JP2000353864A - Method and body for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the productivity and reliability of electronic components. SOLUTION: Quantities of conductive connecting layers are increased, and the self-alignment of the connecting layers is performed by mounting electronic components 1 on a mounting member 4, by aligning conductive adhesive layers 7c and 7d with each other so that the layers 7c and 7d are faced to each other, after the layers 7c and 7d are respectively provided on the outside connecting sections 2 of electronic components 1 and the mounting and connecting sections 5 of a mounting member 4, on which the parts 1 are mounted. Moreover when bump electrodes 3 and 6 are respectively provided on the outside connecting sections 2 and mounting and connecting sections 5, this effect can be obtained with further convenience.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component such as a semiconductor element and a mounting body for an electronic component, and more particularly to a mounting method and a mounting body for mounting a semiconductor element face down.

[0002]

2. Description of the Related Art In recent years, as a method of directly mounting a semiconductor element in a bare chip state on a circuit board, a conductive adhesive is often provided at a connection portion and mounted. That is, after a protruding electrode is formed on an electrode pad, which is an external connection portion of a semiconductor device, a conductive adhesive is transferred to the protruding electrode. Then, the semiconductor device is mounted on the circuit board after aligning the projecting electrodes to which the conductive adhesive has been transferred with the terminal electrodes, which are the mounting connection portions of the circuit board. Subsequently, the conductive adhesive is cured in a curing furnace, a sealing resin is injected into a gap between the semiconductor device and the circuit board, and the sealing resin is further cured in a curing furnace to complete a mounted body. I was

Hereinafter, a conventional method of mounting a semiconductor device and a mounting body thereof will be described with reference to FIG.

In FIG. 5, 1 is a semiconductor element, 2 is an electrode pad of the semiconductor element 1, 3 is a protruding electrode, 4 is a circuit board,
5 is a terminal electrode of the circuit board 4, 7a is a conductive adhesive layer before curing, 7b is a cured conductive adhesive layer, 8 is a sealing resin,
9 is a transfer dish.

[0005] First, as shown in FIG. 5 (a), a projecting electrode 3 formed on an electrode pad 2 of a semiconductor element 1 is placed on a transfer plate 9 by a conductive adhesive controlled to a uniform thickness. The conductive adhesive is transferred to the protruding electrode 3 by being immersed in the liquid material 7a 'to form the conductive adhesive layer 7a. Next, as shown in FIG. 5B, the semiconductor element 1 is positioned with respect to the circuit board 4 so that the electrode pad 2 faces a predetermined position of the terminal electrode 5, and then the semiconductor element 1 is placed face down. The element 1 is mounted on the circuit board 4. Then, at 120 ° C,
The conductive adhesive layer 7a is hardened by heating in a hardening furnace for about 2 hours, and then a liquid sealing resin 8 is injected into the gap between the semiconductor element 1 and the circuit board 4;
By performing the heat treatment for about 2 hours, the sealing resin 8 is cured. As a result, a semiconductor device package shown in FIG. 5C is completed.

[0006]

However, the above conventional mounting method has the following problems. That is, the transfer amount of the conductive adhesive depends on the size of the region (specifically, the bump electrode 3) to which the conductive adhesive layer 7a is transferred. On the other hand, when the pitch between the electrodes becomes narrower with the miniaturization of the mounting body, it is possible to avoid that the area (projecting electrode 3) where the conductive adhesive is transferred to form the conductive adhesive layer 7a becomes small. Absent. Therefore, when the pitch between the electrodes is reduced to reduce the size of the mounting body, the amount of the conductive adhesive transferred decreases, and the conductive adhesive layer 7a necessary for connecting the electrode pad 2 and the protruding electrode 3 is reduced. Cannot be provided. Therefore, when the size of the mounting body is reduced, the amount of the conductive adhesive layer 7a is reduced, and as a result, the productivity is deteriorated due to an increase in the loss, and even if the initial performance is good, there is a change over time. Has caused a problem that the reliability is significantly deteriorated.

[0007]

According to the present invention, in order to solve the above-mentioned problems, an uncured conductive adhesive is applied to an external connection portion of an electronic component and a mounting connection portion of a mounting member for mounting the electronic component. An electronic component including a step of providing an agent layer, a step of aligning the electronic component such that the two conductive adhesive layers face each other and mounting the electronic component on a mounting member, and a step of curing the two conductive adhesive layers. Configure the implementation method of.

[0008]

According to the first aspect of the present invention, an uncured conductive material is applied to an external connection portion of an electronic component and a mounting connection portion of a mounting member for mounting the electronic component. A step of providing an adhesive layer, a step of positioning electronic components such that both conductive adhesive layers are opposed to each other and mounting the electronic component on a mounting member, and a step of curing both conductive adhesive layers. It is characterized by configuring a component mounting method, and thereby has the following operation. That is, since the uncured conductive adhesive layer is provided on both the external connection portion of the electronic component and the mounting connection portion of the mounting member, the size of the external connection portion or the mounting connection portion is reduced due to downsizing of the mounting body. Is smaller, and even if the amount of the conductive adhesive that can be provided on one connection portion is reduced, the amount of the conductive adhesive sufficient by the sum of the two conductive adhesive layers can be obtained. become.

Further, since the uncured conductive adhesive layer is provided on both the external connection portion and the mounting connection portion, the compatibility (affinity) between the conductive adhesive layers is improved, and the conductive adhesive layer is provided. The external connection portion and the mounting connection portion can be securely bonded by the agent layer.

According to the invention described in claim 2 of the present invention,
2. The method for mounting an electronic component according to claim 1, wherein in the step of providing the conductive adhesive layer, a liquid conductive adhesive layer is formed on the external connection portion and the mounting connection portion. Which has the following effect. That is, when the liquid conductive adhesive layers are brought into contact with each other, they tend to be attracted to each other by their surface tension and then become one sphere. Therefore, the electronic component can be self-aligned by utilizing the attracting force, so that the electronic component can be accurately positioned and arranged with respect to the mounting member.

According to a third aspect of the present invention, there is provided the electronic component mounting method according to the second aspect, wherein the external connection portion of the electronic component and the external connection portion are formed as a pretreatment step of forming the adhesive layer. In the mounting connection part of the mounting member to mount the electronic component,
Each of them is characterized in that it further includes a step of forming a protruding electrode, thereby having the following effects.
That is, by providing the protruding electrodes, the surface area of the external connection portion and the mounting connection portion increases, and as a result, the amount of the conductive adhesive layer attached to the external connection portion and the mounting connection portion increases. In addition, the conductive adhesive layer adheres to the protruding electrodes, so that the conductive adhesive layer extends upward (vertically) without spreading in the horizontal direction. As described above, according to the present invention, the amount of the conductive adhesive layer to be formed can be increased without spreading in the lateral direction. Even if it becomes smaller, the electronic component can be reliably connected to the mounting member without causing a short circuit. Furthermore, the conductive adhesive layer,
By increasing the amount of the adhesive while extending in the upward (longitudinal) direction, the conductive adhesive layers having the increased surface tension due to the increased amount can be used without increasing the contact area between the conductive adhesive layers. Direction), but can be abutted,
The accuracy of self-alignment is improved, and the positioning accuracy of electronic components is improved.

The electronic component mounting method according to any one of claims 1 to 3 is particularly effective in a structure in which a semiconductor element is mounted on a circuit board, as described in claim 4.

Furthermore, according to the electronic component mounting method according to any one of the first to fourth aspects of the present invention, as described in the fifth aspect, the external connection portion of the electronic component disposed opposite to each other can be provided. A projecting electrode provided on each of the mounting connection portions of the mounting member, and a conductive adhesive layer provided between each of the protruding electrodes and electrically connecting the external connection portion and the mounting connection portion to each other. Is obtained. For example, a mounting body of such an electronic component is, for example,
As described in claim 6, there is a mounted body in which electronic components are mounted on a circuit board.

Hereinafter, the present invention will be described more specifically with reference to embodiments. In each of the embodiments described below, the present invention is implemented in a structure in which a semiconductor element, which is an example of an electronic component, is mounted on a circuit board, which is an example of a mounting member. This is just one example,
Needless to say, the present invention can be similarly carried out when other electronic components (capacitors, resistors, etc.) are mounted on other mounting members (multilayer substrate, hybrid IC, etc.).

(First Embodiment) FIG. 1 is a process chart of a mounting method according to a first embodiment of the present invention. Here, 1 is a semiconductor element, 2 is an electrode pad which is an external connection part of the semiconductor element 1, 3 is a protruding electrode formed on the electrode pad 2, 4
Is a circuit board which is a mounting member of the semiconductor element 1, 5 is a terminal electrode which is a mounting connection portion of the circuit board 4, 6 is a protruding electrode formed on the terminal electrode 5, and 7c is a first conductive adhesive before curing. 7d, a second conductive adhesive layer before curing, 7e, a first conductive adhesive layer after curing, 7f, a second conductive adhesive layer after curing, 8: a sealing resin , 9A and 9B are transfer dishes,
Each is shown.

First, as shown in FIGS. 1A and 1B,
Protruding electrodes 3 and 6 are formed on the electrode pad 2 of the semiconductor element 1 and the terminal electrode 5 of the circuit board 4, respectively. The protruding electrodes 3 and 6 are located on the electrode pad 2 and the terminal electrode 5 and are formed to have a size equal to or slightly smaller than the electrode pad 2 and the terminal electrode 5. It is formed in a shape protruding from In the drawing, the protruding electrodes 3 and 6 have a shape that protrudes upward by one step, but it is needless to say that the protruding electrodes 3 and 6 may have a shape that protrudes upward in two or more steps.

Next, as shown in FIG. 1C, the liquid 7c 'of the first conductive adhesive is stored in the first transfer tray 9A in a uniform thickness. The liquid 7 of the first conductive adhesive stored in the first transfer dish 9A in such a state.
The first conductive adhesive layer 7c is formed by immersing the projecting electrode 3 of the semiconductor element 1 in c ′ and transferring the first conductive adhesive to the projecting electrode 3.

Similarly, as shown in FIG. 1 (d), the liquid material 7d 'of the second conductive adhesive is stored in the second transfer plate 9B in a uniform thickness. And in this state the second
The projection electrode 6 of the circuit board 4 is immersed in the liquid material 7d 'of the second conductive adhesive stored in the transfer dish 9B, and the second conductive adhesive is transferred to the projection electrode 6. The second conductive adhesive layer 7d is formed.

Next, as shown in FIG. 1E, a first conductive adhesive layer 7c is formed at a predetermined position on the circuit board 4 on which the second conductive adhesive layer 7d is formed. After the semiconductor element 1 is aligned so as to be mounted accurately,
As shown in FIG. 1F, the semiconductor element 1 is mounted on a circuit board 4. Positioning is performed by accurately matching the corresponding electrode pads 2 and terminal electrodes 5 to each other.

At this time, if the pitch of the electrode pads 2 is small, it is difficult to perform accurate positioning.
Since the first and second conductive adhesive layers 7c and 7d are in a liquid state, the conductive adhesive layers 7c and 7d are likely to be rounded due to their surface tension and are self-aligned. Even if 1 is placed with a slight displacement with respect to the circuit board 4, it will be accurately positioned.

By providing the protruding electrodes 3 and 6 on the electrode pad 2 and the terminal electrode 5, respectively, the surface area of the electrode pad 2 and the terminal electrode 5 (including the protruding electrodes 3 and 6) is increased. The amount of the conductive adhesive attached to the electrode pads 2 and the terminal electrodes 5 increases. Moreover, the first and second conductive adhesive layers 7c and 7d adhere to the protruding electrodes 3 and 6, and thus have a shape extending upward (vertically) without spreading in the horizontal direction. Therefore, the first and second conductive adhesive layers 7c and 7d can be extended in the upward (longitudinal) direction to increase the amount of the adhesive and increase the surface tension to increase the amount of the adhesive. The first and second conductive adhesive layers 7c and 7d are not greatly increased in contact area (this is because the first and second conductive adhesive layers
c, 7d do not spread in the horizontal direction),
Can be abutted. For these reasons, the accuracy of the self-alignment is improved, and the positioning accuracy of the semiconductor element 1 is further increased.

The uncured first and second conductive adhesive layers 7c and 7d are provided on both the electrode pads 2 of the semiconductor element 1 and the terminal electrodes 5 of the circuit board 4. Pad 2 due to the size of the circuit board 4
Even if the size of the terminal electrode 5 becomes smaller and the amount of the conductive adhesive that can be provided on the first and second conductive adhesive layers 7c and 7d decreases, both the conductive adhesive layers 7
By the sum of c and 7d, a sufficient amount of the conductive adhesive can be obtained, and a connection failure can be prevented.

Furthermore, by providing the protruding electrodes 3 and 6, the amount of the first and second conductive adhesive layers 7c and 7d can be increased without spreading in the lateral direction. Even if the pitch at which the electrode pads 2 are formed becomes smaller with the miniaturization of the semiconductor device 1, the semiconductor element 1 can be reliably mounted on the circuit board 4 without causing a short circuit.

In addition, the uncured first and second conductive adhesive layers 7c are applied to both the electrode pads 2 and the terminal electrodes 5.
7d, the first and second conductive adhesive layers 7
The compatibility (affinity) between c and 7d is improved, and the first and second conductive adhesive layers 7c and 7d are easily integrated. As a result, the electrical connection between the electrode pad 2 and the terminal electrode 5 is further ensured.

As described above, the semiconductor element 1 is mounted on the circuit board 4 with the first and second conductive adhesive layers 7c and 7d arranged between the electrode pad 2 and the terminal electrode 5. Thereafter, the structure (semiconductor element 1 and circuit board 4) is transported to a curing furnace (not shown) and heat-treated at 120 ° C. for 2 hours, so that first and second conductive adhesives 7c and 7d are formed.
To cure.

Following the curing of the first and second conductive adhesive layers 7c and 7d, the sealing resin 8 is injected into the gap between the semiconductor element 1 and the circuit board 4 by utilizing the capillary phenomenon. Then, the sealing resin 8 is conveyed to a curing furnace (not shown) and heat-treated at 150 ° C. for about 2 hours to cure the sealing resin 8.
FIG. 1G is a cross-sectional view of the mounted body manufactured by the method of the first embodiment.

(Embodiment 2) FIG. 2 is a process chart of a mounting method according to Embodiment 2. In this figure, each reference numeral is basically assigned in the same manner as in the first embodiment. That is, 1 is a semiconductor element, 2 is an electrode pad of the semiconductor element 1, 3 is a protruding electrode formed on the electrode pad 2, 4 is a circuit board, 5 is a terminal electrode of the circuit board 4, and 7c is a first electrode before curing.
7g is a cured second conductive adhesive layer, 7g is a cured first conductive adhesive layer, 7h is a cured second conductive adhesive layer, and 8 is a sealed. Stop resins are shown respectively.

First, as shown in FIG. 2A, the protruding electrodes 3 are formed on the electrode pads 2 of the semiconductor element 1. The projecting electrode 3 is formed on the electrode pad 2 and has a size equal to or slightly smaller than the electrode pad 2, and is formed in a shape protruding above the electrode pad 2. In the figure,
The protruding electrode 3 has a shape protruding upward by one step, but needless to say, a shape protruding upward in two or more steps. In the present embodiment, the projecting electrodes 3 are formed on the semiconductor element 1, but no projecting electrodes are formed on the circuit board 4.

Next, as shown in FIG. 2 (b), the liquid 7c 'of the first conductive adhesive is made uniform in thickness and the transfer dish 9 is formed.
Store in C. Then, the projection electrode 3 of the semiconductor element 1 is immersed in the liquid 7c ′ of the first conductive adhesive stored in the transfer plate 9C in this state, and the first conductive adhesive is Is transferred to form the first conductive adhesive layer 7c.

On the other hand, as shown in FIG. 2C, a second conductive adhesive is formed on the terminal electrodes 5 of the circuit board 4 by a pre-coating method or a coating method to form a thick film. A second conductive adhesive layer 7g is formed. As the precoating method, for example, a vapor deposition process or a spray process can be performed. As an application method, for example, screen printing using a mask can be performed.

Next, as shown in FIG. 2D, a first conductive adhesive layer 7c is formed at a predetermined position on the circuit board 4 on which the second conductive adhesive layer 7g is formed. After the semiconductor element 1 is aligned so as to be mounted accurately,
As shown in FIG. 2E, the semiconductor element 1 is mounted on the circuit board 4.

At this time, the uncured first and second conductive adhesive layers 7c and 7g are provided on both the electrode pads 2 of the semiconductor element 1 and the terminal electrodes 5 of the circuit board 4.
The size of the electrode pad 2 and the terminal electrode 5 is reduced due to the miniaturization of the semiconductor element 1 and the circuit board 4, and the conductive adhesive that can be provided on the first and second conductive adhesive layers 7c and 7g. Of the conductive adhesive layers 7 even if the amount of
By the sum of c and 7 g, a sufficient amount of the conductive adhesive can be obtained, and poor connection can be prevented.

The uncured first and second conductive adhesive layers 7c and 7c are applied to both the electrode pad 2 and the terminal electrode 5.
g, the first and second conductive adhesive layers 7c,
The compatibility (affinity) of the 7 g is improved, and the first and second conductive adhesive layers 7 c and 7 g are easily integrated. As a result, the electrical connection between the electrode pad 2 and the terminal electrode 5 is further ensured.

As described above, the semiconductor element 1 is mounted on the circuit board 4 with the first and second conductive adhesive layers 7c and 7g disposed between the electrode pad 2 and the terminal electrode 5. After that, the structure (semiconductor element 1 and circuit board 4) is transferred to a curing furnace (not shown) and heat-treated at 120 ° C. for 2 hours, thereby forming first and second conductive adhesives 7c and 7g.
To cure.

Subsequent to the curing of the conductive adhesive, the sealing resin 8 is injected into the gap between the semiconductor element 1 and the circuit board 4 by utilizing the capillary phenomenon.
Cured at about 2 hours. FIG. 2F is a cross-sectional view of the mounted body manufactured by the method of the present embodiment.

(Embodiment 3) FIG. 3 is a process chart of a mounting method according to Embodiment 3 of the present invention. In this figure, each reference numeral is basically assigned in the same manner as in the first embodiment. That is, 1 is a semiconductor element, 2 is an electrode pad of the semiconductor element 1, 4 is a circuit board, 5 is a terminal electrode of the circuit board 4,
Reference numeral 6 denotes a protruding electrode formed on the terminal electrode 5, 7i denotes a first conductive adhesive layer before curing, 7d denotes a second conductive adhesive layer before curing, and 7j denotes a cured first conductive adhesive. An agent layer, 7f indicates a cured second conductive adhesive layer, and 8 indicates a sealing resin.

First, as shown in FIG. 3A, the protruding electrodes 6 are formed on the terminal electrodes 5 of the circuit board 4. Protruding electrode 6
Is formed on the terminal electrode 5 and has a slightly smaller size than the terminal electrode 6, and is formed in a shape protruding above the terminal electrode 6. In the drawing, the protruding electrode 6 has a shape protruding upward by one step, but it is needless to say that the protruding electrode 6 may have a shape protruding upward in two or more steps. In the present embodiment, the bump electrodes 6 are formed on the circuit board 4, but no bump electrodes are formed on the semiconductor element 1.

Next, as shown in FIG. 3 (b), the liquid 7d 'of the second conductive adhesive is made to have a uniform thickness,
Store in D. Then, the projection electrode 6 of the circuit board 4 is immersed in the liquid material 7d ′ of the second conductive adhesive stored in the transfer dish 9D in this state, and the second conductive adhesive is Is transferred to form the second conductive adhesive layer 7
forming d.

On the other hand, as shown in FIG. 3C, the first conductive adhesive is formed in a thick film on the electrode pads 2 of the semiconductor element 1 by a precoating method or a coating method. One conductive adhesive layer 7i is formed. As the precoating method, for example, a vapor deposition process or a spray process can be performed. In addition, as an application method, screen printing using a mask can be performed.

Next, as shown in FIG. 3D, a first conductive adhesive layer 7i is formed at a predetermined position on the circuit board 4 on which the second conductive adhesive layer 7d is formed. After the semiconductor element 1 is aligned so as to be mounted accurately,
As shown in FIG. 2E, the semiconductor element 1 is mounted on the circuit board 4.

At this time, the uncured first and second conductive adhesive layers 7i and 7d are provided on both the electrode pads 2 of the semiconductor element 1 and the terminal electrodes 5 of the circuit board 4.
The size of the electrode pad 2 and the terminal electrode 5 is reduced due to the miniaturization of the semiconductor element 1 and the circuit board 4, and the conductive adhesive that can be provided on the first and second conductive adhesive layers 7i and 7d. Of the conductive adhesive layers 7 even if the amount of
By the sum of i and 7d, a sufficient amount of the conductive adhesive can be obtained, and poor connection can be prevented.

The uncured first and second conductive adhesive layers 7i, 7 are applied to both the electrode pad 2 and the terminal electrode 5.
d, the first and second conductive adhesive layers 7i,
The compatibility (affinity) of 7d is improved, and the first and second conductive adhesive layers 7i and 7h are easily integrated. As a result, the electrical connection between the electrode pad 2 and the terminal electrode 5 is further ensured.

As described above, the semiconductor element 1 was mounted on the circuit board 4 with the first and second conductive adhesive layers 7i and 7d being disposed between the electrode pad 2 and the terminal electrode 5. After that, the structure (semiconductor element 1 and circuit board 4) is transferred to a curing furnace (not shown) and heat-treated at 120 ° C. for 2 hours to form first and second conductive adhesive layers 7i, 7
Subsequent to the curing of the conductive adhesive for curing d, the sealing resin 8 is injected into the gap between the semiconductor element 1 and the circuit board 4 by utilizing the capillary phenomenon, and subsequently, is conveyed to a curing furnace to be cured.
Cured at about 2 hours. FIG. 3F is a cross-sectional view of the mounted body manufactured by the method of the present embodiment.

(Fourth Embodiment) FIG. 4 is a process chart of a mounting method according to a fourth embodiment of the present invention. In this figure, each reference numeral is basically assigned in the same manner as in the first embodiment. That is, 1 is a semiconductor element, 2 is an electrode pad of the semiconductor element 1, 4 is a circuit board, 5 is a terminal electrode of the circuit board 4,
7k is a first conductive adhesive layer before curing, 7l is a second conductive adhesive layer before curing, 7m is a cured product of the first conductive adhesive, 7n is a second conductive adhesive The cured product of the layer, 8 indicates a sealing resin.

First, as shown in FIG. 4A, a first conductive adhesive layer 7k is pre-coated or applied on the electrode pads 2 of the semiconductor element 1. Similarly, as shown in FIG. 4B, a second conductive adhesive layer 7l is pre-coated or applied on the terminal electrodes 5 of the circuit board 4. Examples of the precoating method and the coating method are the same as those described in the second and third embodiments.

Next, as shown in FIG. 4C, a second conductive adhesive layer 7l is formed at a predetermined position on the circuit board 4 on which the first conductive adhesive layer 7k is formed. After the semiconductor element 1 is aligned so as to be mounted accurately,
Mount.

Subsequently, as shown in FIG. 4D, the first conductive adhesive 7k and the first conductive adhesive 7k are conveyed to a curing furnace (not shown) and subjected to a heat treatment at 120 ° C. for about 2 hours. The second conductive adhesive 7l is cured.

Following the heat curing treatment of the first and second conductive adhesive layers 7k and 7l, the semiconductor element 1 and the circuit board 4
The sealing resin 8 is injected into the gap with the use of the capillary phenomenon, and then transported to a curing furnace (not shown) at 150 ° C.
It is cured by heat treatment under conditions for about an hour. FIG.
(E) is a cross-sectional view of the mounted body manufactured in the present embodiment.

The combination of the first conductive adhesive layer and the second conductive adhesive layer in each of the above-described embodiments is (the resin component of the first conductive adhesive layer, the second conductive adhesive layer, Resin component of conductive adhesive layer) = (thermoplastic, thermoplastic),
(Thermoplastic, thermosetting), (thermosetting, thermoplastic),
(Thermosetting, thermosetting).

When the first conductive adhesive layer and the second conductive adhesive layer are completely the same conductive adhesive, the same conductive adhesive stored in one transfer dish may be used. It goes without saying that the image may be transferred to the semiconductor element 1 and the circuit board 4.

Next, the characteristics of each combination of the resin compositions of the first and second conductive adhesive layers in the present invention will be described.

(Resin component of first conductive adhesive layer, second conductive adhesive layer
Resin component of conductive adhesive layer) = (thermoplastic, thermoplastic
In this case, a stable structure can be obtained over a long period against the generated thermal stress. In other words, thermoplastic resin can expand and contract without stress causing bulk fracture.
Since it can be sheared, the structure becomes stable against thermal stress over a long period of time. Further, since the thermoplastic resin is dissolved in an organic solvent such as acetone, it can be repaired even when a problem occurs after the conductive adhesive is cured. On the other hand, however, there is also a problem that adhesive strength and bulk strength are weak.

(The resin component of the first conductive adhesive layer, the second
= Resin component of conductive adhesive layer) = (thermosetting, thermosetting)
In this case, a package excellent in mass productivity can be obtained. That is, the thermosetting resin can terminate the reaction at a high speed, and can further improve mass productivity. In addition, since the thermosetting resin has a high adhesive strength, the conductive adhesive layer hardly peels off at the interface with the electrode pad 2 or at the interface with the terminal electrode 5.

(The resin component of the first conductive adhesive layer, the second
Resin component of the conductive adhesive layer) = (thermoplastic, thermosetting)
) Or (thermosetting, thermoplastic) combination
In this case, a bonding layer having the advantages of a thermosetting resin and a thermoplastic resin can be formed. The first advantage is that repair is possible. Here, when the semiconductor element 1 is to be reused, the semiconductor element 1
The side may be a conductive adhesive of a thermoplastic resin, and the circuit board 4 side may be a thermosetting conductive adhesive. If the circuit board 4 is to be reused, the reverse is necessary. Furthermore, because the conductive adhesive layer of thermoplastic resin relieves stress,
It becomes stable against thermal stress.

[0055]

As described above, according to the present invention,
By providing a conductive adhesive layer on each of the external connection portion of the semiconductor element and the mounting connection portion of the mounting member, even if the amount of one conductive adhesive is small, by combining the two,
A sufficient amount of the conductive adhesive can be obtained, and a highly reliable mounting body can be obtained. Such an effect is particularly effective in a case where a sufficient conductive adhesive layer cannot be obtained as the formation pitch of the external connection portion of the electronic component becomes narrower, and as a result, productivity and reliability deteriorate.

Further, as the pitch of forming the external connection portion becomes narrower, it becomes very difficult to align the electronic component and the mounting member. However, the conductive adhesive layer provided on the external connection portion of the electronic component becomes difficult. By making the conductive adhesive layer provided on the mounting connection part of the mounting member liquid, the liquid tends to round due to its surface tension, which enables high-precision self-alignment. , It is possible to perform highly accurate positioning.

By providing an uncured conductive adhesive layer on both the external connection portion and the mounting connection portion,
The familiarity (affinity) between the conductive adhesive layers is improved,
The external connection portion and the mounting connection portion can be securely bonded by the conductive adhesive layer. Further, since the bonding strength is increased, a highly reliable mounting body can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing each step of a mounting method according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing each step of a mounting method according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view showing each step of a mounting method according to a third embodiment of the present invention.

FIG. 4 is a cross-sectional view showing each step of the mounting method according to the embodiment of the present invention.

FIG. 5 is a cross-sectional view showing steps of a mounting method in a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Electrode pad 3 Projection electrode 4 Circuit board 5 Terminal electrode 6 Projection electrode 7c, 7i, 7k First conductive adhesive layer 7d, 7g 7l Second conductive adhesive layer 8 Sealing resin

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yoshihiro Bessho 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5E319 AA03 AB05 AB10 AC01 BB11 CD04 5E336 AA04 BB01 BC28 CC44 CC58 EE07 GG09 5F044 KK01 KK16 LL07 QQ01 QQ06

Claims (6)

[Claims] A step of providing an uncured conductive adhesive layer in each of an external connection portion of an electronic component and a mounting connection portion of a mounting member for mounting the electronic component; A method for mounting an electronic component, comprising: positioning an electronic component so as to face each other, and mounting the electronic component on a mounting member; and curing the two conductive adhesive layers. 2. The method for mounting an electronic component according to claim 1, wherein in the step of providing the conductive adhesive layer, a liquid conductive adhesive layer is provided on the external connection portion and the mounting connection portion. A method for mounting an electronic component, comprising: forming an electronic component; 3. The method for mounting an electronic component according to claim 2, wherein, as a preprocessing step of the step of forming the adhesive layer, an external connection portion of the electronic component and a mounting member for mounting the electronic component are mounted. A method for mounting an electronic component, further comprising a step of forming a projecting electrode in each of the mounting connection portions. 4. The method of mounting an electronic component according to claim 1, wherein the electronic component is a semiconductor element, and the mounting member is a circuit board on which a semiconductor device is mounted. Electronic component mounting method. 5. A protruding electrode formed on an external connection portion of an electronic component and a mounting connection portion of a mounting member, which are disposed opposite to each other, and the external connection portion is provided between the protruding electrodes. And a conductive adhesive layer for electrically connecting the mounting connection part to each other. 6. The electronic component package according to claim 5, wherein the electronic component is a semiconductor element, and the mounting member is a circuit board.