JP2000305279A - Lithographic device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lithographic device which is capable of dealing with a higher packaging density and the miniaturization of electronic apparatus, forming circuit patterns on a horizontal surface, such as, for example, a base surface of a casing, as a work and forming the circuit patterns to the surfaces exclusive of the horizontal surface, for example, a vertical surface, such as a flank or a curved surface having a curvature part and to provide the electronic apparatus which eliminates printed circuit boards and allows the higher packaging density, better heat radiatability and lower assembly cost by packaging chip parts, etc., such as capacitor chips, to the circuit patterns. SOLUTION: This device 1 forms, by irradiation, the circuit pattern images formed by a projector 10 on the inside wall surface of the casing 2 which is a subject. The projector 10 has a triaxial (X, Y and Z axes) projection oscillator 20 to make the projector itself oscillatable and has a biaxial (X and Y axes) work oscillator 30 in order to oscillate the casing 2 in such a manner that the irradiation to the flank, etc., of the casing 2 is made possible.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lithographic apparatus and an electronic apparatus, and more particularly, to a lithographic apparatus for forming a circuit pattern by irradiating a resist layer with an optical image and an electronic apparatus having a circuit pattern formed on a housing wall. It is.

[0002]

2. Description of the Related Art In general, a lithography apparatus uses an L
With the advancement of high integration and high functionality of SI, there are known those which draw a fine integrated circuit pattern in micron units on a horizontal surface of a wafer surface and those which draw a circuit pattern on a printed circuit board. . Further, as an electronic apparatus, there is known an electronic apparatus having a printed circuit board inside a housing and mounting various electronic components on the printed circuit board.

[0003]

However, the conventional lithography apparatus is designed only for drawing a circuit pattern on a substrate surface or a plane on a wafer on which a resist layer is formed. It is impossible to draw a circuit pattern on a surface such as a curved surface having a curvature portion. In electronic devices, there is a strong demand for miniaturization of electronic devices, for example, with the spread of mobile phones. there were.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a work, such as a bottom surface of a housing, as a work in response to high-density mounting and miniaturization of electronic equipment. An object of the present invention is to provide a lithographic apparatus capable of forming a circuit pattern on a surface other than the horizontal surface, for example, a vertical surface such as a side surface or a curved surface having a curvature portion, in addition to forming a circuit pattern on a horizontal surface. The second object is to form a circuit pattern directly on the wall surface of the housing and mount chip components such as a chip capacitor on the circuit pattern, thereby eliminating a printed circuit board, and further increasing a high-density mounting. It is an object of the present invention to provide an electronic device capable of improving the heat dissipation, improving the heat dissipation, and reducing the cost of assembly.

[0005]

According to a first aspect of the present invention, there is provided a lithographic apparatus for irradiating a resist layer with a light image to form a circuit pattern.
It is characterized by having projection means capable of irradiating an optical image onto a resist layer formed on a flat surface of a work or a curved surface having a curvature portion to form a circuit pattern.

According to a second aspect of the present invention, in the lithographic apparatus of the first aspect, the projection means is a digital micromirror device (DMD) having a plurality of micromirrors.
Irradiates the light image.

According to a third aspect of the present invention, in the lithographic apparatus of the first aspect, the projection means irradiates the light image with a liquid crystal.

According to a fourth aspect of the present invention, in the lithographic apparatus according to the first aspect, the projection means includes a tilt projection means for irradiating the resist image with the light image obliquely to form a circuit pattern. It is characterized by the following.

According to a fifth aspect of the present invention, in the lithographic apparatus according to the first aspect, the projection unit irradiates the light image by scanning a laser beam with a galvanomirror.

According to a sixth aspect of the present invention, in the lithographic apparatus according to the fifth aspect, the projection means has an overhang irradiation means for forming a pattern on the overhanging inner wall surface of the housing. .

According to a seventh aspect of the present invention, there is provided the first aspect of the invention.
The lithographic apparatus of any one of 4, 5, and 6, further comprising a driving unit for swinging or rotating the projection unit.

According to an eighth aspect of the present invention, in the lithographic apparatus of the seventh aspect, the driving means has at least three axes of an X-axis, a Y-axis or a Z-axis, and the X-axis, the Y-axis or the Z-axis. The projector is characterized by swinging or rotating about at least one of the axes.

According to a ninth aspect of the present invention, there is provided the first aspect of the invention.
The lithographic apparatus of any one of 4, 5, 6, 7, or 8, further comprising a work moving means for moving the work with respect to the projection means.

According to a tenth aspect of the present invention, in the lithographic apparatus according to the ninth aspect, the work moving means includes an X-axis and a Y-axis.
An axis or at least three axes of a Z axis.
The workpiece is characterized by swinging or rotating around the axis or at least one axis of the Z axis.

According to an eleventh aspect of the present invention, in the lithographic apparatus according to the ninth aspect, the work moving means moves the work in a linear motion in the X-axis direction or the Y-axis direction, or a rocking motion about the Z-axis. Characterized in that at least one exercise is performed.

In order to achieve the second object, a first aspect is provided.
According to a second aspect of the present invention, there is provided an electronic device having a housing, wherein a circuit pattern for mounting an electronic component is formed on a wall surface of the housing.

According to a thirteenth aspect of the present invention, in the electronic device of the twelfth aspect, the housing is used as an exterior.

[0018]

[Embodiment 1] An example of a lithographic apparatus according to the present invention will be described below. FIG. 1 is a perspective view showing a schematic configuration of a lithographic apparatus 1 according to the present embodiment. FIG. 2 is a schematic configuration explanatory view when the projection device 10 irradiates a circuit pattern image to, for example, the housing 2 as a work. The lithographic apparatus 1 according to the present invention irradiates and forms a circuit pattern image created by the projection apparatus 10 on the inner wall surface of the housing 2 as a subject. In order to be able to irradiate the side surface and the like of the housing 2, a three-axis (X, Y, Z-axis) projection swing device 20 is provided so that the projection device 10 itself can be swung. Further, a two-axis (X, Y-axis) workpiece swing device 30 is provided to swing the housing 2.

The projection device 10 will be described with reference to FIG. As the projection device 10, for example, a digital micromirror device (hereinafter, simply referred to as "DMD") 11 can be used. The DMD 11 is a type of a spatial light modulator, and is a device in which a number of small mirrors called micromirrors rotating around a fixed axis are formed on a semiconductor substrate such as Si. As the light source 12, a light emitting diode, a laser, or the like can be used in addition to a normal lamp. Then, after the light from the light source 12 is converted into a substantially parallel beam by the collimator lens 13, the light is applied to the mirror surface of the DMD 11.

The light from the light source 12 is reflected by the DMD 11 with a shift of 90 degrees from the incident light, and is reflected by the micro lens 15.
To form an optical image on the inner wall surface of the housing 2. DMD1
The light applied to one mirror surface is deflected by each micromirror whose rotation is controlled by the control device 14 due to an electrostatic field effect or the like, so that each micromirror is selectively rotated to change the inclination of the reflection surface. Thereby, the housing 2 is selectively irradiated with the reflected light from each micromirror, and an optical image can be formed on the inner wall surface of the housing 2.

The projection swing device 20 will be described with reference to FIG. The projection swing device 20 is a device that swings the projection device 10 about at least one of the X axis, the Y axis, and the Z axis. The projection device 10 is supported by a bracket 21 for an X-axis servo motor, and is controlled by an X-axis servo motor 22 to swing around the X axis within a predetermined range. The bracket 21 for the X-axis servomotor is supported by the bracket 23 for the Y-axis servomotor, and is controlled by the Y-axis servomotor 24 to swing around the Y-axis within a predetermined range. Furthermore, in order to swing the projection device 10 around the Z axis, a Y-axis servo motor bracket 23 is swingably supported by a support arm 26 by a Z-axis servo motor 25. Here, the support arm 26 supports the entire lithographic apparatus 1 and is fixed to a stand (not shown). It should be noted that the projection swing device may be rotated not only in swing motion but also around each axis. Further, the projection swing device is not limited to the above-described three-axis device,
For example, a 16-axis multi-axis articulated robot, a free articulated robot configured in a bellows shape, or the like can be used.

The work swinging device 30 has an X-axis or a Y-axis.
This is a device for swinging the housing 2 about at least one of the axes. In order to hold the housing 2, a work holder 31 is swingably held within a predetermined range by an X-axis servo motor bracket 32. An X-axis servo motor 33 is provided to swing the work holder 31 around the X-axis. Further, a Y-axis servo motor bracket 34 and a Y-axis servo motor 35 are provided to swing the housing 2 around the Y-axis within a predetermined range. The work swinging device 30 is fixed to a gantry (not shown). The work swinging device is not limited to the two axes described above, and may be three axes in addition to the Z axis. The work swinging device may be rotated not only by the swinging motion but also by each axis. Furthermore, for example, a 16-axis multi-axis articulated robot, a free articulated robot configured in a bellows shape, or the like can also be used.

Here, the housing 2 will be described. Housing 2
Is a casing used for a mobile phone, for example, in which a resist layer 2s (see FIG. 2) is formed on the inner wall surface, and the casing exterior can directly constitute the exterior of the mobile phone. By using the housing exterior as the exterior of the mobile phone as it is, it is possible to contribute to miniaturization of the housing, high-density mounting, and improvement of heat dissipation. Note that the housing 2 is not limited to the housing whose housing exterior can directly constitute the exterior of the electronic device, and a configuration in which a separate exterior cover or the like is further provided outside the housing 2 may be employed.

The housing 2 is formed by, for example, an AB using an injection molding machine.
It is formed by injecting a resin material such as S resin into a mold. Thereafter, burrs and the like are removed to form a resist layer 2s on the electronic component mounting surface. However, when formed of a resin material, the surface is smooth, and it is difficult to form the resist layer 2s as it is. Therefore, the adhesion between the housing 2 and the resist layer 2s is improved by performing a surface treatment such as sandblasting or high-frequency plasma on the electronic component mounting surface.

The material of the housing 2 is not limited to the above-mentioned resin material, but may be a metal material such as iron or aluminum. By using a metal material, heat dissipation and housing strength can be significantly improved as compared with the case of a resin material. Furthermore, the housing itself can be used as ground, used as an antenna, or used as a shield. Then, after the electronic component mounting surface is subjected to a surface treatment such as sandblasting or barrel polishing to improve the adhesion, a resist layer 2s is formed. In addition, these surface treatments can also be used for improving the adhesion of the coating film when coating the exterior surface.

Next, the operation of forming a circuit pattern on the inner wall surface of the housing 2 by the lithographic apparatus 1 according to the present invention will be described with reference to FIGS. The housing 2 having the resist layer 2s formed on the inner wall surface is fixed to the work holder 31. Then, the X-axis servo motor 22 and the Y-axis servo motor 24 of the projection swinging device 20 are controlled by a main controller (not shown) in synchronization with the circuit pattern image of the projection device 10. Further, if necessary, the Z-axis servomotor 25 can be operated to swing the projection device 10 around the Z-axis.

The circuit pattern can be formed by scanning the circuit pattern image to illuminate the entire inner wall surface of the housing 2 or by irradiating the circuit pattern for each predetermined unit area and partially superimposing the circuit pattern one by one. There is a step-and-repeat method of irradiating a pattern. The projection apparatus 10 according to the present invention can be appropriately selected from these circuit pattern forming methods depending on the shape and size of the housing 2 as a subject, the type of circuit pattern, and the like, and executed.

In the case of irradiating light, when forming a circuit pattern on a portion other than the center of the housing 2, if the housing 2 is not moved while being fixed, the light is irradiated obliquely to the circuit pattern forming surface. You. In this case, it is possible to perform exposure without reducing the processing speed by performing data processing in advance, but it is desirable that the correction be performed by irradiating the circuit pattern formation surface with light as perpendicularly as possible. .

Therefore, the lithographic apparatus 1 according to the present invention
In (2), by controlling the driving of the work swinging device 30, the light applied to the bottom surface 2t of the housing 2 can be irradiated vertically. Also, when irradiating the side surface 2a on the left side with respect to the X-axis direction, it is possible to irradiate the light at an angle close to vertical, so that it is possible to irradiate light with minimal correction.

FIG. 3A is a diagram illustrating a case where a circuit pattern is formed on the bottom surface 2 t of the housing 2. Bottom 2 of housing 2
When a circuit pattern is formed at t, the work swinging device 30 is controlled to irradiate the light perpendicularly to the bottom surface 2t to form an accurate circuit pattern without correction. It is possible to do.

FIG. 3B is an explanatory diagram showing a case where a circuit pattern is formed on a curved surface 2r having a curvature portion between the bottom surface 2t of the housing 2 and the side surface 2a on the left side in the X-axis direction. . When irradiating the curved surface 2r of the housing 2 with light, the projection oscillating device 20 and the work oscillating device 30 are accurately synchronized with each other so that the light can be vertically projected onto the curved surface 2r. 10 forms a circuit pattern.

With the configuration and operation of the lithographic apparatus 1 described above, not only the bottom surface 2t of the housing 2 but also the curved surface 2r, the left side surface 2a and the right side surface 2 with respect to the X-axis direction.
A circuit pattern can be formed on the side surface 2c on the near side or the side surface 2d on the far side with respect to the b and Y axis directions.

In the above described projection oscillating device 20 and workpiece oscillating device 30, a configuration using a servomotor as a driving source has been described, but a configuration in which a stepping motor and a rotary encoder are combined may be used.

The work swinging device 30 can swing around the X axis and around the Y axis. In addition to this, the swinging device 30 has a mechanism for swinging around the Z axis. It can also be a device. By swinging around the Z axis, it is possible to form a circuit pattern more quickly. Further, the housing 2 is linearly moved in the X-axis and Y-axis directions,
In addition, it is also possible to rotate and move around the Z axis to form a circuit pattern. For example, by using an XY-θ table, the housing 2 can be moved in the horizontal direction by linear movement in the X-axis and Y-axis directions, and the bottom surface 2t of the housing 2 can always be irradiated with light vertically. it can. When irradiating light to the side surface 2a, 2b, 2c, 2d or the curved surface 2r of the housing 2, it is possible to form a circuit pattern by correcting the irradiating light.

[Modification 1] Projection device 1 of Embodiment 1
In the case of 0, the circuit pattern image was formed on the housing 2 using the DMD 11, but a configuration using liquid crystal may be adopted. FIG. 4 is an explanatory diagram of a schematic configuration of a projection device 40 according to the present modification. The light emitted from the light source 42 is converted into a substantially parallel beam by the collimator lens 43 and then applied to the liquid crystal 41. Then, in the liquid crystal 41, each pixel of the liquid crystal 41 is controlled by a control device (not shown) so as to transmit light according to the circuit pattern. The light that has passed through the liquid crystal 41 passes through the micro lens 44 to form a circuit pattern on the housing 2. In this manner, the circuit pattern can be projected onto the inner wall surface of the housing 2 by the projection device 40 using the liquid crystal 41.

[Modification 2] In the first embodiment and the first modification, the circuit pattern forming surface of the housing is irradiated with light as vertically as possible to minimize the correction of the projection light. Although the configuration for forming is described,
The projection light can be irradiated obliquely without correcting the projection light. FIGS. 5A, 5B, and 5C are schematic configuration diagrams of the tilting projection device 50 according to the present modification. FIG.
FIG. 5 is a diagram when a pattern image is projected on the side surface of the housing by the tilting projection device 50.

The tilting projection device 50 can be disposed in place of the projection device 10 of the lithography apparatus 1 shown in FIG. 1, and includes an illumination device 51, a condenser lens 52, and a mask 53.
, An objective lens 54, and a machine frame (not shown). The objective lens 54 is held in a machine frame (not shown) so that the optical axis 54a is vertical, and has a focus mechanism for moving back and forth to focus. Further, a swinging device (not shown) for swinging the illumination device 51, the condenser lens 52, and the mask 53 is provided in a machine frame (not shown). With this swinging device, the illumination device 51 and the condenser lens 52 swing left and right about 45 degrees about the objective lens 54, and the mask 53
In synchronization with the oscillating movement of the focusing lens 1 and the condenser lens 52, the lens 1 moves in parallel to the left and right. In this manner, the tilting projection device 50 is configured to be capable of tilting the projection device backward with respect to the projection plane (a so-called tilting state in the optical field). The objective lens 54 is positioned by the lithographic apparatus 1 so as to be parallel to the circuit pattern forming surface of the housing 2.

The tilting projection device 50 is obtained by allowing the parallel light beam emitted from the illumination device 51 to enter the condenser lens 52 and causing the irradiation light collected by the condenser lens 52 to enter the pattern surface on the mask 53. The pattern image to be formed is formed on the resist layer on the housing 2 via the objective lens 54 to perform line width drawing. When projecting the pattern image on the right side with respect to the objective lens 54, FIG.
As shown in (2), the illumination device 51, the condenser lens 52, and the mask 53 are swung to the left and projected obliquely from the left on the circuit pattern forming surface of the housing 2. Conversely, the objective lens 54
When projecting a pattern image on the left side with respect to FIG.
As shown in (c), the illumination device 51, the condensing lens 52, and the mask 53 are swung to the right to project obliquely from the right on the circuit pattern forming surface of the housing 2.

When projecting the pattern image on the side surface of the housing 2, as shown in FIG. 6, the tilting projection device 50 in the state shown in FIG.
Is rotated by 90 degrees about the X axis of the lithographic apparatus 1 to position the objective lens 54 in parallel with the side surface 2c of the housing 2. By projecting the pattern image in this state, the circuit pattern can be projected obliquely from above onto the side surface 2c of the housing 2 without correcting the projection light.

[Second Embodiment] In the first embodiment, the configuration for forming a circuit pattern using the DMD 11 has been described. In the first modification, the configuration for forming a circuit pattern using the liquid crystal 41 has been described. But,
A laser beam can be used as a light source, and the laser beam can be controlled by a galvanomirror to form a circuit pattern.

FIG. 7 is a schematic configuration diagram of a lithographic apparatus 100 according to the present embodiment. The present lithographic apparatus 10
Reference numeral 0 denotes a laser optical system 110 and a work moving device 120.

The laser optical system 110 includes a laser oscillator 11
The laser beam LB emitted from 1 is scanned by a Z-axis galvanometer mirror 112 oscillating around the Z-axis and a Y-axis galvanometer mirror 113 oscillating around the Y-axis to irradiate the inner wall surface of the housing 2. To form a circuit pattern. Z
The axis galvanometer mirror 112 and the Y-axis galvanometer mirror 113 are respectively controlled by a motor (not shown) and a controller 114 so as to form a circuit pattern on the inner wall surface of the housing 2.

Here, as a method of forming a circuit pattern by irradiating a laser beam LB at a pinpoint, the case 11
There are a method of forming a pattern by repeatedly turning on and off while scanning the entire inner wall surface of 0 in parallel, and a method of forming a pattern by scanning according to a drawing pattern. Note that there is an advantage that it is not necessary to perform focusing by any of the pattern forming methods.

The work moving device 120 is a device that moves, for example, the housing 2 as a work in a straight line in the X-axis direction and rotates around the Z-axis. Guide rail 122 of LM guide (registered trademark of THK) on base 121
Are provided, and the LM block 123 is attached to the guide rail 122.
Are provided so as to be capable of linear motion. This LM block 1
A translation plate 124 is screwed to 23. Further, a ball screw nut 125 is attached to the translation plate 124, and the rotation of the ball screw 126 is controlled by a stepping motor 127 so that the translation plate 1
24 can be moved linearly. A laser displacement type 128 is provided to measure the amount of movement of the translation plate 124, and transmits the measured value to a main controller (not shown).

A rotation drive mechanism 130 for rotating the turntable 129 is provided on the translation plate 124. As the rotation drive mechanism 130, for example, an air cylinder or a motor capable of reciprocating 90 degrees can be used. And turntable 129
For example, a solenoid is provided as the turntable positioning mechanism 131 to accurately position the solenoid. In addition, a cam follower 132 is provided to hold the turntable 129 horizontally. A work holder 133 is provided on the turntable 129.
The housing 2 as a work is held by, for example, a vacuum.

Next, the lithographic apparatus 10 according to the present invention will be described.
The operation for forming a circuit pattern on the inner wall surface of the housing 2 will be described with reference to FIG. The housing 2 having the resist layer formed on the inner wall surface is set on the work holder 133. Then, the laser oscillator 111 is operated, and the Z-axis galvanometer mirror 11 is turned on.
2 and the Y-axis galvanometer mirror 113 are controlled to form a circuit pattern on the inner wall surface of the housing 2. When the laser beam LB is applied obliquely to the circuit pattern formation surface,
The light emitted by the controller 114 or the like is corrected. When irradiating the laser light LB to the side surface (not shown) on the near side and the rear side surface 2d with respect to the Y-axis direction, the turntable 129 is rotated by 90 degrees to irradiate the laser light LB. When the housing 2 is large,
A circuit pattern can be formed by linearly moving the translation plate 124 and moving the circuit pattern forming portion of the housing 2 to a position where the laser beam LB can be irradiated.

With the configuration and operation of the lithographic apparatus 100 described above, the laser light LB
To form a circuit pattern.

The laser optical system 110 according to this embodiment is
Although the configuration is such that the projection oscillating device described in the first embodiment is provided in the laser optical system 110, the projection oscillating device is arranged on the laser optical system 110, and the three axes (X, Y, Z axes) are centered. A circuit pattern can also be formed by using a swinging structure.

The work moving device 120 is configured to move the work linearly in the X-axis direction and to rotate the work around the Z-axis. In addition, the work moving device 120 linearly moves the work in the Y-axis direction. Can also. For example, using an XY-θ table, the work can be linearly moved in the X-axis and Y-axis directions, and can be rotationally moved around the Z-axis. By using this XY-θ table, it is possible to form circuit patterns on various works having different sizes and shapes. Furthermore, three axes (X, Y, Z
Using a work swinging device that swings around the axis)
It is also possible to form a circuit pattern.

[Modification 3] Using the laser optical system 110 in the second embodiment, a pattern can be formed on the inner wall surface of the overhanging housing. FIG. 8 is an explanatory diagram of the overhang irradiation means according to this modification. The overhang irradiating means is for irradiating the laser beam LB to the overhang surface 201u of the housing 200 having the overhang portion 201 or a surface that cannot be irradiated by the overhang portion 201.
The overhang irradiation means has a configuration in which a mirror 151 is swingably disposed at a tip end of an arm 150 that can rotate 360 degrees. Then, the mirror 151 is moved to the housing 200.
Into the arm 15 in synchronization with the laser beam LB.
A predetermined circuit pattern can be formed on the overhang surface 201u by moving the mirror 0 and the mirror 151 by a motor (not shown).

[Embodiment 3] In the above-described Embodiment 2 and Modification 3, the configuration in which the circuit pattern is formed by irradiating the inner wall surface of the housing 2 on which the resist layer is formed with laser light LB has been described. It is also possible to form a pattern on the housing on which the above layer is formed. Teflon has a low dielectric constant and is particularly suitable for forming a high-frequency circuit.

It is difficult to form a circuit pattern because the surface of Teflon is difficult to be plated as it is. Therefore, usually, the surface of Teflon is treated with a chemical, or subjected to a plasma treatment or a glow discharge treatment to activate the surface and facilitate plating. However, these surface treatments require equipment, and the process is complicated, which may increase the cost.

Therefore, according to the present invention, a circuit pattern can be formed by plating the surface of Teflon by a simple method without requiring the above-described surface treatment of Teflon. Specifically, by irradiating the housing on which the Teflon layer is formed with, for example, a YAG laser or an excimer laser, a portion irradiated with the laser is activated. Then, this housing is plated with an electroless plating solution. Then, plating is applied only to the portion irradiated with the laser, so that a circuit pattern can be formed. It is considered that the reason for this is that fluorine on the Teflon surface in the portion irradiated with the laser disappears and a functional group appears on the surface.

[0054]

According to the first to eleventh aspects of the present invention, the lithographic apparatus includes a projection means for irradiating a resist layer formed on a flat surface of the work or a curved surface having a curvature portion with an optical image. Because it has, the plane of the work,
Alternatively, there is an excellent effect that a circuit pattern can be formed even on a curved surface.

In particular, in the second aspect of the present invention, the optical image is irradiated on the resist layer formed on the flat surface of the work or the curved surface having the curvature portion by the digital micromirror device (DMD). There is an excellent effect that a circuit pattern can be formed accurately and quickly.

In particular, according to the third aspect of the present invention, since the liquid crystal irradiates the resist image formed on the flat surface of the work or the curved surface having the curvature portion with the light image, the circuit can be accurately and quickly performed. There is an excellent effect that a pattern can be formed.

In particular, according to the fourth aspect of the present invention, the tilting projection means can irradiate the pattern forming surface obliquely without correcting the light image. There is an excellent effect that a circuit pattern can be formed accurately and quickly.

In particular, according to the fifth aspect of the invention, the laser beam is scanned by a galvanomirror,
Since the light image is applied to the resist layer formed on the flat surface of the work or the curved surface having the curvature portion, it is unnecessary to focus, and it is possible to form a circuit pattern accurately and quickly. effective.

In particular, according to the invention of claim 6, since the projection means has the overhang irradiation means, an excellent circuit pattern can be easily formed on the wall surface of the overhanged housing. Has an effect.

In particular, according to the seventh aspect of the present invention, the driving means for swinging or rotating the projection means is provided.
Since the projection means is swung or rotated, there is an excellent effect that the irradiation range of the light image can be greatly expanded.

In particular, according to the eighth aspect of the present invention, the X axis, Y
By swinging or rotating the projection means about at least one axis, or at least one of the Z axes, to enlarge the irradiation range of the light image, it is possible to cope with various works having different sizes and shapes. Thus, there is an excellent effect that a circuit pattern can be formed accurately and quickly.

In particular, according to the ninth aspect of the present invention, the work moving means moves the work with respect to the projecting means, so that a plane of the work or
There is an excellent effect that a circuit pattern can be accurately and quickly formed on a resist layer formed on a curved surface having a curvature portion.

In particular, according to the tenth aspect of the present invention, the work is swung or rotated about at least one of the X axis, the Y axis, or the Z axis, thereby enabling the projection means to be rotated. The light image can be imaged at or near an angle perpendicular to the resist layer of the workpiece. By this, without correcting the light image, or
There is an excellent effect that the light image can be irradiated with the minimum correction.

In particular, according to the eleventh aspect of the present invention, the work is linearly moved in the X-axis direction and the Y-axis direction, or at least one of rocking movements about the Z-axis is performed. There is an excellent effect that a circuit pattern can be accurately and quickly formed on a resist layer formed on a flat surface of a work or a curved surface having a curvature portion.

According to the twelfth and thirteenth aspects of the present invention, a circuit pattern is formed on the inner wall surface of the housing, and the electronic component can be directly mounted on the circuit pattern. There is an excellent effect that a printed circuit board to be used is not required, and the electronic device can be reduced in size and mounted with high density.

In particular, according to the thirteenth aspect of the present invention, since the exterior of the housing can be used as the exterior of the electronic equipment as it is, an excellent effect of improving heat dissipation and reducing the cost of assembly is possible. There is.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a lithographic apparatus according to an embodiment.

FIG. 2 is an explanatory diagram when illuminating the inside wall of a housing by a projection device.

FIG. 3A is a diagram illustrating a case where a projection device and a housing are swung to irradiate a bottom surface of the housing. FIG. 3B is an explanatory diagram in a case where the projection device and the housing are swung to irradiate a curved surface of the housing.

FIG. 4 is an explanatory diagram of a projection device according to a modification.

FIGS. 5A to 5C are explanatory diagrams when a circuit pattern is projected by a tilt projection device according to another modification.

FIG. 6 is an explanatory diagram when a circuit pattern is projected on the side surface of the housing by the tilting projection device.

FIG. 7 is an explanatory diagram illustrating a schematic configuration of a lithography apparatus according to another embodiment.

FIG. 8 is a schematic configuration diagram of an overhang irradiation unit according to still another modification.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lithography apparatus 2 Housing 2a, 2b, 2c, 2d Housing side surface 2r Curved surface having a curvature portion 2s Resist layer 10 Projection device 11 DMD (digital micromirror device) 20 Projection swing device 30 Work swing device 40 Projection device 41 Liquid crystal 50 Projection device 100 Lithography device 110 Laser optical system 112 Z-axis galvanomirror 113 Y-axis galvanomirror 120 Work moving device 151 Mirror of overhang irradiation means LB Laser light

Claims (13)

[Claims] 1. A lithographic apparatus for irradiating a resist layer with a light image to form a circuit pattern, comprising:
Alternatively, a lithography apparatus comprising a projection unit capable of irradiating an optical image onto a resist layer formed on a curved surface having a curvature portion to form a circuit pattern. 2. A lithographic apparatus according to claim 1, wherein said projection means irradiates said light image with a digital micromirror device (DMD) having a plurality of micromirrors. 3. A lithographic apparatus according to claim 1, wherein said projection means irradiates said light image with a liquid crystal. 4. The lithographic apparatus according to claim 1, wherein said projecting means comprises a tilting projecting means for irradiating said resist image obliquely with said light image to form a circuit pattern. Lithographic apparatus. 5. The lithographic apparatus according to claim 1, wherein the projection means irradiates the light image by scanning a laser beam with a galvanomirror. 6. A lithographic apparatus according to claim 5, wherein said projection means has overhang irradiation means for forming a pattern on the overhanging inner wall surface of the housing. 7. A lithographic apparatus according to claim 1, further comprising a driving means for swinging or rotating said projecting means. . 8. A lithographic apparatus according to claim 7, wherein said driving means has at least three axes of an X axis, a Y axis and a Z axis, and at least one of said X axis, Y axis and Z axis. A lithography apparatus characterized by swinging or rotating the projection means about an axis of the lithography apparatus. 9. The lithographic apparatus according to claim 1, further comprising a work moving means for moving the work with respect to the projection means. Lithographic apparatus. 10. The lithographic apparatus according to claim 9, wherein
The work moving means includes at least three axes of an X axis, a Y axis, and a Z axis, and swings the work around at least one of the X axis, the Y axis, and the Z axis. A lithographic apparatus, which is rotated. 11. The lithographic apparatus according to claim 9, wherein
A lithographic apparatus, wherein the workpiece moving means causes the workpiece to perform at least one of linear motion in an X-axis direction and a Y-axis direction or rocking motion about a Z-axis. 12. An electronic device having a housing, wherein a circuit pattern for mounting an electronic component is formed on a wall surface of the housing. 13. An electronic device according to claim 12, wherein said housing is used as an exterior.