JP2000322548A - Production of noncontact data carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a completely packaged noncontact data carrier which is produced by the molding of a single time and has no section of a support frame when the carrier is packaged by the transfer molding. SOLUTION: A transfer molding machine is provided with a pair of hot plates 12 (12a, 12b), a pair of metallic plates 11 (11a, 11b), a pair of support pins 15 which support a support frame in the cavities 13 (13a, 13b) and the lift tools 18 which move up and down the pins 15 in the cavities 13 respectively. Then circuit parts and an antenna coil are mounted on the support frame, and this support frame is supported by the pins 15, driven by the tools 18 and located almost at the centers of cavities 13 respectively. Then the sealing resin is pressed into the cavities 13 and the pins 15 are moved down right before the sealing resin is changed into a hardened state from its fluid state. Thus, a sealing resin layer is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for manufacturing a contactless data carrier. More specifically, the present invention relates to a method for manufacturing a non-contact data carrier which has an IC chip as a main internal component and transmits and receives signals to and from an external device in a non-contact manner by a transfer molding machine.

[0002]

2. Description of the Related Art A contactless data carrier system comprises a transponder which is called a contactless data carrier and an interrogator connected to a host. Then, non-contact communication is performed between the transponder and the interrogator via a transmission medium such as a magnetism, an induction electromagnetic field, or a microwave (radio wave).

In this non-contact data carrier system, a transponder is attached to various individuals (articles), information about the individuals is remotely read by an interrogator and provided to a host, thereby realizing information processing regarding the individuals. is there.

FIG. 10 shows an example of such a non-contact data carrier 1. FIG. 10A is a plan view of the non-contact data carrier 1, and FIG. It is. The transponder (contactless data carrier 1) is an antenna coil 3 for transmitting and receiving signals to and from the interrogator.
In general, the internal components 4 such as the antenna coil 3 and the circuit components 2 are hermetically sealed with a sealing resin layer 5 in consideration of durability and environmental resistance. Have.

In the non-contact data carrier 1 attached to the individual, the circuit board on which the circuit components 2 and the like are mounted, the antenna coil 3 and their joints and the like are damaged by impact, vibration, and the like caused by the movement of the individual. Failure may occur. In particular, the strength of the circuit board and the joint between the antenna coil 3 and the circuit board is relatively weak, and some protection is required so that the circuit board and the antenna coil 3 are not damaged by external mechanical impact.

In addition, such a non-contact data carrier 1
Is attached to an individual that is easily elastically deformed such as a tire or a rubber mat, for example, stress is applied to the internal component 4 in the non-contact data carrier 1 due to the elastic deformation of the individual, and the internal component 4 may be destroyed. .

In order to prevent such destruction of the internal component 4,
The entire non-contact data carrier 1 must be protected by a hard material. As a method of packaging the non-contact data carrier 1 with a hard material, transfer molding in which a softened resin is pressed into a mold under heating and pressure has been generally used.

[0008]

In this case, in order to completely seal the internal component 4 with the hardened material, it is necessary to form the internal component 4 at the center of the package. In order to position the internal component 4 at the center of the package, there are typically the following two methods. One is a method of molding a package by using a lead frame made of a metal thin film and positioning the internal component 4 placed on the lead frame at the center of the mold, as shown in FIG. 1 is obtained by the method. Also,
The other one is a method in which the package is formed only in half, the internal component 4 is placed on the semi-finished product, and then the remaining half package is overlaid.

In the former method using a lead frame,
Normally, a lead frame 9 as shown in FIG. 11 is used. The lead frame 9 is provided with a mount pad 9a on which the internal component 4 is mounted, and is disposed around the mount pad 9a and held at the time of molding, for example, a square frame. Frame 9 formed in a shape
b, and four tie bars 9c that support the mount pad on the frame in a double-supported manner.

Therefore, in this method, it is necessary to cut the tie bar 9c after molding to separate the package portion from the extra unframed lead frame 9 portion. The cut end is exposed, and the internal component 4 cannot be completely sealed with the hard material. For this reason, there was a problem that deterioration was recognized in appearance and environmental resistance.

On the other hand, in the latter method of molding the package in half, there is no need to cut the lead frame 9 after molding, and the cutout of the lead frame 9 is not exposed on the side surface of the package, so that a package excellent in environmental resistance can be obtained. . However, since it is necessary to perform the molding twice, the operation becomes complicated and leads to an increase in cost. In addition, since the package is molded in half, there is a case where the reliability of the joint is reduced depending on the molding method.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and in a non-contact data carrier 1 packaged by transfer molding, the non-contact data carrier 1 is formed by one molding.
It is another object of the present invention to provide a completely packaged non-contact data carrier 1 having no cut edge of the lead frame 9.

[0013]

According to a first aspect of the present invention, there is provided a method for manufacturing a non-contact data carrier.
A method for manufacturing a non-contact data carrier in which internal components mounted on a support frame are resin-sealed using a transfer molding machine, wherein the transfer molding machine includes a set of supporting the support frame in a cavity. It is characterized by comprising a support pin and an elevating jig for moving the support pin up and down in the cavity.

That is, according to the present invention, a lower frame of a transfer molding machine is provided with a lifting / lowering jig for raising / lowering a holding pin so as to be able to protrude into a mold cavity, and a supporting frame in which internal components are mounted on the holding pin. It is intended to perform transfer molding in a state of being supported.

As a result, the package can be formed by a single molding, and the support frame can be completely packaged.

According to a second aspect of the present invention, in the method for manufacturing a non-contact data carrier according to the first aspect, after the supporting frame is supported in the cavity, a sealing resin is filled in the cavity, and the sealing is performed. It is characterized in that the support pins are lowered just before the resin is cured.

According to the manufacturing method of the second aspect, the package can be formed without opening the cavity by disposing the support pins outside the cavity immediately before the curing of the sealing resin.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic configuration diagram of a transfer molding machine used in a method of manufacturing a non-contact data carrier according to the present invention, and FIG. 2 is a diagram showing a non-contact data carrier manufactured by the manufacturing method. And FIG.
FIG. 3B is a plan view of the structure, FIG.
Is a plan view of a support frame used for the non-contact data carrier shown in FIG. 2, and FIGS. 4 to 9 are explanatory views showing a manufacturing method according to the present invention.

The non-contact data carrier 1 has substantially the same structure as the conventional example, and includes a circuit component 2 including a storage element for storing information, and an antenna coil for transmitting and receiving signals to and from an external device in a non-contact manner. 3 is sealed with a sealing resin layer 5.

The circuit component 2 is formed by, for example, forming a copper circuit pattern and terminals on the surface of an epoxy substrate, and soldering an IC chip to the circuit pattern and terminals. The IC chip incorporates each functional circuit unit except for the antenna coil 3 for transmission and reception. As the antenna coil 3, for example, a coil made of a copper wire is used.

These internal components 4 are mounted on a support frame 6 as shown in FIG. The support frame 6 is made of a material having rigidity and strength enough to withstand transfer molding, for example, a metal thin plate or the like, as in the related art.

The support frame 6, unlike the conventional lead frame 9, is formed only by mount pads on which the circuit components 2 and the antenna coil 3 are mounted, and has no frame portion or tie bars. The support frame 6
The shape is not particularly limited. For example, as shown in FIG. 3, a substantially circular shape or a rectangular shape in plan view is used.

Since the support frame 6 is completely covered with the transfer-molded sealing resin layer 5, the support frame 6 is designed to be large enough to fit in the cavity of the mold.

As a material of the sealing resin forming the sealing resin layer 5, a thermosetting resin such as an epoxy resin, a silicone resin, a phenol resin or the like is preferable in order to sufficiently protect the internal component 4 as described above. Used.

This non-contact data carrier 1 is manufactured by a transfer molding machine 10 as shown in FIG. This transfer molding machine 10 includes a pair of upper and lower hot plates 12 and the same one as in the conventional transfer molding machine.
A pair of upper and lower molds 11 are provided between the pair of hot plates 12.

A pair of upper and lower molds 11, that is, an upper mold 11
A concave portion 13a and a concave portion 13b are formed on the lower mold 11a and the lower die 11b, respectively, with the openings facing each other. The two concave portions 13a and 13b form a cavity 13 for molding the sealing resin layer 5. The upper mold 11a has a guiding portion 14 for pushing the molten resin into the cavity 13.
a has been established. On the other hand, an insertion port 16 through which the support pin 15 is inserted is formed in the lower mold 11b as described below.

A pair of upper and lower hot plates 12, that is, an upper hot plate 12
a and the lower hot plate 12b are for heating the upper mold 11a and the lower mold 11b, respectively, and have a structure capable of heating the mold 11 via the hot plate 12. Hot plate 1
2a is provided with another guiding portion 14b connected to the guiding portion 14a of the upper mold 11a.
The resin material charging chamber 14 is formed by the 4a and the guide portion 14b. On the other hand, an insertion hole 17 through which the support pin 15 is inserted is also formed in the lower heat plate 12b. Further, a lifting jig 18 for driving each support pin 15 is provided on a lower surface of the lower heating plate 12b.

Of the pair of hot plate 12 and mold 11,
Either one of the hot plate 12 and the mold 11, that is, the upper hot plate 1
2a and the upper mold 11a are fixed to a molding machine main body (not shown), and the remaining lower hot plate 12b and lower mold 11b are provided in the molding machine main body so as to be vertically driven by a driving device (not shown). Therefore, the lower heating plate 12b and the lower mold 11b move upward to form the cavity 13 by driving the driving device, and the lower heating plate 12b and the lower mold 11b move downward by driving the driving device. It moves to open the cavity 13.

The support pins 15 are for supporting the support frame 6 at a predetermined position in the cavity 13, more specifically, at a substantially central position in the vertical direction within the cavity 13. Therefore, at least three or more support pins 15 are provided, and the tip of each support pin 15 is substantially horizontal so that the support frame 6 can be supported substantially horizontally.

The support pins 15 can freely pass through the insertion port 17 of the lower heat plate 12b and the insertion port 16 of the lower mold 11b, and are vertically moved by a lifting jig 18 provided on the lower heat plate 12b. Driven in the direction. At this time, leakage of the resin is prevented by packing or the like so that at least the insertion port 16 of the lower mold 11b does not allow the resin pushed into the cavity 13 to flow out. When the support pin 15 is driven upward by the lifting jig 18,
The tip of the support pin 15 is located substantially in the center of the cavity 13. When the support pin 15 is driven downward by the lifting jig 18, the tip of the support pin 15 is
The surface is substantially the same as the bottom surface of the recess 1b. The upper position of the support pin 15 is not necessarily the upper limit of the center of the cavity 13 in the vertical direction, and is preferably designed so that it can be raised higher than the upper limit.

A jig 1 for raising and lowering the driving device and the support pin 15
Numeral 8 is an independently drivable one. Therefore, in the transfer molding machine 10, the support pin 15 can be freely moved up and down in the cavity 13 by driving the lifting jig 18 in a state where the cavity 13 is formed.

Further, it is possible to drive the supporting pin 15 up and down by driving the lifting jig 18 while the lower heating plate 12b and the lower mold 11b are positioned below or while moving them upward or downward. it can. Therefore,
With the cavity 13 opened, the lifting jig 18 is driven to move the support pin 15 up and down to a position where the support frame 6 can be easily inserted from between the upper mold 11a and the lower mold 11b. The support frame 6 can be supported thereon. At this time, the tip of the support pin 15 is
This is because it is extremely difficult to support the support frame 6 on the support pins 15 unless the support frame 15 protrudes upward from the recess 13b of FIG. In addition, by raising the support pin 15 after molding, the function as an ejector pin can be achieved.

Next, a method for manufacturing the non-contact data carrier 1 using the transfer molding machine 10 will be described in detail.

At the time of resin sealing, a circuit component 2 such as an IC chip and an antenna coil 3 are previously provided. Next, the support frame 6 is placed on the support pins 15 and sealed with a resin by the transfer molding machine 10.

First, as shown in FIG. 4, the lower hot plate 12b and the lower mold 11b are lowered, and
3 is left open. In this state, since the support pin 15 is in a lowered state as described below, as shown in FIG. 6, the lifting jig 18 is driven to support the support frame 6 in the vicinity of the center of the cavity 13 in the vertical direction. The support pin 15 is raised so as to be able to. In FIG. 4, the ejector pins will be described as being provided separately from the support pins 15 in the transfer molding machine 10.

Next, as shown in FIG. 6, the support frame 6 on which the internal components 4 are mounted is placed on the support pins 15 and supported by the support pins 15. Then, as shown in FIG. 7, after driving the driving device to raise the lower mold 11b and the lower heating plate 12b to form the cavity 13, the resin material charging chamber 14 is formed.
After that, the cavity 13 is filled with the sealing resin 7.

Thereafter, the supporting frame 6 is supported by the supporting pins 15 until the molten sealing resin 7 is uniformly filled in the cavity 13 and the supporting frame 6 is sufficiently supported by the sealing resin 7. Hold the state that was made. Then, as shown in FIG. 8, immediately before the sealing resin 7 changes from the flowing state to the hardened state, the support pins 15 are lowered. Note that, in this state, the tip of the support pin 15 is substantially aligned with the bottom surface of the lower mold 11. While maintaining this state, the sealing resin layer 5 is completely formed. afterwards,
As shown in FIG. 9, the driving device is driven to lower the lower heating plate 12 and the lower mold 11, open the cavity 13, and take out the non-contact data carrier 1 by the ejector pin.

By adopting such a molding method, the internal component 4 mounted on the support frame 6 can be resin-sealed at a substantially central position of the non-contact data carrier 1. As a result, it is possible to easily obtain the non-contact data carrier 1 having no side of the lead frame.

Of course, the transfer molding machine 10
Is not limited to the above manufacturing procedure,
What is necessary is just to be able to hold the support frame 6 substantially at the center in the cavity 13. For example, immediately after the non-contact data carrier 1 is taken out, the support pins 15 are in a lowered state. For example, in this state, the support frame 6 is placed on the bottom surface of the concave portion 13b of the lower mold 11b, and thereafter, It is also conceivable to operate the lifting jig 18 to raise the support pin 15. Further, as described above, by using the support pin 15 also as an ejector pin, the non-contact data carrier 1 can be taken out by raising the support pin 15 after the molding of the sealing resin layer 5.

[0040]

According to the present invention, the end surface of the support frame is not exposed to the side surface of the package, and the internal components mounted on the support frame can be completely sealed with a single molding. As a result, a non-contact data carrier excellent in environmental resistance and reliability can be provided easily and at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a transfer molding machine used in a method for manufacturing a non-contact data carrier according to the present invention.

FIGS. 2A and 2B are diagrams showing a non-contact data carrier manufactured by the manufacturing method of the present invention, wherein FIG. 2A is a plan view and FIG. 2B is a cross-sectional view.

FIG. 3 is a plan view of a support frame used for the non-contact data carrier shown in FIG. 2;

FIG. 4 is an explanatory view showing a manufacturing method of the present invention.

FIG. 5 is an explanatory view showing the manufacturing method of the present invention.

FIG. 6 is an explanatory view showing a manufacturing method of the present invention.

FIG. 7 is an explanatory view showing the manufacturing method of the present invention.

FIG. 8 is an explanatory view showing the manufacturing method of the present invention.

FIG. 9 is an explanatory view showing the manufacturing method of the present invention.

10A and 10B are views showing a non-contact data carrier as a conventional example, wherein FIG. 10A is a plan view of the same, and FIG. 10B is a cross-sectional view of the same.

FIG. 11 is a plan view of a lead frame used for the non-contact data carrier of FIG. 10;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Non-contact data carrier 2 ... Circuit parts 3 ... Antenna coil 4 ... Internal parts 5 ... Sealing resin layer 6 ... Support frame 9 ... Lead frame 9a ... Mount pad 9b ... Frame part 9c ... Tie bar Reference Signs List 10 transfer molding machine 11 mold 11a upper mold 11b lower mold 12 hot plate 12a upper heat plate 12b lower heat plate 13 cavity 13a lower cavity 13b lower mold Mold recess 14 ... Resin material insertion chamber 15 ... Support pin 16 ... Insertion opening opened in lower mold 17 ... Insertion opening established in lower hot plate 18 ... Elevating jig

Continued on the front page F term (reference) 4F202 AA37 AA39 AD19 AH33 CA12 CB01 CB12 CK41 CQ03 CQ07 4F206 AA37 AA39 AD19 AH37 JA02 JB17 JN25 JQ81 5B035 AA08 BA03 BB09 CA03 CA23

Claims (2)

[Claims] 1. A method for manufacturing a non-contact data carrier in which an internal component mounted on a support frame is resin-sealed using a transfer molding machine, wherein the transfer molding machine places the support frame in a cavity. A method for manufacturing a non-contact data carrier, comprising: a set of support pins for supporting; and a lifting jig for lifting and lowering the support pins in a cavity. 2. The method for manufacturing a non-contact data carrier according to claim 1, wherein after supporting the support frame in a cavity, a sealing resin is filled in the cavity, and the supporting resin is cured immediately before the sealing resin is cured. A method for manufacturing a non-contact data carrier, wherein a pin is lowered.