JP2000331611A - Thick film pattern composition, application composition for forming thick film pattern, and plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the smoothness of the top of barrier ribs and enhance the strength of the barrier ribs to prevent the breakage of the barrier rib in its sealing by forming a panel from an upper layer and lower layer having different compositions, and setting the relation between the softening point of the lower composition and the softening point of the upper layer composition to a specified condition. SOLUTION: A thick film pattern (barrier rib) composition is formed by laminating an upper layer composition and lower layer composition having different components. Both the compositions comprise glass frit forming a fusing base body, and aggregates and pigments to be contained as occasion demands. When the softening point of the lower layer composition it Ts1, and the softening point of the upper layer composition is Ts2, each component of the upper layer composition and lower layer compositor is set so that the relation between the both satisfies the condition of 3 deg.C<=Ts1-Ts2<=25 deg.C, more desirably, 7 deg.C<=Ts1-Ts2<= deg.C. When the thickness of the lower layer composition is h1, and the thickness of the upper layer composition is h2, the both preferably satisfy the condition of 0.04<=(h2/(h1+h2))<=0.4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film pattern composition, a coating composition for forming a thick film pattern, and a plasma display panel, and more particularly to a self-luminous type flat display panel using gas discharge. The present invention relates to a thick film pattern composition used and a plasma display panel using the thick film pattern composition.

[0002]

2. Description of the Related Art A plasma display panel (PDP), which is a gas discharge panel, is provided with a pair of electrodes regularly arranged on two opposing glass substrates, and mainly comprises Ne, He, Xe, etc. therebetween. It has a structure in which a rare gas is sealed. Then, a voltage is applied between these electrodes, and a discharge is generated in minute cells around the electrodes, so that each cell emits light and display is performed.
In order to display information, regularly arranged cells are selectively caused to emit light. There are two types of PDPs, a direct current type (DC type) in which the electrodes are exposed to the discharge space, and an alternating current type (AC type) in which the electrodes are covered with an insulating layer. And a refresh driving method and a memory driving method.

In a DC PDP and an AC PDP, each cell is formed by holding two glass substrates facing each other by partition walls. Such a partition, in order to obtain a high-luminance light emission by making the display discharge space as large as possible,
It is required to be perpendicular to the glass substrate and to have a small width and a sufficient height. Especially high definition PD
In P, for example, the width is 30 to 5 with respect to the height of 100 μm.
A partition having a high aspect ratio of 0 μm is required.

Conventionally, partition walls in PDPs are made of a composition comprising glass frit, amorphous alumina, zircon, zirconia, etc., a colorant and ethyl cellulose, acrylic resin which disappears by firing, terpineol, butyl carbitol, etc. A method of printing and drying a paste obtained by kneading an organic vehicle dissolved in a solvent with a three roll or the like in a pattern by screen printing until a desired height is obtained, and baking, or screen printing, blade coating, die coating, etc. After forming a solid film by coating and drying, a mask having sand blast resistance is formed in a pattern on the solid film, sand blasting is performed, the mask is peeled off, and then fired.

[0005] The space between the partitions formed on the back plate (one glass substrate) is filled with a phosphor, and then the phosphor is overlapped with the front plate (the other glass substrate) and sealed. Is done. At the time of the sealing, the top of the partition and the front plate come into close contact with each other and pressure is applied to the partition, so that the partition is required to have high strength. Further, in order to improve the adhesion at the time of sealing, it is required that the top of the partition wall has no irregularities.

[0006]

However, in the above-mentioned conventional barrier rib composition, unevenness due to the mesh of the screen printing plate remains or the blast mask is peeled off with the barrier composition adhered to the blast mask. A phenomenon such as a depression at the top or a projection at the top of the partition due to insufficient softening of the coarse glass particles present at the top of the partition occurs, and as a result, the strength of the partition is not sufficient, and at the time of panel sealing. There were problems such as breakage of the partition walls, chipping at the top, and poor adhesion during sealing.

[0007] Such a defect of the partition may cause erroneous discharge in an adjacent discharge space or a point defect of light emission due to a piece of the partition remaining on the phosphor.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to improve the smoothness of the top of the partition wall, increase the strength of the partition wall, and prevent breakage during panel sealing. An object of the present invention is to provide a coating composition for forming a thick film pattern which can be formed, and a plasma display panel using the same which is free from erroneous discharge and point defects.

[0009]

In order to solve the above problems, the present invention provides a thick film pattern composition comprising an upper layer composition and a lower layer composition having different compositions, the composition comprising: The upper layer composition includes a glass frit serving as a molten matrix, and an aggregate and a pigment contained as needed.The lower layer composition includes a glass frit serving as a molten matrix, an aggregate, and optionally contained. When the softening point of the lower layer composition is Ts1 and the softening point of the upper layer composition is Ts2, the condition of 3 ° C. ≦ Ts1−Ts2 ≦ 25 ° C. is satisfied.

In a preferred embodiment, when the thickness of the lower layer composition is h 1 and the thickness of the upper layer composition is h 2, the condition of 0.04 ≦ (h 2 / (h 1 + h 2)) ≦ 0.4 is satisfied. Is configured to be satisfied.

In a preferred embodiment, the upper layer composition is composed of a glass frit serving as a molten matrix, and has a thickness h2 of 3 μm ≦ h2 ≦ 20 μm.

Further, the present invention is configured such that a glass frit serving as a molten matrix of a thick film pattern and an aggregate mainly for maintaining the form and strength of the thick film pattern are mixed and dispersed with an organic vehicle. A coating composition for forming a thick film pattern, wherein the average particle diameter (d ₅₀ ) of all particles contained in the coating composition is 0.05 μm ≦ d ₅₀ ≦ 5 μm
, And 20% or less of particles having a particle diameter in the range of 5 to 10 μm among all particles contained in the coating composition.

[0013] The present invention also relates to a coating composition for forming a thick film pattern, wherein the coating composition further contains a pigment for coloring, wherein the average particle of all the particles contained in the coating composition is provided. The diameter (d ₅₀ ) is 0.05 μm ≦ d ₅₀ ≦ 5
of particles having a particle diameter in the range of 5 to 10 μm out of all the particles contained in the coating composition.
% Or less.

In a preferred embodiment, the upper layer composition of the above thick film pattern composition is formed using the above coating composition for forming a thick film pattern, and has a thickness h 2 of 3 μm ≦ h.
It is configured as 2 ≦ 20 μm.

According to the present invention, there is provided a plasma display panel having a partition for partitioning a discharge space, wherein the partition is made of the thick film pattern composition described above.

[0016]

Embodiments of the present invention will be described below in detail.

First, as an example of the thick film pattern composition of the present invention, a composition of a partition wall used in manufacturing a plasma display panel (PDP) will be described. Before describing the composition of the partition wall, the configuration of the entire plasma display panel will be briefly described.

FIG. 1 is a perspective view showing an example of the configuration of an AC type PDP. In this figure, reference numeral 1 denotes a front plate, and reference numeral 2
Is a back plate, 3 is a partition, 4 is a sustain electrode, 5 is a bus electrode, 6 is a dielectric layer, 7 is an MgO layer, 8 is an address electrode, and 9 is a phosphor layer. .

FIG. 1 shows the front panel 1 and the rear panel 2 separated so that the structure of the PDP can be easily understood. As shown in FIG. 1, an AC type PDP has a front plate 1 and a rear plate 2 made of glass plates which face each other in parallel with each other, and a partition wall 3 erected on the rear plate 2 to separate the front plate 1 and the rear plate 2. Are fixed at regular intervals so as to form a sealed cell.

On the back side of the front plate 1, a composite electrode composed of a sustain electrode 4 as a transparent electrode and a bus electrode 5 as a metal electrode is formed in parallel with each other, and a dielectric layer 6 and MgO layers 7 are sequentially formed.

On the front side of the back plate 2, address electrodes 8 are formed in a stripe shape parallel to each other so as to be orthogonal to the composite electrode and located between the partition walls 3.
A phosphor layer 9 is provided on the bottom surface of the cell on the address electrode 8. As shown in the sectional view of FIG. 2, an address electrode 8 is formed after a base layer 10 is formed on the glass substrate 2.
And a dielectric layer 6 ′ is laminated thereon, and then the partition wall 3 and the phosphor layer 9 are provided.

Such an AC type PDP is of a surface discharge type, in which a predetermined voltage is applied from an AC power source between composite electrodes on the front panel 1 to form an electric field, thereby forming the front panel 1, the rear panel 2 and the partition wall. The discharge is performed in each cell as a display element defined by the cells 3 and 3. By causing the phosphors 9 to emit light by the ultraviolet rays generated by the discharge, the light transmitted through the front plate 1 can be visually recognized by the observer.

FIG. 3 shows an example of the configuration of a DC PDP. FIG. 3A is a plan view, FIG.
FIG. 3B is a cross-sectional view taken along line XX in FIG. In the figure, reference numeral 11 denotes a front plate, reference numeral 12 denotes a rear plate, reference numeral 13 denotes a cathode, reference numeral 14 denotes an electrode body, reference numeral 15 denotes a display anode,
Reference numeral 16 denotes a partition wall, reference numeral 17 denotes a discharge cell, reference numeral 18 denotes a terminal portion, reference numeral 19 denotes a resistor, reference numeral 20 denotes an auxiliary electrode, reference numeral 21
Denotes an electrode body, 22 denotes a phosphor layer, and 23 denotes a priming slit.

As shown in FIG. 3, a DC type PDP is
The two glass substrates of the front plate 11 and the rear plate 12 are combined to form a panel, and a first electrode group including a cathode 13 is formed on the front plate 11, and the first electrode group is electrically formed on the rear plate 12. A second electrode group including four connected electrodes and the display anode 15 is formed. The front plate 11 and the back plate 12 are opposed to each other by the partition 16 so that the cathode 13 and the display anode 15 are substantially orthogonal to each other, thereby forming a discharge cell 17. The cathode 13 and the electrode body 14 in the discharge cell 17 form a unit discharge electrode pair.

The display anode 15 includes a linear portion 15a and a protrusion 15b protruding laterally from the linear portion 15a. A terminal portion 18 extends from the electrode body 14 in parallel with the display anode 15. The projection 15 b of the display anode 15 and the terminal 18 of the electrode body 14 are electrically connected by a resistor 19. Further, an auxiliary anode 20 is provided between the adjacent display anodes 15 in parallel with the display anode 15, and an electrode body 21 is provided on the auxiliary anode 20 at a position intersecting with the cathode 13.

In a DC type PDP, a cathode 13 and a display anode 1
5, a current flows through the electrode body 14 through the resistor 19, and the cathode 13 in the discharge cell 17.
A discharge is generated between the electrode body 14 and the electrodes 14, and the ultraviolet rays generated by the discharge cause the phosphor layers 22 of, for example, R, G, B and three colors to emit light. This light emission is radiated to the outside through the front panel 11, and a full-color image display is performed. In this case, the auxiliary anode 18 charges the charged particles serving as a pilot light in the discharge cell 17 with the priming slit 23.
Has the role of supplying through. Reference numeral 24 denotes a dielectric layer, which electrically isolates the display anode 15, the terminal portion 18, the resistor 19, and the auxiliary anode 20 from the discharge space, and limits the discharge generation location to only the electrode members 14 and 21.

The partition wall 3 and the partition wall 16 for the PDP in the present invention (hereinafter, the partition wall 3 will be described as a representative).
Is a method of pattern-printing a coating composition for forming a thick film pattern in a partition shape by screen printing, or screen-printing a coating composition for forming a thick film pattern, blade coating,
After coating with a die coat and drying to form a solid film,
A thick film pattern composition formed by a method in which a mask having sand blast resistance is formed in a pattern on a solid film, sand blasting is performed, the mask is peeled off, and then fired.

The partition 3 (thick film pattern composition) in the present invention is formed by laminating an upper layer composition 35 and a lower layer composition 31 having different compositions from each other as shown in FIG. In the present invention, the “upper layer” refers to a side closer to the front plate 1 side.

The upper layer composition 35 includes a glass frit serving as a molten matrix, and optionally an aggregate and a pigment, and the lower layer composition 31 includes a glass frit serving as a molten matrix and a bone frit. It comprises a material and, if necessary, a pigment to be contained.

In the present invention, when the softening point of the lower layer composition is Ts1 and the softening point of the upper layer composition is Ts2, the relationship between the two is more preferably 3 ° C. ≦ Ts1−Ts2 ≦ 25 ° C. Are set so that the condition of 7 ° C. ≦ Ts1−Ts2 ≦ 20 ° C. is satisfied. When the value of Ts1−Ts2 is 3
If the temperature is lower than 0 ° C., the shape of the partition walls 3 cannot be maintained if the firing temperature is increased in expectation of a leveling effect at the top of the partition walls 3. On the other hand, when the value of Ts1−Ts2 exceeds 25 ° C., the top of the partition wall 3 is excessively melted and the shape of the top cannot be maintained.

In the present invention, the softening point of the glass is defined as the powder frit or the mixed frit of glass, aggregate, and pigment, etc., heated under predetermined conditions by a differential thermal analyzer (TDA). The rate of change (slope) of the temperature difference from the reference due to the change in shape during softening is detected, and the point of change in the slope (bending point) is defined as the softening point.
In other words, in the present invention, before the inorganic component and the organic component (organic vehicle) are mixed to form a coating composition (paste) for forming a thick film pattern, only the inorganic components such as glass frit, aggregate, pigment, etc. are taken out. The softening point is determined by observing the shape change when the frit is softened by the above method. In this regard, the apparent softening point is accurately measured.In order to change the softening point of glass in the present invention, for example, changing the softening point of the glass frit itself, changing the particle size, What is necessary is just to change the content ratio of a material and a pigment.

A specific measuring method is as follows: a high-temperature type TG-DTA TG-8110 type manufactured by Rigaku Corporation, a macro sample holder, and a temperature rising rate in air of 10 ° C./min. The softening point of the frit is measured using a sample amount of 500 mg, alumina as a reference, and a pair of Pt containers for macros manufactured by Rigaku Corporation as a sample container. For reference, FIG. 5 shows a chart in which a glass frit (single substance) having a softening point of 550 ° C. was actually measured. In FIG. 5, points indicated by arrows are softening points according to the present invention.

In the present invention, as shown in FIG. 4, when the thickness of the lower layer composition 31 is h 1 and the thickness of the upper layer composition 35 is h 2, 0.04 ≦ (h 2 / (h
1 + h2)) ≤0.4, more preferably 0.04≤ (h
It is desirable to satisfy the condition of 2 / (h1 + h2)). Ltoreq.0.25. This is because the leveling effect at the top of the partition wall 3 is further enhanced in combination with the setting of the softening point.
Usually, the height h1 + h2 of the partition 3 is 50 to 50.
It is about 250 μm.

Further, the upper layer composition 35 is composed of only a glass frit serving as a molten matrix, and has a thickness h2 of:
Setting 3 μm ≦ h2 ≦ 20 μm is also one of the preferable embodiments for exhibiting the leveling effect. The value of h2 is 20μ
If it exceeds m, the top will drop during firing, and h2
Is less than 3 μm, a sufficient leveling effect cannot be expected.

Further, the lower layer composition 31 is white to increase the luminance efficiency, and the upper layer composition 35 is
Is preferably black in order to increase the contrast. The color adjustment may be performed by adding a pigment or the like.

The glass frit contained in the partition wall 3 for PDP in the present invention serves as a binder (adhesive), and its glass transition point (Tg) is determined by the resin used as a paste in the coating composition. It is desirable that the temperature be equal to or higher than the temperature at which it completely disappears by firing. Further, the softening point of the glass frit must be lower than the temperature at which the glass substrate is deformed. Specifically, Tg is 350 to 50
0 ° C and the softening point are appropriately selected between 400 and 600 ° C.

Further, in order to minimize the residual strain and to suppress the warpage of the substrate and the occurrence of cracks in the dielectric layer, the coefficient of thermal expansion (α) of the glass frit is determined by the thermal expansion coefficient of the glass substrate, the underlying layer, and the dielectric layer. It is necessary to match the coefficient as much as possible.
Therefore, specifically, it is desirable to use those having α = approximately 60 to 90 × 10 ⁻⁷ / ° C. However, since α is changed by adding an aggregate and a coloring agent, the partition wall composition is finally changed. What is necessary is just to select suitably so that (alpha) when it is made into a thing may be about 60-90 * 10 < ^-7 > / degreeC.

Examples of the aggregate contained in the partition wall 3 of the present invention include alumina, silica, zirconia, titanium oxide, magnesia, zircon, mullite, cordierite, silicon carbide, barium titanate, barium zirconate, and glass. Those which are stably present at a temperature equal to or lower than the firing temperature of the partition walls are used.

The aggregate used in the present invention can also have a function as a coloring agent depending on the selection of the material. However, in many cases, coloring is actively required. In that case, the partition 3 contains a pigment (colorant).

The pigment (colorant) has heat resistance
Is used. In the case of the present invention, firing during the substrate manufacturing process is performed.
What is necessary is that it has heat resistance higher than the formation temperature. With such colorants
As a composite oxide pigment (Cr, Co, Ni, Fe,
Mn, Cu, Sb, As, Bi, Ti, Cd, Al, C
from oxides of two or more metals such as a, Si, Mg, Ba
Pigment), titanium oxide, alumina, zircon, zircon
Near, silica, magnesia, lead titanate, potassium titanate
, Cadmium sulfate selenide, red iron oxide (Fe₂O ₃ ),
Cuprous oxide, cadmium mercury red (CdS + HgS), black
Mver million, silver vermilion, antimony red iodine red, zinc
Iron red, molybdenum red, lead red, cadmium red
De, chrome green, zinc green, cobalt green, oxidation
Chrome, viridian, emerald green ultramarine, navy blue,
Cobalt blue, Cerulean blue, copper sulfide, titanium alloy
Yellow, titanium black, black iron oxide (Fe₃O
₄ ), Yellow iron oxide, cadmium yellow, yellow lead, etc.
These may be appropriately selected and used according to the purpose.
No.

The composition of the partition wall 3 described above contains 40 to 95%, preferably 60 to 90% of glass frit; 1 to 60%, preferably 5 to 30% of aggregate;
It is preferable to configure the range of 0%. A coating composition for forming a thick film pattern containing these is mixed with an organic vehicle, kneaded and dispersed by a three-roll mill, a bead mill, or the like to obtain a paste-like coating composition.

Examples of the organic vehicle resin used herein include cellulose derivatives such as ethylcellulose, hydroxypropylcellulose, methylcellulose and nitrocellulose, polyester resins such as polyacrylester and alkyd resin, acrylic acid, methacrylic acid, itaconic acid and maleic acid. Acid, fumaric acid, crotonic acid, vinyl acetic acid, methyl methacrylate, methyl acrylate, ethyl acrylate, ethyl methacrylate, propyl methacrylate, propyl acrylate, n-butyl methacrylate, isobutyl methacrylate, 2-ethylhexyl methacrylate, 2-hexyl acrylate, lauryl methacrylate, Lauryl acrylate, stearyl methacrylate, stearyl acrylate, dodecyl methacrylate, dode Acrylate, hexyl methacrylate, hexyl acrylate, octyl methacrylate, octyl acrylate, cetyl methacrylate, cetyl acrylate, nonyl methacrylate, nonyl acrylate, decyl methacrylate, decyl acrylate, cyclohexyl methacrylate, cyclohexyl acrylate, glycidyl methacrylate, dimethylaminoethyl methacrylate, 2-methoxy Acrylate, 2 (2-ethoxyethoxy) ethyl acrylate,
2-hydroxyethyl methacrylate, diacetone acrylamide, N, N-dimethylaminopropylacrylamide, N, N-diethylacrylamide, isopropylacrylamide, diethylaminoethyl methacrylate, t-butyl methacrylate, N, N-dimethylacrylamide, α-methylstyrene, Homopolymers composed of monomers such as styrene, vinyltoluene and N-vinyl-2-pyrrolidone, and copolymers composed of two or more monomers selected from the above monomers, ethylene-acrylic acid copolymers, ethylene-methacrylic acid copolymers Examples thereof include polymers, polyolefin-based resins such as ethylene-vinyl acetate copolymer, polyvinyl formal, polyvinyl butyral, and the like.

Examples of the solvent include terpenes such as α-, β- and γ-terpineol, ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, diethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, and ethylene glycol monoalkyl. Ether acetates, ethylene glycol dialkyl ether acetates, diethylene glycol monoalkyl ether acetates, diethylene glycol dialkyl ether acetates, propylene glycol monoalkyl ethers,
Examples include propylene glycol dialkyl ethers, propylene glycol monoalkyl ether acetates, propylene glycol dialkyl ether acetates, alcohols such as methanol, ethanol, isopropanol, 2-ethylhexanol, 1-butoxy-2-propanol, and the like. You may use individually or in mixture of 2 or more types.

Further, a plasticizer, an anti-settling agent, a dispersant and the like can be used as needed.

As described above, the coating composition (paste) for forming a thick film pattern comprises a glass frit serving as a molten matrix of the thick film pattern and an aggregate mainly for maintaining the shape and strength of the thick film pattern. It is composed by mixing and dispersing with an organic vehicle.

Therefore, the coating composition contains various kinds of particles having various particle diameters. As an example of a preferable coating composition (paste) for forming a thick film pattern according to the present invention, the coating composition contains Average particle size (d ₅₀ ) of all particles
0.05 μm ≦ d ₅₀ ≦ 5 μm, preferably 0.1 μm
m ≦ d ₅₀ ≦ 4 μm, and particles having a particle diameter in the range of 5 to 10 μm out of all particles contained in the coating composition are 20% (number%) or less, particularly 0 to 10% ,
More preferably, those constituted so as to be contained at 0 to 5% can be mentioned. The average particle size (d ₅₀ ) is determined as described above in order to improve the smoothness and denseness of the fired surface, improve defects such as chipping, and maintain strength. If the ratio is out of the above range, the smoothness and denseness after firing deteriorate, the number of chips increases, and the strength decreases.

If the particle diameter in the range of 5 to 10 μm exceeds 20% of all the particles, it is not possible to reduce the occurrence of unevenness at the top of the partition wall, and the partition wall is damaged or chipped at the time of panel sealing. Often occur. Such a coating composition (paste) having a limited particle diameter range can be formed as a thick film pattern composition 3 having a uniform composition by appropriately selecting the firing temperature, but is more preferably. It is desirable to use it as a coating composition (paste) for forming only the upper layer composition 35 (FIG. 4). In this case, the thickness h2 of the upper layer composition 35 is set to 3 μm ≦ h
It is preferable to set the range of 2 ≦ 20 μm.

Next, a brief description will be given of a method of manufacturing a back plate having the partition walls 3 with reference to FIG. First, the address electrodes 8 are patterned on the glass substrate 2.

The electrode 8 can be formed by (1) a method of combining a thin film forming process such as a sputtering method or a vacuum deposition method with a photo process, (2) a method of pattern printing by a screen printing method, (3) a screen printing method, or the like. Examples include a method of combining a coating method such as blade coating, die coating, roll coating, and reverse coating with a photo process. As a photo process, there is a method in which a photoresist is applied and dried, and then patterned by an exposure and development process, or a method in which a photoresist is similarly patterned using a dry film resist. The electrode thickness may be, for example, Cr as an electrode material.
When the film is formed by sputtering using
An electrode is formed by patterning the formed Cr thin film using a photoresist. The electrode material and the patterning method are not necessarily limited to these methods.

After the address electrodes 8 having a predetermined pattern are formed by using any of the above methods, the partition walls 3 are formed.
As described above, the partition wall 3 is formed by using the coating composition for forming a thick film pattern, as described above, by performing pattern printing on the partition wall by screen printing, or after forming a solid film by screen printing, blade coating, die coating, or the like. ,
An example is a method in which a mask having sandblast resistance is formed in a pattern on a solid film, and an unnecessary portion of a partition wall forming material is removed by sandblasting to form a predetermined partition wall shape. Furthermore, a method of coating a paste on a film in advance, laminating the paste on a substrate, and similarly performing a sandblasting process is also exemplified. After forming the partition by any of the above methods, baking is performed to obtain a predetermined partition 3. The height of the partition wall 3 to be formed is about 50 μm to 250 μm.

In the PDP as shown in FIG. 2, the base layer 10 and the dielectric layer 6 'are formed using a paste mainly composed of glass frit having a softening point not lower than the baking temperature of the partition wall 3. The film thickness is 1 μm
About 50 μm.

This manufacturing method can of course be applied to the DC type PDP shown in FIG.

[0053]

The present invention will be described in more detail with reference to specific examples below. In the examples, "parts" refers to parts by weight,
“%” Indicates “% by weight”.

(Example 1)

Preparation of frit mixture

A frit mixture was prepared in the following manner.

Upper layer composition 35 , glass frit (main components PbO, SiO ₂ , B ₂ O ₃ ; alkali-free; d ₅₀ = 1.5 μm; Ts = 547 ° C .; coefficient of thermal expansion 75 × 10 ⁻⁷ / ° C .; glass) transition point 450 ° C.) ... 75 parts aggregate (EP zirconium (Daiichi Kigenso Kagaku Kogyo Co., _{Ltd., d 50 = 1μm)) ...} 15 parts pigment (die Piroki side black # 9510 (Dainichiseika Color & chemicals Mfg. Co. )) ... 10 parts of the lower layer composition 31 glass frit (the main component _{PbO, SiO 2, B 2 O} 3; _{alkali-free; d 50 = 1.5μm; Ts =} 560 ℃; thermal expansion coefficient of 72 × ^{10 -7} / ° C. ; glass transition point 458 ° C.) ... 75 parts aggregate (EP zirconium (Daiichi Kigenso Kagaku Kogyo Co., _{Ltd., d 50 = 1μm)) ...} 15 parts pigment (die Piroki side black # 9510 (Dainichiseika Industrial ) ... 10 parts

The above upper layer composition 35 and lower layer composition 31
Were individually placed in a container made of a fluororesin, and mixed for 15 minutes by a paint conditioner RC-5000 (manufactured by Red Devil Co., Ltd.) to prepare frit mixtures for the upper layer and the lower layer.

Next, a high temperature type TG-D manufactured by Rigaku Corporation
Using a TA TG-8110 type macro sample holder, the temperature was raised in air at a rate of 10 ° C./min. , Sample volume 50
The softening point Ts1 of the lower layer composition and the softening point Ts2 of the upper layer composition were measured using 0 mg, alumina as a reference, and a pair of Pt containers for macros manufactured by Rigaku Corporation as a sample container. The value of Ts1-Ts2 was determined. As a result, a value of Ts1-Ts2 = 15 ° C was obtained.

Coating composition (paste) for forming barrier ribs
Production of

Next, the following additives were added to the frit mixture in the following manner to prepare a coating composition (paste) for forming partition walls. -The above frit mixture ... 80 parts-Ethocel STD-100FP (manufactured by Dow Chemical Company) ... 2 parts-Diethylene glycol monobutyl ether acetate (manufactured by Junsei Chemical) ... 9 parts-Screen oil 759 (manufactured by Okuno Pharmaceutical) ... 9 parts

After these were uniformly mixed, the mixture was kneaded with a three-roll mill (C-4.3 / 4 × 10, manufactured by Inoue Seisakusho) to produce a paste.

The average particle diameter (d ₅₀ ) of all the particles contained in the paste and the content ratio of the particle diameter in the range of 10 to 20 μm of the total particles contained in the paste were measured. Average particle diameter (d ₅₀ ) = 1 μ
m, content ratio of particle diameter in the range of 5 to 10 μm = 1%; average particle diameter (d ₅₀ ) of lower layer paste = 1 μm, 5-1
The content ratio of the particle diameter in the range of 0 μm was 1%.

Production of Panel Back Plate

ELD-1155 (manufactured by Okuno Pharmaceutical Co., Ltd.) is printed as a base layer on a 300 × 450 mm glass substrate by screen printing, dried and fired to form a base layer having a thickness of 10 μm. D-590-HV-MOD (manufactured by ES L Japan) is printed as an address electrode on the screen in an electrode pattern by screen printing and baked to form an electrode having a film thickness of 8 μm, a line width of 40 μm, and a pitch of 240 μm. did.

Next, PLS-3232 (manufactured by Nippon Electric Glass) was printed as a dielectric layer on the address electrode by screen printing, dried and fired to form a 7 μm-thick dielectric layer.

Next, the coating composition (paste) for forming the partition walls was diluted with a screen oil 759 (manufactured by Okuno Pharmaceutical Co., Ltd.) and a shear rate of 15 [1 / sec], 22
The viscosity was adjusted to 600 poise at a temperature of 600 ° C., and printing and drying were repeated a predetermined number of times by screen printing.
A solid film of 00 μm (thickness for lower layer composition = 160 μm, thickness for upper layer composition = 40 μm) was prepared.
After heating the substrate on which the solid film is formed to 80 ° C. and laminating a dry film resist (OSBR film BF-605, manufactured by Tokyo Ohka Kogyo Co., Ltd.) on the solid film, a parallel light printer using an ultra-high pressure mercury lamp as a light source is used. , Line width 100μ
Exposure was performed via a line pattern mask having a pitch of 240 μm. The exposure conditions were an intensity of 200 μW / cm ² and an irradiation amount of 80 mJ / cm ² when measured at 365 μm.

Next, using a 0.2% aqueous solution of anhydrous sodium carbonate, spray development was carried out at a liquid temperature of 35 ° C. to prepare a sand blast mask, which was dried and then fused alumina A- #
Unnecessary portions were removed by sand blasting using 800 (made by Fujimi Abrasives) as a cutting material.

Then, using a 0.7% aqueous solution of sodium hydroxide, the sandblast mask was peeled off at a liquid temperature of 30 ° C. and dried, and then a peak temperature of 575 ° C. and a holding time of 20 minutes.
And baking for 2 hours with a total baking time of 2 hours and a line width of 65 μm and a height of 150 μm (thickness h1 of the lower layer composition = 100 μm, thickness h2 of the upper layer composition = 20 μm: (h2 / h1 + h2
)) = 0.17) was obtained.

The breakage of the partition walls thus produced at the time of sealing was evaluated as “partition breakage frequency” and evaluated in the following manner.

Partition wall breakage frequency

An elemental glass substrate of the same size as the back plate on which the partition wall was formed was superposed on the partition wall surface, and the pressure was set to 40 mmH with a contact printer (P-202-G, manufactured by Dainippon Screen Mfg. Co., Ltd.).
After contact for 3 minutes with g, the number of damaged partition walls was counted. The results are as shown in Table 1. In addition, the numerical value (partition wall breakage frequency) shown in Table 1 was expressed relative to the damage number of Comparative Example 1 as 100.

From the results shown in Table 1, it can be seen that the frequency of breakage of the partition wall of Example 1 was 5, which was significantly reduced as compared with 100 of Comparative Example 1, and that the partition wall strength was significantly higher.

(Embodiment 2)

Preparation of frit mixture

A frit mixture was prepared in the following manner.

Upper layer composition 35 , glass frit (main components PbO, SiO ₂ , B ₂ O ₃ ; alkali-free; d ₅₀ = 1.5 μm; Ts = 547 ° C .; thermal expansion coefficient 75 × 10 ⁻⁷ / ° C .; glass) transition point 450 ° C.) ... 75 parts aggregate (alumina RA-40 (Iwatani chemical industry Co., _{Ltd., d 50 = 1μm)) ...} 15 parts pigment (die Piroki side black # 9510 (manufactured by Dainichiseika Color & chemicals Mfg.) ) ... 10 parts of the lower layer composition 31 glass frit (the main component _{PbO, SiO 2, B 2 O} 3; _{alkali-free; d 50 = 1.5μm; Ts =} 560 ℃; thermal expansion coefficient of 72 × ^{10 -7} / ℃; glass transition point 458 ° C.) ... 75 parts aggregate (alumina RA-40 (Iwatani chemical industry Co., _{Ltd., d 50 = 1μm)) ...} 15 parts pigment (die Piroki side black # 9510 (Dainichiseika Color & chemicals Mfg. Co. ))… 1 0 copies

The upper layer composition 35 and the lower layer composition 31
Were individually placed in a container made of a fluororesin, and mixed for 15 minutes by a paint conditioner RC-5000 (manufactured by Red Devil Co., Ltd.) to prepare frit mixtures for the upper layer and the lower layer.

Next, a high temperature type TG-D manufactured by Rigaku Corporation
Using a TA TG-8110 type macro sample holder, the temperature was raised in air at a rate of 10 ° C./min. , Sample volume 50
The softening point Ts1 of the lower layer composition and the softening point Ts2 of the upper layer composition were measured using 0 mg, alumina as a reference, and a pair of Pt containers for macros manufactured by Rigaku Corporation as a sample container. The value of Ts1-Ts2 was determined. As a result, a value of Ts1−Ts2 = 5 ° C. was obtained.

Coating composition (paste) for forming barrier ribs
Production of

Next, the following additives were added to the above frit mixture in the following manner to prepare a coating composition (paste) for forming partition walls. -The above frit mixture ... 80 parts-Ethocel STD-100FP (manufactured by Dow Chemical Company) ... 2 parts-Diethylene glycol monobutyl ether acetate (manufactured by Junsei Chemical) ... 9 parts-Screen oil 759 (manufactured by Okuno Pharmaceutical) ... 9 parts

After these were uniformly mixed, they were kneaded with a three-roll mill (C-4.3 / 4 × 10, manufactured by Inoue Seisakusho) to produce a paste. Using a method similar to that described in Example 1 above, the average particle diameter (d ₅₀ ) of all the particles contained in the paste and _{5 to} 10 μm of all the particles contained in the paste were measured. Was measured, the average particle diameter (d ₅₀ ) of the upper layer paste was 1 μm, and the content ratio of the particle diameters in the range of 5 to 10 μm was 2%; the average particle diameter of the lower layer paste ( d ₅₀ ) = 1 μm, the content ratio of particle diameters in the range of 5 to 10 μm = 2%.

Production of Panel Back Plate

Using the coating composition (paste) for forming the partition walls, a back plate was prepared in the same manner as in Example 1.
The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls, and the “partition breakage frequency” was obtained. As shown in Table 1, the frequency of breakage of the partition wall of Example 2 was remarkably reduced to 5, as compared with 100 of Comparative Example 1.

(Embodiment 3)

Preparation of frit mixture

A frit mixture was prepared in the following manner.

Upper layer composition 35 glass frit (main components PbO, SiO ₂ , B ₂ O ₃ ; alkali-free; d ₅₀ = 3 μm; Ts = 540 ° C .; thermal expansion coefficient 80 × 10 ⁻⁷ / ° C .; glass transition point 75 parts ・ Aggregate (EP zirconium (Daiichi Kagaku Kagaku Co., Ltd., d ₅₀ = 1 μm)) 15 parts ・ Pigment (Dipiroxide Side Black # 9510 (Dainichi Seika Kogyo)) ... 10 parts of the lower layer composition 31 glass frit (the main component _{PbO, SiO 2, B 2 O} 3; _{alkali-free; d 50 = 3μm; Ts =} 560 ℃; thermal expansion coefficient of 70 × ^{10 -7} / ℃; glass transition temperature 460 ° C) 75 parts Aggregate (EP zirconium (Daiichi Kagaku Kagaku Kogyo Co., Ltd., d ₅₀ = 1 μm)) 15 parts Pigment (Dipiroxide Black # 9510 (Dainichi Seika Kogyo)) … 1 Part

The upper layer composition 35 and the lower layer composition 31
Were individually placed in a container made of a fluororesin, and mixed for 15 minutes by a paint conditioner RC-5000 (manufactured by Red Devil Co., Ltd.) to prepare frit mixtures for the upper layer and the lower layer.

Next, a high temperature type TG-D manufactured by Rigaku Corporation
Using a TA TG-8110 type macro sample holder, the temperature was raised in air at a rate of 10 ° C./min. , Sample volume 50
The softening point Ts1 of the lower layer composition and the softening point Ts2 of the upper layer composition were measured using 0 mg, alumina as a reference, and a pair of Pt containers for macros manufactured by Rigaku Corporation as a sample container. The value of Ts1-Ts2 was determined. As a result, a value of Ts1-Ts2 = 22 ° C was obtained.

Coating composition (paste) for forming barrier ribs
Production of

Next, the following additives were added to the frit mixture in the following manner to prepare a coating composition (paste) for forming partition walls. -The above frit mixture ... 80 parts-Ethocel STD-100FP (manufactured by Dow Chemical Company) ... 2 parts-Diethylene glycol monobutyl ether acetate (manufactured by Junsei Chemical) ... 9 parts-Screen oil 759 (manufactured by Okuno Pharmaceutical) ... 9 parts

After these were uniformly mixed, the mixture was kneaded with a three-roll mill (manufactured by Inoue Seisakusho, C-4 / 3/4 × 10) to produce a paste. Using a method similar to that described in Example 1 above, the average particle diameter (d ₅₀ ) of all the particles contained in the paste and _{5 to} 10 μm of all the particles contained in the paste were measured. Was measured, the average particle diameter (d ₅₀ ) of the upper layer paste was 2.5 μm, the content ratio of the particle diameters in the range of 5 to 10 μm was 10%, and the average particle of the lower layer paste was 10%. The diameter (d ₅₀ ) was 2.5 μm, and the content ratio of particle diameters in the range of 5 to 10 μm was 10%.

Production of Panel Back Plate

Using the coating composition (paste) for forming the partition walls, a back plate was prepared in the same manner as in Example 1.
The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls, and the “partition breakage frequency” was obtained. As shown in Table 1, the frequency of breakage of the partition wall in Example 3 was remarkably reduced to 20, compared to 100 in Comparative Example 1.

(Comparative Example 1)

Preparation of frit mixture

[0098]

A frit mixture was prepared in the following manner.

Upper layer composition 35 glass frit (main components PbO, SiO ₂ , B ₂ O ₃ ; alkali-free; d ₅₀ = 3 μm; Ts = 560 ° C .; thermal expansion coefficient 70 × 10 ⁻⁷ / ° C .; glass transition point 460 ° C.) ... 75 parts aggregate (alumina RA-40 (Iwatani chemical industry Co., _{Ltd., d 50 = 1μm)) ...} 15 parts pigment (die Piroki side black # 9510 (manufactured by Dainichiseika Color & chemicals Mfg.)) ... 10 parts of the lower layer composition 31 glass frit (the main component _{PbO, SiO 2, B 2 O} 3; _{alkali-free; d 50 = 3μm; Ts =} 560 ℃; thermal expansion coefficient of 70 × ^{10 -7} / ℃; glass transition point 460 ° C.) ... 75 parts aggregate (EP zirconium (Daiichi Kigenso Kagaku Kogyo Co., _{Ltd., d 50 = 1μm)) ...} 15 parts pigment (die Piroki side black # 9510 (manufactured by Dainichiseika Color & chemicals Mfg.)) ... 10 copies

The upper layer composition 35 and the lower layer composition 31
Were individually placed in a container made of a fluororesin, and mixed for 15 minutes by a paint conditioner RC-5000 (manufactured by Red Devil Co., Ltd.) to prepare frit mixtures for the upper layer and the lower layer.

Next, a high temperature type TG-D manufactured by Rigaku Corporation
Using a TA TG-8110 type macro sample holder, the temperature was raised in air at a rate of 10 ° C./min. , Sample volume 50
The softening point Ts1 of the lower layer composition and the softening point Ts2 of the upper layer composition were measured using 0 mg, alumina as a reference, and a pair of Pt containers for macros manufactured by Rigaku Corporation as a sample container. The value of Ts1-Ts2 was determined. As a result, a value of Ts1-Ts2 = 1 ° C. was obtained.

Coating composition (paste) for forming partition walls
Production of

Next, the following additives were added to the frit mixture in the following manner to prepare a coating composition (paste) for forming partition walls. -The above frit mixture ... 80 parts-Ethocel STD-100FP (manufactured by Dow Chemical Company) ... 2 parts-Diethylene glycol monobutyl ether acetate (manufactured by Junsei Chemical) ... 9 parts-Screen oil 759 (manufactured by Okuno Pharmaceutical) ... 9 parts

After these were uniformly mixed, they were kneaded with a three-roll mill (manufactured by Inoue Seisakusho Co., Ltd., C-4 ・ / 4 × 10) to produce a paste. Using a method similar to that described in Example 1 above, the average particle diameter (d ₅₀ ) of all the particles contained in the paste and _{5 to} 10 μm of all the particles contained in the paste were measured. Was measured, the average particle diameter (d ₅₀ ) of the upper layer paste was 2.5 μm, the content ratio of the particle diameters in the range of 5 to 10 μm was 10%, and the average particle of the lower layer paste was 10%. The diameter (d ₅₀ ) was 2.5 μm, and the content ratio of particle diameters in the range of 5 to 10 μm was 10%.

Production of Panel Back Plate

Using the coating composition (paste) for forming the partition walls, a back plate was prepared in the same manner as in Example 1.
The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls. As shown in Table 1, the number of breaks in Comparative Example 1 was defined as a partition breakage frequency of 100 (conventional reference value).

(Comparative Example 2)

Preparation of frit mixture

A frit mixture was prepared in the following manner.

Upper layer composition 35 glass frit (main components PbO, SiO ₂ , B ₂ O ₃ ; alkali-free; d ₅₀ = 3 μm; Ts = 540 ° C .; thermal expansion coefficient 80 × 10 ⁻⁷ / ° C .; glass transition point 85 parts ・ Aggregate (Alumina RA-40 (manufactured by Iwatani Chemical Industry Co., Ltd., d ₅₀ = 1 μm)) 5 parts ・ Pigment (Dipiroxide Black # 9510 (manufactured by DAINICHI SEIKA KOGYO CO., LTD.)) 10 parts of the lower layer composition 31 glass frit (the main component _{PbO, SiO 2, B 2 O} 3; _{alkali-free; d 50 = 3μm; Ts =} 560 ℃; thermal expansion coefficient of 70 × ^{10 -7} / ℃; glass transition point 460 ° C.) ... 75 parts aggregate (alumina RA-40 (Iwatani chemical industry Co., _{Ltd., d 50 = 1μm)) ...} 15 parts pigment (die Piroki side black # 9510 (manufactured by Dainichiseika Color & chemicals Mfg.)) ... 10 Department

The upper layer composition 35 and the lower layer composition 31
Were individually placed in a container made of a fluororesin, and mixed for 15 minutes by a paint conditioner RC-5000 (manufactured by Red Devil Co., Ltd.) to prepare frit mixtures for the upper layer and the lower layer.

Next, a high temperature type TG-D manufactured by Rigaku Corporation
Using a TA TG-8110 type macro sample holder, the temperature was raised in air at a rate of 10 ° C./min. , Sample volume 50
The softening point Ts1 of the lower layer composition and the softening point Ts2 of the upper layer composition were measured using 0 mg, alumina as a reference, and a pair of Pt containers for macros manufactured by Rigaku Corporation as a sample container. The value of Ts1-Ts2 was determined. As a result, a value of Ts1-Ts2 = 28 ° C was obtained.

Coating composition (paste) for forming partition walls
Production of

Next, the following additives were added to the above frit mixture in the following manner to prepare a coating composition (paste) for forming partition walls. -The above frit mixture ... 80 parts-Ethocel STD-100FP (manufactured by Dow Chemical Company) ... 2 parts-Diethylene glycol monobutyl ether acetate (manufactured by Junsei Chemical) ... 9 parts-Screen oil 759 (manufactured by Okuno Pharmaceutical) ... 9 parts

After these were uniformly mixed, the mixture was kneaded with a three-roll mill (manufactured by Inoue Seisakusho Co., Ltd., C-4 ／/ 4 × 10) to produce a paste. Using a method similar to that described in Example 1 above, the average particle diameter (d ₅₀ ) of all the particles contained in the paste and _{5 to} 10 μm of all the particles contained in the paste were measured. Was measured, the average particle diameter (d ₅₀ ) of the upper layer paste was 2.5 μm, the content ratio of the particle diameters in the range of 5 to 10 μm was 10%, and the average particle of the lower layer paste was 10%. The diameter (d ₅₀ ) was 2.5 μm, and the content ratio of particle diameters in the range of 5 to 10 μm was 10%.

Production of Panel Back Plate

Using the coating composition (paste) for forming the partition walls, a back plate was prepared in the same manner as in Example 1.
The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls, and the “partition breakage frequency” was obtained. As shown in Table 1, the frequency of breakage of the partition walls in Comparative Example 2 was 10. However, in this case, the top of the partition wall was rounded, and the partition wall shape was not practically preferable.

(Example 4)

In Example 1, the thickness of the partition walls was set so that the thickness h1 of the lower layer composition was 112 μm and the thickness h2 of the upper layer composition was 8 μm ((h2 / (h1 + h2) = 0.0).
67). Except for this, the panel back plate of Example 4 was manufactured in the same manner as in Example 1 described above. With respect to the prepared partition walls, the number of breakage of the partition walls was counted in the same manner as in Example 1 to determine “partition breakage frequency”. As shown in Table 1, the breakage frequency of the partition wall in Example 4 was 5.

(Example 5)

In Example 1, the thickness ratio of the partition walls was set so that the thickness h1 of the lower layer composition was 80 μm and the thickness h2 of the upper layer composition was 40 μm ((h2 / (h1 + h2) = 0.3).
Changed to 3). Except for this, the panel back plate of Example 5 was manufactured in the same manner as in Example 1 above. The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls,
"Partition breakage frequency" was determined. As shown in Table 1, the breakage frequency of the partition wall in Example 5 was 5.

(Comparative Example 3)

In Example 1, the thickness of the partition walls was set such that the thickness h1 of the lower layer composition was 48 μm and the thickness h2 of the upper layer composition was 72 μm ((h2 / (h1 + h2) = 0.
Changed to 6). Except for this, the panel back plate of Comparative Example 3 was manufactured in the same manner as in Example 1. The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls,
"Partition breakage frequency" was determined. As shown in Table 1, the frequency of breakage of the partition wall in Comparative Example 3 was 10. However, in this case, the top of the partition wall was rounded, and the partition wall shape was not practically preferable.

(Comparative Example 4)

In Example 1, the thickness of the partition walls was set so that the thickness h1 of the lower layer composition was 118.5 μm and the thickness h2 of the upper layer composition was 1.5 μm ((h2 / (h1 + h2)).
= 0.013). Except for this, the panel back plate of Comparative Example 4 was manufactured in the same manner as in Example 1 above. The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls, and the “partition breakage frequency” was obtained. As shown in Table 1, the frequency of breakage of the partition wall in Comparative Example 4 was 90.

(Embodiment 6)

Preparation of frit mixture

The frit mixture was prepared in the following manner.

Upper layer composition 35 glass frit (main components PbO, SiO ₂ , B ₂ O ₃ ; alkali-free; d ₅₀ = 1.5 μm; Ts = 560 ° C .; thermal expansion coefficient 72 × 10 ⁻⁷ / ° C .; glass) transition point 458 ° C.) ... 80 parts of underlayer composition 31 glass frit (the main component _{PbO, SiO 2, B 2 O} 3; _{alkali-free; d 50 = 1.5μm; Ts =} 560 ℃; thermal expansion coefficient of 72 × 10 ^{- 7} / ° C .; glass transition point 458 ° C.) 85 parts Aggregate (Alumina RA-40 (manufactured by Iwatani Chemical Industry Co., Ltd., d ₅₀ = 1 μm)) 7 parts Pigment (Dipiroxide Black # 9510 (Large) Nissei Chemical Industries)) ... 10 parts

The upper layer composition 35 and the lower layer composition 31
Were individually placed in a container made of a fluororesin, and mixed for 15 minutes by a paint conditioner RC-5000 (manufactured by Red Devil Co., Ltd.) to prepare frit mixtures for the upper layer and the lower layer.

Next, a high temperature type TG-D manufactured by Rigaku Corporation
Using a TA TG-8110 type macro sample holder, the temperature was raised in air at a rate of 10 ° C./min. , Sample volume 50
The softening point Ts1 of the lower layer composition and the softening point Ts2 of the upper layer composition were measured using 0 mg, alumina as a reference, and a pair of Pt containers for macros manufactured by Rigaku Corporation as a sample container. The value of Ts1-Ts2 was determined. As a result, a value of Ts1-Ts2 = 15 ° C was obtained.

Coating composition (paste) for forming barrier ribs
Production of

Next, the following additives were added to the frit mixture in the following manner to prepare a coating composition (paste) for forming partition walls. -The above frit mixture ... 80 parts-Ethocel STD-100FP (manufactured by Dow Chemical Company) ... 2 parts-Diethylene glycol monobutyl ether acetate (manufactured by Junsei Chemical) ... 9 parts-Screen oil 759 (manufactured by Okuno Pharmaceutical) ... 9 parts

After these were uniformly mixed, the mixture was kneaded with a three-roll mill (manufactured by Inoue Seisakusho, C-4 / 3/4 × 10) to produce a paste. Using a method similar to that described in Example 1 above, the average particle diameter (d ₅₀ ) of all the particles contained in the paste and _{5 to} 10 μm of all the particles contained in the paste were measured. Was measured, the average particle diameter (d ₅₀ ) of the upper layer paste was 1 μm, the content ratio of the particle diameters in the range of 5 to 10 μm was 0.5%, and the average particle of the lower layer paste was 0.5%. The diameter (d ₅₀ ) was 1 μm, and the content ratio of particle diameters in the range of 5 to 10 μm was 1%.

Production of Panel Back Plate

Using the coating composition (paste) for forming the partition walls, the thickness h1 of the lower layer composition was 100 μm, and the thickness h2 of the upper layer composition was 5 μm ((h2 / (h1 + h2)).
= 0.047), except that the back plate was produced in the same manner as in Example 1 above. The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls, and the “partition breakage frequency” was obtained. As shown in Table 1, the breakage frequency of the partition wall in Example 6 was 5.

(Embodiment 7)

In Example 6, the thickness h2 of the upper layer composition was changed to 18 μm ((h2 / (h1 + h2) =
0.15). Otherwise, the panel back plate of Example 7 was produced in the same manner as in Example 6 above. The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls,
"Partition breakage frequency" was determined. As shown in Table 1, the frequency of breakage of the partition wall in Example 7 was 5.

(Comparative Example 5)

In Example 6, the thickness of the upper layer composition was changed to h2 = 2 μm ((h2 / (h1 + h2) = 0.
02). Except for this, the panel back plate of Comparative Example 5 was manufactured in the same manner as in Example 6. The number of breakage of the partition walls was counted in the same manner as in Example 1 for the prepared partition walls, and the “partition breakage frequency” was obtained. As shown in Table 1, Comparative Example 5
Of the partition wall was 70.

(Comparative Example 6)

In Example 6, the thickness h1 of the lower layer composition was changed to 46 μm, and the thickness h2 of the upper layer composition was changed to 54 μm ((h2 / (h1 + h2) = 0.54). A panel back plate of Comparative Example 6 was manufactured in the same manner as in Example 6. The number of breakage of the manufactured partition walls was counted in the same manner as in Example 1, and the “partition breakage frequency” was obtained. As can be seen, the frequency of breakage of the partition wall in Comparative Example 6 was 10. However, in this case, the top of the partition wall was rounded, and the partition wall shape was not practically preferable.

[0144]

[Table 1]

[0145]

The effects of the present invention are clear from the above results. That is, since the present invention is configured with the above-described predetermined requirements, the smoothness of the top of the partition wall and sufficient partition wall strength are obtained, and breakage of the partition wall and chipping of the top portion during panel sealing may occur. Extremely low. Thus, a plasma display panel free from erroneous discharge and point defects can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration example of an AC type PDP.

FIG. 2 is a cross-sectional view for explaining a structure of a back plate of FIG.

FIG. 3 shows an example of the configuration of a DC PDP.
FIG. 3A is a plan view, and FIG.
It is sectional drawing in the XX line in (a).

FIG. 4 is a cross-sectional view illustrating a structure of a partition.

FIG. 5 is a graph for explaining a measurement example of a softening point.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Front plate 2 ... Back plate 3 ... Partition wall 4 ... Sustain electrode 5 ... Bus electrode 6 ... Dielectric layer 7 ... MgO layer 8 ... Address electrode

Claims (7)

[Claims] 1. A thick film pattern composition formed by laminating an upper layer composition and a lower layer composition having different compositions, wherein the upper layer composition comprises: a glass frit serving as a molten matrix;
With an aggregate and a pigment contained as needed, the lower layer composition, a glass frit to be a molten matrix,
Aggregate and, if necessary, a pigment to be contained. When the softening point of the lower layer composition is Ts1 and the softening point of the upper layer composition is Ts2, the condition of 3 ° C ≦ Ts1−Ts2 ≦ 25 ° C is satisfied. A thick film pattern composition characterized by being filled. 2. When the thickness of the lower layer composition is h 1 and the thickness of the upper layer composition is h 2, 0.04 ≦ (h 2 /
2. The thick film pattern composition according to claim 1, which satisfies the condition of (h1 + h2)). Ltoreq.0.4. 3. The upper layer composition is composed of a glass frit serving as a molten matrix, and has a thickness h2 of 3 μm ≦ h2 ≦.
The thick film pattern composition according to claim 1, which has a thickness of 20 µm. 4. A thick film pattern formed by mixing and dispersing a glass frit serving as a molten matrix of the thick film pattern and an aggregate mainly for maintaining the form and strength of the thick film pattern with an organic vehicle. Coating composition, wherein the average particle diameter (d) of all particles contained in the coating composition is
₅₀ ) is in the range of 0.05 μm ≦ d ₅₀ ≦ 5 μm, and 5 to 5 of all particles contained in the coating composition.
A coating composition for forming a thick film pattern, comprising 20% or less of particles having a particle diameter in a range of 10 μm. 5. A coating composition for forming a thick film pattern further comprising a coloring pigment, wherein the average particle diameter (d) of all particles contained in the coating composition is
₅₀ ) is in the range of 0.05 μm ≦ d ₅₀ ≦ 5 μm, and 5 to 5 of all particles contained in the coating composition.
2. The coating composition for forming a thick film pattern according to claim 1, wherein 20% or less of particles having a particle diameter in a range of 10 μm is contained. 6. The method according to claim 4, wherein the coating composition for forming a thick film pattern is used for forming the upper layer composition, and the thickness h2 is in the range of 3 μm ≦ h2 ≦ 20 μm. Item 7. The thick film pattern composition according to Item 1. 7. A plasma display panel having a partition wall for partitioning a discharge space, wherein the partition wall is formed in a plasma display panel.
A plasma display panel comprising the thick film pattern composition according to any one of the above.