JP2000328288A - Formation of plating film on micropore or groove and its forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the penetration of a treating liquid into micropores or grooves and to improve the deposition characteristic therein by maintaining a material to be formed with a plating film in a reduced pressure atmosphere and executing treatment, such as plating, while spraying a treating liquid thereto. SOLUTION: The degreasing treatment in a surface treatment is executed in the reduced pressure atmosphere and is executed by injecting a degreasing treating liquid LD to an insulating tape material 2 in a degreasing treating vessel 4 via degreasing treating liquid injection nozzles 16a and 16b. As a result, the degreasing treating liquid LD infiltrates uniformly into the micropores or grooves of the insulating tape material 2 and the wettability of the inside of all the micropores or grooves with the degreasing treating liquid LD is improved and the deposition characteristic of the plating, i.e., the deposition characteristic of the plating film in the plating treatment of a post stage, is improved. Further, the surface treatment in the micropores or grooves of the insulating tape material 2 is uniformly and well carried out and, therefore, the conduction defects in a TAB tape to be manufactured by using a tape-like substrate 18 are decreased and electrical reliability is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for forming a plated film of fine holes or grooves, and more particularly to a method of forming a plated film of fine holes or grooves on a surface of a multilayer wiring board or a semiconductor wafer and an apparatus for forming the same. It is about.

[0002]

2. Description of the Related Art High integration and performance of semiconductor devices,
With the increase in the speed and the increase in the amount of heat generated, various types of multilayer wiring boards have been developed in consideration of high-density wiring, high-speed transmission, high heat dissipation, and the like, and some of them have begun to be applied.

[0003] As a multilayer wiring board, a plurality of wiring boards having a wiring pattern (copper foil pattern) formed on one surface of an insulating material are laminated to form a multilayer, and each wiring board is electrically connected via conductive projections (bumps). A method has been proposed (Japanese Patent Laid-Open No. 8-37375).

[0004] The bumps for making the wiring boards mutually conductive,
A method (via filling) of embedding a conductive material into a blind via hole or a fine through hole (hereinafter, referred to as a fine hole) formed on each wiring substrate is most often used. Many methods have been devised, such as a conductive paste embedding method.

[0005] Here, via filling by the plating method has less variation in the height of the conductive projections, is excellent in electric conductivity, and is advantageous in cost as compared with the conductive paste embedding method. A very useful method.

[0006] As described above, in the production of a multilayer wiring board, the plating process in the fine holes is an important elemental technology. The plating step mainly includes four steps of degreasing, pickling, plating, and water washing.

[0007]

However, the opening diameter of the fine holes formed at the time of manufacturing a multilayer wiring board is 300 μm.
m or less, and even smaller ones having a diameter of less than 100 μm. A degreasing solution, a pickling solution, a plating solution, or the like is penetrated into these micropores, and a cleaning process for forming a film and / or
Alternatively, in the case of performing an electrochemical treatment, if the pore diameter is small, the treatment liquid is difficult to enter, and a treatment failure is likely to occur.

Therefore, in order to promote the penetration of the processing solution into the micropores, a method of applying ultrasonic vibration in the processing solution or adding a surfactant having good permeability to the processing solution is employed. In the case of applying ultrasonic waves, there is a problem that adhesion between the copper foil pattern and the insulating plate is reduced, and the copper foil pattern is peeled off. In addition, when a surfactant is added to the processing liquid, the processing liquid easily foams, which may cause a decrease in workability.

Accordingly, the present invention solves the above-mentioned problems, and has a good penetration of a processing solution into micropores or grooves, and a plating method for micropores or grooves having good film-forming properties in micropores or grooves. An object of the present invention is to provide a film forming method and a film forming apparatus.

[0010]

According to a first aspect of the present invention, a material to be plated having fine holes or grooves is subjected to degreasing, pickling, plating, and water washing. In the method of forming a plating film by performing plating, the plating film forming material is maintained in a reduced pressure atmosphere, and a treatment such as plating is performed while a treatment liquid is sprayed on the plating film forming material.

According to a second aspect of the present invention, there is provided a method for forming a plated film by subjecting a material to be plated having fine holes or grooves to degreasing, pickling, plating, and rinsing to form a plated film. While maintaining the film forming material in a reduced-pressure atmosphere, performing a degreasing treatment while spraying a degreasing treatment liquid on the material to be plated, and performing an acid washing treatment, and then maintaining the material to be plated in a reduced-pressure atmosphere, The plating process is performed while spraying a plating solution onto the material to be plated.

According to the above method, the processing liquid is sprayed on the surface of the material to be plated after the material to be plated having the fine holes or grooves is held under reduced pressure, and thus, The treatment liquid can effectively penetrate, and the surface treatment in the fine holes or grooves can be performed uniformly (good).

As described above, by spraying the processing liquid while holding the material to be plated under a reduced pressure, the processing liquid effectively penetrates into the fine holes or the grooves only when the processing liquid is introduced into the processing liquid under the reduced pressure. This is because bubbles and decompressed gas components (in the case of a degreasing treatment liquid, dissolved oxygen, dissolved carbon dioxide gas, etc.) are easily removed from the treatment liquid. As a result, the treatment liquid efficiently penetrates into the fine holes or grooves of the material to be plated, and the wettability is improved, so that the surface treatment in the fine holes or grooves can be performed uniformly.

According to a third aspect of the present invention, the processing solution is degassed in advance, and then the processing solution is sprayed on the material for forming a film to be plated. It is a forming method.

According to the above method, since the degassed treatment liquid is sprayed on the surface of the material for forming the film to be plated, the surface treatment in the fine holes or grooves is further improved.

According to a fourth aspect of the present invention, there is provided an apparatus for forming a plated film by subjecting a material to be plated having fine holes or grooves to degreasing, pickling, plating, and rinsing to form a plated film. In the kept processing tank, one or a plurality of spray nozzles for spraying the processing liquid onto the surface of the material to be plated film introduced into the processing tank are provided.

According to a fifth aspect of the present invention, there is provided an apparatus for forming a plated film by subjecting a material to be plated having fine holes or grooves to degreasing, pickling, plating, and rinsing to form a plated film. In the kept degreasing tank and plating tank, one or more sprays for spraying a degreasing solution and a plating solution onto the surface of the material to be plated introduced into the degreasing tank and plating tank. An attachment nozzle is provided.

According to the above arrangement, the processing tank is formed so as to be able to hold a reduced-pressure atmosphere, and one or a plurality of spray nozzles are provided in the processing tank. And the surface treatment in the fine holes or grooves can be performed uniformly (good).

According to a sixth aspect of the present invention, there is provided an apparatus for forming a plating film having fine holes or grooves, wherein a vacuum pump is connected to a storage tank for supplying the processing liquid to the spray nozzle. It is.

According to the above arrangement, since the vacuum pump is connected to the storage tank, the processing liquid introduced into the storage tank can be degassed.

According to a seventh aspect of the present invention, there is provided an electronic device comprising a wiring substrate having fine holes or grooves, which is subjected to degreasing, pickling, plating, and washing to form a plating film on the surface of the wiring substrate. In the wiring substrate, a treatment such as plating is performed while spraying a processing liquid onto the wiring substrate maintained in a reduced-pressure atmosphere.

The invention according to claim 8 is a semiconductor wafer having fine holes or grooves, which is subjected to degreasing, pickling, plating,
In addition, in a semiconductor wafer for an electronic device in which a plating film is formed on the surface of a semiconductor wafer by performing a water washing process, a process such as plating is performed while spraying a processing solution on the semiconductor wafer maintained in a reduced pressure atmosphere.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to the accompanying drawings.

A problem with the surface treatment in the micropores or grooves is that bubbles enter the micropores or grooves, and the air bubbles become an insulating layer and are not conducted, so that surface treatment cannot be performed.

Therefore, as a result of various studies conducted by the present inventors, a processing tank for processing the material to be plated is kept in a reduced pressure atmosphere, and the processing liquid is applied to the surface of the material to be plated by using a nozzle. By spraying, the wettability in the micropores or grooves by the treatment liquid is improved, and even if bubbles are generated or penetrated, the separation is improved and the surface treatment can be uniformly performed. I found it.

FIG. 1 is a schematic view of a microporous or grooved plating film forming apparatus 1 according to the present invention.

As shown in FIG. 1, an apparatus 1 for forming a plating film having fine holes or grooves according to the present invention mainly comprises a delivery reel 3 for delivering an insulating tape material (material for forming a film to be plated) 2, A degreasing treatment tank 4 for performing a degreasing treatment on the delivered insulating tape material 2 and a pickling tank 5 for washing the insulating tape material 2 after the degreasing treatment with acid.
And an electrolytic copper plating tank (plating treatment tank) 6 for plating the insulating tape material 2 after pickling, and the tape-like substrate 1 after plating.
A washing tank 7 for washing the substrate 8 with water and a take-up reel 9 for winding a tape-like substrate 18 after washing with water.

At both ends in the width direction of the insulating tape material 2, sprocket holes (feed holes; not shown) are formed, and fine holes or grooves (not shown) are formed at predetermined positions (bump forming positions). The copper foil (or copper alloy foil) is formed on one side (or both sides).

The degreasing tank 4 comprises a shell-shaped degreasing tank body 1.
1 and shutter members 12 and 13 provided on the introduction side and the delivery side of the insulating tape material 2 in the degreasing tank body 11.
And a vacuum pump 14 connected to the degreasing tank main body 11 via a suction line 15, and a large number (eight in FIG. 1) of degreasing treatment liquid spray nozzles 16a provided inside the degreasing tank main body 11 , 16b. Here, the degreasing liquid jet nozzles 16a and 16b are provided facing the front and back sides (the upper and lower sides in FIG. 1) of the insulating tape material 2. The nozzles 16a and 16b include a groove-shaped nozzle in addition to a normal cylindrical nozzle. In addition, a slack tank 10 is provided before and after the degreasing tank 4.
a and 10b are provided.

A drying device 8 is provided between the washing tank 7 and the take-up reel 9 for drying water adhering to the surface of the tape-shaped substrate 18.

The degreasing degreasing liquid L _D treatment fluid ejection nozzle 1
6a, supply means for supplying to 16b are not particularly limited, after stored once the storage tank to a degreasing treatment liquid L _D (not shown), degreasing liquid injection nozzle 16a, 1
6b. At this time, in order to degas the degreasing liquid L _D in the storage tank, it is preferable to connect the vacuum pump (not shown) to the storage tank (not shown).

Next, a method for forming a plating film of a fine hole or groove according to the present invention will be described with reference to FIGS.

FIG. 5 shows the flow of the method for forming a plating film for micropores or grooves according to the present invention. Here, FIG. 5A shows a cross-sectional view of the insulating tape 51, and FIG.
1 shows a cross-sectional view after punching, and FIG.
5C shows a cross-sectional view after bonding the copper foil 53 to the insulating tape 51, FIG. 5D shows a cross-sectional view after plating the insulating tape material 2, and FIG. Is a tape-shaped substrate 1
8 shows a cross-sectional view after the copper foil 53 of No. 8 is etched. The same members as those in FIG. 1 are denoted by the same reference numerals.

First, the insulating tape 51 shown in FIG. 5A is punched, and as shown in FIG. 5B, the fine holes or grooves 52 and the sprocket holes (feed holes) penetrate through the insulating tape 51. 56 is formed. Then, FIG.
As shown in FIG. 5C, a copper foil 53 is adhered to one surface of the insulating tape (the lower surface in FIG. 5C), and the insulating tape material 2 is produced. After the insulating tape material 2 is sent out and wound on a reel 3, it is set in the plating film forming apparatus 1.

Thereafter, the insulating tape material 2 is sent out from the sending reel 3 by a predetermined length, and the insulating tape material 2 is guided into the degreasing tank 4, and then the running of the insulating tape material 2 is stopped. Here, the insulating tape material 2 in the degreasing tank 4
Of the insulation tape material 2 in other tanks even if the running of
Is always running, so that the slack tanks 10a and 10b are provided before and after the degreasing tank 4 to allow the insulating tape material 2 to run in another tank.

Next, after closing the shutter members 12 and 13, the vacuum pump 14 is operated and the suction line 1 is closed.
The pressure inside the degreasing tank 4 is reduced to a predetermined pressure through the step 5. Thereafter, degreasing liquid injection nozzle 16a, the degreasing liquid L _D injected from 16b, degreased the plated portion of the insulating tape 2 (fine holes or grooves 52 and the fine holes or grooves 52 periphery).

By the jetting under the reduced pressure, the degreasing treatment liquid L _D is introduced into the fine holes or grooves 52 in the insulating tape material 2.
There effectively infiltration, also with wettability with the degreasing liquid L _D in the fine holes or grooves 52 is improved, also leaves the bubble as the bubble in the micropores or groove 52 occurs, intrusion As a result, the degreasing treatment in the fine holes or grooves 52 can be performed uniformly. At this time, the degreasing treatment liquid L _D is previously depressurized and degassed, and the dissolved gas contained in the degreasing treatment liquid L _D is removed, and thereafter, the degreasing treatment is performed more effectively to perform the degreasing treatment. It becomes possible.

[0038] However, since holding the degreasing liquid L _D in a reduced pressure environment, a degreasing liquid L _D raise the temperature of the degreasing liquid L _D boils, the amount of degreasing liquid L _D is reduced There is a possibility that the composition of the degreasing liquid L _D may be destroyed. Therefore, in performing the fine holes or grooves plating film forming method of the present invention, as degreasing liquid L _D does not boil, it is necessary to appropriately adjust the degree of vacuum in accordance with the temperature of the degreasing liquid L _D.

Next, the insulating tape material 2 after the degreasing treatment is introduced into the pickling tank 5, and is washed with an acid (for example, sulfuric acid) in the open to the atmosphere to clean the portion to be plated of the insulating tape material 2. .

Next, the insulating tape material 2 after pickling is introduced into the electrolytic copper plating tank 6, and electrolytic copper plating is performed while the insulating tape material 2 is immersed in a plating solution (not shown). Since the copper foil 53 is exposed on the bottom surface of the fine hole or groove 52, a plating film is formed from the bottom surface of the fine hole or groove 52 by electrically conducting the copper foil 53 in a plating solution,
Bumps 54 are formed in the fine holes or grooves 52 by thick plating.

Next, the tape-like substrate 18 after electrolytic copper plating
Is introduced into a washing tank 7, washed with water, dried using a drying device 8 and taken up on a take-up reel 9.

Finally, the copper foil 5 on the tape-like substrate 18
After applying a photoresist to the non-bonded surface (the lower surface in FIG. 5D) of No. 3, a resist pattern is formed on the photoresist by exposure and development, and thereafter, etching is performed to form a copper foil fine pattern 55 on the lower surface. A TAB tape (wiring board for electronic device) 50 having the same is manufactured.

The method for forming a plating film of fine holes or grooves according to the present invention is not limited to the application to the degreasing tank 4 alone, but includes the degreasing tank 4, the pickling tank 5, the electrolytic copper plating tank 6, and the water washing. Needless to say, the present invention may be applied to a plurality of processing tanks such as the tank 7 in combination, thereby further improving the film forming property of the plating film in the fine holes or grooves 52.

The plating method in the method for forming a plating film for micropores or grooves of the present invention is not limited to electrolytic treatment (electroplating), but may be immersion treatment without applying electric energy or electroless plating. Needless to say.

According to the method for forming a plating film for micropores or grooves of the present invention, the degreasing treatment in the surface treatment is performed under a reduced pressure atmosphere, and the degreasing treatment liquid spray nozzles 16a, due to the injection degreased liquid L _D via 16b, degreasing liquid L _D in the micropores or grooves 52 are uniformly penetrates, wettability to degreasing treatment liquid L _D in all of the fine holes or grooves 52 Is good.

[0046] Furthermore, since wettability to degreasing treatment liquid L _D in the fine holes or grooves 52 is good, the plating treatment in a later step, plating deposition properties (film formability of the plated film) is improved.

Further, since the surface treatment in the fine holes or grooves 52 of the insulating tape material 2 is performed uniformly and favorably, in the TAB tape 50 manufactured using the tape-shaped substrate 18, conduction failure due to plating failure is reduced. Less, and high electrical reliability is obtained.

Next, another embodiment of the present invention (first embodiment and second embodiment) will be described with reference to the accompanying drawings.

FIG. 2 is a schematic view of the apparatus 21 for forming a plating film of fine holes or grooves according to the first embodiment, and FIG. 3 is an enlarged view of the plating tank 26 in FIG. The same members as those in FIG. 1 are denoted by the same reference numerals.

In the apparatus 1 for forming a plating film having fine holes or grooves according to the present invention, the degreasing tank 4 is formed so as to be able to hold a reduced-pressure atmosphere, and the degreasing liquid jet nozzles 16a and 16b are provided in the tank 4.
Was provided.

On the other hand, in the plating film forming apparatus 21 of the present embodiment, the electrolytic copper plating tank 26 is formed so as to be able to hold a reduced-pressure atmosphere, and the plating solution spray nozzle 3 is provided in the tank 26.
6a and 36b.

That is, as shown in FIGS. 2 and 3,
A delivery reel 3 for delivering the insulating tape material 2 and a degreasing tank 2 for performing a degreasing process on the delivered insulating tape material 2
4 and a pickling tank 5 for washing the insulating tape material 2 after degreasing with acid.
And an electrolytic copper plating tank 26 for plating the insulating tape material 2 after pickling, a washing tank 7 for washing the plated tape-like substrate 18 with water, and a take-up reel for winding the tape-like substrate 18 after washing. 9.

The electrolytic copper plating tank 26 includes a plating tank main body 31.
Shutter members 32 and 33 provided on the introduction side and the delivery side of the insulating tape material 2, a vacuum pump 34 connected to the plating tank main body 31 via a suction line 35,
It is composed of a large number (eight in FIG. 2 and nine in FIG. 3) of plating solution jet nozzles 36a and 36b provided facing the inside of the plating tank main body 31.

Here, the plating solution spray nozzles 36a, 36
b denotes the front and back sides of the insulating tape material 2 (FIGS. 2 and 3).
(The upper surface / lower surface side in the figure). In addition, at each end of the plating solution spray nozzles 36a and 36b,
A platinum net 39 as an anode is provided. Further, a pair of cathode power supply rollers 37 are provided on the introduction side and the delivery side of the insulating tape material 2 in the vicinity of the electrolytic copper plating tank 26.
a and 37b are provided. Further, slack tanks 20a and 20b are provided before and after the electrolytic copper plating tank 26.
Is provided.

Next, a method of forming a plating film for a fine hole or groove according to the present embodiment will be described with reference to FIGS. 2, 3 and 5.

After the insulating tape material 2 produced in the same manner as in the present invention is sent out and wound on a reel 3, it is set in a plating film forming apparatus 21.

Thereafter, the insulating tape material 2 is sent out from the delivery reel 3 and the insulating tape material 2 is introduced into the degreasing tank 24, immersed and degreased in the open to the atmosphere, and the portion of the insulating tape material 2 to be plated ( The fine holes or grooves 52 and the periphery of the fine holes or grooves 52 are degreased.

Next, the insulating tape material 2 after the degreasing treatment is introduced into the pickling tank 5 and washed with an acid (for example, sulfuric acid) in the open to the atmosphere to clean the portion of the insulating tape material 2 to be plated. .

Next, the insulating tape material 2 after pickling is sent out for a predetermined length and introduced into the electrolytic copper plating tank 26, and then the running of the insulating tape material 2 is stopped. Here, even though the running of the insulating tape material 2 in the electrolytic copper plating tank 26 is stopped, the insulating tape material 2 is always running in other tanks. By providing the slack tanks 20a and 20b, the running of the insulating tape material 2 in another tank is enabled.

Next, after closing the shutter members 32 and 33, the vacuum pump 34 is operated and the suction line 3 is closed.
The pressure in the electrolytic copper plating tank 26 is reduced to a predetermined pressure through the step 5. Thereafter, the cathode feed roller 37a, thereby charging the insulating tape 2 to the negative with 37b, and injection plating solution injection nozzle 36a, the plating liquid L _M which is charged positively from 36b in the insulating tape 2, copper Perform plating. As shown in FIG. 5, since the copper foil 53 is exposed from the bottom surface of the fine hole or groove 52, by electrically conducting the copper foil 53 in the plating solution, A plating film is formed, and bumps 54 are formed in the fine holes or grooves 52 by thick plating.

[0061] Wetting of the injection in the vacuum state, the plating solution L _M effectively penetrate into the fine pores or grooves 52 in the insulating tape 2, also the plating liquid L _M in the fine holes or grooves 52 As a result, even if air bubbles are generated or penetrated into the fine holes or grooves 52, the separation of the air bubbles is improved, and the plating treatment in the fine holes or grooves 52 can be performed uniformly. At this time, along with degassed beforehand under reduced pressure to a plating solution L _M, leave remove dissolved gas contained in the plating solution L _M, then by subjecting the injection be carried out plating treatment more effectively It becomes possible.

[0062] However, the plating solution for the L _M held in the reduced pressure environment, the plating solution L the plating solution L _M and increasing the temperature of the _M boils, the plating solution decreases the amount of the plating liquid L _M L
The composition of _M may be destroyed. Therefore, even when performing the plating film forming method of micropores or grooves of this embodiment, as the plating liquid L _M does not boil, it is necessary to appropriately adjust the degree of vacuum in accordance with the temperature of the plating solution L _M .

Next, the tape-like substrate 18 after electrolytic copper plating
Is introduced into a washing tank 7, washed with water, dried using a drying device 8 and taken up on a take-up reel 9.

Finally, the copper foil 5 on the tape-like substrate 18
After applying a photoresist to the non-bonding surface (the lower surface in FIG. 5D) of No. 3, a resist pattern is formed on the photoresist by exposure and development, and thereafter, etching is performed to form the copper foil fine pattern 55 on the lower surface. The TAB tape 50 is prepared.

According to the method for forming a plating film for micro holes or grooves according to the present embodiment, the plating treatment in the surface treatment is performed under a reduced pressure atmosphere, and the plating solution spray nozzle is applied to the insulating tape material 2 in the electrolytic copper plating tank 26. 36a, since the ejecting the plating solution L _M via 36b, also enables good separation of bubbles as the bubbles in the micropores or groove 52 occurs, penetration plating solution L _M in the micropores or groove 52 Can be uniformly infiltrated.

The plating solution L is placed in the fine holes or grooves 52.
_{Since M} uniformly penetrates, the deposition property (plating film forming property) of plating in the fine holes or grooves 52 is improved.

FIG. 4 is a schematic view of a fine hole or groove plating film forming apparatus 41 according to the second embodiment. The same members as those in FIGS. 1 to 3 are denoted by the same reference numerals.

In the apparatus 1 for forming a plating film having fine holes or grooves according to the present invention, the degreasing tank 4 is formed so as to be able to maintain a reduced-pressure atmosphere, and the degreasing liquid jet nozzles 16a and 16b are provided in the tank 4.
In the plating film forming apparatus 21 of the first embodiment, an electrolytic copper plating tank 26 is formed so as to be able to hold a reduced-pressure atmosphere, and a plating solution spray nozzle 36 is provided in the tank 26.
a, 36b.

On the other hand, in the plating film forming apparatus 41 for fine holes or grooves according to the present embodiment, the degreasing tank 4 and the electrolytic copper plating tank 26 are formed so as to be able to hold a reduced-pressure atmosphere, and the degreasing is performed in the tank 4. The plating solution injection nozzles 36a and 36b are provided in the processing solution injection nozzles 16a and 16b and the tank 26.

That is, as shown in FIG. 4, a delivery reel 3 for delivering the insulating tape material 2, a degreasing treatment tank 4 for performing a degreasing treatment on the delivered insulating tape material 2, and an insulating material after the degreasing treatment A pickling tank 5 for washing the tape material 2 with acid, an electrolytic copper plating tank 26 for plating the insulating tape material 2 after pickling,
It comprises a water washing tank 7 for washing the tape-like substrate 18 after plating with water, and a take-up reel 9 for winding the tape-like substrate 18 after washing.

The slack tanks 10 a and 10 b are provided before and after the degreasing tank 4, and the slack tanks 20 a and 20 b are provided before and after the electrolytic copper plating tank 26.

In the method for forming a plating film for fine holes or grooves using the apparatus 41 for forming a plating film for fine holes or grooves according to the present embodiment, the present invention and the method for forming a plating film for fine holes or grooves according to the first embodiment are also used. the plating film forming method same effects as the fine holes or grooves using a plated film forming apparatus 1, 21 is obtained, not to mention the wettability is further improved with respect to the degreasing treatment liquid L _D in the fine holes or grooves 52 Along with
A new effect that the film formability of the plating film in the fine holes or grooves 52 is further improved is exhibited.

[0073]

EXAMPLES Example 1 A reel-shaped polyimide tape material having a thickness of 50 μm and having a polyimide adhesive applied on one side to a thickness of about 12 μm (trade name: Iupilex, Ube Industries, Ltd.) Then, a sprocket hole (feeding hole) is formed by a punching method, and a predetermined position of the polyimide tape material (a position where a projection is formed by plating).
Then, micropores having a diameter of 200 μm are formed.

Next, a copper foil having a thickness of 18 μm is thermocompression-bonded to the adhesive-coated surface of the polyimide tape material using a roll laminator to produce an insulating tape material. This insulating tape material was subjected to a surface treatment using the plating film forming apparatus shown in FIG.

Here, the pressure in the degreasing tank is 1.6 × 1
0 ⁴ Pa (120 Torr = 0.16 atm), and all surface treatments after degreasing were performed in the open to the atmosphere (at atmospheric pressure). Sulfuric acid was used as an acid in the pickling tank, and a copper sulfate bath was used as a plating solution.

The plating is performed by electrolytic copper plating by an immersion method, and the composition of the plating solution is 90 g / copper sulfate (pentahydrate).
1, concentrated sulfuric acid 180g / l, commercial additive 10ml / l
The liquid temperature was 25 ° C., the current density was 5 A / dm ² , and the plating thickness (height) was 60 μm so that the bumps protruded from the polyimide tape material.

When the degreasing treatment is carried out by the ordinary immersion method at atmospheric pressure, the degreasing liquid does not uniformly penetrate into the fine pores. In the plating step, poor plating deposition in the fine holes was observed.

On the other hand, in the case of the plating film forming method of Example 1, the degreasing treatment liquid is sprayed onto the insulating tape material under a reduced pressure environment, so that the degreasing treatment liquid uniformly penetrates into all the fine holes. In addition, the wettability to the degreasing treatment liquid is improved in all the micropores. Therefore, in the subsequent plating step,
No poor plating deposition in the micropores was observed.

Example 2 A surface treatment was performed on the insulating tape material manufactured in the same manner as in Example 1 using the plating film forming apparatus shown in FIG.

Here, the pressure in the electrolytic copper plating tank was 1.6.
× 10 ⁴ Pa (120 Torr = 0.16 atm), and all surface treatments except the plating treatment were performed in the open to the atmosphere (at atmospheric pressure). Sulfuric acid was used as an acid in the pickling tank, and a copper sulfate bath was used as a plating solution.

The plating was performed by electrolytic copper plating by nozzle injection under a reduced pressure atmosphere. The composition of the plating solution was 90 g / l of copper sulfate (pentahydrate), 180 g / l of concentrated sulfuric acid, and 10 ml / l of a commercially available additive. l, the liquid temperature is 25 ° C, and the current density is 5
A / dm ² and the plating thickness (height) were set to 60 μm so that the bumps protruded from the polyimide tape material.

When the electrolytic copper plating is carried out by the ordinary immersion method under the atmospheric pressure, hydrogen gas generated by the side reaction at the time of plating is not sufficiently removed from the inside of the fine holes, and hydrogen gas is present in the fine holes as bubbles. Therefore, many micropores that are not completely filled by plating are generated, and poor plating deposition in the micropores has been observed.

On the other hand, in the case of the plating film forming method of Example 2, by spraying the plating solution onto the insulating tape material under a reduced pressure environment, the bubbles can be well separated from the inside of the fine holes. For this reason, no plating deposition failure in the fine holes was observed at all.

The present invention is not limited to the surface treatment in the fine holes in the TAB tape (wiring board for electronic device) 50. For example, the contact protrusion for KGD (Known Good Die) inspection is formed by plating. It can be applied to the case of forming. That is, photofabrication is performed on a thick dry film resist to form fine holes, and the fine holes are subjected to thick plating, and thereafter,
When removing the resist to form the contact protrusions,
The present invention can be applied to a thick plating process.

The present invention can also be applied to the case of performing a surface treatment in a fine hole in a semiconductor wafer for an electronic device. For example, when forming a gold projection for TAB connection on an aluminum pad of a semiconductor device of a semiconductor wafer by plating, by applying the present invention, a fine hole of a thick photoresist formed on the surface of the semiconductor wafer is formed. On the other hand, surface treatment can be performed favorably.

Further, recently, it has been studied to replace a semiconductor circuit wiring on a semiconductor wafer for an electronic device with a copper wiring from a conventional aluminum wiring, and as a method for forming the copper wiring, a film formation by an electroplating method is used. Considered good.
Here, when the semiconductor circuit wiring is formed on the semiconductor wafer by plating, by applying the present invention, a small opening (an opening diameter of 1 μm or less) which cannot be compared with the fine hole on the wiring board or the aluminum pad. ) Can be satisfactorily plated.

[0087]

In summary, according to the present invention, the surface treatment for the material to be plated having fine holes or grooves is performed by:
Under a reduced pressure atmosphere, and by injecting the processing liquid through the injection nozzle to the plating film forming material in the processing tank, the processing liquid uniformly penetrates into the fine holes or grooves, and An excellent effect that the film formability of the plating film is improved is exhibited.

[Brief description of the drawings]

FIG. 1 is a schematic view of an apparatus for forming a plating film having fine holes or grooves according to the present invention.

FIG. 2 is a schematic view of an apparatus for forming a plating film of fine holes or grooves according to the first embodiment.

FIG. 3 is an enlarged view of a plating tank in FIG.

FIG. 4 is a schematic diagram of an apparatus for forming a plated film of micro holes or grooves according to a second embodiment.

FIG. 5 is a flowchart of a method for forming a plating film of a fine hole or groove according to the present invention.

[Explanation of symbols]

2 Insulating tape material (Plating film forming material) 4,24 Degreasing tank 6,26 Plating tank 16a, 16b Degreasing liquid jet nozzle 36a, 36b Plating liquid jet nozzle 50 TAB tape (wiring board for electronic device) 52 Fine Hole or groove L _D Degreasing solution (Treatment solution) L _M Plating solution (Treatment solution)

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor: Mamoru Mita 3-1-1, Sukekawa-cho, Hitachi City, Ibaraki Prefecture Inside the cable plant of Hitachi Cable Co., Ltd. 17 F-term (reference) 4K024 AA09 AB01 AB08 BA09 BA11 BB11 BB12 BC01 CA16 CB01 CB13 CB18 CB26 DA03 DA04 DB10 GA16 4M104 BB04 BB09 DD52 DD53 HH13 5E317 AA24 BB03 BB12 CC33 CC42 CD01 CD03 CD11 CC32 A CC02 CC10 CC32 CC02 CC10 DD02 DD24 DD32 GG02 GG13 GG16 HH33

Claims (8)

[Claims] 1. A method for forming a plating film by subjecting a material to be plated having fine holes or grooves to a degreasing treatment, an acid washing treatment, a plating treatment, and a water washing treatment, wherein the plating film forming material is depressurized. A method for forming a plating film having fine holes or grooves, characterized in that a treatment such as plating is performed while maintaining an atmosphere and spraying a processing solution onto a material for forming a film to be plated. 2. A method for forming a plating film by subjecting a material to be plated having fine holes or grooves to a degreasing treatment, an acid washing treatment, a plating treatment, and a water washing treatment, wherein the plating film forming material is depressurized. After performing the degreasing treatment while spraying the degreasing treatment liquid on the plating film forming material while maintaining the atmosphere,
A method of forming a plating film for micro-holes or grooves, wherein the plating material is subjected to an acid pickling process, and thereafter, the plating material is kept in a reduced pressure atmosphere, and the plating process is performed while spraying a plating solution onto the plating material. . 3. The method according to claim 1, wherein the treatment liquid is degassed in advance, and then the treatment liquid is sprayed on the material to be plated. 4. An apparatus for forming a plating film by subjecting a material to be plated having fine holes or grooves to a degreasing treatment, an acid washing treatment, a plating treatment, and a water washing treatment, wherein the treatment tank is maintained at a reduced pressure atmosphere. Wherein one or a plurality of spray nozzles for spraying a processing solution onto the surface of the material to be plated introduced into the processing bath are provided therein. 5. An apparatus for forming a plating film by subjecting a material to be plated having fine holes or grooves to a degreasing treatment, an acid washing treatment, a plating treatment, and a water washing treatment, wherein the degreasing treatment is performed under a reduced pressure atmosphere. One or a plurality of spray nozzles for spraying a degreasing treatment liquid and a plating solution on the surface of the plating film forming material introduced into the degreasing treatment tank and the plating treatment tank are provided in the tank and the plating treatment tank. An apparatus for forming a plating film having fine holes or grooves. 6. A vacuum pump is connected to a storage tank for supplying the processing liquid to the spray nozzle.
6. A plating film forming apparatus for micro holes or grooves according to claim 5. 7. An electronic device wiring board in which a wiring board having fine holes or grooves is subjected to a degreasing treatment, an acid washing treatment, a plating treatment, and a water washing treatment to form a plating film on the surface of the wiring board. A wiring board for an electronic device using a method for forming a plating film of fine holes or grooves, wherein a processing such as plating is performed while spraying a processing solution onto the wiring board kept in an atmosphere. 8. A semiconductor wafer for an electronic device in which a semiconductor wafer having fine holes or grooves is subjected to degreasing, pickling, plating, and water washing to form a plating film on the semiconductor wafer surface. A semiconductor wafer for an electronic device using a method for forming a plating film of fine holes or grooves, characterized in that processing such as plating is performed while spraying a processing solution onto the semiconductor wafer kept in an atmosphere.