JP2000343392A - Chamfering device for board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To save space and reduce a tact time by setting the dimension of a grinding wheel, such that there is no need for sliding the grinding wheel or a substrate in chamfering, and connecting or moving the grinding wheel directly to or close to a rotation driving mechanism. SOLUTION: A chamfering device includes a disc grinding wheel 1 capable of chamfering the ridge line of a substrate 12 to be chamfered at a time, a substrate holder 4 for moving the ridge line 12a of the substrate 12 close to or away from the grinding wheel and a motor 2 connected or moved directly to or close to the grinding wheel 1. The grinding wheel 1 is installed in horizontal, the substrate holding part 4 is pivotally mounted on a support 6 installed near the grinding wheel in a rocking manner and has a substrate holding stage 7 capable of pushing the ridge line of the substrate 1 against the upper face of the grinding wheel, and a stopper 10 is provided for stopping the rocking of the substrate holding plane of the stage 7 in contact therewith.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display,
The present invention relates to a chamfering device for chamfering a glass substrate such as a display device and a plasma display device.

[0002]

2. Description of the Related Art In a series of manufacturing processes of a liquid crystal display device, an EL display device, a plasma display device, and the like, a process of cutting a glass substrate on which an electrode pattern is formed into predetermined dimensions by cutting is provided. The ridgeline part of the later glass substrate forms a sharp edge and is dangerous,
For example, as shown in Japanese Patent Application Laid-Open No. 4-278917, a ridge is chamfered.

[0003] The chamfering is performed by an automatic machine or a manual machine. In each case, the glass substrates are taken out one by one from a storage cassette, and are put into a polishing section to be chamfered. Has repeatedly chamfered a plurality of glass substrates by repeating the operation of inserting the glass substrates into the storage cassette. As the chamfering device constituting the polishing section, there are a chamfering device for a disk-type grindstone and a chamfering device for a rotating belt type.

[0004]

However, in the disk-type grinding wheel chamfering device, since the grinding wheel is smaller than the substrate, either the grinding wheel or the substrate must be slid in the direction of chamfering. A unit was required, and the device had to be enlarged.

On the other hand, the rotating belt type chamfering apparatus performs chamfering by bringing one side of the substrate into contact with the endless belt at one time. However, since the endless belt is inclined by the chamfering angle and covers the substrate holding stage. Therefore, the slide stroke from the position where the substrate is supplied to the position where the substrate is brought into contact with the belt has to be lengthened, and the endless belt is connected to the motor via a connecting member, and is not directly connected, so the same as above. The device had to be enlarged.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is intended to set the dimensions of the grinding stone so that it is not necessary to slide the grinding stone or the substrate at the time of chamfering. It is an object of the present invention to save space and shorten tact time by directly connecting or providing a drive mechanism.

[0007]

The present invention has the following configuration to achieve the above object. The invention of claim 1 is
A disk-shaped polishing member capable of chamfering a ridge portion of a substrate to be chamfered at a time, a substrate holding portion for moving the ridge portion of the substrate closer to or away from the polishing member, and directly connected to or adjacent to the polishing member And a rotary drive mechanism.

According to a second aspect of the present invention, the substrate holding portion is swingably provided on a support portion provided near the polishing member.
And a stopper for stopping the swing by contacting the substrate holding surface of the substrate holding stage with the substrate holding stage capable of pressing the ridge portion of the substrate against the polishing member. It is a substrate chamfering apparatus as described in the above.

According to a third aspect of the present invention, the substrate holding portion is slidably provided on a support portion provided near the polishing member.
And a substrate holding stage capable of inclining the substrate with respect to the polishing member and pressing a ridge portion thereof against the polishing member, and further comprising a drive unit for reciprocating the substrate holding stage. 1 is a substrate chamfering apparatus.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a substrate chamfering apparatus according to the present invention will be described with reference to the drawings. FIGS. 1 and 2 show a first embodiment, in which a grinding wheel 1 is formed of a donut-shaped disk, is set horizontally so that its axis is directed vertically, and a motor 2 for rotational driving is provided.
Is directly connected to the center hole of the grinding wheel 1.
Note that the motor 2 may be connected to the grinding wheel 1 via a driving gear or the like in a close state. The radius of the disk-shaped or donut-shaped polishing portion 1a forming the upper surface of the whetstone 2 is equal to the radius of the glass substrate 1 described later.
2 is set larger than the long side. In FIG. 2, the radius of the grindstone 1 is smaller than the long side of the glass substrate 12, but this is for the case where only the short side is chamfered. As the grindstone 1, a polishing material in which abrasive grains are fixed to a diamond grindstone, cloth, paper, or the like with an adhesive or the like is used.

Reference numeral 4 denotes an oscillating substrate holder 4 for holding the glass substrate for polishing the glass substrate with the grindstone 1. The oscillating substrate holding unit 4 includes a base plate 5 provided above the side of the grindstone 1, a support base 6 fixed to the base plate 5 in an upright state, and penetrating engagement near the upper part of the support base 6. A supporting shaft 8B rotatably mounted on the shaft 8 and having the other end fixed to one end of a substrate holding stage 7, which will be described later, and fixed to the supporting portion 8B. And a plate-like substrate holding stage 7 to which a positioning plate 9 is fixedly attached to the distal end with the base side as the base end.

Reference numeral 10 denotes a pair of columnar stoppers 10 (one is not shown) on both sides near the end of the grindstone 1 on the base plate 5 in the direction of the center.
By stopping the swinging of the substrate holding stage 7 in the counterclockwise direction by contacting the substrate holding surface 7a, the amount of contact between the glass substrate 12 and the polishing portion 1a of the grindstone 1 is limited. The tip of the stopper 10 has a gauge 11 that can be adjusted to expand and contract in order to control the amount of contact between the glass substrate 12 and the polishing section 1a.
Is provided. Therefore, by adjusting the expansion and contraction of the gauge 11, the contact amount and the angle of the glass substrate 12 with respect to the polishing section 1a are changed, and the desired chamfer amount and chamfer angle can be adjusted. Further, by adjusting the expansion and contraction of each gauge 11, one side of the glass substrate 12 is supported in parallel with the polishing portion 1a, so that oblique chamfering can be prevented.

Reference numeral 12 denotes a glass substrate constituting a liquid crystal panel, which is formed of two rectangular glass plates and is held on the substrate holding surface 7a of the stage 7. The method of holding the glass substrate 12 on the stage 7 is performed by vacuum suction as shown in FIG. That is, in the inside of the substrate holding stage 7 having a predetermined thickness, a plurality of rows of vertical holes 13 closing one end are formed at predetermined intervals in parallel with the ridge line portion of the glass substrate 12 which is the portion to be polished. Vertical hole 13 from holding surface 7a
A plurality of suction holes 14 communicating with the vertical holes 13 are formed for each vertical hole 13. Further, a pipe 15 is connected to the opening of each vertical hole 13 via a switching cock 16 so as to be closed at the end, and connected to a vacuum source (not shown). , Suction hole 1 selected by switching cock 16
By generating an attraction force by 4, the glass substrate 12 on the substrate holding surface 7 a is attracted and held at a predetermined position. The changeover of a different substrate size is performed by the switching cock 16 using the suction hole 1.
This is done by selecting 4. At this time, by making the row of the suction holes 14 shorter than the shortest side substrate of the vertical hole 13 used individually, it is possible to cope with the maximum substrate.

The substrate holding surface 7 of the substrate holding stage 7
A handle 17 for an operator to operate the substrate holding stage 7 is provided on the back side of “a”. Reference numeral 18 denotes a cooling nozzle for supplying water or a coolant to the grindstone 1 and the glass substrate 12.

Next, the operation of the present embodiment will be described.
In order to hold the glass substrate 12 on the substrate holding stage 7, the substrate holding surface 7a of the substrate holding stage 7 is turned upward as shown by a broken line in FIG. After the (polished side) is brought into contact with the positioning plate 9, the glass substrate 12 is vacuum-sucked. Then, the substrate holding stage 7 is held by the handle 17 with the shaft 8.
, The ridge 12a of the glass substrate 12 is pressed against the polishing portion 1a of the upper surface of the rotating grindstone 1 to perform polishing.
The entire area of one side (ridge 12a) is chamfered.

After a predetermined amount of chamfering, the substrate holding surface 7a of the substrate holding stage 7
1 and stops swinging, and the chamfering of the entire side is completed. In addition, since the stopper 10 is provided in a pair in the left-right direction to prevent the substrate holding stage 7 from tilting, uniform chamfering is possible. Further, when the whetstone is unevenly worn, it is possible to perform uniform chamfering by adjusting the left and right of the stopper 10.

The configuration of the tip of the stopper 10 is as follows.
For example, by providing a sensor on the base end side of the gauge 11, the amount of contact between the glass substrate 12 and the polishing section 1a can be controlled more accurately. Further, it is also possible to provide a cylinder capable of controlling the amount of rotation on the shaft 8 and stop the operation of the cylinder or stop the rotation of the motor 2 according to a sensor signal of the stopper 10 to end the chamfering.

In FIG. 2, one of the left and right halves of the polishing section 1a is used, but the other area may be used. In this selection, it is necessary to take into consideration that the glass substrate 12 is not damaged even if the glass substrate 12 is broken or scattered off the substrate holding stage 7.

In the case of chamfering a thread, or in the case where the substrate is prevented from being scattered by a safety cover or the like, the chamfering can be performed at the longest chamferable portion A extending over the left and right portions of the polishing portion 1a of the grindstone 1. And a larger glass substrate can be chamfered. It is also possible to provide stages 7 on both left and right sides of the grindstone 1 and perform chamfering alternately on the left and right. The chamfering of each side can be performed by releasing the vacuum suction and changing the direction of the substrate. Similarly, the upper and lower surfaces can be chamfered by changing the vertical direction of the substrate. Furthermore, the suction hole 1
By making the formation region of 4 smaller than the area of the minimum glass substrate, it is possible to correspond to the maximum glass substrate.

Next, a second embodiment will be described with reference to FIG. Note that the same parts as those described above are denoted by the same reference numerals, and description thereof will be omitted. In the first embodiment, the swinging type substrate holding unit 4 is used for detaching / attaching the glass substrate to / from the whetstone 1. In the present embodiment, a reciprocating type substrate holding unit is used in order to make the apparatus compact. Things.

As shown in FIG. 3, the substrate holding stage 20 is tilted forward with respect to the base plate 5 and supported slidably (reciprocally) on a support base 6 having a predetermined width. The piston rod 22 of the slide cylinder 21 supported on the support base 6 in parallel with the
It is connected to the lower surface of the stage 20 via 2a. Also,
The positioning plate 23 is fixed to one end of a lever 24 rotatably supported by the shaft 8 a on the base plate 5, and the other end 24 a of the lever 24 engages with the rod tip 22 a of the piston rod 22. I have.

Next, the operation will be described. When the piston rod 22 is in a contracted state, the positioning plate 23 is located on the front end side of the substrate holding stage 20 and is used for positioning the front end of the glass substrate 12. The glass substrate 12 is positioned by the positioning plate 23 and sucked by the suction means 13 to the substrate holding stage 20.
After holding by 15 etc. (see FIG. 2), the piston rod 22 is extended. As a result, the substrate holding stage 20 to which the piston rod 22 is connected approaches the grindstone 1 while sliding on the support base 6, and presses the end 24 a of the lever 24 to be engaged. 23 rises. Therefore, the glass substrate 12 moves forward with the rise of the positioning plate 23, presses the grindstone 1 at a predetermined angle, and becomes polished. The amount of polishing is adjusted by adjusting the extension of the piston rod 22,
Alternatively, it can be determined in advance by adjusting the mounting position of the slide cylinder 21, and the stopper 10 shown in the first embodiment becomes unnecessary. As described above, since the positioning plate 23 rises at the time of chamfering and the movement of the glass substrate 12 becomes linear,
The positional relationship between the glass substrate 12 and the grindstone 1 can be set to the shortest distance.

Next, a third embodiment will be described with reference to FIG. Note that the same parts as those described above are denoted by the same reference numerals, and description thereof will be omitted. In the second embodiment, the case where the grindstone 1 is made parallel and the glass substrate 12 is inclined to approach is described. However, in the present embodiment, the glass substrate 12 is made parallel and approachable by inclining the grindstone 1 in reverse. Things.

The grindstone 1 is inclined according to the chamfer angle,
The substrate holding stage 25 is capable of reciprocating in a horizontal state below the grindstone 1 and in parallel with a horizontally provided base plate 5. More specifically, the distal end portion 22 of the piston rod 22 of the slide cylinder 26 fixed to the support 6 provided upright on the base plate 5 with the longitudinal direction directed toward the grindstone 1.
a is fixed to the lower surface of the substrate holding stage 25, and the stage 25 slidably engaged with the support base 6 moves back and forth by the expansion and contraction of the piston rod 22.

Accordingly, the tip of the glass substrate 12 placed on the substrate holding stage 25 is aligned with the positioning plate 9 and is sucked by the control of suction means 13 to 15 (not shown) (see FIG. 2) to extend the piston rod 22. Then, the substrate holding stage 25 advances along with this, and the ridge portion of the tip of the glass substrate 12 is moved by a predetermined amount at a time by the polishing portion 1a of the grindstone 1.
Can be polished to an angle.

In the third embodiment, the base plate 5 is set in a horizontal state, and the grindstone 1 is provided diagonally above the base plate 5 to form a predetermined angle between the glass substrate 12 and the polishing portion 1a. The same effect can be obtained by making both the base plate 5 and the grindstone 1 stand vertically and making the glass substrate 12 attachable to and detachable from the grindstone 1 at an angle.

[0027]

According to the first to third aspects of the present invention,
Since the radius of the polishing member is set to a dimension that can bevel the edge line portion of the substrate at a time, for example, a dimension larger than the short side of the substrate, there is no need to slide the polishing member or the substrate in the chamfering direction, thereby saving. Space can be provided. Further, since the rotary drive mechanism is directly connected to or brought close to the polishing member, no extra space is required, and further space saving can be achieved in combination with the above. Furthermore, since it is not necessary to slide the polishing member or the substrate in the chamfering direction at the time of chamfering, tact time can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing a first embodiment of a substrate chamfering apparatus according to the present invention.

FIG. 2 is a schematic plan view of FIG.

FIG. 3 is a schematic side view showing a second embodiment of the substrate chamfering apparatus according to the present invention.

FIG. 4 is a schematic side view showing a third embodiment of the substrate chamfering apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Whetstone 1a Polishing part 2 Motor 4 Substrate holding part 7 Substrate holding stage 7a Substrate holding surface 10 Stopper 12 Glass substrate 12a Ridge part 21, 26 Cylinder

Claims (3)

[Claims] 1. A disk-shaped polishing member capable of chamfering a ridge portion of a substrate to be chamfered at a time, a substrate holding portion for moving the ridge portion of the substrate toward and away from the polishing member; A chamfering apparatus for a substrate, comprising: a rotary drive mechanism directly connected to or close to a member. 2. The method according to claim 1, wherein the substrate holding section is provided on a supporting section provided near the polishing member so as to be swingable, and has a substrate holding stage capable of pressing a ridge portion of the substrate against the polishing member. 2. The substrate chamfering apparatus according to claim 1, further comprising a stopper that abuts on the substrate holding surface of the substrate holding stage to stop the swing. 3. The substrate holding portion is slidably provided on a support portion provided near a polishing member, and is capable of inclining the substrate with respect to the polishing member and pressing the ridge portion thereof against the polishing member. 2. The apparatus for chamfering a substrate according to claim 1, further comprising a substrate holding stage, and a driving unit for reciprocating the substrate holding stage.