JP2000077301A - Aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve throughput by reducing the time required for step movement. SOLUTION: A wafer W as an object to be exposed is held by a stage constituted of an X-stage to be driven in an X'-axial direction and a Y-stage to be driven in a Y'-axial direction. The step movement of the wafer W, since one shot area S1 is exposed until the next shot area S2, is operated in a direction inclined to the X' axial direction and Y' axial direction at 45 deg.. That is, the X-stage and the Y-stage are moved at the same to the same distance, so that the wafer W can be step-moved linearly. The movement distance of the stage in the X'-axial direction and the Y'-axial direction can be turned into α.2-1/2 with respect to a step movement distance α, and a time required for step movement can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for manufacturing a semiconductor device, a liquid crystal display, an image pickup device such as a CCD, and a micro device such as a thin film magnetic head.

[0002]

2. Description of the Related Art In a photolithography process which is one of the manufacturing processes of a semiconductor device, an exposure apparatus for transferring a pattern formed on a mask or a reticle onto a wafer (photosensitive substrate) coated with a photoresist. A projection exposure apparatus (stepper) for reducing and projecting a mask pattern onto a shot area on a wafer is often used. The stepper uses a step-and-repeat method in which mask patterns are exposed collectively to shot areas on the wafer, and the wafer is sequentially moved and batch exposure is performed for other shot areas. In order to improve the exposure performance, the mask and the wafer are moved synchronously, scanned and illuminated with slit light of a rectangular or other shape to sequentially expose the shot area on the wafer, and sequentially move the wafer to A step-and-scan method in which scanning and exposure are repeated with respect to the shot area has been developed and put to practical use.

In this type of exposure apparatus, a wafer to be exposed is held by suction on a wafer holder held on a wafer table. The wafer stage moves in the X-axis direction in a plane substantially perpendicular to the optical axis of the projection optical system, and moves in the Y-axis direction perpendicular to the X-axis direction in a plane substantially perpendicular to the optical axis of the projection optical system. Is moved in the XY plane by the moving Y stage. The X stage and the Y stage are driven by a drive system having a linear motor or the like extending in the X axis direction and the Y axis direction, respectively. For example, a Y stage is mounted on the X stage,
A wafer table is placed on the stage. A moving mirror of a laser interferometer for detecting the position is integrally fixed to the wafer table, and the movement of the wafer table is controlled based on the measurement value and control data of the laser interferometer.

In the case of a conventional step-and-repeat type exposure apparatus, the step movement of the wafer is performed in the X-axis direction as the driving direction of the X stage or in the Y-axis direction as the driving direction of the Y stage. ing.

Further, synchronous movement (scan) in the case of a conventional step-and-scan type exposure apparatus.
Is performed in the X-axis direction as the driving direction of the X stage or in the Y-axis direction as the driving direction of the Y stage.

[0006]

As described above, conventionally, a step movement or a synchronous movement (scan) is performed in one axial direction corresponding to the driving direction of the stage. Here, in the exposure apparatus, an improvement in throughput (production amount per unit time) is required, and the step movement after performing the exposure processing on one shot area until the exposure processing on the next shot area is performed. , The overall throughput can be greatly improved.

The present invention has been made in view of such a point, and an object of the present invention is to shorten the time required for moving from one shot area to the next shot area, and as a whole, An object of the present invention is to provide an exposure apparatus capable of improving throughput.

[0008]

Means for Solving the Problems In the following description, in order to facilitate understanding, each constituent element of the present invention will be described with reference numerals shown in the drawings of the embodiments. The constituent elements of the invention are not limited by these reference numerals.

1. An exposure apparatus according to the present invention for achieving the above object comprises a photosensitive substrate on a stage (16) which is moved by first and second driving systems (18X, 18Y) in first and second directions substantially orthogonal to each other. (W), while moving the stage stepwise, the illumination optical system (11)
In the exposure apparatus, the image of the pattern of the mask (R) illuminated by the above is sequentially transferred onto the photosensitive substrate, and the step moving direction is changed to the first and second directions within a plane including the first and second directions. It is characterized by being set in a direction inclined with respect to two directions.

Conventionally, the stage is moved stepwise in the same direction as the driving direction of the stage by the first drive system (or the second drive system). Therefore, the step movement distance is the same as the step movement distance by the first drive system (or the second drive system). Although it was necessary to move the distance, according to the present invention, the direction (Y direction) inclined with respect to the first direction (X ′ direction) and the second direction (Y ′ direction) as the driving direction of the stage, That is, both the first drive system and the second drive system are simultaneously operated at a speed ratio corresponding to the tilt angle ratio between the first direction and the second direction of the step movement direction, and the stage is linearly moved in the tilt direction. Moved.

Therefore, the moving distance in the first direction by the first driving system and the moving distance in the second direction by the second driving system are both shorter than the step moving distance. That is,
Assuming that the angle between the first direction and the step moving direction is θ and the step moving distance is α, α · cos θ in the first direction,
What is necessary is just to move by α · sin θ in the second direction. For example, the angle between the first direction and the step moving direction is θ = 45.
If set to °, the movement distances in the first and second directions are each 2-1 ^{/ 2} times, that is, about 0.707α.

[0012] Thus, if the speed of the drive system which is longer of the moving distance in the first direction and the moving distance in the second direction is set to be the same as the conventional step moving speed, the step moving is required. Time can be reduced. If the time required for the step movement is set to be the same as the conventional one, the moving speed of the stage by the first drive system or the second drive system can be reduced, and the burden on the first drive system or the second drive system is reduced. Less.

2. An exposure apparatus according to the present invention for achieving the above object comprises a photosensitive substrate on a stage (16) which is moved by first and second driving systems (18X, 18Y) in first and second directions substantially orthogonal to each other. (W), while scanning the photosensitive substrate and the mask (R) synchronously, and sequentially transferring the image of the pattern of the mask illuminated by the illumination optical system (11) onto the photosensitive substrate. Wherein the synchronous movement direction is set in a direction inclined with respect to the first and second directions in a plane including the first and second directions.

In the exposure apparatus according to the present invention, the stage (12) is moved by the first and second driving systems (13X, 13Y) in first and second directions substantially orthogonal to each other.
An image of a pattern of the mask illuminated by the illumination optical system (11) is sequentially transferred onto the photosensitive substrate while the mask (R) is held thereon and the photosensitive substrate (W) and the mask are synchronously moved. In the scanning type exposure apparatus described above, the synchronous movement direction is set to a direction inclined with respect to the first and second directions in a plane including the first and second directions.

In the prior art, the stage is moved synchronously (scanned) in the same direction as the driving direction by the first driving system (or the second driving system), so that the moving speed of the stage by the first driving system (or the second driving system). Must be set to the same speed as the synchronous movement speed. However, according to the present invention, the stage is inclined with respect to the first direction (X ′ direction) and the second direction (Y ′ direction) as the driving direction of the stage. Direction, that is, both the first drive system and the second drive system are simultaneously operated at a speed ratio according to the tilt angle ratio with respect to the first direction and the second direction of the synchronous movement direction, and the stage is linearly moved in the tilt direction. Moved synchronously.

Therefore, the moving speed in the first direction by the first drive system and the moving speed in the second direction by the second drive system can both be lower than the synchronous moving speed. That is, if the angle between the first direction and the synchronous movement direction is θ and the synchronous movement speed is v, v · cos θ in the first direction,
What is necessary is just to move at a speed of v · sin θ in the second direction. For example, the angle between the first direction and the synchronous movement direction is θ = 45 °
, The moving speeds in the first direction and the second direction are each 2-1 ^{/ 2} times, that is, about 0.707v.

Thus, the moving speed in the first direction and the moving speed in the second direction can be reduced, the load on the first drive system or the second drive system is reduced, and the stage by each drive system is reduced. The time and distance required for acceleration / deceleration (running scan) can be reduced, and the overall throughput can be improved.

[0018]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic block diagram of a step-and-repeat or step-and-scan type reduction projection exposure apparatus according to an embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes an illumination optical system,
The illumination optical system 11 includes an exposure light source for emitting excimer laser light, a fly-eye lens or a rod-eye lens for uniformizing the illuminance distribution.
It comprises an optical integrator (homogenizer) such as an integrator, an illumination system aperture stop, a reticle blind (variable field stop), and a condenser lens system.

A reticle R as a photomask on which a pattern to be transferred is formed is held by suction on a reticle stage 12 having an X stage 12X and a Y stage 12Y. The reticle R on the reticle 12 is irradiated. The image of the pattern in the illumination area of the reticle R is projected onto the surface of the wafer W coated with a photoresist as an exposure target at a reduction magnification (for example, 1/5 or 1/4) via the projection optical system PL. Projected.

In the following description, a direction parallel to the optical axis AX of the projection optical system PL is defined as a Z axis, and a direction parallel to the plane of FIG. 1 in a plane perpendicular to the Z axis is defined as an X axis. The direction perpendicular to the plane of FIG. 1 is the Y axis, and this coordinate system is called a first coordinate system. The first coordinate system is a second coordinate system including the X 'axis, the Y' axis, and the Z axis rotated 45 degrees counterclockwise about the Z axis.

The X stage 12X is driven in the X 'axis direction by a reticle X drive system 13X having a linear motor or the like extended on the column (not shown) in the X' axis direction. Y
The stage 12Y is a reticle Y drive system 1 having a linear motor or the like extended on the X stage 12X in the Y ′ axis direction.
Driven in the Y′-axis direction by 3Y. The positions of the reticle stage 12 in the X-axis direction and the Y-axis direction are respectively measured by a laser interferometer (not shown), and control from the control device 14 is performed based on the measured values and control data stored and held in the storage device 15 in advance. Reticle stage 1 by signal
2 is controlled.

In this embodiment, as shown in FIG. 2, the reticle R has a predetermined reference M whose X-axis (or Y-axis)
Are held by suction on the reticle stage 12 in a state where they are aligned. In other words, the reticle R is in the X′-axis direction as the driving direction by the reticle X driving system 13X (or the Y′-axis direction as the driving direction by the reticle Y driving system 13Y).
Is held by suction on the reticle stage 12 in a state of being rotated by 45 ° with respect to.

Referring again to FIG. The wafer W is held by vacuum suction on a wafer holder WH placed on a wafer table (not shown), and this wafer table is placed on a wafer stage 16 composed of an X stage 16X and a Y stage 16Y. The X stage 16X is driven by a wafer X drive system 18X having a linear motor or the like extended on the base 17 in the X′-axis direction. The Y stage 16Y is driven by a wafer Y drive system 18Y having a linear motor or the like extended on the X stage 16X in the Y 'axis direction. The wafer table is installed on the Y stage 16Y via a plurality of actuators (not shown) displaced in the Z direction.

The surface of the wafer W sucked and held by the wafer holder WH is appropriately controlled by an auto-focus system, which controls the focus position of the wafer W (position in the optical axis AX direction) and the actuator for displacing the tilt angle in the Z-axis direction. Thereby, it is adjusted to the image plane of the projection optical system PL. The positions of the wafer table in the X-axis direction and the Y-axis direction are respectively measured by a laser interferometer (not shown), and a control signal from the control device 14 is obtained based on the measured values and control data stored and held in the storage device 15 in advance. Accordingly, the operation of the wafer stage 16 is controlled.

The control device 14 controls the operation of the wafer stage 16 and the reticle stage 12 in accordance with control data including shot map data stored and held in the storage device 15 in advance. The shot map data is data indicating the position of each shot area where a pattern on the wafer W is to be transferred.

In this embodiment, the shot map data is expressed with reference to the first coordinate system.
Therefore, the data is converted into data based on the second coordinate system,
Each control signal is generated, and the wafer X drive system 18X
And to the wafer Y drive system 18Y. However, as the shot map data, data expressed based on the second coordinate system can be adopted, and in that case, the coordinate conversion is not necessary.

In the above description, the laser interferometer for detecting the positions of the reticle stage 12 and the wafer stage 16 uses the X of the reticle stage 12 and the wafer stage 16.
Although the positions in the axial direction and the Y-axis direction are measured, the positions in the X′-axis direction and the Y′-axis direction may be measured.

The wafer holder WH is a substantially disk-shaped member, and is detachably held at a predetermined position on the wafer table by vacuum suction. On the wafer mounting surface on the upper surface of the wafer holder WH, a number of substantially concentric concave grooves are formed in order to hold the wafer W by suction. Each groove communicates with a negative pressure source (not shown) through a hole penetrating in the thickness direction of the wafer holder WH.

The wafer holder WH has a plurality of through holes through which three up and down pins forming a wafer up and down movement mechanism for vertically moving the wafer W are supported while the wafer W is being replaced at three points. Then, the wafer W is mounted on the wafer holder WH by the wafer vertical movement mechanism, and the negative pressure source is operated, so that the wafer W is suction-held on the mounting surface of the wafer holder WH.

The wafer W has an orientation flat (orientation flat) or a notch or a mark.
In this embodiment, the wafer W is suction-held by the wafer holder WH with the predetermined reference aligned with the X-axis (or the Y-axis). For example, as shown in FIG. 3, when the predetermined reference of the wafer W is an orientation flat, the orientation of the edge OF forming the orientation flat is substantially parallel to the X-axis direction (or the Y-axis direction). Is set. That is, the wafer W is suction-held by the wafer holder WH in a state of being rotated by 45 degrees with respect to the driving directions (X′-axis direction, Y′-axis direction) by the wafer X drive system 18X and the wafer Y drive system 18Y.

Step-and-Repeat Method Hereinafter, a case where the present invention is applied to a step-and-repeat type reduction projection exposure apparatus will be described. The step-and-repeat type reduction projection exposure apparatus collectively exposes a reduced image of the pattern of the reticle R to a shot area on the wafer W, and performs batch exposure on other shot areas while sequentially moving the wafer stepwise. It is an exposure apparatus of a repeating system.

First, the controller 14 controls the reticle X drive system 1
A control signal is sent to the 3X and reticle Y drive system 13Y to carry the reticle R to a predetermined reticle set position. Also,
The wafer W is carried into the vicinity of the wafer table, and is suction-held by the wafer holder WH. The control device 14 sends a control signal to the wafer X drive system 18X and the wafer Y drive system 18Y based on the shot map data and other control data in the storage device 15 so that the first shot area to be subjected to the exposure processing is projected onto the projection optical system PL Is set to the projection position. At that position, illumination by the illumination optical system 11 is performed, and the projection image of the pattern of the reticle R is transferred to the first shot area at a time.

Next, a control signal is sent to the wafer X drive system 18X and the wafer Y drive system 18Y so that the next shot area is set at the projection position, and the wafer X drive system 18X and the wafer Y drive system 18Y are simultaneously operated. And X '
It moves in the axial direction and the Y′-axis direction at the same speed and for the same time. As a result, the wafer W is step-moved by the distance α at an angle of 45 ° with respect to the + Y-axis direction, that is, the X′-axis direction and the Y′-axis direction. Exposure processing is similarly performed at that position.

Exposure processing is sequentially performed on each shot area in the Y-axis direction while similarly stepwise moving in the + Y-axis direction, and if a row of exposure processing in the Y-axis direction is completed,
Step by one frame in the + X-axis direction. Then Y
Exposure processing is performed while sequentially moving stepwise in the −Y-axis direction for each shot area in the axial direction, and thereafter the exposure processing is similarly repeated up to the last shot area.

According to this embodiment, the wafer X drive system 18X and the wafer Y drive system 18Y are simultaneously operated at the same speed for the same time to move the wafer W in the Y-axis direction, that is, the X stage by the wafer X drive system 18X. 4 with respect to the X'-axis direction as the driving direction of the 16X and the Y'-axis direction as the driving direction of the Y stage 16Y by the wafer Y driving system 18Y.
Step movement is performed in a direction inclined by 5 °.

As a result, as shown in FIG.
In the prior art in which the wafer X drive system 18X step-moves in the X'-axis direction as the drive direction of the X stage 16X, the wafer X drive system 18X needs to move the X stage 16X by a distance equal to the step movement distance α. However, as shown in FIG. 5, according to the present embodiment, the moving distance of the X stage 16X by the wafer X drive system 18X and the Y stage 16 by the wafer Y drive system 18Y
The moving distance of Y is 2 ⁻¹ / ² · α, that is,
When the moving speed of the X stage 16X by the wafer X driving system 18X and the moving speed of the Y stage 16Y by the wafer Y driving system 18Y are set to be the same as the conventional step movement in one axial direction, the step of the distance α The time required for the movement is reduced to about 0.707 times. Therefore, the time required for the exposure processing for one wafer W can be significantly reduced, and the throughput can be improved. In FIG. 4 or FIG. 5, S1 and S2 indicate shot areas on which the exposure processing has been performed, and the dotted line indicates the position of the wafer W after the step movement.

If the time required for the step movement is set to be the same as the conventional one, the moving speed of the X stage 16X by the wafer X drive system 18X or the Y stage 16Y by the wafer Y drive system 18Y can be reduced. The burden on the X drive system 18X or the wafer Y drive system 18Y is reduced, and a small output and small drive system can be adopted, and the cost can be reduced.

Step-and-Scan Method Hereinafter, the case where the present invention is applied to a step-and-scan type reduction projection exposure apparatus will be described. In the step-and-scan method, the illumination light IL from the illumination optical system 11 is shaped into a rectangular or other slit shape, the reticle R is illuminated with the slit light, and the reticle R and the wafer W are projected onto the projection optical system PL. Is synchronously moved (scanned) with respect to the projection optical system PL at a speed ratio corresponding to the projection magnification of, so that the projected image of the pattern of the reticle R is sequentially transferred to the shot area of the wafer W, and the wafer is sequentially moved step by step. This is a method in which exposure is sequentially repeated for other shot areas.

First, the controller 14 controls the reticle X drive system 1
A control signal is sent to the 3X and reticle Y drive system 13Y, and the reticle R is set to the forward initial position of two predetermined initial positions. Further, the wafer W is transferred to the wafer holder W.
The controller 14 sends a control signal to the wafer X drive system 18X and the wafer Y drive system 18Y based on the shot map data and other control data in the storage device 15 to hold the shots to be exposed first. The area is set to a predetermined initial position near the position projected by the projection optical system PL. In this state, the movement of the reticle R in the + Y-axis direction (run-in) is started, and in synchronization therewith, the movement of the
Start moving (running) in the Y-axis direction, and perform illumination / scanning with slit light at the time when each reaches a predetermined speed.
The projected image of the pattern of the reticle R is sequentially transferred to the first shot area.

That is, the control device 14 sends a control signal to the reticle X drive system 13X and the reticle Y drive system 13Y, and the reticle X drive system 13X and the reticle Y drive system 13X.
Y at the same time, the + X 'axis direction and + Y'
It moves in the axial direction at the same speed for the same time. Thus, the reticle R is moved at an angle of 45 ° with respect to the + Y-axis direction, that is, the X′-axis direction and the Y′-axis direction.

On the other hand, the control unit 14 controls the wafer X drive system 18X and the wafer Y drive system 18Y
To the wafer X drive system 18X and the wafer Y
The drive systems 18Y are simultaneously operated to move in the -X 'axis direction and the -Y' axis direction at the same speed and for the same time. Thereby, the wafer W is moved in the −Y axis direction, that is,
The reticle R is moved in a direction opposite to the moving direction of the reticle R at an angle of 45 ° with respect to the X ′ axis direction and the Y ′ axis direction.

Next, the controller 14 sends control signals to the reticle X drive system 13X and the reticle Y drive system 13Y,
The reticle R is set at a plurality of initial positions among two predetermined initial positions of forward and backward. Further, the control device 14 sends a control signal to the wafer X drive system 18X and the wafer Y drive system 18Y based on the shot map data and other control data in the storage device 15 to determine the next shot area to be subjected to the next exposure processing. It is set to a predetermined initial position near the position projected by the projection optical system PL. In this state, the reticle R is synchronously moved in the −Y axis direction and the wafer W is synchronously moved in the + Y axis direction, and the projected image of the pattern of the reticle R is sequentially transferred to the next shot area.

That is, the control device 14 sends a control signal to the reticle X drive system 13X and the reticle Y drive system 13Y, and the reticle X drive system 13X and the reticle Y drive system 13X.
Y are operated at the same time, so that the -X 'axis direction and -Y'
It moves in the axial direction at the same speed for the same time. As a result, the reticle R is moved at an angle of 45 ° with respect to the −Y-axis direction, that is, the X′-axis direction and the Y′-axis direction.

On the other hand, the control device 14 controls the wafer X drive system 18X and the wafer Y drive system 18Y
To the wafer X drive system 18X and the wafer Y
The drive systems 18Y are simultaneously operated to move in the + X 'axis direction and the + Y' axis direction at the same speed and for the same time. As a result, the wafer W is moved in the + Y-axis direction,
The reticle R is moved in a direction opposite to the moving direction of the reticle R at an angle of 45 ° with respect to the X ′ axis direction and the Y ′ axis direction.

Exposure processing is sequentially performed on each shot area in the + X-axis direction while sequentially moving to the adjacent shot area in the same manner. When the exposure processing in one row in the X-axis direction is completed, the exposure processing is performed in the + Y-axis direction. Exposure processing is performed while step-moving by one frame and sequentially stepping in the −X-axis direction for each shot area in the X-axis direction, and thereafter, the exposure processing is similarly repeated up to the last shot area.

According to this embodiment, the wafer X drive system 18X and the wafer Y drive system 18Y are simultaneously operated at the same speed and for the same time to move the wafer W in the Y-axis direction (or -Y-axis direction), The wafer is synchronously moved in a direction inclined by 45 degrees with respect to the X'-axis direction as the driving direction of the X stage 16X by the X driving system 18X and the Y'-axis direction as the driving direction of the Y stage 16Y by the wafer Y driving system 18Y. ing.

Thus, in the prior art in which the wafer X drive system 18X synchronously moves in the X'-axis direction as the drive direction of the X stage 16X, the wafer X drive system 18X
X moves the X stage 16X to the synchronous movement speed v of the wafer W.
Although it was necessary to move at a speed equal to 1, according to the present embodiment, the X stage 1 by the wafer X drive system 18 </ b> X was used.
The moving speed of 6X and the moving speed of the Y stage 16Y by the wafer Y drive system 18Y are 2 ^-1 / 2.v1, respectively.
That is, it is about 0.707 · v1.

Therefore, the moving speed of the X stage 16X in the X 'direction by the wafer X driving system 18X and the moving speed of the Y stage 16Y in the Y' direction by the wafer Y driving system 18Y can be reduced. The load on the system 18X or the wafer Y driving system 18Y is reduced, and the time and distance required for acceleration / deceleration (running scan) at the time of the step movement are reduced, and the time required for exposure processing for one wafer W is greatly reduced. And the throughput can be improved.

According to this embodiment, the reticle X drive system 13X and the reticle Y drive system 13Y are simultaneously operated at the same speed and for the same time to move the reticle R in the Y-axis direction (or -Y-axis direction), that is, The reticle X drive system 13X synchronously moves in the X'-axis direction as the drive direction of the X stage 12X by the reticle Y drive system 13Y and the Y 'axis direction as the drive direction of the Y stage 12Y by the reticle Y drive system 13Y in a direction inclined by 45 °. Like that.

Thus, in the prior art in which the reticle X driving system 13X synchronously moves the X stage 12X in the X 'axis direction as the driving direction of the X stage 12X, the reticle X driving system 13X moves the X stage 12X synchronously with the reticle R. Although it was necessary to move at a speed equal to the speed v2, according to the present embodiment, the moving speed of the X stage 12X by the reticle X driving system 13X and the moving speed of the Y stage 13Y by the reticle Y driving system 13Y are respectively 2
^{−１ ／} · v2, that is, about 0.707 · v2.

Therefore, X by the reticle X drive system 13X
Moving speed of stage 12X in X 'direction and reticle Y
The moving speed of the Y stage 12Y in the Y ′ direction by the drive system 13Y can be reduced, and the reticle X drive system 13X
Alternatively, the load on the reticle Y drive system 13Y is reduced, and the time and distance required for acceleration / deceleration (running scan) during step movement are reduced, so that the time required for exposure processing for one wafer W is significantly reduced. And the throughput can be improved.

Here, in this embodiment, FIG.
As shown in (A), the movement from the exposure processing for one shot area S1 to the exposure processing for the next shot area S2 is performed, and after the scanning exposure in the + Y axis direction, + Y Go straight in the axial direction and decelerate,
After stopping at the point P1, it moves in the + X-axis direction and stops at the point P2, and then accelerates in the -Y-axis direction to move to the next shot area S2.
Is subjected to scanning exposure.

However, as shown in FIG. 6B, after the exposure processing for one shot area S1, it is preferable to proceed in an arc shape and perform the scanning exposure for the next shot area S2. This is because, since the traveling direction is continuously changed, the occurrence of vibration is smaller than that shown in FIG. 6A, and the moving distance can be shortened because the moving distance is short.

As shown in FIG. 6C,
After the exposure processing for one shot area S1, go straight and change the direction at point P3, turn back at a right angle at point P4, change the direction at point P5, proceed in the −Y-axis direction, and proceed to the next shot area. The scanning exposure for S2 may be performed. In the case of FIGS. 6 (A) and 6 (C), a transition curve such as an arc or a quadratic curve is inserted in the vicinity of the points P1 to P5 where the direction is changed, and the generation of the vibration accompanying the change in the traveling direction is performed. Should be suppressed.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore,
Each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above embodiment, the step-and-repeat method and the step-and-repeat method
The scan type reduction projection exposure apparatus has been described as an example, but the present invention is not limited to these, and is also applicable to a large substrate exposure apparatus for manufacturing a stepper type or a mirror projection type liquid crystal display device. be able to.

[0059] Further, the exposure illumination light, emission lines (e.g., g-line, i-line), KrF excimer laser (wavelength 248 nm), ArF excimer laser (wavelength 193 nm), _{F 2} excimer laser (wavelength 157n
m) or a harmonic such as a YAG laser. Further, for example, EUV (Extreme Ul) having an oscillation spectrum at 5 to 15 nm (soft X-ray region).
(tra Violet) light is used as exposure illumination light, an illumination area on the reflection mask is defined in an arc slit shape, and a reduction projection optical system including only a plurality of reflection optical elements (mirrors) is provided. EUV exposure equipment, etc., which transfers the reflection mask pattern onto the wafer by synchronously moving the reflection mask and the wafer at a speed ratio corresponding to the magnification of
The present invention can be applied.

[0060]

Since the present invention is constructed as described above, an exposure apparatus capable of reducing the time required for moving from one shot area to the next shot area and improving the overall throughput is provided. There is an effect that it can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a relationship between a reticle attitude and a coordinate system according to the embodiment of the present invention.

FIG. 3 is a diagram showing a relationship between a posture of a wafer and a coordinate system according to the embodiment of the present invention.

FIG. 4 is an explanatory view of a step movement of a conventional step-and-repeat type exposure apparatus.

FIG. 5 is an explanatory diagram of a step movement of the exposure apparatus of the step-and-repeat method according to the embodiment of the present invention.

FIG. 6 is an explanatory diagram of movement of a wafer in the step-and-scan exposure apparatus according to the embodiment of the present invention.

[Explanation of symbols]

 R ... reticle (mask) W ... wafer (photosensitive substrate) WH ... wafer holder PL ... projection optical system IL ... illumination light 11 ... illumination optical system 12 ... reticle stage 12X ... X stage 12Y ... Y stage 13X ... reticle X drive system 13Y ... Reticle Y drive system 14 Control device 15 Storage device 16 Wafer stage 16X X stage 16Y Y stage 18X Wafer X drive system 18Y Wafer Y drive system

Claims (6)

[Claims] An illumination optical system holds a photosensitive substrate on a stage moved by first and second driving systems in first and second directions substantially orthogonal to each other, and moves the stage in steps. An exposure apparatus for sequentially transferring the image of the mask pattern thus formed onto the photosensitive substrate, wherein the step movement direction is set with respect to the first and second directions in a plane including the first and second directions. An exposure apparatus, wherein the exposure apparatus is set in a tilting direction. 2. The exposure apparatus according to claim 1, wherein an inclination angle of the step movement direction with respect to the first and second directions is set to approximately 45 degrees. 3. The mask according to claim 1, wherein the mask is arranged to be inclined by an angle corresponding to an inclination angle of the step moving direction with respect to the first and second directions.
3. The exposure apparatus according to claim 1. 4. An illumination optical system that holds a photosensitive substrate on a stage moved by first and second driving systems in first and second directions substantially orthogonal to each other, and synchronously moves the photosensitive substrate and the mask. A scanning type exposure apparatus for sequentially transferring an image of a mask pattern illuminated by a system onto the photosensitive substrate, wherein the synchronous movement direction is the first and the second in a plane including the first and the second directions. An exposure apparatus, wherein the exposure apparatus is set in a direction inclined with respect to a second direction. 5. An illumination optical system while holding a mask on a stage moved by first and second driving systems in first and second directions substantially orthogonal to each other, and synchronously moving the photosensitive substrate and the mask. In the scanning exposure apparatus, the images of the pattern of the mask illuminated by are sequentially transferred onto the photosensitive substrate, wherein the synchronous movement direction is the first and the second in a plane including the first and the second directions. An exposure apparatus, wherein the exposure apparatus is set in a direction inclined with respect to two directions. 6. The exposure apparatus according to claim 4, wherein an inclination angle of the synchronous movement direction with respect to the first and second directions is set to approximately 45 degrees.