JP2000353758A - Hollow plastic package and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To expose all leads on the exposed surface of a hollow section by hanging down inner leads from the inner-lead contacting surface of a mold having projecting sections forming the hollow section and molding a resin, in a state where the inner leads reach the bottom of the mold on the side on which the hollow section is not formed. SOLUTION: A lead frame LF, which becomes a lead electrode, is sandwiched in advance between a male mold D1 and a female mold D2. The frame LF nearly vertically drops down toward a bottom face SB of the female mold D2 on the inside from a position corresponding to the lead contacting surface of the male mold D1. Consequently, the lead frame LF is not deformed by its own weight, mismatching between the male and female molds D1 and D2, etc., because the frame LF is maintained in a horizontal attitude at the position corresponding to the lead contacting surface of the male mold D1 by the front end of the drop-down section of the frame LF, which is in contact with the bottom face SB of the mold D2. Therefore, a molten resin is not able to infiltrate between the lead frame LF and the lead contacting surface of the male mold D1, and accordingly, the occurrence of a nonconformity is eliminated where the resin is molded in a state with leads not being exposed in a hollow section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a hollow portion inside, for example, a package of a CCD device,
The present invention relates to a method for manufacturing a hollow plastic package in which a lead electrode is exposed in a hollow portion and is electrically connected to a chip.

[0002]

2. Description of the Related Art In recent years, a package of a CCD device, for example, an image pickup device of a type which has a space inside and is sealed with a transparent cover after a chip is mounted thereon, is an epoxy as shown in FIG. The adoption of plastic packages using resin and the like is increasing. The hollow package is different from a solid package such as a normal semiconductor package in that the chip 1 is mounted after molding and the electrode on the chip is electrically connected to the hollow lead, so that the lead 1 is exposed in the hollow part. There is a need.

FIG. 2 shows the concept of a conventional resin molding method for a hollow package. According to the conventional method of manufacturing a hollow package shown in FIG. 2, the upper die is manufactured so that the grip surface S1 of the upper outer lead and the upper die contact surface S2 are coplanar. However, since the distance between the inner leads joined to the chip is designed to be relatively narrower than the distance between the outer leads in most cases, the inner lead is usually located at the center of the hollow plastic package in plan view as shown in FIG. The lead is short as L1 and longer as L2 toward the end.

In such a case, the lead must be in close contact with the upper-type lead contact surface S2 for forming the exposed surface of the hollow lead, but in reality, the lead's own weight as shown by L3 in FIG. Or, the inner lead hangs down due to the downward pressure of the flowing resin, and the tip does not adhere to the contact surface of the upper mold.When the resin is filled in this state, the resin enters between the contact surface and the lead, and as a result, As a result, there has been a problem that the lead is molded in a state where the lead is not exposed to the hollow portion. Further, in addition to the sagging of the inner lead due to its own weight, the L4 lead gripping surface S in FIG.
When the lead L4 is gripped by the upper and lower dies as shown in 3, there is a case where the alignment of the upper and lower dies is misaligned, and the misalignment causes a stress to be transmitted to the inner lead to cause distortion, thereby maintaining horizontality. However, the tip does not come into close contact with the contact surface of the upper mold, and when the resin is filled in this state, the resin enters between the contact surface and the lead as in the above case, and as a result, it enters the hollow part. There has been a problem that the leads are molded without being exposed. A hollow package molded with no leads exposed in the hollow part is naturally useless because the leads that should be connected to the chip electrodes are not exposed in the hollow part even if the chip is mounted inside. They had to be discarded as defective.

[0005]

As described above, according to the resin molding method of a hollow package according to the prior art, as described above, the inner lead hangs down due to the weight of the lead or the downward pressure of the resin flowing into the inner package. The part does not adhere to the contact surface of the upper mold, and when resin is filled in that state, the resin enters between the contact surface and the lead, and as a result, the mold is molded without the lead being exposed in the hollow part. In addition to the fact that it occurred and the sagging of the inner lead due to its own weight, when the lead was gripped by the upper and lower molds, the upper and lower molds could be misaligned. Stress is transmitted and distortion occurs, so that the level cannot be maintained and the tip does not come into close contact with the contact surface of the upper mold. Filling the resin between the contact surface and the lead in the same manner as described above, resulting in a problem that the lead is molded in a state where the lead is not exposed in the hollow portion, and these Due to the defect of the above, the hollow package that was molded without the lead exposed in the hollow part, because the lead that should be connected to the chip electrode even if the chip is mounted inside is not exposed in the hollow part, Naturally, it had to be discarded as a defective product instead of being used.

[0006]

According to the present invention, there is provided a method of manufacturing a hollow plastic package for molding a chip mounting portion into a hollow in order to achieve the above object, wherein an inner lead forms a hollow portion. A method of manufacturing a hollow plastic package, comprising: hanging down from an inner lead contact surface of a mold having a convex portion to be formed, and performing resin molding in a state of reaching a mold bottom surface on a side not forming a hollow portion, Or, the inner lead is substantially perpendicular to the inner lead contact surface of the mold having a convex portion forming a hollow portion,
A method of manufacturing a hollow plastic package, wherein the resin molding is performed in a state of hanging down to a mold bottom surface on a side where no hollow portion is formed, or a method in which an inner lead has a convex portion forming a hollow portion. From the inner lead contact surface of the mold, it hangs downward and bends toward the center or outside of the package at the top of the mold bottom on the side where no hollow part is formed. A method of manufacturing a hollow plastic package, wherein the hollow plastic package is contacted at an elevation angle of 0 to 90 degrees.
The present invention also proposes a hollow plastic package manufactured by these manufacturing methods.

[0007]

Embodiment 1 Next, an embodiment will be described in detail with reference to the drawings. FIG. 5 shows the concept of the method for manufacturing a hollow plastic package according to the present invention. D1 is an upper mold, and D2 is a thermosetting resin which is heated to a temperature at which the thermosetting resin can be melted and thermoset. A protrusion 6 for forming the hollow portion 2 of the hollow package is provided on the upper die D1.
Is provided. Into the pot 3 of the lower mold D2, a thermosetting resin tablet R such as an epoxy resin is charged in advance.

A lead frame LF serving as a lead electrode is held between the upper die D1 and the lower die D2. When the lead frame LF goes inward from a position corresponding to the upper die lead contact surface S2, the lead frame LF hangs at a substantially right angle toward the bottom surface SB of the lower die D2, and its tip contacts the bottom surface SB of the lower die D2. In this state, the leading end of the lead frame LF contacts the bottom surface SB of the lower die D2 and horizontally holds the position corresponding to the upper die contact surface S2. It will not be deformed.

Next, as shown in FIG. 6, the thermosetting resin R charged into the pot 3 is thermally melted in a high-temperature mold, and the plunger 4 is raised from that state as shown in FIG. Through the runner 5 into the cavities C1 and C2. After a predetermined heat curing time, the upper and lower molds are separated and the molded product is taken out.

According to the above steps, the lead frame LF
Since the tip of the hanging part contacts the bottom surface SB of the lower die D2 and horizontally holds the position corresponding to the upper die contact surface S2, the lower pressure of the flowing resin, the weight of the lead frame,
There is no deformation due to misalignment of the mold. Therefore, molten resin cannot enter between the lead frame LF and the upper die contact surface S2. Therefore, the problem that the resin enters between the upper die lead contact surface and the lead frame LF and is molded in a state where the lead is not exposed to the hollow portion as a result is eliminated.

[0011]

Second Embodiment FIGS. 7 and 8 show a method of manufacturing a hollow plastic package according to a second embodiment of the present invention. In this embodiment, in the first embodiment described above,
While the leading end of the lead frame LF contacts the bottom surface SB of the lower die D2 at an elevation angle of about 90 degrees to the lower die D2, the position corresponding to the upper die lead contact surface S2 is held horizontally.
Connect the tip of the lead frame LF to the bottom surface S of the lower mold D2.
B is bent almost horizontally toward the center of the package at the top of B and the lower mold D
The resin molding is performed in a state in which the second bottom surface SB is in substantially horizontal surface contact at an elevation angle of 0 °.

According to the method of the present embodiment, the hanging dimension of the lead frame LF in the first embodiment is changed to the upper die contact surface S
The lead frame LF must be bent again toward the center of the package at the upper portion of the bottom surface SB while the lead frame must be strictly adjusted to the dimension between the bottom surface SB and the bottom surface SB of D2. From the lead frame L
Even if the drooping dimension of F is set roughly, the drooping dimension can be adjusted by the deformation of the lead frame LF itself, so that the lead frame can be easily formed at low cost.

Embodiment 3

FIGS. 9, 10, 11 and 12 show a method of manufacturing a hollow plastic package according to a third embodiment of the present invention. In this embodiment, the drooping tip of the lead frame LF in the second embodiment is
While resin molding was performed in a state where the lower mold D2 was bent substantially horizontally toward the center of the package above the bottom SB of the lower mold D2 and was almost horizontally in contact with the bottom SB of the lower mold D2 at an elevation angle of 0 °,
Connect the tip of the lead frame LF to the bottom surface S of the lower mold D2.
The resin molding is performed in a state where it is bent toward the center of the package above B and is in surface contact with the bottom surface SB of the lower mold D2 at a predetermined elevation angle.

According to the method of this embodiment, as in the second embodiment, even if the drooping dimension of the lead frame LF is roughly set, the drooping dimension can be adjusted by deformation of the lead frame LF itself, so that the lead frame can be easily formed. It can be cheaper.

[0015]

Fourth Embodiment FIGS. 13 and 14 show a method of manufacturing a hollow plastic package according to a fourth embodiment of the present invention. In this embodiment, in the third embodiment described above, the hanging tip of the lead frame LF is bent toward the center of the package above the bottom SB of the lower mold D2, and is formed at a predetermined elevation angle with respect to the bottom SB of the lower mold D2. While the resin molding was performed in the contact state, the tip of the hanging portion of the lead frame LF was bent outward of the package above the bottom surface SB of the lower mold D2, and was formed at a predetermined elevation angle with respect to the bottom surface SB of the lower mold D2. Resin molding is performed in a state of surface contact.

According to the method of the present embodiment, the drooping dimension of the lead frame LF can be adjusted by the deformation of the lead frame LF itself even if the drooping dimension of the lead frame LF is roughly set as in the second and third embodiments. Can be easily and inexpensively formed.

[0017]

According to the present invention, there is provided a method of manufacturing a hollow plastic package for molding a chip mounting portion in a hollow manner, that is, in which an inner lead is lowered downward from an inner lead contact surface of a mold having a convex portion forming a hollow portion. A method of manufacturing a hollow plastic package, wherein resin molding is performed in a state of reaching a mold bottom on a side where a hollow portion is not formed, or a mold inner having a convex portion in which an inner lead forms a hollow portion. A method of manufacturing a hollow plastic package, wherein a resin mold is performed in a state in which the mold is suspended substantially perpendicularly and downward from a lead contact surface and reaches a mold bottom surface on a side where a hollow portion is not formed, or the inner lead is hollow. The package that hangs down from the inner lead contact surface of the mold that has the convex portion that forms the The center side direction or the outer direction of the di,
The method of manufacturing a hollow plastic package according to the prior art uses a method of manufacturing a hollow plastic package, which is characterized by contacting a bottom surface of a mold that is bent and does not form a hollow portion at an elevation angle of 0 to 90 degrees. The inner lead hangs down due to the defect that occurred, the weight of the lead or the downward pressure of the flowing resin, and the tip does not adhere to the contact surface of the upper mold. In addition to the inconvenience that the resin enters between the leads and is molded in a state where the leads are not exposed in the hollow part as a result, and the sagging due to the weight of the inner lead, the lead is held down by the upper and lower molds, In some cases, misalignment of the mold may occur, and the misalignment may cause stress to be transmitted to the inner lead, causing distortion. , Can not maintain horizontal, the tip does not come into close contact with the contact surface of the upper mold, and when the resin is filled in that state, the resin enters between the contact surface and the lead as in the above case, As a result, there is no problem that the leads are molded in a state where the leads are not exposed to the hollow portion. Therefore, in the hollow package obtained by the method for manufacturing a hollow plastic package according to the present invention, all the leads are exposed to the exposed surface of the hollow portion. .

[0018]

[Brief description of the drawings]

Fig. 1 External view of hollow plastic package

FIG. 2 is an explanatory view of a method of manufacturing a hollow plastic package according to a conventional technique.

FIG. 3 is a partial perspective plan view of a hollow plastic package.

FIG. 4 is an explanatory view of a method of manufacturing a hollow plastic package according to a conventional technique.

FIG. 5 is an explanatory diagram of a method for manufacturing a hollow plastic package according to Embodiment 1 of the present invention.

FIG. 6 is an explanatory diagram of a method for manufacturing a hollow plastic package according to the first embodiment of the present invention.

FIG. 7 is an explanatory view of a method of manufacturing a hollow plastic package according to Embodiment 2 of the present invention.

FIG. 8 is an explanatory diagram of a method for manufacturing a hollow plastic package according to Embodiment 2 of the present invention.

FIG. 9 is an explanatory view of a method of manufacturing a hollow plastic package according to Embodiment 3 of the present invention.

FIG. 10 is an explanatory view of a method for manufacturing a hollow plastic package according to Embodiment 3 of the present invention.

FIG. 11 is an explanatory view of a method of manufacturing a hollow plastic package according to Embodiment 3 of the present invention.

FIG. 12 is an explanatory view of a method for manufacturing a hollow plastic package according to Embodiment 3 of the present invention.

FIG. 13 is an illustration of a method for manufacturing a hollow plastic package according to Embodiment 4 of the present invention.

FIG. 14 is an explanatory diagram of a method for manufacturing a hollow plastic package according to Embodiment 4 of the present invention.

[Explanation of symbols]

 PKG ... hollow plastic package L ... lead L1 ... lead L2 ... lead L3 ... lead L4 ... lead S1 ... upper outer lead gripping surface S2 ... upper lead contact surface S3 ... L4 lead gripping surface D1 ... upper die D2 ... lower Mold C1 Upper mold cavity C2 Lower mold cavity R Thermosetting resin LF Lead frame 1 Lead 2 Hollow 3 Pot 4 Plunger 5 Runner 6 Projection

Claims (6)

[Claims] 1. A hollow plastic package for molding a chip mounting portion into a hollow, wherein an inner lead hangs downward from an inner lead contact surface of a mold having a convex portion forming a hollow portion to form a hollow portion. A hollow plastic package that reaches the bottom of the mold on the side that does not. 2. A hollow plastic package for molding a chip mounting portion into a hollow, wherein an inner lead hangs substantially perpendicularly downward from an inner lead contact surface of a mold having a convex portion forming a hollow portion. A hollow plastic package which reaches the bottom of the mold on the side where no part is formed. 3. A hollow plastic package for molding a chip mounting portion into a hollow, wherein an inner lead hangs downward from an inner lead contact surface of a mold having a convex portion forming a hollow portion, and the hollow portion is formed. A hollow plastic which is bent at the upper portion of the bottom surface of the mold on the side where the mold is not formed and toward the center or outside of the package and contacts the bottom surface of the mold where the hollow portion is not formed at an angle of 0 to 90 degrees in elevation. package. 4. A method of manufacturing a hollow plastic package for molding a chip mounting portion into a hollow, wherein an inner lead is suspended downward from an inner lead contact surface of a mold having a convex portion forming a hollow portion. A method of manufacturing a hollow plastic package, wherein resin molding is performed in a state where the mold reaches a bottom surface of a mold on which a part is not formed. 5. A method of manufacturing a hollow plastic package in which a chip mounting portion is molded into a hollow, wherein an inner lead hangs substantially perpendicularly and downward from an inner lead contact surface of a mold having a convex portion forming a hollow portion. And performing resin molding in a state where the mold reaches the bottom of the mold on the side where no hollow portion is formed. 6. A method of manufacturing a hollow plastic package in which a chip mounting portion is molded into a hollow, wherein an inner lead hangs downward from an inner lead contact surface of a mold having a convex portion forming a hollow portion, It is characterized by contacting the mold bottom at the upper part of the mold bottom side where the hollow portion is not formed and toward the center side or the outside direction of the package at an angle of elevation of 0 ° to 90 ° with the mold bottom side where the hollow portion is not formed. Manufacturing method of hollow plastic package.