JP2000021316A - Partition for plasma display panel and plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a partition for plasma display panel and a plasma display panel using the same which can improve the adhesion between the partition and a fluorescent layer, while improving quality and yield of products with less rib defects. SOLUTION: In a partition for plasma display panel which comprises a glass frit serving as a base material for fusion of a partition 3 and an aggregate for mainly keeping the shape and strength of the partition 3 as main components, the partition 3 contains (1) zirconia and/or zircon as the aggregate and (2) a Bi base glass in the glass frit component, and the relation of content between (1) and (2) is within a predetermined range.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a partition for a plasma display panel and a plasma display panel using the same.

[0002]

2. Description of the Related Art A plasma display panel (PDP), which is a gas discharge panel, is provided with a pair of electrodes regularly arranged on two opposing glass substrates, and mainly comprises Ne, He, Xe, etc. therebetween. It has a structure in which a rare gas is sealed. Then, a voltage is applied between these electrodes, and a discharge is generated in minute cells around the electrodes, so that each cell emits light and display is performed.
In order to display information, cells arranged regularly are selectively discharged and emitted. There are two types of PDPs, a direct current type (DC type) in which the electrodes are exposed to the discharge space, and an alternating current type (AC type) in which the electrodes are covered with an insulating layer. And a refresh driving method and a memory driving method.

In a DC PDP and an AC PDP, each cell is formed by holding two glass substrates facing each other by partition walls. Such a partition, in order to obtain a high-luminance light emission by making the display discharge space as large as possible,
It is required to be perpendicular to the glass substrate and to have a small width and a sufficient height. Especially high definition PD
In P, for example, the width is 30 to 5 with respect to the height of 100 μm.
A partition having a high aspect ratio of 0 μm is required.

Conventionally, a partition wall in a PDP has been made of a composition comprising a glass frit, an aggregate, and a colorant, and an organic vehicle obtained by dissolving ethyl cellulose and an acrylic resin which disappear by firing in a solvent such as terpineol or butyl carbitol. A method of printing and drying the paste kneaded by the rolls or the like in a pattern by screen printing until a desired height is obtained, followed by baking; or coating and drying by screen printing, blade coating, die coating or the like to form a solid film. Thereafter, a mask having sand blast resistance is formed in a pattern on the solid film, sand blasting is performed, and the mask is peeled off and fired.

[0005] A phosphor layer is provided on the side surfaces of the partition walls formed on the back plate (one glass substrate) and between the partition walls. Such a phosphor layer is
After formation of the partition walls, a photosensitive phosphor layer coating composition is applied, exposed, and developed to be arranged and formed at predetermined positions.

[0006]

However, in forming such a phosphor layer, it cannot be said that the adhesion between the partition and the phosphor layer is sufficient. In particular, the phosphor near the upper end of the side wall of the partition. Peeling of the layer sometimes occurred. When the adhesion is extremely poor, the phosphor layer itself may fall off in its entirety.

The present invention has been made in view of the above circumstances, and an object of the present invention is to improve the adhesion between a partition and a phosphor layer, thereby improving the quality and yield of a product. An object of the present invention is to provide a panel partition and a plasma display panel using the same.

[0008]

SUMMARY OF THE INVENTION In order to solve such problems, the present invention mainly comprises a glass frit serving as a molten matrix of a partition and an aggregate mainly for maintaining the shape and strength of the partition. Wherein the partition contains (1) zirconia and / or zircon as an aggregate, and (2) a Bi-based glass among glass frit components.
And (2) are configured so as to be within a range satisfying the following relationships (a) to (e). Further, according to the present invention, in a plasma display panel having a partition partitioning a discharge space and a phosphor layer adhered to the partition, the partition has (1) zirconia and / or zircon as an aggregate; ) The glass frit component contains Bi-based glass, and is configured such that the content ratio relationship between (1) and (2) is within a range satisfying the following relationships (a) to (e).

(A) The total of zirconia / zircon is 0
When the content is more than 0.5% by weight and more than 0.5% by weight, the range in which the Bi-based glass in the glass frit is contained in the glass frit component at 60% by weight or more and 90% by weight or less; (b) Zirconia / zircon is 0.5% in total. % To less than 1 wt%, Bi in the glass frit
A range in which the system glass contains 35 wt% to 90 wt% of the glass frit component; (c) a total of 1 wt% to 2 zirconia / zircon
When the content is less than 20 wt%, the Bi-based glass in the glass frit is contained in the glass frit component in an amount of 20 wt% or more and 90 wt% or more.
(d) a total content of zirconia / zircon of 2 wt% or more and 2
When the content is 0 wt% or less, Bi-based glass in the glass frit exceeds 0 wt% in the glass frit component and exceeds 9 wt%.
(E) When the total content of zirconia / zircon is more than 20 wt% and not more than 60 wt%, B in the glass frit
A range in which i-based glass is contained in an amount of more than 0 wt% and 65 wt% or less among glass frit components.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing the composition of the barrier ribs for a plasma display panel according to the present invention, the structure of the whole plasma display panel will be briefly described.

FIG. 1 is a perspective view showing an example of the configuration of an AC type PDP. In this figure, reference numeral 1 denotes a front plate, and reference numeral 2
Is a back plate, 3 is a partition, 4 is a sustain electrode, 5 is a bus electrode, 6 is a dielectric layer, 7 is an MgO layer, 8 is an address electrode, and 9 is a phosphor layer. .

FIG. 1 shows a front panel 1 and a rear panel 2 separated so that the configuration of the PDP can be easily understood. As shown in FIG. 1, an AC type PDP has a front plate 1 and a rear plate 2 made of glass plates which face each other in parallel with each other, and a partition wall 3 erected on the rear plate 2 to separate the front plate 1 and the rear plate 2. Are fixed at regular intervals so as to form a sealed cell.

On the back side of the front plate 1, a composite electrode composed of a sustain electrode 4 as a transparent electrode and a bus electrode 5 as a metal electrode is formed in parallel with each other, and a dielectric layer 6 and MgO layers 7 are sequentially formed.

On the front side (upper side in the drawing) of the back plate 2, address electrodes 8 are formed parallel to each other in the form of stripes so as to be orthogonal to the composite electrode and located between the partition walls 3. A phosphor layer 9 is provided on the bottom surface of the cell on the electrode 8.

FIG. 2 shows a detailed structure of the cross section. According to this figure, an address electrode 8 is provided after a base layer 10 is formed on a glass substrate 2, and a dielectric layer 6 'is further formed. After the lamination, the partition 3 and the phosphor layer 9 are provided.

Such an AC type PDP is of a surface discharge type, in which a predetermined voltage is applied from an AC power source between composite electrodes on the front panel 1 to form an electric field, whereby the front panel 1, the rear panel 2 and the partition wall are formed. The discharge is performed in each cell as a display element defined by the cells 3 and 3.

By causing the phosphor 9 to emit light by ultraviolet rays generated by the discharge, the light transmitted through the front plate 1 can be visually recognized by an observer.

FIG. 3 shows an example of the configuration of a DC type PDP. FIG. 3 (a) is a plan view and FIG.
FIG. 3B is a cross-sectional view taken along line XX in FIG. In the figure, reference numeral 11 denotes a front plate, reference numeral 12 denotes a rear plate, reference numeral 13 denotes a cathode, reference numeral 14 denotes an electrode body, reference numeral 15 denotes a display anode,
Reference numeral 16 denotes a partition wall, reference numeral 17 denotes a discharge cell, reference numeral 18 denotes a terminal portion, reference numeral 19 denotes a resistor, reference numeral 20 denotes an auxiliary electrode, reference numeral 21
Denotes an electrode body, 22 denotes a phosphor layer, and 23 denotes a priming slit.

As shown in FIG. 3, a DC type PDP is
The two glass substrates of the front plate 11 and the rear plate 12 are combined to form a panel, and a first electrode group including a cathode 13 is formed on the front plate 11, and the first electrode group is electrically formed on the rear plate 12. A second electrode group including four connected electrodes and the display anode 15 is formed. The front plate 11 and the back plate 12 are opposed to each other by the partition 16 so that the cathode 13 and the display anode 15 are substantially orthogonal to each other, thereby forming a discharge cell 17. The cathode 13 and the electrode body 14 in the discharge cell 17 form a unit discharge electrode pair.

The display anode 15 includes a linear portion 15a and a protrusion 15b protruding laterally from the linear portion 15a, and a terminal portion 18 extends from the electrode body 14 in parallel with the display anode 15. The projection 15 b of the display anode 15 and the terminal 18 of the electrode body 14 are electrically connected by a resistor 19. Further, an auxiliary anode 20 is provided between the adjacent display anodes 15 in parallel with the display anode 15, and an electrode body 21 is provided on the auxiliary anode 20 at a position intersecting with the cathode 13.

In a DC type PDP, a cathode 13 and a display anode 1 are used.
5, a current flows through the electrode body 14 through the resistor 19, and the cathode 13 in the discharge cell 17.
A discharge is generated between the electrode body 14 and the electrodes 14, and the ultraviolet rays generated by the discharge cause the phosphor layers 22 of, for example, R, G, B and three colors to emit light. This light emission is radiated to the outside through the front panel 11, and a full-color image display is performed. In this case, the auxiliary anode 18 charges the charged particles serving as a pilot light in the discharge cell 17 with the priming slit 23.
Has the role of supplying through. Reference numeral 24 denotes a dielectric layer, which electrically isolates the display anode 15, the terminal portion 18, the resistor 19, and the auxiliary anode 20 from the discharge space, and limits the discharge generation location to only the electrode members 14 and 21.

The partition wall 3 and the partition wall 16 for the PDP in the present invention (hereinafter, the partition wall 3 will be described as a representative).
A method of pattern-printing a partition-forming coating composition in a partition shape by screen printing, or a method of applying a partition-forming coating composition by screen printing, blade coating, die coating, etc., followed by drying to form a solid film. A mask having sandblast resistance is formed in a pattern thereon, sandblasting is performed, the mask is peeled off, and then fired.

The partition walls 3 formed after such firing are:
A glass frit serving as a molten matrix of the partition wall 3;
And an aggregate for maintaining the shape and strength of the partition wall.

The partition 3 in the present invention contains zirconia and / or zircon as an aggregate. Further, the partition wall 3 in the present invention contains Bi-based glass in a glass frit component serving as a molten matrix of the partition wall 3.
The content of the Bi-based glass in the glass frit component is determined so as to fall within a range satisfying the following relationships (a) to (e) in relation to the total content of zirconia / zircon. (A) When the total content of zirconia / zircon is more than 0 wt% (particularly 0.1 wt% or more) and less than 0.5 wt%, 60 wt% of Bi-based glass in the glass frit is included in the glass frit component. (B) When zirconia / zircon is contained in a total amount of 0.5 wt% or more and less than 1 wt%, Bi in the glass frit is contained.
A range in which the system glass contains 35 wt% to 90 wt% of the glass frit component; (c) a total of 1 wt% to 2 zirconia / zircon
When the content is less than 20 wt%, the Bi-based glass in the glass frit is contained in the glass frit component in an amount of 20 wt% or more and 90 wt% or more.
(d) a total content of zirconia / zircon of 2 wt% or more and 2
When the content is 0 wt% or less, the range in which Bi-based glass in the glass frit exceeds 90 wt% (especially 1 wt% or more) in the glass frit component;
And (e) when the total content of zirconia / zircon is more than 20 wt% and not more than 60 wt%, B in the glass frit
It is a range in which the i-based glass is contained in an amount of more than 0 wt% (particularly 1 wt% or more) and 65 wt% or less in the glass frit component.

Further, a more preferable range is a range that satisfies the following relationships (a ') to (f'). That is, (a ′) 0.5 wt% of zirconia / zircon in total
When the content is less than 1 wt%, B in the glass frit
a range in which the i-based glass contains 60 wt% or more and 65 wt% or less in the glass frit component; (b ′) when the total content of zirconia / zircon is 1 wt% or more and less than 2 wt%, the Bi-based glass in the glass frit is glass 40wt% or more among frit components 6
(C ′) When the total content of zirconia / zircon is 2 wt% or more and less than 3 wt%, the Bi-based glass in the glass frit is 35 wt% or more in the glass frit component.
(D ′) When zirconia / zircon is contained in a total amount of 3 wt% or more and less than 5 wt%, Bi-based glass in the glass frit is contained in a glass frit component of 20 wt% or more and 6 wt% or less.
(E ') Bi in glass frit when zirconia / zircon is contained in a total amount of 5 wt% or more and less than 10 wt%.
A range in which the system glass contains more than 0 wt% (especially 1 wt% or more) and 65 wt% or less in the glass frit component; and (f ′) when the total content of zirconia / zircon is 10 wt% to less than 20 wt%, B in frit
It is a range in which the i-based glass is contained in an amount of more than 0 wt% (particularly 1 wt% or more) and 60 wt% or less in the glass frit component.

Outside of this range, the adhesion to the phosphor layer cannot be improved, or the rib pattern after firing becomes brittle, increasing the defect generation rate.
The inconvenience of being unable to use occurs.

The zirconia or zircon as the aggregate may be used singly or as a mixture of two or more. Of course, a mixture of zirconia and zircon may be used. When two or more kinds are used, the total may be within the above range.

In addition, other aggregate components such as alumina, silica, titanium oxide, magnesia, mullite, cordierite, silicon carbide, barium titanate, glass and the like are contained in a small amount without departing from the effects of the present invention. May be. As the aggregate component, one that is stably present at a temperature equal to or lower than the firing temperature is used.

The Bi-based glass referred to here is a glass containing Bi as a main component, and Bi ₂ O
_3, Bi ₂ O ₃ which contains as a main component -ZnO-B ₂ O ₃ and the like as a preferable example. In the present invention, the content of the Bi-based glass indicates the content in the glass frit component as described above, but does not indicate the content with respect to the entire partition.

As the Bi-based glass, one type may be used, or two or more types may be mixed and used. As described above, Bi of the predetermined content range used in the present invention is used.
The glass frit other than the system glass is not particularly limited, but generally, a lead-based glass which is supplied in a large amount and is inexpensive is used.

Glass frit is a binder (adhesive)
And its glass transition point (T
g) is desirably not lower than the temperature at which the resin used as the paste in the coating composition completely disappears by firing. Further, the softening point of the glass frit must be lower than the temperature at which the glass substrate is deformed. Specifically, Tg
Is appropriately selected from 350 to 500 ° C and the softening point is from 400 to 600 ° C. Furthermore, in order to minimize residual strain and suppress the occurrence of substrate warpage and cracks in the dielectric layer, the coefficient of thermal expansion (α) of the glass frit should be set to the same value as that of the glass substrate, underlayer, and dielectric layer. Need to match. Therefore, specifically, α = 60 to 90 × 10 ⁻⁷ /
Although it is desirable to use about ° C. things, aggregate, because α is changed by adding a colorant, and α at the time of the final partition wall 3 is 60~90 × 10 ^-7 / ℃ about What is necessary is just to select suitably. The average particle size of the glass frit is 0.
It can be in the range of 1 to 10 μm, preferably 1 to 5 μm. The content of the glass frit in the partition wall 3 is, for example, about 40 to 95 wt%, preferably about 60 to 90 wt%.

Further, there are many cases where the partition walls 3 are positively colored, in which case a colorant is contained in the partition walls.
A coloring agent having heat resistance is used. In the case of the present invention, it suffices that the material has heat resistance equal to or higher than the sintering temperature during the substrate manufacturing process. As such a coloring agent, complex oxide pigments (Cr, Co, Ni, Fe, Mn, Cu, Sb, A
s, Bi, Ti, Cd, Al, Ca, Si, Mg, Ba
Pigments composed of oxides of two or more metals such as, for example, titanium oxide, alumina, silica, magnesia, lead titanate, potassium titanate, cadmium sulfate selenide, and red iron oxide (Fe ₂ O)
₃ ), cuprous oxide, cadmium mercury red (CdS + Hg
S), chrome vermilion, silver vermilion, antimony red iodine red, zinc iron red, molybdenum red, lead red, cadmium red, chrome green, zinc green, cobalt green, chromium oxide, viridian, emerald green ultramarine, navy blue, cobalt blue, Cerulean blue, copper sulfide, titanium yellow, titanium black, black iron oxide (F
e ₃ O _4), yellow iron oxide, cadmium yellow, etc. chrome yellow and the like, which may be selected and used depending on the needed purpose.

In order to form the partition 3 as described above, a coating composition (paste) for forming a partition is prepared. The content of the aggregate, the glass frit, and the like is adjusted such that the solid content composition of the coating composition for forming the partition walls when the partition walls 3 are finally formed by firing is within the above range. After these solids are mixed, an organic vehicle is added, and the mixture is kneaded and dispersed by a three-roll mill, a bead mill, or the like to obtain a paste-like coating composition.

The organic vehicle resin used herein includes cellulose derivatives such as ethylcellulose, hydroxypropylcellulose, methylcellulose and nitrocellulose, polyester resins such as polyacrylester and alkyd resin, acrylic acid, methacrylic acid, itaconic acid and maleic acid. Acid, fumaric acid, crotonic acid, vinyl acetic acid, methyl methacrylate, methyl acrylate, ethyl acrylate, ethyl methacrylate, propyl methacrylate, propyl acrylate, n-butyl methacrylate, isobutyl methacrylate, 2-ethylhexyl methacrylate, 2-hexyl acrylate, lauryl methacrylate, Lauryl acrylate, stearyl methacrylate, stearyl acrylate, dodecyl methacrylate, dode Acrylate, hexyl methacrylate, hexyl acrylate, octyl methacrylate, octyl acrylate, cetyl methacrylate, cetyl acrylate, nonyl methacrylate, nonyl acrylate, decyl methacrylate, decyl acrylate, cyclohexyl methacrylate, cyclohexyl acrylate, glycidyl methacrylate, dimethylaminoethyl methacrylate, 2-methoxy Acrylate, 2 (2-ethoxyethoxy) ethyl acrylate,
2-hydroxyethyl methacrylate, diacetone acrylamide, N, N-dimethylaminopropylacrylamide, N, N-diethylacrylamide, isopropylacrylamide, diethylaminoethyl methacrylate, t-butyl methacrylate, N, N-dimethylacrylamide, α-methylstyrene, Homopolymers composed of monomers such as styrene, vinyltoluene and N-vinyl-2-pyrrolidone, and copolymers composed of two or more monomers selected from the above monomers, ethylene-acrylic acid copolymers, ethylene-methacrylic acid copolymers Examples thereof include polymers, polyolefin-based resins such as ethylene-vinyl acetate copolymer, polyvinyl formal, polyvinyl butyral, and the like.

Examples of the solvent include terpenes such as α-, β- and γ-terpineol, ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, diethylene glycol monoalkyl ethers, diethylene glycol dialkyl ethers, and ethylene glycol monoalkyl. Ether acetates, ethylene glycol dialkyl ether acetates, diethylene glycol monoalkyl ether acetates, diethylene glycol dialkyl ether acetates, propylene glycol monoalkyl ethers,
Examples include propylene glycol dialkyl ethers, propylene glycol monoalkyl ether acetates, propylene glycol dialkyl ether acetates, alcohols such as methanol, ethanol, isopropanol, 2-ethylhexanol, 1-butoxy-2-propanol, and the like. You may use individually or in mixture of 2 or more types.

Further, a plasticizer, an anti-settling agent, a dispersant and the like can be used as needed.

Next, a brief description will be given of a method of manufacturing the back plate having the partition walls 3 with reference to FIG.

First, an address electrode 8 is formed on the glass substrate 2 with a base layer 10 interposed therebetween. Examples of the method for forming the electrode 8 include: (1) a method of combining a thin film forming process such as a sputtering method or a vacuum evaporation method with a photo process;
(2) a method of pattern printing by a screen printing method, and (3) a method of combining a photolithography process with a coating method such as screen printing, blade coating, die coating, roll coating, and reverse coating.
As a photo process, there is a method in which a photoresist is applied and dried, and then patterned by an exposure and development process, or a method in which a photoresist is similarly patterned using a dry film resist. The thickness of the electrode is, for example, about 0.05 to 0.2 μm when Cr is used as an electrode material and the film is formed by a sputtering method. To form an electrode. The electrode material and the patterning method are not necessarily limited to these methods.

After forming the address electrode 8 of a predetermined pattern by using any of the above methods, a dielectric layer 6 'is formed, and the partition 3 is formed thereon. As a method for forming the partition wall 3, as described above, using the coating composition for forming a partition wall, a method of performing pattern printing on a partition wall shape by screen printing, or after forming a solid film by screen printing, blade coating, die coating, or the like, An example is a method in which a mask having sandblast resistance is formed in a pattern on a solid film, and an unnecessary portion of a partition wall forming material is removed by sandblasting to form a predetermined partition wall shape. Furthermore, a method of coating a paste on a film in advance, laminating the paste on a substrate, and similarly performing a sandblasting process is also exemplified. After forming the partition by any of the above methods, baking is performed to obtain a predetermined partition 3. The height of the partition wall 3 to be formed is about 50 μm to 250 μm. A phosphor layer 9 is formed between the partition walls 3 formed in this way. The phosphor layer 9 is usually formed by a photolithography process. After a photosensitive phosphor layer forming paint is applied and dried, exposure and development are performed to form a gap between the partition walls 3. The phosphor layer 9 is formed. The phosphor layer 9 is adhered to the upper end of the side wall of the partition 3 as shown in the figure.
This is a point where peeling at the contact boundary surface 9a at the upper end of the side surface is particularly problematic. The coating material for forming a phosphor layer contains a fluorescent powder, a polymer, a monomer, a polymerization initiator, a solvent, and various additives.

This manufacturing method can of course be applied to the DC type PDP shown in FIG.

[0041]

The present invention will be described in more detail with reference to specific examples below. In the examples, "parts" refers to parts by weight,
“%” Indicates “% by weight”. Experimental Example I Preparation of Frit Mixtures Various frit mixtures were prepared in the following manner.

Glass frit (Bi-based glass: MB-
014, manufactured by Matsunami Glass Industry)-Glass frit (Pb-based glass: WO-26, manufactured by Degussa Japan Co., Ltd.)-Aggregate (zirconia (EP zirconium oxide; manufactured by Daiichi Kagaku Kagaku Kogyo Co., Ltd.) Aggregates are shown in Tables 1-3 below
The zirconia content and the Bi-based glass content (content in the glass frit) shown in Table 1 were variously changed.・ Pigment (Dipiroxide Black # 9510 (manufactured by Dainichi Seika Kogyo)): It is blended and set to be 10 wt%. These are put in a container made of a fluororesin, and coated with paint conditioner RC-5000 (manufactured by Red Devil Co.).
Mix for various minutes to make various frit mixtures.

Preparation of Partition Wall Forming Material (Paste) Next, the following additives were added to the above frit mixture in the following manner to prepare various partition wall forming materials (pastes).

• The above-mentioned frit mixture (various): 80 parts • Ethocel STD-100FP (manufactured by Dow Chemical Company): 2 parts 9 parts After these were uniformly mixed, they were kneaded with a three-roll mill (manufactured by Inoue Seisakusho, C-4Ｃ / 4 × 10) to produce a paste.

A plate-like substrate using a partition wall forming material (paste)
Preparation of a sample The above-mentioned partition wall forming material (paste) was diluted with a screen oil 759 (manufactured by Okuno Pharmaceutical Co., Ltd.) on a 300 × 450 mm glass substrate, and a shear rate of 15 [1 / sec], 22
The viscosity was adjusted to 600 poise at ℃, and printing and drying were repeated 10 times each by screen printing, and the dry film thickness was 200
A μm solid film was produced. Thereafter, a peak temperature of 575
Firing was performed at a temperature of 20 ° C., a holding time of 20 minutes, and a total firing time of 2 hours to produce a plate-like sample having the same composition as the intended various partition walls. The baked surface of this plate-shaped sample was washed with acetone, and then dried at a temperature of 80 ° C. for 30 minutes.

Preparation of Phosphor Layer Forming Paste Three kinds of phosphor layer forming pastes G (Gre
en), B (Blue), and R (Red). (Paste G ) ・ Phosphor (NP-200; manufactured by Nichia Corporation) ... 55 parts ・ Hydroxypropylcellulose ... 6 parts ・ Pentaerythritol triacrylate ... 15 parts ・ Irgacure I907 (Ciba Geigy) ... 2 parts ・ 3- Methoxy-3-methyl-1-butanol 50 parts (paste B )-Phosphor (NP-107; manufactured by Nichia Corporation) 55 parts-Hydroxypropyl cellulose 6 parts-Pentaerythritol triacrylate 10 parts-Irga Cure I907 (manufactured by Ciba-Geigy) ... 3 parts-3-methoxy-3-methyl-1-butanol ... 50 parts (paste R )-Phosphor (NP-360; manufactured by Nichia Corporation) ... 55 parts-Hydroxypropyl cellulose ... 6 parts ・ Pentaerythritol triacrylate… 15 parts ・ Irga Yua I907 on the (Ciba Geigy) ... 2 parts of 3-methoxy-3-methyl-1-butanol ... plate-shaped sample made of the adhesion test the various partition wall composition of 50 parts of phosphor layers, each phosphor of the Each of the layer forming pastes G , B , and R was coated, dried, exposed (using a mask having an opening of 40 μm), and developed to form a predetermined phosphor layer pattern.
Then, the minimum required exposure amount (minimum required irradiation amount) in a state where the phosphor layer pattern did not peel off during the development for forming the pattern was determined. The smaller this minimum required exposure, the more
The adhesion was good, and the criteria for the adhesion were as follows.

…: A phosphor layer pattern can be formed in close contact with the minimum required exposure of 200 mJ or less.…: The minimum required exposure exceeds 200 mJ and is 1280 mJ.
A phosphor layer pattern can be formed in close contact with the following. ×: Even if the minimum required exposure amount exceeds 1280 mJ, the phosphor layer pattern does not remain due to development, or the rib (septum) after firing is such that the pattern is peeled off. ) State of pattern The state of the rib pattern after firing was confirmed, and ranking was performed according to the following criteria.

◎: The defect generation rate is low and extremely good.…: The defect generation rate is kept within the usable range.…: The defect portion can be repaired, and it can be used sufficiently after the repair. ×: The rib pattern is extremely brittle and cannot be used even if modified. The results of the adhesion test of the phosphor layer for each sample are shown in Table 1 below, and the rib (partition) pattern of each sample after firing is shown. The state is shown in Table 2 below. Table 1
Table 3 below shows a table comprehensively determined by superimposing the results of Table 2 and Table 2. In Table 3, "◎" indicates the optimal level,
“○” indicates a usable level, and “×” indicates an unusable level. In addition, the portions specified in a matrix by the zirconia content and the Bi content (content in the glass frit) in Tables 1 to 3 represent various samples.
That is, the number of samples in Tables 1 to 3 is 90.

[0049]

[Table 1]

[0050]

[Table 2]

[0051]

[Table 3] [Experimental Example II] The zirconia used as the aggregate used in [Experimental Example I] was replaced with zircon (MZ1000B;
Rare element chemical industry). Other than that, when the same experiment was performed according to the above [Experimental Example I],
It was confirmed that the same experimental results as those shown in FIG. [Experimental example III] Preparation of panel back plate A panel back plate was actually prepared in the following manner, and the effect of the partition wall of the plasma display panel was confirmed.

First, ELD-1155 (manufactured by Okuno Pharmaceutical Co., Ltd.) was printed as a base layer on a 300 × 450 mm glass substrate by screen printing, dried and baked to form a film having a thickness of 10 μm.
After forming an underlayer of m, D-590-HV-MOD (manufactured by ES L Japan) is printed as an address electrode on the underlayer in an electrode pattern by screen printing.
Baking, film thickness 8μm, line width 40μm, pitch 240μm
Electrodes were formed.

Next, PLS-3232 (manufactured by Nippon Electric Glass) was printed as a dielectric layer on the address electrode by screen printing, and dried and fired to form a 12 μm-thick dielectric layer.

Next, the coating composition (paste) for forming a partition wall within the scope of the present invention, in which preferable results were obtained in the above experimental examples, was diluted with a screen oil 759 (manufactured by Okuno Pharmaceutical Co., Ltd.) and a shear rate of 15 [1 / sec] was obtained. The viscosity was adjusted to 600 poise at 22 ° C., and printing and drying were repeated 10 times each by screen printing to produce a solid film having a dry film thickness of 200 μm. The substrate on which the solid film is formed is heated to 80 ° C., and a dry film resist (OS, manufactured by Tokyo Ohka Kogyo Co., Ltd.
After laminating the BR film BF-605), exposure was performed through a line pattern mask having a line width of 100 μm and a pitch of 240 μm using a parallel light printer using an ultra-high pressure mercury lamp as a light source. Exposure conditions are as follows: when measured at 365 μm, intensity 200 μW / cm ² , irradiation amount 80 mJ / c
m ² .

Next, using a 0.2% aqueous solution of anhydrous sodium carbonate, spray development was carried out at a liquid temperature of 35 ° C. to produce a sandblast mask, which was dried and then fused alumina A- #
Unnecessary portions were removed by sand blasting using 800 (made by Fujimi Abrasives) as a cutting material.

Next, using a 0.7% aqueous solution of sodium hydroxide, the sandblasting mask was peeled off at a liquid temperature of 30 ° C. and dried.
For 2 minutes, firing was performed for a total firing time of 2 hours to obtain partition walls having a line width of 65 μm and a height of 150 μm.

The above-mentioned paints G, B, and R for forming a phosphor layer were applied, dried, exposed, and developed, respectively, to form a predetermined phosphor layer pattern. as a result,
It was confirmed that the adhesion of the phosphor layer was extremely good. It was confirmed that the state of the rib (partition) pattern after firing was also good.

[0058]

The effects of the present invention are clear from the above results. That is, the present invention relates to a partition wall for a plasma display panel containing, as main components, a glass frit serving as a molten matrix of the partition wall, and an aggregate for mainly maintaining the shape and strength of the partition wall. 1) zirconia and / or zircon as an aggregate; (2)
Since the glass frit component contains Bi-based glass and the content ratio relationship between (1) and (2) is within a predetermined range, the adhesion between the partition walls and the phosphor layer is improved. It is possible to improve the product quality and the yield with less rib defects.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration example of an AC type PDP.

FIG. 2 is a cross-sectional view for explaining a structure of a back plate of FIG. 1;

FIG. 3 shows an example of the configuration of a DC PDP.
FIG. 3A is a plan view, and FIG.
It is sectional drawing in the XX line in (a).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Front plate 2 ... Back plate 3 ... Partition wall 4 ... Sustain electrode 5 ... Bus electrode 6 ... Dielectric layer 7 ... MgO layer 8 ... Address electrode

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Naoki Goto 1-1-1 Ichigaya-Kaga-cho, Shinjuku-ku, Tokyo F-term in Dai Nippon Printing Co., Ltd. 5C040 AA04 BB05 BB11 DD09

Claims (2)

[Claims] 1. A partition wall for a plasma display panel comprising, as main components, a glass frit serving as a molten matrix of the partition wall and an aggregate for mainly maintaining the shape and strength of the partition wall, wherein the partition wall comprises (1) ) Zirconia and / or zircon as aggregate and (2) B among glass frit components
A partition wall for a plasma display panel, comprising i-type glass, wherein the content relationship between the above (1) and (2) is within a range satisfying the following relationships (a) to (e). (A) When the total content of zirconia / zircon is more than 0 wt% and less than 0.5 wt%, B in the glass frit
a range in which the i-based glass contains 60 wt% or more and 90 wt% or less in the glass frit component; (b) Bi in the glass frit when the total content of zirconia / zircon is 0.5 wt% or more and less than 1 wt%.
A range in which the system glass contains 35 wt% to 90 wt% of the glass frit component; (c) a total of 1 wt% to 2 zirconia / zircon
When the content is less than 20 wt%, the Bi-based glass in the glass frit is contained in an amount of 20 wt% or more and 90 wt% of the glass frit component.
(d) a total content of zirconia / zircon of 2 wt% or more and 2
When the content is 0 wt% or less, Bi-based glass in the glass frit exceeds 0 wt% in the glass frit component and exceeds 9 wt%.
(E) When the total content of zirconia / zircon is more than 20 wt% and not more than 60 wt%, B in the glass frit
A range in which i-based glass is contained in an amount of more than 0 wt% and 65 wt% or less among glass frit components. 2. A plasma display panel having a partition partitioning a discharge space and a phosphor layer attached to the partition, wherein the partition comprises: (1) zirconia and / or zircon as an aggregate; and (2) B among glass frit components
A plasma display panel comprising an i-based glass, wherein the content ratio relationship between the above (1) and (2) is within a range satisfying the following relationships (a) to (e). (A) When the total content of zirconia / zircon is more than 0 wt% and less than 0.5 wt%, B in the glass frit
a range in which the i-based glass contains 60 wt% or more and 90 wt% or less in the glass frit component; (b) Bi in the glass frit when zirconia / zircon is contained in a total of 0.5 wt% or more and less than 1 wt%
A range in which the system glass contains 35 wt% to 90 wt% of the glass frit component; (c) a total of 1 wt% to 2 zirconia / zircon
When the content is less than 20 wt%, the Bi-based glass in the glass frit is contained in the glass frit component in an amount of 20 wt% or more and 90 wt% or more.
(d) a total content of zirconia / zircon of 2 wt% or more and 2
When the content is 0 wt% or less, Bi-based glass in the glass frit exceeds 0 wt% in the glass frit component and exceeds 9 wt%.
(E) When the total content of zirconia / zircon is more than 20 wt% and not more than 60 wt%, B in the glass frit
A range in which i-based glass is contained in an amount of more than 0 wt% and 65 wt% or less among glass frit components.