JP2000353868A - Jig for soldering in mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To smoothly perform wave soldering and effectively suppress deformation at the ends of a mounting board due to thermal stress, by forming on the body of a jig a blade-like protruded portion which is protruded toward melted solder fed to the backside of the board and is so structured that the tip of the protruded portion is submerged in the melted solder. SOLUTION: A body reinforcing member 12 is provided with a blade-like protruded portion 12B at its right end, and the protruded portion 12B comprises a V-shaped downward protruded portion 12Ba which is protruded downward with V-shaped cross sections and runs toward melted solder, a sloped face 12Bk which is raised from the protruded end to the upper right, and an upward protruded portion 12Bb which is part of the sloped face and is protruded upward. By means of the blade-like protruded portion 12B installed at an end of a mounting board 1, the oxide film on the melted solder is removed and further wave soldering is performed to the backside of the mounting board 1 using the clean melted solder face. Therefore, defective soldering due to an oxide film is significantly reduced, and wave soldering is accomplished with high quality and reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for soldering a mounting board, and more particularly to a jig body having a U-shaped cross section and preventing warping of the mounting board at the time of automatic soldering on the back side of the mounting board. The present invention relates to a jig for mounting board solder having a structure that functions as a tool.

[0002]

2. Description of the Related Art In an automatic soldering process for automatically soldering a through hole of a mounting board and an input / output terminal or the like inserted into the through hole, a molten state in a state of a wave in a solder bath. Solder is used. In this case, the back surface of the mounting board continuously contacts the raised portion of the molten solder in the process of passing through the mounting board, whereby, for example, the through hole of the mounting board described above is inserted into the through hole and the back surface is inserted. The protruding input / output terminals
It is designed to be soldered automatically. 6 to 9 show examples of wave soldering in this conventional example.

Usually, when performing wave soldering,
As shown in FIG. 6, the mounting substrate 101 is placed on a conveyor (not shown) and is advanced over the molten solder 102, and the surface to be soldered (the back surface) is brought into contact with the molten solder 102. . Here, reference numeral 103 indicates an electronic component, and reference numeral 103a indicates an input / output terminal. FIG. 6 shows a case where the electronic components 103 are mounted on the mounting board 101 in four rows. Arrow A indicates the direction in which the mounting board 101 is transported, and arrow B indicates the direction in which the molten solder 102 flows in a predetermined area in a wave shape. Further, reference numeral 102a indicates an oxide film formed by contact with air.

In this case, the end face of the mounting board 101 is deformed (warped) by receiving a great deal of thermal stress when it comes into contact with the molten solder 102. In order to prevent this, a mounting board soldering jig 110 having a U-shaped cross section as shown in FIGS. 6 and 7 is attached to the end of the mounting board 101, thereby deforming the end of the mounting board 101 ( (Warpage) is forcibly prevented. FIG. 7 shows an example of a mounting board 101 provided with mounting board soldering jigs 110 at both ends. FIG. 7 shows a case where the electronic components 103 are mounted in one row.
Reference numeral 103a denotes an input / output terminal of the electronic component 103.

FIG. 8 shows a detailed cross-sectional view of the mounting substrate soldering jig 110 in the above conventional example. In FIG. 8, the mounting board soldering jig 110 is
A jig body 1 having a U-shaped cross section having an opening 111A engaged with an end of the mounting board 101 and a board holding portion 111B for holding an end of the mounting board 101 inserted from the opening 111A.
The jig body 111 is provided with a guide portion 112 for inserting the mounting board which functions at the time of inserting the mounting board into the opening 111A of the jig main body 111. Has become.

Here, the substrate holding portion 111B of the jig main body 111 has a shape in which the right end in FIG. 8 is slightly expanded in the vertical direction (outward). A predetermined elastic pressing force for preventing warpage is always forcibly applied.

However, since the mounting board soldering jig 110 is used to prevent the deformation (warpage) of the mounting board 101, the surface of the molten solder 102, which is harmful when soldering, is used as it is. The oxide film 102a could not be removed, and there was a disadvantage that solder defects were likely to occur (see FIG. 6).

For this reason, recently, as shown in FIG. 9, before the mounting substrate 101 reaches the molten solder 102, the upper surface of the molten solder 102 is scraped with a metal spatula 120 or the like, so that an oxide film on the surface is removed. A method has been adopted in which 102a is removed and thereby the wave soldering of the back surface of the mounting board 101 is performed.

[0009]

However, after removing the oxide film 102a with the metal spatula 120, it is desirable to solder the mounting board as soon as possible.
In the above-described method using 20 or the like, there is an inconvenience that the timing for carrying in the mounting board must be matched. Inconvenience that the removal of the oxide film by the metal spatula 120 is required again is always required.

In particular, when a lead-free solder having a high melting point is used, the temperature of the molten solder is set higher than that of a conventional solder (for example, Sn-Pb eutectic).
The generation speed of 2a is high, and the thermal stress on the mounting substrate 101 is also increased, so that the conventional mounting substrate soldering jig 110 cannot cope with the problem.

[0011]

SUMMARY OF THE INVENTION The object of the present invention is to improve the disadvantages of the prior art, and in particular to achieve smooth wave soldering of a mounting substrate and thermal stress even when using a lead-free or other molten solder having a high melting point. To provide a mounting board soldering jig that can effectively suppress the deformation of the mounting board edge due to
With that purpose.

[0012]

In order to achieve the above object, in each of the first and second aspects of the present invention, an opening is provided at one end and an end of a mounting board inserted through the opening is clamped. A jig main body having a U-shaped cross section provided with a substrate holding portion, the opening of the jig main body is provided with a mounting portion for inserting the mounting substrate that functions when the mounting substrate is inserted, and the back surface of the mounting substrate In the mounting board soldering jig having a structure that functions to prevent warping of the mounting board when wave soldering the input / output terminals of the electronic components protruding to the side, the jig body described above is attached to the back side of the mounting board described above. And a blade-shaped projection having a structure in which the tip is buried in the molten solder corresponding to the molten solder fed into the molten solder.

For this reason, in each of the first and second aspects of the present invention, the following effects can be obtained by performing wave soldering by equipping the front end of the mounting board in the moving direction. First, when the mounting board is transported toward the wave solder, and the tip of the board comes into contact with the molten solder,
First, the lower end of the blade-shaped protruding portion of the mounting board soldering jig provided at the front end of the mounting board contacts the molten solder. Furthermore, when the mounting board is moved in the same direction, the oxide film formed on the surface of the molten solder is physically pushed away by the blade-shaped protrusions. Are formed temporarily. Subsequently, as the mounting substrate advances, the input / output terminals (leads) protruding from the rear surface of the mounting substrate are sequentially and continuously sent to the clean molten solder surface, and the input / output terminals (leads) are effectively and securely inserted. Soldered.

Since such an operation is performed continuously, the same environmental conditions are always maintained for the wave soldering. Therefore, according to such a method, high-quality and reliable wave soldering is performed. In this case, the mounting board soldering jig has a blade-like projection compared to the conventional jig, and the overall rigidity is enhanced at this point. It is possible to sufficiently prevent the thermal deformation of the portion in response to this.

Here, it is preferable that at least a part of the blade-shaped projection is formed by projecting a corner of the jig body on the molten solder side toward the molten solder. In this case, there is an advantage that the structure is simple and processing is easy.

In each of the third and fourth aspects of the present invention, a jig having a U-shaped cross section having an opening at one end and a board holding portion for holding an end of the mounting board inserted from the opening. The jig body has a guide portion for inserting the mounting board that functions when the mounting board is inserted, and the jig body has a wave guide for input / output terminals and the like of electronic components protruding on the back side of the mounting board. In a mounting board soldering jig having a structure functioning to prevent warping of the mounting board during soldering, a main body for covering the jig main body and reinforcing the jig main body on an outer surface side of the jig main body. Equipped with reinforcing members. Then, the blade-shaped protruding portion having a structure of projecting toward the molten solder corresponding to the molten solder sent to the back surface side of the mounting board and having a tip buried in the molten solder is formed on the main body reinforcing member described above. To provide,
The configuration is adopted.

Therefore, in each of the inventions according to claims 3 and 4, in addition to functioning equivalently to the invention described in claim 1 or 2, the main body reinforcing member functions effectively and the overall structure is improved. The rigidity of the mounting board is remarkably enhanced. Therefore, it is possible to effectively and reliably prevent the deformation of the tip portion of the mounting board in response to the deformation. here,
The above-mentioned blade-shaped protrusion, at least a part thereof,
It may be formed by projecting a corner of the main body reinforcing member on the molten solder side toward the molten solder. In this case, there is an advantage that the structure is simple and processing is easy.

According to a fifth aspect of the present invention, in the above-described mounting board soldering jig of the first, second, third, or fourth aspect, the tip of the blade-shaped protrusion is previously mounted on the mounting board. The configuration is such that the input and output terminals of the electronic component are made to protrude larger than the protruding end.

Therefore, according to the fifth aspect of the present invention, in addition to having the same function as that of the first, second, third or fourth aspect of the present invention, the tip of the blade-like projection is provided with an electronic component. Since the protruding portion protrudes longer than the output terminal (lead), the tip of the blade-shaped protruding portion penetrates into the molten solder, so that the blade-shaped protruding portion 13 reliably pushes the oxide film away. The wave soldering can be continued in a stable state.

According to a sixth aspect of the present invention, in the above-described soldering jig for a mounting board according to the first, second, third, fourth, or fifth aspect, the blade-shaped projection has a flat surface on the side in the traveling direction. In addition, the inclination of the flat surface is set to an inclination of 90 ° or less with respect to the tangent line of the molten solder at the contact portion with the molten solder described above.

Therefore, according to the invention of claim 6,
In addition to having the same function as the above-mentioned claim 1, 2, 3, 4 or 5, the inclined surface of the blade-like projection is made to slide on the surface of the molten solder (without scooping up the molten solder). Therefore, only the oxide film can be removed from the surface of the molten solder, which is efficient.

According to a seventh aspect of the present invention, in the mounting jig for a mounting board according to the first, second, third, fourth, fifth, or sixth aspect, a Teflon film is applied to the blade-shaped protrusion. Has been adopted.

Therefore, in the invention according to claim 7,
In addition to having the same function as the above-mentioned claim 1, 2, 3, 4, 5 or 6, the heat resistance of the blade-shaped projection and the separability of the oxide film are improved, and the soldering for the mounting board is improved. There is an advantage that the durability of the tool itself can be enhanced.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described below with reference to FIGS. In FIG. 1, reference numeral 101 denotes a plurality of electronic components 103.
Shows a mounting board equipped with. On one end 101A of the mounting board 101, a mounting board soldering jig 10 is detachably mounted.

The mounting board soldering jig 10 includes a jig main body 11 having a U-shaped cross section and a main body reinforcing member 12 for reinforcing the jig main body 11. Here, the jig body 11
Is configured similarly to the jig body 111 (see FIG. 8) in the above-described conventional example, and has an opening 11A and one end 101A of the mounting board 101 inserted through the opening 11A.
And a substrate holding portion 11B for holding the substrate. And
The mounting board 101 is provided in the opening 11A of the jig main body 11.
The substrate guide 13 for guiding the insertion of the through the opening 11A is provided integrally with the substrate guide 13 opened outward.

The main body reinforcing member 12 is formed of the jig main body 1 described above.
1 so that the substrate holding portion 11B of the jig body 11 is sandwiched from outside and the entire outer surface of the jig body 11 is wrapped.
It is equipped integrally on the outer surface side of. Reference numeral 12a denotes an opening 11A of the jig main body 11 for connecting the main body reinforcing member 12 described above.
3 shows a connecting pin integrally connected in the vicinity. This connecting pin 1
2 a are provided at a plurality of locations along the longitudinal direction of the jig main body 11.

Further, the main body reinforcing member 12 is entirely formed in a partially deformed U-shaped cross section, and its opening 1 is formed.
The substrate holding portion 11B of the jig body 11 described above is held on the 2A side. A state in which the lower corner of the right end in FIG. 1 of the main body reinforcing member 12 projects downward in FIG. 1 (specifically, toward the molten solder located below) in a V-shaped cross section. Is formed. At the same time, the main body reinforcing member 12 is formed such that the upper corner at the right end protrudes obliquely upward in FIG.

As a result, the main body reinforcing member 12 is generally extended so that the right end in FIG. 1 rises up from a lower side in FIG. 1 with a predetermined inclined surface. The structure has a blade-shaped protrusion 12B having a surface 12Bk.

That is, the main body reinforcing member 12 is provided with a blade-shaped protrusion 12B at the right end in FIG. 1, and the blade-shaped protrusion 12B projects downward in FIG. V-shaped downward protruding portion 12Ba toward
And an inclined surface 12Bk rising from the protruding end of the V-shaped lower protruding portion 12Ba in the upper right direction in FIG.
An upper protruding portion 12Bb protruding upward in FIG. 1 and forming a part of the inclined surface 12Bk is in a state.

Here, at least a part of the above-mentioned blade-shaped protrusion has a lower protrusion 12Ba that causes a corner of the main body reinforcing member 12 on the side of the molten solder 102 to project toward the molten solder 102. It is formed by this. This simplifies the structure,
There is an advantage that processing is easy.

Further, in this case, the V-shaped downwardly projecting portion 12Ba projecting downward in FIG. 1 has, in the present embodiment, the distal end thereof being the distal end of the input / output terminal 103a of the electronic component 103 mounted on the mounting board 1. The portion is set to protrude further than the portion.

The lower corner of the right end of the jig main body 11 in FIG. 1 is assembled in such a manner as to come into contact with the inclined surface 12Bk of the main body reinforcing member 12 from the inside. Further, on the outer surface of the substrate holding portion 11B located on the upper side of the jig main body 11 in FIG.
The second opening 12A side is set in a partially overlapped state. Thereby, the jig main body 11 and the main body reinforcing member 1
2 is further strengthened, and deformation of the end of the mounting substrate 1 due to heat is effectively prevented.

Further, the jig main body 11 and the main body reinforcing member 12 are all provided with a Teflon film (coated with Teflon), but may be Teflon coated only on the outer surface. . In this manner, the jig body 1 as well as the blade-shaped protrusion 12B is formed.
1 and the whole body reinforcing member 12 have the advantage that the heat resistance and the separability of the oxide film are improved, and the durability of the mounting substrate soldering jig itself can be enhanced.

The angle θ between the blade-shaped protruding portion 12B and the inclined surface 12Bk and the surface of the molten solder (specifically, the tangent to the contact surface with the molten solder) is set to 90 ° or less. . Therefore, as described later, it is possible to efficiently remove the oxide film of the molten solder. In FIG. 1, θ is set to about 60 °. Other configurations are the same as those of the above-described conventional example.

Next, the operation of the above embodiment will be described with reference to FIG. In FIG. 2, the arrow A indicates the mounting substrate 10
The arrow B indicates the flow direction of the molten solder 102 flowing in a wave shape in a predetermined area. Further, reference numeral 2a denotes an oxide film formed on the outer surface of the molten solder 102 by contact with air.

As described above, the wave soldering operation is performed by the electronic component 103 protruding from the rear surface of the mounting board 101.
Is performed when the input / output terminals (leads) 103a of the contacting terminal 103a contact the molten solder 102. As shown in FIG. 2A, when the mounting board 101 is transferred in the direction of arrow A and its tip comes to a region where it comes into contact with the molten solder 102, first, the mounting device mounted on the tip of the mounting board 101 is mounted. The lower end of the blade-shaped protrusion 12 </ b> B of the board soldering jig 10 contacts the molten solder 102. Then, when the mounting substrate 101 moves in the direction A as it is, the oxide film 102a formed on the surface of the molten solder 102 is physically pushed away by the blade-shaped protrusion 12B.

In this case, in this embodiment, since the tip of the blade-shaped protrusion 12B protrudes longer than the input / output terminal (lead) 103a of the electronic component 103, the blade-like protrusion 12B protrudes into the molten solder 102. Therefore, the blade-shaped protrusion 12B moves while pushing away the oxide film 102a, and as a result, as shown in FIG.
A clean molten solder surface without 02a is formed temporarily.

Subsequently, with the transfer of the mounting substrate 1, the input / output terminals (leads) 103a are sent to the clean molten solder surface, and as a result, as shown in FIG. 2B, there is no oxide film 102a. The input / output terminals (leads) 103a are sequentially and continuously sent to the clean molten solder surface 2b, and the input / output terminals (leads) 103a are effectively and reliably soldered.

Since such an operation is performed continuously, the same environmental conditions are always maintained for the wave soldering. Therefore, according to such a method, high-quality and reliable wave soldering is performed. FIG. 2 (b)
In the above, the case where the clean molten solder surface 2b from which the oxide film 102a has been removed is separated from the back surface of the mounting board 101 is illustrated.
Wave soldering is performed continuously in a state almost in contact with the back surface of the substrate.

As described above, according to the present embodiment, while the oxide film 102a on the molten solder 102 is removed by the blade-shaped protrusion 12B provided at the tip of the mounting substrate 1, the mounting substrate 1 is cleaned on the clean molten solder surface 2b. Is performed, so that solder defects caused by the oxide film 102a, which have conventionally occurred, can be significantly reduced, and high-quality and reliable wave soldering is performed. This makes it possible to significantly increase the uniformity and durability of the quality of the mounting board 1 obtained.

Further, in the above-described embodiment, the deformation of the mounting substrate 1 due to heat is doubled by the jig main body 11 and the main body reinforcing member 12, so that the wave solder is made of lead-free solder or the like having a high melting point. There is an advantage that sufficient rigidity can be maintained even when mounting is performed.

(Second Embodiment) Next, a second embodiment will be described with reference to FIG. In the jig 20 for mounting board solder according to the second embodiment, the jig main body 11 in the first embodiment is improved to form a jig main body 21, and the main body reinforcing member 12 in the first embodiment is used.
This is characterized in that the structure is simplified and the cost is reduced by reducing the number of parts.

Hereinafter, this will be described. The jig body 21 shown in FIG. 3 is generally formed in a U-shaped cross section, has an opening 21A at one end, and a blade-like projection 21B at the other end.
And a substrate holding portion 21C is provided at an intermediate portion thereof.

A guide portion 24 for guiding the insertion of the mounting board 101 is provided in the opening 21A at one end similarly to the case shown in FIG. The guide portion 24 and the above-described jig main body 21 constitute the mounting substrate soldering jig 20.

The above-mentioned blade-shaped protrusion 21B has a lower protruding portion 21Ba formed by protruding a lower corner of the right end of the jig main body 21 in FIG. 3 further downward, and an upper part of the right end. Right protruding portions 21Bb formed by protruding the corner portions of the protruding portions toward the lower right direction in the figure, and the respective protruding portions 21Ba, 21B.
b is formed by an inclined surface 21Bk formed by linearly connecting the front ends of the b.

Here, at least a part of the above-mentioned blade-like projection portion, the lower projection portion 21Ba, causes a corner of the jig body 21 on the side of the molten solder 102 to project toward the molten solder 102. It is formed by this. In this case, there is an advantage that the structure is simple and processing is easy.

In this case, the inclination angle θ of the inclined surface 21Bk
As in the case of the inclined surface 12Bk in FIG. 1 described above, assuming that the angle between the contact surface and the tangent at the contact surface with the molten solder is θ, if θ has an appropriate inclination angle of 90 ° or less. Good. In the second embodiment disclosed in FIG. 3, θ is set to about 60 °.

In the jig body 21 having the above-described structure, when the end of the mounting board 101 is inserted, the corners of the ends of the jig body 21 are all connected to the jig body 2.
1 is configured to contact the inner wall surface. here,
The entire jig body 21 and the guide portion 24 are provided with a Teflon film (coated with Teflon), but may be Teflon-coated only on the outer surface.

For this reason, the jig 20 for mounting board solder according to the second embodiment is slightly lower in rigidity than the jig 10 for mounting board solder shown in FIG. Since the blade-shaped protrusion 21B of the jig body 21 has two protrusions 21Ba and 21Bb as a whole, the rigidity is higher than that of the above-described conventional mounting board soldering jig 110 (see FIG. 8). In addition, there is an advantage that the operation function for removing the oxide film during operation is substantially the same as that of the mounting board soldering jig 10 in the first embodiment described above. Further, since the structure can be extremely simplified, there is an advantage that cost can be reduced, weight can be reduced, and versatility can be improved in this respect.

FIGS. 4 and 5 show a modification of the mounting substrate soldering jig 20 in the second embodiment. Among them, the mounting substrate soldering jig 26 of FIG. 4 includes a jig main body 27 formed in a generally U-shaped cross section. The jig body 27 has an opening 27A at one end, a blade-like projection 27B at the other end, and a substrate holding portion 27C at an intermediate portion. Also, an opening 27A at one end.
Is provided with a guide portion 24 for guiding the insertion of the mounting board 101 as in the case of FIG. 3 described above.
The guide portion 24 and the above-described jig main body 27 constitute a mounting substrate soldering jig 26.

On the other hand, the mounting board soldering jig 2 shown in FIG.
6, a lower protruding portion 27Ba in which the blade-shaped protruding portion 27B protrudes further downward at a lower corner of the right end portion in FIG. 4, and a right end surface of the protruding portion 27Ba in FIG. And the inclined surface 27Bk provided at the bottom. Here, the lower protruding portion 27Ba has substantially the same configuration as the lower protruding portion 21Ba in FIG. Other configurations are the same as those of the above-described conventional example of FIG.

Even in this case, since the overall strength (rigidity) is increased by the provision of the lower protruding portion 27Ba, the overall strength (rigidity) is substantially the same as that of the mounting board soldering jig 20 shown in FIG. An equivalently functioning mounting board soldering jig 26 can be obtained.

The soldering jig 28 for the mounting board shown in FIG. 5 includes the blade-like projection 27B shown in FIG.
a having a blade-shaped protrusion 29Ba substantially equivalent to the above-mentioned, and the inclined surface 27 of the blade-shaped protrusion 27Ba described above.
The feature is that the inclination angle θ of Bk is set to 0 °.

The blade-shaped protrusion 29Ba has a lower protruding portion 29Ba formed by protruding a lower corner of the right end in FIG. 5 further downward, and a lower protruding portion 29Ba.
And an end surface 29Bk for removing an oxide film provided on the right end surface in FIG. The right end face 29Bk in FIG. 5 is the inclined face 27 in FIG.
The inclination angle θ of Bk is set to 0 °.

More specifically, the mounting board soldering jig 28 of FIG. 5 includes a jig body 29 formed in a generally U-shaped cross section. The jig body 29 has an opening 29A at one end and a blade-like projection 2 at the other end.
9B, and a substrate holding portion 29C is provided at an intermediate portion thereof.

A guide portion 24 for guiding the insertion of the mounting board 101 is provided in the opening 29A at one end similarly to the case of FIG. 3 described above. The guide portion 24 and the above-described jig body 29 constitute a mounting substrate soldering jig 28.

On the other hand, the mounting board soldering jig 2 shown in FIG.
In 8, the blade-shaped protrusion 29B has a lower protruding portion 29Ba formed by protruding the lower corner of the right end in FIG. 5 further downward. Here, the lower protruding portion 29Ba is, as described above, the inclined surface 2 in FIG.
7Bk is equivalent to an inclination angle θ of 0 °. Other configurations are the same as those in FIG. 4 described above.

Even in this case, since the overall strength (rigidity) is enhanced by the provision of the lower protruding portion 29Ba, the overall strength (rigidity) is substantially the same as that of the mounting board soldering jig 26 shown in FIG. An equivalently functioning mounting board soldering jig 28 can be obtained.

[0059]

According to the present invention, since the present invention is constructed and functions as described above, according to the present invention, the mounting jig for soldering the mounting board provided at the front end of the mounting board is provided with the blade-shaped protrusion in advance, so that the mounting In the process of transferring the board onto the molten solder, the blade-shaped protrusion automatically removes the oxide film on the molten solder, so that wave soldering is always performed on the backside of the mounting board with a clean molten solder surface. As a result, it is possible to significantly reduce solder defects caused by an oxide film, which has conventionally occurred, and to perform high-quality and reliable wave soldering. The strength (rigidity) of the jig main body is greatly enhanced by the provided main body reinforcing member, and therefore, it is possible to effectively suppress the deformation of the end portion of the mounting board due to thermal stress. It can sufficiently cope with the high temperature of the molten solder, particularly when using a molten solder such as lead-free having a high melting point. In this regard, when the jig according to the present invention is equipped and the wave soldering is performed, the quality becomes high. It is possible to provide an unprecedented and excellent mounting board soldering jig that can further improve the uniformity and durability of the mounting board.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of a mounting board soldering jig according to the present invention.

2A and 2B are diagrams illustrating a use state of the mounting board soldering jig disclosed in FIG. 1; FIG. 2A illustrates a blade-shaped protrusion of the mounting board soldering jig in an oxide film as the mounting board advances; FIG. 2 (b) is an explanatory view showing a state in which the soldering portion has entered, and FIG. 2 (b) is an explanatory view showing a progress of soldering of a portion to be soldered by a surface of a clean molten solder from which an oxide film is removed by further progress of a mounting substrate.

FIG. 3 is a sectional view showing a second embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a modification of the second embodiment disclosed in FIG.

FIG. 5 is a sectional view showing another modification of the second embodiment disclosed in FIG. 3;

FIG. 6 is an explanatory view showing a working example of wave soldering in a conventional example.

FIG. 7 is an explanatory view showing an example of a mounting board and a mounting board soldering jig to be subjected to wave soldering disclosed in FIG. 6;

FIG. 8 is a cross-sectional view showing an example of a mounting board soldering jig disclosed in FIG. 6;

FIG. 9 is an explanatory view showing another working example of the wave soldering in the conventional example.

[Explanation of symbols]

 10, 20, 26, 28 Soldering jig for mounting board 11, 21, 27, 29 Jig body 11A, 12A, 21A, 27A, 29A Opening 11B, 21C, 27C, 29C Board holding section 12 Main body reinforcing member 12B, 21B, 27B, 29B Blade-shaped protrusion 12Ba, 21Ba, 27Ba, 29Ba Lower protrusion 12Bb, 21Bb Upper protrusion 12Bk, 21Bk, 27Bk Inclined surface 13, 24 Guide portion 101 Mounting substrate 101A Edge 102 Melted solder 102a Oxide film 103 Electronic component 103a Input / output terminal θ Tilt angle

Claims (7)

[Claims] 1. A jig body having a U-shaped cross section having an opening at one end and a board holding portion for holding an end of a mounting board inserted through the opening. The opening is provided with a guide portion for inserting the mounting board, which functions when the mounting board is inserted, and prevents the mounting board from warping at the time of wave soldering to the input / output terminals and the like of the electronic components protruding on the back side of the mounting board. In the jig for mounting board solder having a structure that functions as a tool, the jig main body connected to and mounted on an end portion of the mounting board in the traveling direction corresponds to the molten solder sent to the back side of the mounting board. A mounting board soldering jig provided with a blade-shaped protrusion having a structure protruding toward a molten solder and having a tip buried in the molten solder. 2. The method according to claim 1, wherein at least a part of the blade-shaped projection is formed by projecting a corner of the jig body on the molten solder side toward the molten solder. 2. The jig for soldering a mounting board according to 1. 3. A jig body having a U-shaped cross section having an opening at one end and a board holding portion for holding an end of a mounting board inserted through the opening. The opening is provided with a guide portion for inserting the mounting board, which functions when the mounting board is inserted, and prevents the mounting board from warping at the time of wave soldering to the input / output terminals and the like of the electronic components protruding on the back side of the mounting board. A jig for mounting a solder on a mounting board having a structure functioning as a main body is provided with a main body reinforcing member for reinforcing the jig main body on an outer surface side of the jig main body so as to cover the jig main body. The member is provided with a blade-shaped protruding portion having a structure in which the member protrudes toward the molten solder corresponding to the molten solder sent to the back side of the mounting substrate and a tip portion is buried in the molten solder. Jig mounting substrate solder characterized. 4. The blade-shaped protrusion is formed by projecting at least a part of a corner of the main body reinforcing member on the side of the molten solder toward the molten solder. 3. The jig for mounting board solder according to 3. 5. The device according to claim 1, wherein the tip of the blade-like projection is made to project more than the projection of an input / output terminal of an electronic component previously mounted on the mounting board. The jig for mounting board solder according to 2, 3, or 4. 6. The blade-shaped protruding portion has a flat surface on the side in the traveling direction, and the inclination of the flat surface is 90 ° or less with respect to a tangent line of the molten solder at a contact portion with the molten solder. 6. The mounting board soldering jig according to claim 1, wherein the mounting jig is set with an inclination. 7. The device according to claim 1, wherein said blade-shaped protrusion is provided with a Teflon film.
7. The mounting board soldering jig according to 5 or 6.