Lam Research Corporation Semiconductor processing equipment having tiled ceramic liner
US6227140B1 (en) 1999-09-23 2001-05-08 Lam Research Corporation Semiconductor processing equipment having radiant heated ceramic liner
US6673198B1 (en) * 1999-12-22 2004-01-06 Lam Research Corporation Semiconductor processing equipment having improved process drift control
JP4640876B2 (ja) * 2000-06-13 2011-03-02 株式会社アルバック 基板搬送装置
EP1295385B1 (en) * 2000-06-14 2006-09-13 Herman Allison Electro-adhesion device
US6506254B1 (en) 2000-06-30 2003-01-14 Lam Research Corporation Semiconductor processing equipment having improved particle performance
US6890861B1 (en) * 2000-06-30 2005-05-10 Lam Research Corporation Semiconductor processing equipment having improved particle performance
US6475336B1 (en) 2000-10-06 2002-11-05 Lam Research Corporation Electrostatically clamped edge ring for plasma processing
US6790242B2 (en) 2000-12-29 2004-09-14 Lam Research Corporation Fullerene coated component of semiconductor processing equipment and method of manufacturing thereof
US7128804B2 (en) * 2000-12-29 2006-10-31 Lam Research Corporation Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof
US6533910B2 (en) 2000-12-29 2003-03-18 Lam Research Corporation Carbonitride coated component of semiconductor processing equipment and method of manufacturing thereof
US6613442B2 (en) * 2000-12-29 2003-09-02 Lam Research Corporation Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof
US6537429B2 (en) 2000-12-29 2003-03-25 Lam Research Corporation Diamond coatings on reactor wall and method of manufacturing thereof
US6620520B2 (en) 2000-12-29 2003-09-16 Lam Research Corporation Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof
US6830622B2 (en) * 2001-03-30 2004-12-14 Lam Research Corporation Cerium oxide containing ceramic components and coatings in semiconductor processing equipment and methods of manufacture thereof
US6483690B1 (en) 2001-06-28 2002-11-19 Lam Research Corporation Ceramic electrostatic chuck assembly and method of making
US6780787B2 (en) * 2002-03-21 2004-08-24 Lam Research Corporation Low contamination components for semiconductor processing apparatus and methods for making components
US7311797B2 (en) * 2002-06-27 2007-12-25 Lam Research Corporation Productivity enhancing thermal sprayed yttria-containing coating for plasma reactor
US6898065B2 (en) * 2002-07-26 2005-05-24 Brad Mays Method and apparatus for operating an electrostatic chuck in a semiconductor substrate processing system
US7033443B2 (en) * 2003-03-28 2006-04-25 Axcelis Technologies, Inc. Gas-cooled clamp for RTP
JP4247739B2 (ja) * 2003-07-09 2009-04-02 Ｔｏｔｏ株式会社 静電チャックによるガラス基板の吸着方法および静電チャック
EP1498780A3 (en) * 2003-07-15 2005-04-06 ASML Netherlands B.V. Substrate holder and lithographic projection apparatus
EP1498777A1 (en) * 2003-07-15 2005-01-19 ASML Netherlands B.V. Substrate holder and lithographic projection apparatus
US7072165B2 (en) * 2003-08-18 2006-07-04 Axcelis Technologies, Inc. MEMS based multi-polar electrostatic chuck
US6947274B2 (en) * 2003-09-08 2005-09-20 Axcelis Technologies, Inc. Clamping and de-clamping semiconductor wafers on an electrostatic chuck using wafer inertial confinement by applying a single-phase square wave AC clamping voltage
US7072166B2 (en) * 2003-09-12 2006-07-04 Axcelis Technologies, Inc. Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltage
US6905984B2 (en) * 2003-10-10 2005-06-14 Axcelis Technologies, Inc. MEMS based contact conductivity electrostatic chuck
US6946403B2 (en) * 2003-10-28 2005-09-20 Axcelis Technologies, Inc. Method of making a MEMS electrostatic chuck
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100526923B1 (ko) * 2004-01-05 2005-11-09 삼성전자주식회사 반도체 제조설비의 리프트핀 및 그 제조방법
US20070223173A1 (en) * 2004-03-19 2007-09-27 Hiroshi Fujisawa Bipolar Electrostatic Chuck
TWI271815B (en) 2004-11-30 2007-01-21 Sanyo Electric Co Method for processing stuck object and electrostatic sticking method
WO2007007674A1 (ja) 2005-07-08 2007-01-18 Creative Technology Corporation 静電チャック及び静電チャック用の電極シート
DE202005011367U1 (de) 2005-07-18 2005-09-29 Retzlaff, Udo, Dr. Transfer-ESC auf Wafer-Basis
US20070139855A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus
JP4982554B2 (ja) * 2006-03-29 2012-07-25 ドクトル・ヨハネス・ハイデンハイン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 担持体にスケールを保持するための方法ならびに担持体とスケールを備えた組立体
WO2008082977A2 (en) * 2006-12-26 2008-07-10 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chuck and method of forming
US7983017B2 (en) 2006-12-26 2011-07-19 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chuck and method of forming
KR100886015B1 (ko) 2007-05-15 2009-02-26 삼성전자주식회사 다중 리프터를 갖는 반도체 제조설비의 드라이 크린방법
US7972471B2 (en) * 2007-06-29 2011-07-05 Lam Research Corporation Inductively coupled dual zone processing chamber with single planar antenna
WO2009078923A2 (en) * 2007-12-19 2009-06-25 Lam Research Corporation Film adhesive for semiconductor vacuum processing apparatus
MY166000A (en) * 2007-12-19 2018-05-21 Lam Res Corp A composite showerhead electrode assembly for a plasma processing apparatus
JP2008205508A (ja) * 2008-05-15 2008-09-04 Ulvac Japan Ltd 基板搬送装置、真空処理装置
JP2008205509A (ja) * 2008-05-15 2008-09-04 Ulvac Japan Ltd 絶縁基板搬送方法、位置合わせ方法
US7760004B2 (en) * 2008-10-30 2010-07-20 Analog Devices, Inc. Clamp networks to insure operation of integrated circuit chips
CN109254501A (zh) 2012-02-03 2019-01-22 Asml荷兰有限公司 衬底支架、光刻装置、器件制造方法和制造衬底保持器的方法
GB201321463D0 (en) 2013-12-05 2014-01-22 Oxford Instr Nanotechnology Tools Ltd Electrostatic clamping method and apparatus
CN105812989A (zh) * 2014-12-31 2016-07-27 鸿富锦精密工业（深圳）有限公司 扬声器
FR3063832B1 (fr) 2017-03-08 2019-03-22 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede d'auto-assemblage de composants microelectroniques
DE102019101657A1 (de) * 2019-01-23 2020-07-23 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Haltevorrichtung zur elektrostatischen Halterung eines Bauteils mit einem durch Diffusionsbonden gefügten Grundkörper und Verfahren zu deren Herstellung
KR102818334B1 (ko) 2019-04-05 2025-06-11 헤레우스 코반틱스 노스 아메리카 엘엘씨 에칭 적용을 위한 제어된 다공성 산화이트륨
JP7567048B2 (ja) 2020-10-03 2024-10-15 ヘレーウス コナミック ノース アメリカ エルエルシー 大寸法の焼結された酸化イットリウム体
EP4228894A1 (en) 2020-10-15 2023-08-23 Heraeus Conamic North America LLC Multilayer sintered ceramic body and method of making
CN120663600A (zh) 2020-12-18 2025-09-19 贺利氏科万特北美有限责任公司 多层烧结陶瓷体
JP7785179B2 (ja) 2021-12-23 2025-12-12 ヘレーウス コバンティックス ノース アメリカ エルエルシー 多層焼結セラミック体及び作製方法
EP4215360A1 (en) 2022-01-24 2023-07-26 Heraeus Conamic North America LLC Multilayer sintered ceramic body and method of making
TWI876287B (zh) 2022-03-31 2025-03-11 美商賀利氏科納米北美有限責任公司 用於陶瓷之高頻率拋光的方法與設備以及多晶燒結陶瓷體
EP4269024A1 (en) 2022-04-29 2023-11-01 Heraeus Conamic North America LLC High frequency polishing of ceramics
US12165899B2 (en) 2022-10-07 2024-12-10 Applied Materials, Inc. Bipolar electrostatic chuck for etch chamber
WO2025012822A2 (en) 2023-07-12 2025-01-16 Solventum Intellectual Properties Company Packaged pressure sensitive adhesives
TW202517602A (zh) 2023-10-30 2025-05-01 美商賀利氏科納米北美有限責任公司 美國亞利桑那州錢德勒市北羅斯福大道 301 號 鑭系元素增強的耐腐蝕性

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634740A (en) * 1970-04-20 1972-01-11 Addressograph Multigraph Electrostatic holddown
US3916270A (en) * 1974-05-02 1975-10-28 Tektronix Inc Electrostatic holddown apparatus
US4184188A (en) * 1978-01-16 1980-01-15 Veeco Instruments Inc. Substrate clamping technique in IC fabrication processes
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
US4340462A (en) * 1981-02-13 1982-07-20 Lam Research Corporation Adjustable electrode plasma processing chamber
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
JPS6059104B2 (ja) * 1982-02-03 1985-12-23 株式会社東芝 静電チヤツク板
US4551192A (en) * 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
US4692836A (en) * 1983-10-31 1987-09-08 Toshiba Kikai Kabushiki Kaisha Electrostatic chucks
US4579618A (en) * 1984-01-06 1986-04-01 Tegal Corporation Plasma reactor apparatus
US4534816A (en) * 1984-06-22 1985-08-13 International Business Machines Corporation Single wafer plasma etch reactor
US4615755A (en) * 1985-08-07 1986-10-07 The Perkin-Elmer Corporation Wafer cooling and temperature control for a plasma etching system
US4724510A (en) * 1986-12-12 1988-02-09 Tegal Corporation Electrostatic wafer clamp
US5262029A (en) * 1988-05-23 1993-11-16 Lam Research Method and system for clamping semiconductor wafers
US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
US4948458A (en) * 1989-08-14 1990-08-14 Lam Research Corporation Method and apparatus for producing magnetically-coupled planar plasma
US5001594A (en) * 1989-09-06 1991-03-19 Mcnc Electrostatic handling device
US5013400A (en) * 1990-01-30 1991-05-07 General Signal Corporation Dry etch process for forming champagne profiles, and dry etch apparatus
JP3129452B2 (ja) * 1990-03-13 2001-01-29 富士電機株式会社 静電チャック
US5238499A (en) * 1990-07-16 1993-08-24 Novellus Systems, Inc. Gas-based substrate protection during processing
US5055964A (en) * 1990-09-07 1991-10-08 International Business Machines Corporation Electrostatic chuck having tapered electrodes
US5200232A (en) * 1990-12-11 1993-04-06 Lam Research Corporation Reaction chamber design and method to minimize particle generation in chemical vapor deposition reactors
EP0506537A1 (en) * 1991-03-28 1992-09-30 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
US5155652A (en) * 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
US5191506A (en) * 1991-05-02 1993-03-02 International Business Machines Corporation Ceramic electrostatic chuck
US5315473A (en) * 1992-01-21 1994-05-24 Applied Materials, Inc. Isolated electrostatic chuck and excitation method
US5350479A (en) * 1992-12-02 1994-09-27 Applied Materials, Inc. Electrostatic chuck for high power plasma processing
US5326725A (en) * 1993-03-11 1994-07-05 Applied Materials, Inc. Clamping ring and susceptor therefor

Similar Documents

Publication Publication Date Title
JP2000500228A5 (cg-RX-API-DMAC7.html)
JP2000500033A5 (cg-RX-API-DMAC7.html)
JP2000500445A5 (cg-RX-API-DMAC7.html)
JP2000500440A5 (cg-RX-API-DMAC7.html)
JP2000500327A5 (cg-RX-API-DMAC7.html)
JP2000502794A5 (cg-RX-API-DMAC7.html)
JP2000500145A5 (cg-RX-API-DMAC7.html)
JP2000500155A5 (cg-RX-API-DMAC7.html)
JP2000500406A5 (cg-RX-API-DMAC7.html)
JP2000500361A5 (cg-RX-API-DMAC7.html)
JP2000502509A5 (cg-RX-API-DMAC7.html)
JP2000500115A5 (cg-RX-API-DMAC7.html)
JP2000500322A5 (cg-RX-API-DMAC7.html)
JP2000500258A5 (cg-RX-API-DMAC7.html)
JP2000500342A5 (cg-RX-API-DMAC7.html)
JP2000500192A5 (cg-RX-API-DMAC7.html)
JP2001520531A5 (cg-RX-API-DMAC7.html)
JP2000500226A5 (cg-RX-API-DMAC7.html)
JP2000500051A5 (cg-RX-API-DMAC7.html)
JP2000500407A5 (cg-RX-API-DMAC7.html)
JP2000500397A5 (cg-RX-API-DMAC7.html)
JP2000500019A5 (cg-RX-API-DMAC7.html)
JP2000500166A5 (cg-RX-API-DMAC7.html)
JP2000500125A5 (cg-RX-API-DMAC7.html)
JP2000500044A5 (cg-RX-API-DMAC7.html)