JP2000303042A - Conductive paste and production of filler for conductive paste - Google Patents
Conductive paste and production of filler for conductive pasteInfo
- Publication number
- JP2000303042A JP2000303042A JP11111730A JP11173099A JP2000303042A JP 2000303042 A JP2000303042 A JP 2000303042A JP 11111730 A JP11111730 A JP 11111730A JP 11173099 A JP11173099 A JP 11173099A JP 2000303042 A JP2000303042 A JP 2000303042A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- conductive paste
- powder
- resin
- binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000843 powder Substances 0.000 claims abstract description 23
- 239000011230 binding agent Substances 0.000 claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 abstract description 11
- 230000001070 adhesive effect Effects 0.000 abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 6
- 238000005096 rolling process Methods 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 abstract description 3
- 239000004925 Acrylic resin Substances 0.000 abstract description 2
- 229920000178 Acrylic resin Polymers 0.000 abstract description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012461 cellulose resin Substances 0.000 abstract description 2
- 229920006122 polyamide resin Polymers 0.000 abstract description 2
- 229920005749 polyurethane resin Polymers 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000011231 conductive filler Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 9
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器の導電部
を電気的に通電させて接続する導電ペーストおよび該導
電ペーストに使用するフィラーの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste for connecting a conductive portion of an electronic device by electrically supplying a conductive portion, and a method for producing a filler used for the conductive paste.
【０００２】[0002]
【従来の技術】一般に導電部を接着するものとしては溶
接、はんだ付け等の無機的なものと、導電ペーストのよ
うな有機的なものがある。後者の導電ペーストとは、
金、銀、銅、はんだ、カーボン等の微粉末をエポキシ樹
脂のような有機樹脂に混合させたもので、熱硬化により
微粉末を機械的、電気的に接着するものである。この導
電ペーストは、あらゆる電子部品、リード、コネクター
等、電子機器の導電部の接着に使用され、その用途はき
わめて広い。2. Description of the Related Art Generally, there are inorganic materials such as welding and soldering, and organic materials such as a conductive paste for bonding a conductive portion. The latter conductive paste
Fine powder of gold, silver, copper, solder, carbon, etc. is mixed with an organic resin such as epoxy resin, and the fine powder is mechanically and electrically bonded by thermosetting. This conductive paste is used for bonding conductive parts of electronic devices such as all electronic components, leads, connectors, etc., and its use is extremely wide.
【０００３】従来の導電ペーストは、フィラーが球状、
不定形、鱗片状、等の形状であった。[0003] Conventional conductive pastes have spherical fillers,
The shapes were irregular, scaly, etc.
【０００４】[0004]
【発明が解決しようとする課題】ところで従来の導電ペ
ーストは、接着強度を強くすると電気抵抗が小さくな
り、逆に電気抵抗を小さくすると接着強度が弱くなると
いう問題があった。However, the conventional conductive paste has a problem that the electric resistance decreases when the adhesive strength is increased, and the adhesive strength decreases when the electric resistance is decreased.
【０００５】本発明者が、従来の導電ペーストで接着強
度を強くすると電気抵抗が小さくなり、電気抵抗を小さ
くすると接着強度が弱くなる原因について鋭意検討を加
えた結果、接着強度が弱くなるのはフィラーの含有量が
多くなるため導電ペースト中の接着強度に寄与するバイ
ンダーの量が少なくなり、また電気抵抗が大きくなるの
は導電ペースト中のフィラーの量が少なくなるためであ
ることが判明した。つまり従来の導電ペーストは、フィ
ラーが縦・横の長さがほぼ同一長という球状、不定形、
鱗片状、等であり、隣接するフィラーとフィラーが接触
する部分が少ないために、混合するフィラーの量が少な
いとフィラー同士の接触が少なくなって電気抵抗が大き
くなることが判明した。つまり電気抵抗を小さくするた
めにフィラーを大量に混合して密度を高めると、その分
バインダーの量が少なくなって、接着力が弱くなるもの
である。[0005] The inventors of the present invention have conducted intensive studies on the cause of the decrease in the electric resistance when the adhesive strength is increased with the conventional conductive paste, and the decrease in the electric strength when the electric resistance is decreased. It has been found that the content of the filler increases, the amount of the binder contributing to the adhesive strength in the conductive paste decreases, and the electric resistance increases because the amount of the filler in the conductive paste decreases. In other words, conventional conductive pastes have spherical, indeterminate,
It was found that the filler was scaly and the like, and there was little contact between the filler and the adjacent filler. Therefore, it was found that if the amount of the filler to be mixed was small, the contact between the fillers was reduced and the electric resistance was increased. That is, when the density is increased by mixing a large amount of filler to reduce the electric resistance, the amount of the binder is reduced correspondingly, and the adhesive strength is reduced.
【０００６】図２は球形のフィラーが混合された従来の
導電ペーストにおける導体の接着状態を説明する図であ
る。導電部１、１間を従来の導電ペースト２で接着する
と、バインダー３中に球形のフィラー４・・・が混在し
ている。球形のフィラー４はフィラー同士が接触するこ
とにより導通がなされるが、球形のフィラー４は表面積
が小さいため、他の球形のフィラーとの接触する部分も
少ない。従って、球形のフィラー同士を接触させるため
には導電ペースト中にフィラーを大量に混合しなければ
ならない。しかしながら導電ペースト中に大量のフィラ
ーが混合されると接着に寄与するバインダーの量が少な
くなるため接着強度が弱くなってしまうものである。FIG. 2 is a view for explaining the bonding state of conductors in a conventional conductive paste mixed with a spherical filler. When the conductive portions 1 and 1 are bonded to each other with the conventional conductive paste 2, spherical fillers 4 are mixed in the binder 3. The spherical filler 4 conducts when the fillers come into contact with each other. However, since the spherical filler 4 has a small surface area, the spherical filler 4 has less contact with other spherical fillers. Therefore, in order to bring spherical fillers into contact with each other, a large amount of fillers must be mixed into the conductive paste. However, if a large amount of filler is mixed into the conductive paste, the amount of the binder contributing to the adhesion becomes small, so that the bonding strength is weakened.
【０００７】[0007]
【課題を解決するための手段】そこで本発明者は、フィ
ラーの形状を表面積が大きくなるようにして導電ペース
ト中でフィラー同士が接触しやすくなれば混合するフィ
ラーの量が少なくても電気抵抗を小さくできることに着
目して本発明を完成させた。Accordingly, the present inventor has proposed that if the shape of the filler is increased so that the surface area becomes larger and the fillers easily contact each other in the conductive paste, the electric resistance can be reduced even if the amount of the filler mixed is small. The present invention has been completed by noting that it can be made smaller.
【０００８】本発明は、円柱状のフィラーがバインダー
中に５０〜９５重量％混合されていることを特徴とする
導電ペーストであり、球状の金属粉を二枚の圧延板に載
置し、該金属粉を二枚の圧延板間で押圧しながら圧延板
の一方を移動させるか、或いは二枚の圧延板をそれぞれ
反対方向に移動させて金属粉を転動させることにより円
柱状に成形することを特徴とする導電ペースト用フィラ
ーの製造方法である。According to the present invention, there is provided a conductive paste characterized in that a columnar filler is mixed in a binder in an amount of 50 to 95% by weight, and a spherical metal powder is placed on two rolled plates. Either moving one of the rolled plates while pressing the metal powder between the two rolled plates, or moving the two rolled plates in opposite directions and rolling the metal powder to form a cylindrical shape A method for producing a filler for conductive paste, characterized in that:
【０００９】[0009]
【発明の実施の形態】本発明の導電ペーストに使用する
粉末は円柱状であり、円柱状への成形のしやすさ、価
格、入手の容易性等の点で銅粉が適している。本発明で
は円柱状の銅粉そのものでもよいが、さらに抵抗を小さ
くするためには円柱状の銅粉に銀メッキを施しておく。
円柱状への銀メッキは、化学メッキ、電気メッキ等の手
段で行う。BEST MODE FOR CARRYING OUT THE INVENTION The powder used for the conductive paste of the present invention has a columnar shape, and copper powder is suitable from the viewpoints of ease of molding into a columnar shape, price, and availability. In the present invention, the columnar copper powder itself may be used, but in order to further reduce the resistance, the columnar copper powder is plated with silver.
The silver plating on the columnar shape is performed by chemical plating, electroplating or the like.
【００１０】本発明では、導電ペースト中に円柱状のフ
ィラーが５０重量％より少ないと電気抵抗が高くなって
しまい、９０重量％よりも多くなるとバインダーの量が
少なくなって接着強度が弱くなってしまう。In the present invention, when the amount of the columnar filler in the conductive paste is less than 50% by weight, the electric resistance increases, and when the amount is more than 90% by weight, the amount of the binder decreases and the adhesive strength decreases. I will.
【００１１】本発明の導電ペーストは、バインダー中に
円柱状の粉末を混合するものであるが、本発明に使用す
るバインダーとしては、エポキシ系樹脂、ポリアミド系
樹脂、酢酸ビニール系樹脂、塩化ビニール系樹脂、アク
リル系樹脂、セルローズ系樹脂、ゴム系樹脂、ポリウレ
タン系樹脂、ポリエステル系樹脂、フェノール系樹脂、
メラミン系樹脂等が好適であり、さらに適宜その他の熱
硬化性樹脂等を添加してもよい。The conductive paste of the present invention is obtained by mixing a columnar powder into a binder. The binder used in the present invention may be an epoxy resin, a polyamide resin, a vinyl acetate resin, or a vinyl chloride resin. Resin, acrylic resin, cellulose resin, rubber resin, polyurethane resin, polyester resin, phenol resin,
Melamine-based resins and the like are preferred, and other thermosetting resins and the like may be added as appropriate.
【００１２】ここで本発明の導電ペーストで導電部を接
続した状態について図１で説明する。導電部１、１を本
発明の導電ペースト５で接着すると、バインダー３中に
円柱状のフィラー６・・・が混在する。円柱状のフィラ
ーは球形のフィラーに比べて表面積が大きいため、他の
フィラーとの接触部分も多く、図１に示すように網状に
混在し、混合量が少なくても容易に接触しあって電気抵
抗が小さくなる。Here, a state where the conductive parts are connected by the conductive paste of the present invention will be described with reference to FIG. When the conductive portions 1 and 1 are bonded with the conductive paste 5 of the present invention, columnar fillers 6 are mixed in the binder 3. Since the cylindrical filler has a larger surface area than the spherical filler, there are many contact portions with other fillers, and as shown in FIG. Resistance decreases.
【００１３】本発明の導電ペースト用フィラーの製造方
法は、球状の金属粉を二枚の圧延板間に置き、圧延板に
圧力をかけながら圧延板を移動させることにより球状の
金属粉を転がして円柱状に成形するものである。移動さ
せる圧延板は一方だけでもよいし、或いは二枚の圧延板
をそれぞれ相反する方向に移動させてもよい。In the method for producing a filler for a conductive paste according to the present invention, a spherical metal powder is placed between two rolled plates, and the rolled plate is moved by applying pressure to the rolled plate to roll the spherical metal powder. It is formed into a cylindrical shape. Only one rolled plate may be moved, or two rolled plates may be moved in opposite directions.
【００１４】[0014]
【実施例】以下図面に基づいて本発明の導電ペースト用
フィラーの製造方法について説明する。図３は本発明の
導電ペースト用フィラーの製造方法を説明する図であ
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for producing a filler for a conductive paste according to the present invention will be described below with reference to the drawings. FIG. 3 is a diagram illustrating a method for producing a filler for a conductive paste according to the present invention.
【００１５】二枚の圧延板７，８間に球状の金属粉９・
・・を載置し、上部の圧延板７を下方へ押圧（矢印Ｘ）
しながら往復移動（矢印Ｙ）させる。すると球形の金属
粉９・・・は二枚の圧延板７，８間で転がり（矢印Ｚ）
ながら徐々に円柱状に成形される。A spherical metal powder 9 is placed between two rolling plates 7 and 8.
.. is placed and the upper rolling plate 7 is pressed downward (arrow X)
While reciprocating (arrow Y). Then, the spherical metal powder 9 rolls between the two rolling plates 7 and 8 (arrow Z).
It is gradually formed into a columnar shape.
【００１６】金属球の成形状態は図４に示すように、最
初は球形（Ａ）であったのが、二枚の圧延板での成形で
長さの短い俵状（Ｂ）となり、さらに成形が進むと両端
が丸い円柱状（Ｃ）となる。As shown in FIG. 4, the shape of the metal sphere is initially spherical (A), but becomes short bale (B) by forming with two rolled plates. Progresses, both ends become round cylindrical shapes (C).
【００１７】本発明では５０μｍの銅粉を上記方法で長
さ約１ｍｍの円柱状に成形し、該円柱状の金属粉をＡｇ
ＣＮの電解液中で銀の電気メッキを行った。このフィラ
ー８０重量％とエポキシ系樹脂残部から成る導電ペース
トを作製し銀電極における接着強度と電気抵抗を測定し
た。比較例として５０μｍの球状銅粉に銀メッキを行っ
たフィラーが９５重量％、残部バインダーからなる導電
ペーストで接着強度と電気抵抗の測定を行った。その結
果、本発明の導電ペーストは接着強度が１３０Ｋｇ／ｃ
ｍ２ 、電気抵抗が９Ω−ｃｍ２ であった。一方、比較
例の導電ペーストは接着強度が４５Ｋｇ／ｃｍ２ 、電
気抵抗が６６Ω−ｃｍ２ であった。In the present invention, 50 μm copper powder is formed into a columnar shape having a length of about 1 mm by the above-mentioned method, and the columnar metal powder is formed of Ag.
Silver electroplating was performed in a CN electrolyte. A conductive paste comprising 80% by weight of the filler and the remainder of the epoxy resin was prepared, and the adhesive strength and the electrical resistance at the silver electrode were measured. As a comparative example, the adhesive strength and electric resistance were measured using a conductive paste composed of 95% by weight of a filler obtained by plating silver on 50 μm spherical copper powder and the balance being a binder. As a result, the conductive paste of the present invention has an adhesive strength of 130 kg / c.
m2, and the electrical resistance was 9 Ω-cm2. On the other hand, the conductive paste of the comparative example had an adhesive strength of 45 kg / cm 2 and an electric resistance of 66 Ω-cm 2.
【００１８】[0018]
【発明の効果】以上説明したように、本発明の導電ペー
ストは、電気抵抗が小さいにもかかわらず接着強度が強
いため、電子機器の導電部間を接着したときに信頼のあ
る接着部が得られるという従来にない優れた効果を奏す
るものであり、また本発明の導電ペースト用フィラーの
製造方法は市販されている球状の金属粉末を二枚の圧延
板で転造するだけで容易に製造ができるという経済性に
も優れた製造方法である。As described above, since the conductive paste of the present invention has a high bonding strength despite its low electric resistance, a reliable bonding portion can be obtained when bonding between conductive parts of electronic equipment. In addition, the method for producing a conductive paste filler of the present invention can be easily produced simply by rolling a commercially available spherical metal powder with two rolled plates. This is a manufacturing method that is also economical in that it can be performed.
【図１】本発明の導電ペーストで導体間を接続した状態
の説明図FIG. 1 is an explanatory view of a state where conductors are connected by a conductive paste of the present invention.
【図２】従来の導電ペーストで導体間を接続した状態の
説明図FIG. 2 is an explanatory diagram of a state where conductors are connected by a conventional conductive paste.
【図３】本発明の導電ペースト用フィラーの製造方法を
説明する図FIG. 3 is a diagram illustrating a method for producing a filler for a conductive paste of the present invention.
【図４】本発明の導電ペースト用フィラーの製造方法に
おけるフィラーの成形状態FIG. 4 is a view showing the state of filler molding in the method for producing a filler for conductive paste of the present invention.
１ 導電部 ２ 従来の導電ペースト ３ バインダー ４ 球状金属粉末 ５ 本発明の導電ペースト ６ 円柱状フィラー ７、８ 圧延板 ９ 球状金属粉 REFERENCE SIGNS LIST 1 conductive part 2 conventional conductive paste 3 binder 4 spherical metal powder 5 conductive paste of the present invention 6 cylindrical filler 7, 8 rolled plate 9 spherical metal powder
Claims (3)
〜９０重量％混合されていることを特徴とする導電ペー
スト。1. The method according to claim 1, wherein the columnar filler is 50% in the binder.
A conductive paste characterized in that it is mixed in an amount of up to 90% by weight.
キが施された銅粉であることを特徴とする請求項１記載
の導電ペースト。2. The conductive paste according to claim 1, wherein the columnar filler is a copper powder having a surface plated with silver.
該金属粉を二枚の圧延板間で押圧しながら圧延板の一方
を移動させるか、或いは二枚の圧延板をそれぞれ反対方
向に移動させて金属粉を転動させることにより円柱状に
成形することを特徴とする導電ペースト用フィラーの製
造方法。3. A spherical metal powder is placed on two rolled plates,
One of the rolled plates is moved while pressing the metal powder between the two rolled plates, or the metal powder is rolled by moving the two rolled plates in opposite directions to form a cylindrical shape. A method for producing a filler for a conductive paste, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11111730A JP2000303042A (en) | 1999-04-20 | 1999-04-20 | Conductive paste and production of filler for conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11111730A JP2000303042A (en) | 1999-04-20 | 1999-04-20 | Conductive paste and production of filler for conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000303042A true JP2000303042A (en) | 2000-10-31 |
Family
ID=14568731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11111730A Pending JP2000303042A (en) | 1999-04-20 | 1999-04-20 | Conductive paste and production of filler for conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000303042A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007157551A (en) * | 2005-12-06 | 2007-06-21 | Sekisui Chem Co Ltd | Conductive particles and conductive connection structure |
| KR100765502B1 (en) | 2005-10-03 | 2007-10-10 | 가부시키가이샤 덴소 | Conductive adhesive, method of producing the same, and bonding method |
| CN103555225A (en) * | 2013-10-11 | 2014-02-05 | 湖州光博生物科技有限公司 | Preparation method for silver ion anti-bacterial glue |
-
1999
- 1999-04-20 JP JP11111730A patent/JP2000303042A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100765502B1 (en) | 2005-10-03 | 2007-10-10 | 가부시키가이샤 덴소 | Conductive adhesive, method of producing the same, and bonding method |
| JP2007157551A (en) * | 2005-12-06 | 2007-06-21 | Sekisui Chem Co Ltd | Conductive particles and conductive connection structure |
| CN103555225A (en) * | 2013-10-11 | 2014-02-05 | 湖州光博生物科技有限公司 | Preparation method for silver ion anti-bacterial glue |
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