JP2000310470A - Cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooler having an inner cooling passage of arbitrary shape being manufactured easily and stably. SOLUTION: A cooling groove 2 is made in the surface of a substrate 1, inlets/outlets 3, 4 penetrating the substrate are made at the starting and ending points of the cooling groove 2, a cover plate 5 is applied onto the substrate 1, the periphery of the cooling groove 2 and the outer circumference at the joint of the substrate 1 and the cover plate 5 are welded by means of an electron beam and then the joint face 6 of the substrate and the cover plate is subjected to diffusion joint by hot isotropic pressurization.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device having a cooling passage through which a liquid or gaseous refrigerant flows inside a metal plate, and used for various cooling plates and high-frequency accelerating cavities for particle accelerators.

[0002]

2. Description of the Related Art Conventionally, brazing has been used as a method of manufacturing a cooling device having a cooling water channel provided in a copper plate. That is, as shown in FIG. 3, a water channel groove 21 serving as a cooling water channel, a copper plate 24 provided with through holes 22 and 23 serving as inlets and outlets of cooling water at the start and end points thereof, and a copper plate 25 serving as a lid thereof are formed into grooves. A cooling device having a cooling water passage inside the copper plate is manufactured by applying a brazing material to the joining surface 26 except for the portion 21 and brazing it.

[0003]

The above-mentioned conventional cooling device has the following problems. 1. It is difficult to perform sufficient bonding over the entire surface of the bonding surface 26 by brazing, and thus it is difficult to stably obtain sufficient airtightness and watertightness.

[0004] 2. Therefore, after brazing, it is difficult to process a part of the joining surface 26 to obtain a required shape, because there is a risk of impairing airtightness and watertightness. 3. Also, a brazing groove 27 for applying a brazing material is
Processing and sufficient flatness and finishing accuracy are required.

[0005] For these reasons, it is difficult to reliably obtain a cooling device of stable quality. SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems and to provide a cooling device having a cooling path of an arbitrary shape therein and capable of being easily and stably manufactured.

[0006]

According to a first aspect of the present invention, there is provided a cooling apparatus, wherein a cooling groove is formed on a surface of a substrate, and an entrance hole which penetrates the substrate is provided at a start point and an end point of the cooling groove. And welding the periphery of the cooling groove and the outer periphery of the joint between the substrate and the cover plate by electron beam welding, and then diffusion bonding the joint surface between the substrate and the cover plate by hot isostatic pressing. It is characterized by.

[0007] In the cooling device having the above-described structure, electron beam welding is performed so as to surround the joint surface between the substrate and the cover plate, so that the joint surface is sealed in a vacuum, that is, in a so-called canning state. Leads to the outside. When diffusion bonding is performed by hot isostatic pressing in this state,
The joining surfaces that are vacuum-sealed are integrated by diffusion joining, and a high-temperature gas flows into the cooling grooves, so that a cooling path can be formed inside without deformation.

According to a second aspect of the present invention, the cooling device is characterized in that the substrate is an end plate of an acceleration cavity. According to this cooling device, it is possible to obtain an acceleration cavity that is sufficiently cooled, and thus has a high output.

The cooling device according to claim 3 is characterized in that the material of the substrate is copper and the material of the cover plate is stainless steel. According to the present invention, a cooling device having high rigidity and high mechanical strength can be obtained.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 1 shows the configuration of a cooling device according to a first embodiment of the present invention. A cooling groove 2 for cooling the entire substrate is formed in a copper substrate 1, and an entrance hole 3 and an exit hole 4 penetrating the substrate 1 are formed at the start and end points of the cooling groove 2. I have.

The cover plate 5 for covering the cooling groove 2 is
Then, the welding wire 7 is welded by electron beam welding around the outer periphery of the substrate 1 and the cover plate 5 and around the cooling groove 2 so as to surround the joining surface 6. Thereafter, they are integrated by diffusion bonding by a hot isostatic pressing method.

According to the present embodiment, a state in which the joint surface 6 is sealed in a vacuum by performing electron beam welding along the welding line 7 so as to surround the joint surface 6 between the substrate 1 and the cover plate 5;
In a so-called canned state, the cooling groove 2 communicates with the outside through the entrance holes 3 and 4. In this state, diffusion bonding is performed by a hot isostatic pressing method, so that the vacuum-sealed bonding surface 6 is integrated by diffusion bonding, and
A high-pressure gas flows from the entrance / exit holes 3 and 4, and a cooling device having the cooling groove 2 therein can be formed without deformation.

(Second Embodiment) FIG. 2 shows the configuration of an end cooling device with a cooling water channel for a high-frequency acceleration cavity according to a second embodiment of the present invention.

The end plate 11 has an inner surface forming an acceleration cavity,
A finishing process is performed according to the shape of the acceleration cavity, and a channel groove 12 for cooling the entire end plate 11 is formed on the opposite side according to the shape.

The lid plate 13 forms these lids.
Entrance holes 14 and 15 are formed in the end plate 11 at portions corresponding to the start point and the end point of the water channel 12. After the end plate 11 and the cover plate 13 have been joined, the entire periphery of the joint between the end plate 11 and the cover plate 13 and the water channel 12 is welded by electron beam welding along the welding line 17 so as to surround the joint surface 16. After that, they are integrated by a hot isostatic pressing method.

According to the present embodiment, electron beam welding is performed so as to surround the joint surface 16 between the end plate 11 and the cover plate 13, so that the joint surface 16 is sealed in a vacuum, that is, in a so-called canned state. The water channel 12 serving as a cooling water channel communicates with the outside at the entrance and exit holes 14 and 15. In this state, the diffusion bonding is performed by the hot isostatic pressing method, so that the vacuum-sealed bonding surface 16 is integrated by diffusion bonding, and the water passage groove 12 serving as a cooling water passage is provided with the inlet / outlet holes 14 and 15. The high-pressure gas flows in, and the end cooling device of the high-frequency acceleration cavity having the cooling water channel therein can be formed without forming the inner peripheral finish shape and the water channel groove 12.

(Third Embodiment) In the above two embodiments, the material of the substrate 1, the end plate 11 and the cover plates 5, 13 is generally made of copper, but in the third embodiment, the material of the cover is The plates 5 and 13 are made of stainless steel.

According to this embodiment, the cooling side is made of a copper material having good heat conductivity, and the lid side is made of clad steel using high-strength stainless steel, and has good heat conductivity and high rigidity. A cooling device can be obtained.

[0019]

According to the present invention, since the cooling groove is formed on the surface of the substrate, its shape and size can be freely selected, the connection between the substrate and the cover plate is sufficient, and the cooling passage is provided inside. Thus, a cooling device having reliable airtightness and watertightness can be obtained.

Further, by performing diffusion bonding by hot isostatic pressing, bonding can be performed without deforming a complicated shape, and a cooling device having a complicated shape such as a curved plate as well as a flat substrate can be obtained. Can also be manufactured.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIGS. 2A and 2B are diagrams showing a second embodiment of the present invention, wherein FIG.
(B) is a view on arrow AA, (b) is a view on arrow BB in (a).

FIG. 3 shows a conventional cooling device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Cooling groove, 3 ... Inlet hole, 4 ... Outlet hole, 5 ...
Cover plate, 6: joining surface, 7: welding line, 11: end plate, 12: water channel, 13: cover plate, 14: inlet hole, 15: outlet hole, 16: joining surface,
17… welding line, 21… water channel, 22… through hole, 23… through hole, 24
... copper plate, 25 ... copper plate, 26 ... joining surface, 27 ... brazing groove.

Claims (3)

[Claims] 1. A cooling groove is formed on a surface of a substrate, and an entrance / exit hole which penetrates the substrate is provided at a start point and an end point of the cooling groove, and a lid plate having substantially the same size as that of the substrate is placed on the substrate. The method is characterized in that the periphery of the groove and the outer periphery of the joint between the substrate and the cover plate are welded by electron beam welding, and thereafter, the bonding surface between the substrate and the cover plate is diffusion-bonded by hot isostatic pressing. Cooling system. 2. The cooling device according to claim 1, wherein the substrate is an end plate of an acceleration cavity. 3. The cooling device according to claim 1, wherein the material of the substrate is copper, and the material of the cover plate is stainless steel.