JP2000328006A - Emc module and its manufacture - Google Patents
Emc module and its manufactureInfo
- Publication number
- JP2000328006A JP2000328006A JP13588499A JP13588499A JP2000328006A JP 2000328006 A JP2000328006 A JP 2000328006A JP 13588499 A JP13588499 A JP 13588499A JP 13588499 A JP13588499 A JP 13588499A JP 2000328006 A JP2000328006 A JP 2000328006A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- electromagnetic
- wave absorbing
- paste
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Paints Or Removers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＥＭＣモジュール及
びその製造方法に関する。より詳しくは、印刷法により
電磁波吸収ペーストを塗布したＥＭＣモジュール及びそ
の製造方法に関するものである。The present invention relates to an EMC module and a method for manufacturing the same. More specifically, the present invention relates to an EMC module coated with an electromagnetic wave absorbing paste by a printing method and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】電磁波ノイズに対しシールド機能を有す
るＥＭＣ（Electromagnetic Compatibility）モジュー
ル が開発されている。このようなＥＭＣモジュールの
電磁ノイズ対策方法として、金属シールドケースによ
り、実装済みプリント配線板上の電子部品を覆ってシー
ルドする方法や、フェライト等の電磁波吸収材料を分
散させて形成した粘着剤付き電磁波吸収テープをシール
ドすべき電子部品の表面に貼付する方法等が用いられて
いる。2. Description of the Related Art An EMC (Electromagnetic Compatibility) module having a shielding function against electromagnetic noise has been developed. As a method of preventing electromagnetic noise of such an EMC module, a method of covering an electronic component on a mounted printed wiring board with a metal shield case to shield the electromagnetic wave, or a method of dispersing an electromagnetic wave absorbing material such as ferrite to form an electromagnetic wave with an adhesive. A method of attaching an absorbing tape to the surface of an electronic component to be shielded or the like is used.
【０００３】一方、電磁波吸収ペーストを用いた電子部
品の電磁シールド構造が特開平８−１２９０４号公報
に開示され、またスラリー含浸法による電磁シールド層
をコーティングしたノイズ抑制型電子装置が特開平９
−１１６２８９号公報に開示されている。On the other hand, an electromagnetic shielding structure of an electronic component using an electromagnetic wave absorbing paste is disclosed in Japanese Patent Application Laid-Open No. Hei 8-12904, and a noise suppression type electronic device coated with an electromagnetic shielding layer by a slurry impregnation method is disclosed in Japanese Patent Application Laid-Open No. Hei 9 (1999).
-116289.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記
の金属シールドケースを用いる方法では、部品に合せた
ケース形状の加工が必要になり、またスペースを多く占
有するため高密度実装への対応が十分できない。また、
金属ケースを用いるため電子機器の軽量化が図られな
い。However, in the above-mentioned method using the metal shield case, it is necessary to process the case shape according to the parts, and the space occupies a large amount, so that it is not possible to sufficiently cope with high-density mounting. . Also,
Since the metal case is used, the weight of the electronic device cannot be reduced.
【０００５】また、上記の電磁波吸収テープを用いる
方法では、テープに含有される電磁波吸収材料の含有量
に限界があり（５０ｗｔ％以下）、その効果も３ｄＢ以
下であり十分大きなシールド効果が得られない。In the method using the electromagnetic wave absorbing tape, the content of the electromagnetic wave absorbing material contained in the tape is limited (50 wt% or less), and the effect is 3 dB or less, and a sufficiently large shielding effect can be obtained. Absent.
【０００６】また、上記の公報記載の電磁シールド構
造においては、基板を電磁波吸収ペーストの浴に浸漬し
てシールド層を形成するものであり、膜の均一化や選択
的な形成がむずかしい。また、シールド効果を高めるた
めに膜厚を厚くしようとすれば、ディッピング回数を増
やす等の処理が必要になりプロセスが複雑になる。Further, in the electromagnetic shield structure described in the above publication, the substrate is immersed in a bath of an electromagnetic wave absorbing paste to form a shield layer, and it is difficult to make the film uniform and selective. Further, if the film thickness is to be increased in order to enhance the shielding effect, processing such as increasing the number of times of dipping is required, and the process becomes complicated.
【０００７】また、上記の公報記載のノイズ抑制構造
においては、スラリー含浸法によりシールド層を形成す
るため、上記の構造と同様に、膜の均一化や選択的な
形成がむずかしく、また膜厚を厚くしようとしたときの
プロセスが面倒になる。In the noise suppression structure described in the above publication, since the shield layer is formed by the slurry impregnation method, uniformity and selective formation of the film are difficult as in the above structure, and the film thickness is reduced. The process when trying to thicken is cumbersome.
【０００８】本発明は上記従来技術を考慮したものであ
って、簡単な塗布プロセスでシールド層（電磁波吸収
層）を形成することができ、小型軽量で大きなシールド
効果（電磁波吸収効果）が得られるＥＭＣモジュール及
びその製造方法の提供を目的とする。The present invention has been made in consideration of the above-mentioned prior art, and a shield layer (electromagnetic wave absorbing layer) can be formed by a simple coating process, and a small and lightweight shield effect (electromagnetic wave absorbing effect) can be obtained. An EMC module and a method for manufacturing the same are provided.
【０００９】[0009]
【課題を解決するための手段】前記目的を達成するた
め、本発明では、電子部品を搭載したプリント配線板の
部品搭載面の全面またはその一部が、印刷により形成さ
れた電磁波吸収ペーストからなる電磁シールド層により
覆われていることを特徴とするＥＭＣモジュールを提供
する。In order to achieve the above object, according to the present invention, the whole or a part of the component mounting surface of a printed wiring board on which electronic components are mounted is made of an electromagnetic wave absorbing paste formed by printing. An EMC module covered with an electromagnetic shield layer is provided.
【００１０】この構成によれば、電磁波吸収ペーストが
印刷法により形成されるため、簡単なプロセスで高精度
で所望の位置にシールド層を形成することができ、小型
軽量で高い電磁波吸収特性を有する高密度実装のＥＭＣ
モジュールが得られる。According to this structure, since the electromagnetic wave absorbing paste is formed by the printing method, the shield layer can be formed at a desired position with high accuracy by a simple process, and has a small size, light weight and high electromagnetic wave absorbing characteristics. EMC of high-density mounting
A module is obtained.
【００１１】好ましい構成例では、前記電磁波吸収ペー
ストは、磁性体材料と誘電体材料からなるフェライト系
複合粉末と低収縮応力タイプのエポキシ樹脂を混合した
熱硬化型のペーストであることを特徴としている。In a preferred configuration example, the electromagnetic wave absorbing paste is a thermosetting paste obtained by mixing a ferrite composite powder composed of a magnetic material and a dielectric material with a low-shrinkage stress type epoxy resin. .
【００１２】この構成によれば、特に電磁障害として問
題となる３００ＭＨｚ〜５ＧＨｚの周波数帯域の電磁波
に対する吸収特性が大きいフェライト系複合粉末を低収
縮応力タイプのバインダーで結合したペーストを用いて
シールド層を形成するため、高い電磁シールド構造が得
られるとともにペースト硬化後の基板の反り等が発生せ
ず高い電磁シールド効果が維持される。According to this structure, the shield layer is formed by using a paste obtained by bonding a ferrite-based composite powder having a large absorption characteristic to electromagnetic waves in a frequency band of 300 MHz to 5 GHz, which is a problem as electromagnetic interference, with a binder of a low shrinkage stress type. As a result, a high electromagnetic shielding structure can be obtained, and a high electromagnetic shielding effect can be maintained without warping of the substrate after the paste is cured.
【００１３】さらに好ましい構成例では、前記フェライ
ト系複合粉末の磁性体材料はＮｉＯ，ＺｎＯおよびＦｅ
2Ｏ3 からなり、誘電体材料はＣｕＯからなることを特
徴としている。In a further preferred configuration example, the magnetic material of the ferrite-based composite powder is NiO, ZnO and Fe.
It is made of 2 O 3 , and the dielectric material is made of CuO.
【００１４】このような構成のフェライト系複合粉末を
用いることにより、十分大きいノイズ低減効果を有する
電磁波吸収ペーストが実現される。By using the ferrite-based composite powder having such a constitution, an electromagnetic wave absorbing paste having a sufficiently large noise reduction effect is realized.
【００１５】さらに本発明では、電子部品を搭載したプ
リント配線板の部品搭載面の全面またはその一部に、電
磁波吸収ペーストをメタルスクリーンを用いて、真空中
で印刷、または印刷後に真空処理を施したことを特徴と
するＥＭＣモジュールの製造方法を提供する。Further, according to the present invention, an electromagnetic wave absorbing paste is printed in a vacuum on a metal screen on a whole or a part of the component mounting surface of a printed wiring board on which electronic components are mounted, or a vacuum process is performed after the printing. A method of manufacturing an EMC module is provided.
【００１６】この構成によれば、簡単なプロセスにより
十分な膜厚で、平滑で且つピンホールの発生が抑制され
た高品質のＥＭＣモジュールが形成される。According to this configuration, a high-quality EMC module having a sufficient film thickness, smoothness and suppressed generation of pinholes is formed by a simple process.
【００１７】[0017]
【発明の実施の形態】以下図面を参照して本発明の実施
の形態について説明する。図１（Ａ）（Ｂ）は、それぞ
れ本発明の電磁波吸収ペーストを塗布する前および後の
ＥＭＣモジュールの断面図である。Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B are cross-sectional views of an EMC module before and after applying the electromagnetic wave absorbing paste of the present invention, respectively.
【００１８】（Ａ）に示すように、プリント配線板１の
上面に複数の不要輻射ノイズの大きい又は電磁波ノイズ
を発生しやすい半導体パッケージ（電子部品）２および
その他の電子部品３が実装される。これらの半導体パッ
ケージ２は、ＯＰ（OutlinePackage）やＱＦＰ（Quad F
lat Package）あるいはＣＳＰ（Chip Size Package）等
からなる電子部品である。プリント配線板１の上面には
電極パターン４が形成され、この電極パターン４上に各
半導体パッケージ２のリード端子５が半田接合され、ま
た電子部品３が半田６により接合される。プリント配線
板１は、片面プリント板でもよいし、両面プリント板あ
るいは多層プリント板であってもよい。 このような実
装済みプリント配線板１の部品実装面に、内部応力の小
さい高純度の熱硬化型エポキシ樹脂をバインダーとし
て、これに高磁性体と高誘電体からなるフェライト系複
合粉末を混練した電磁波吸収ペーストを印刷により塗布
する。印刷はステンレス等のメタルスクリーンを用い、
プリント配線板１の全面または電磁シールドすべき半導
体パッケージ２を覆うように印刷する。印刷後、真空脱
泡して印刷したペースト内部の泡を除去する。この場
合、真空印刷機を用いて、真空中で印刷することにより
脱泡してもよい。As shown in FIG. 1A, a plurality of semiconductor packages (electronic parts) 2 and other electronic parts 3 having large unnecessary radiation noise or easily generating electromagnetic wave noise are mounted on the upper surface of the printed wiring board 1. These semiconductor packages 2 include OP (Outline Package) and QFP (Quad F
lat package) or CSP (Chip Size Package). An electrode pattern 4 is formed on the upper surface of the printed wiring board 1, and a lead terminal 5 of each semiconductor package 2 is soldered on the electrode pattern 4, and an electronic component 3 is joined by solder 6. The printed wiring board 1 may be a single-sided printed board, a double-sided printed board, or a multilayer printed board. An electromagnetic wave obtained by kneading a ferrite-based composite powder composed of a high magnetic substance and a high dielectric substance with a binder made of a high-purity thermosetting epoxy resin having a small internal stress on a component mounting surface of such a mounted printed wiring board 1. The absorbent paste is applied by printing. The printing uses a metal screen such as stainless steel,
Printing is performed so as to cover the entire surface of the printed wiring board 1 or the semiconductor package 2 to be electromagnetically shielded. After printing, the inside of the printed paste is removed by vacuum defoaming. In this case, defoaming may be performed by printing in a vacuum using a vacuum printer.
【００１９】次に、１００〜１２０℃で１〜２時間仮硬
化し、さらに１５０℃で３０分〜１時間本硬化させ、
（Ｂ）に示すように、厚さ５００μｍ〜１．０ｍｍの電
磁波吸収材からなる電磁シールド層（電磁波吸収層）７
を形成する。これによりＥＭＣモジュール８が形成され
る。Next, the composition is temporarily cured at 100 to 120 ° C. for 1 to 2 hours, and further fully cured at 150 ° C. for 30 minutes to 1 hour.
As shown in (B), an electromagnetic shielding layer (electromagnetic wave absorbing layer) 7 made of an electromagnetic wave absorbing material having a thickness of 500 μm to 1.0 mm.
To form Thus, the EMC module 8 is formed.
【００２０】[0020]
【実施例】フェライト系複合粉末として、ＮｉＯ，Ｚｎ
Ｏ，ＣｕＯ，Ｆｅ2Ｏ3の混合体を用いた。この場合、Ｎ
ｉＯを１０〜２０ｗｔ％、ＺｎＯを１０〜２０ｗｔ％、
ＣｕＯを１５〜２５ｗｔ％、Ｆｅ2Ｏ3を５０ｗｔ％の組
成としたときに良好な電磁波吸収特性が得られた。EXAMPLES As ferrite-based composite powder, NiO, Zn
A mixture of O, CuO, and Fe 2 O 3 was used. In this case, N
10-20 wt% of iO, 10-20 wt% of ZnO,
Good electromagnetic wave absorption characteristics were obtained when the composition of CuO was 15 to 25 wt% and Fe 2 O 3 was 50 wt%.
【００２１】このときの平均粒子径は５〜１５μｍであ
った。この場合、粒子径は２〜１０μｍであることがノ
イズ除去効果上さらに好ましい。なお、ＮｉＯ、ＺｎＯ
およびＦｅ2Ｏ3は高磁性体であり、ＣｕＯは高誘電体で
ある。The average particle size at this time was 5 to 15 μm. In this case, the particle diameter is more preferably 2 to 10 μm from the viewpoint of the noise removal effect. Note that NiO, ZnO
And Fe 2 O 3 are high magnetic substances, and CuO is a high dielectric substance.
【００２２】フェライト系複合粉末の添加量とノイズ除
去効果および印刷性については、添加量が６０ｗｔ％以
下のときは、印刷性は良好であったが添加量が少な過ぎ
てノイズ除去効果はほとんどなく、添加量が６０〜７０
ｗｔ％ではノイズ除去効果は５ｄＢで印刷性は良好、添
加量が７０〜８０ｗｔ％ではノイズ除去効果は８ｄＢで
印刷性は良好、添加量が８０〜８５ｗｔ％ではノイズ除
去効果は１０ｄＢで印刷性は良好、添加量が８５ｗｔ％
以上では粉末が多過ぎて膜にクラックが入り印刷性が悪
くなった。With respect to the addition amount of the ferrite-based composite powder, the noise removal effect, and the printability, when the addition amount was 60 wt% or less, the printability was good, but the addition amount was too small and there was almost no noise removal effect. , The amount of addition is 60 to 70
When the addition amount is 70 to 80 wt%, the noise removal effect is 8 dB and the printability is good. When the addition amount is 80 to 85 wt%, the noise removal effect is 10 dB and the printability is good. Good, 85% by weight
Above, the powder was too much, and the film cracked, resulting in poor printability.
【００２３】したがって、フェライト系複合粉末の添加
量は６０〜８５ｗｔ％が電磁波吸収特性上好ましく、こ
のとき５〜１０ｄＢのノイズ除去効果が得られた。ま
た、ペースト粘度は３００〜５００ｐｏｉｓｅが好まし
い。また、フェライト系複合粉末の他に、粘度や粘性の
調整および塗膜形成補助剤としてタルクやシリカを適当
量添加してもよい。Accordingly, the addition amount of the ferrite-based composite powder is preferably 60 to 85% by weight in terms of electromagnetic wave absorption characteristics. At this time, a noise removal effect of 5 to 10 dB was obtained. Further, the paste viscosity is preferably 300 to 500 poise. Further, in addition to the ferrite-based composite powder, talc or silica may be added in an appropriate amount as a viscosity or viscosity adjusting agent or a film forming aid.
【００２４】ペースト印刷の際のスクリーンとして、形
成すべき電磁シールド層の厚さに合わせて厚さ５００μ
ｍ〜１．０ｍｍのステンレススクリーンを使用した。こ
のようなスクリーン印刷法を用いることにより、タクト
が早くなり生産性が向上するとともに、均一な膜を高精
度で選択的に塗布形成することができ、非塗布部分に支
障を来すことなく高密度実装に対処できる。A screen for paste printing has a thickness of 500 μm according to the thickness of the electromagnetic shield layer to be formed.
A stainless screen of m to 1.0 mm was used. By using such a screen printing method, the tact time is increased and the productivity is improved, and a uniform film can be selectively formed with high precision without affecting the non-coated portion. Can handle density mounting.
【００２５】以上のようにして作製したＥＭＣモジュー
ルは、周波数帯域３００ＭＨｚ〜５ＧＨｚの電磁波に対
し、５〜１０ｄＢのノイズ除去効果を示した。The EMC module manufactured as described above has a noise removal effect of 5 to 10 dB for electromagnetic waves in the frequency band of 300 MHz to 5 GHz.
【００２６】なお、シールド効果を高めるために、プリ
ント配線板の裏面（下面）側全面にベタパターンを形成
してもよく、また裏面側もＥＭＣ構造としてもよい。In order to enhance the shielding effect, a solid pattern may be formed on the entire back surface (lower surface) of the printed wiring board, or the back surface may have an EMC structure.
【００２７】[0027]
【発明の効果】以上説明したように、本発明では、電磁
波吸収ペーストが印刷法により形成されるため、簡単な
プロセスで高精度で所望の位置に電磁波吸収材からなる
電磁シールド層を形成することができ、小型軽量で高い
電磁波吸収特性を有する高密度実装のＥＭＣモジュール
が得られる。As described above, in the present invention, since the electromagnetic wave absorbing paste is formed by the printing method, the electromagnetic shielding layer made of the electromagnetic wave absorbing material can be formed at a desired position with high accuracy by a simple process. Thus, a high-density mounting EMC module having a small size, light weight, and high electromagnetic wave absorption characteristics can be obtained.
【図１】 本発明に係るＥＭＣモジュールの断面図。FIG. 1 is a cross-sectional view of an EMC module according to the present invention.
１：プリント配線板、２：半導体パッケージ、３：電子
部品、４：電極パターン、５：リード端子、６：半田、
７：電磁シールド層、８：ＥＭＣモジュール。1: printed wiring board, 2: semiconductor package, 3: electronic component, 4: electrode pattern, 5: lead terminal, 6: solder,
7: electromagnetic shielding layer, 8: EMC module.
Claims (4)
搭載面の全面またはその一部が、印刷により形成された
電磁波吸収ペーストからなる電磁シールド層により覆わ
れていることを特徴とするＥＭＣモジュール。An EMC module wherein an entire surface or a part of a component mounting surface of a printed wiring board on which electronic components are mounted is covered with an electromagnetic shield layer made of an electromagnetic wave absorbing paste formed by printing. .
誘電体材料からなるフェライト系複合粉末と低収縮応力
タイプのエポキシ樹脂を混合した熱硬化型のペーストで
あることを特徴とする請求項１に記載のＥＭＣモジュー
ル。2. The thermosetting paste according to claim 1, wherein the electromagnetic wave absorbing paste is a mixture of a ferrite-based composite powder composed of a magnetic material and a dielectric material and a low shrinkage stress type epoxy resin. 2. The EMC module according to claim 1.
ＮｉＯ，ＺｎＯおよびＦｅ2Ｏ3 からなり、誘電体材料
はＣｕＯからなることを特徴とする請求項２に記載のＥ
ＭＣモジュール。3. The magnetic recording medium according to claim 2, wherein the magnetic material of the ferrite-based composite powder is made of NiO, ZnO and Fe 2 O 3 , and the dielectric material is made of CuO.
MC module.
搭載面の全面またはその一部に、電磁波吸収ペーストを
メタルスクリーンを用いて、真空中で印刷、または印刷
後に真空処理を施したことを特徴とするＥＭＣモジュー
ルの製造方法。4. A method in which an electromagnetic wave absorbing paste is printed in a vacuum on a metal screen using a metal screen, or is subjected to a vacuum treatment after the printing, on the whole or a part of the component mounting surface of the printed wiring board on which the electronic components are mounted. A method for manufacturing an EMC module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13588499A JP2000328006A (en) | 1999-05-17 | 1999-05-17 | Emc module and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13588499A JP2000328006A (en) | 1999-05-17 | 1999-05-17 | Emc module and its manufacture |
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| Publication Number | Publication Date |
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| JP2000328006A true JP2000328006A (en) | 2000-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP13588499A Pending JP2000328006A (en) | 1999-05-17 | 1999-05-17 | Emc module and its manufacture |
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|---|---|---|---|---|
| CN102268213A (en) * | 2011-08-29 | 2011-12-07 | 朱恩灿 | Electromagnetic wave shielding coating and preparation method thereof |
| DE112017005682T5 (en) | 2016-11-11 | 2019-08-14 | Mitsubishi Electric Corporation | SEMICONDUCTOR UNIT AND METHOD FOR THE PRODUCTION THEREOF AND WIRELESS DATA TRANSMISSION DEVICE |
| WO2019176612A1 (en) * | 2018-03-12 | 2019-09-19 | マクセルホールディングス株式会社 | Electromagnetic absorber composition, three-dimensionally molded article formed from electromagnetic absorber, electronic component and electronic device using same, and methods for producing electronic component and electronic device |
| CN110503987A (en) * | 2018-05-16 | 2019-11-26 | 兆电子有限公司 | The electromagnetic armouring structure of solid state drive |
| US11121095B2 (en) | 2016-12-21 | 2021-09-14 | Mitsubishi Electric Corporation | Semiconductor device having electromagnetic wave absorbing layer with heat dissipating vias |
| CN114188312A (en) * | 2022-02-17 | 2022-03-15 | 甬矽电子(宁波)股份有限公司 | Package shielding structure and manufacturing method thereof |
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1999
- 1999-05-17 JP JP13588499A patent/JP2000328006A/en active Pending
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|---|---|---|---|---|
| CN102268213A (en) * | 2011-08-29 | 2011-12-07 | 朱恩灿 | Electromagnetic wave shielding coating and preparation method thereof |
| DE112017005682T5 (en) | 2016-11-11 | 2019-08-14 | Mitsubishi Electric Corporation | SEMICONDUCTOR UNIT AND METHOD FOR THE PRODUCTION THEREOF AND WIRELESS DATA TRANSMISSION DEVICE |
| US11081449B2 (en) | 2016-11-11 | 2021-08-03 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same and wireless communication apparatus |
| US11121095B2 (en) | 2016-12-21 | 2021-09-14 | Mitsubishi Electric Corporation | Semiconductor device having electromagnetic wave absorbing layer with heat dissipating vias |
| DE112017006387B4 (en) | 2016-12-21 | 2024-07-11 | Mitsubishi Electric Corporation | SEMICONDUCTOR UNIT |
| WO2019176612A1 (en) * | 2018-03-12 | 2019-09-19 | マクセルホールディングス株式会社 | Electromagnetic absorber composition, three-dimensionally molded article formed from electromagnetic absorber, electronic component and electronic device using same, and methods for producing electronic component and electronic device |
| JPWO2019176612A1 (en) * | 2018-03-12 | 2021-03-25 | マクセルホールディングス株式会社 | A composition for an electromagnetic wave absorber, a three-dimensional model of an electromagnetic wave absorber, electronic parts and electronic devices using the same, and a method for manufacturing the electronic parts and electronic devices. |
| JP7141444B2 (en) | 2018-03-12 | 2022-09-22 | マクセル株式会社 | Electromagnetic wave absorber composition, electromagnetic wave absorber three-dimensional structure, electronic component and electronic device using the same, and method for manufacturing the electronic component and electronic device |
| CN110503987A (en) * | 2018-05-16 | 2019-11-26 | 兆电子有限公司 | The electromagnetic armouring structure of solid state drive |
| CN110503987B (en) * | 2018-05-16 | 2021-03-23 | 兆电子有限公司 | Electromagnetic shielding structure of solid state drive |
| CN114188312A (en) * | 2022-02-17 | 2022-03-15 | 甬矽电子(宁波)股份有限公司 | Package shielding structure and manufacturing method thereof |
| CN114188312B (en) * | 2022-02-17 | 2022-07-08 | 甬矽电子(宁波)股份有限公司 | Package shielding structure and manufacturing method thereof |
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