JP2000294697A - Stiffener integrating a heat sink and a method of manufacturing the same - Google Patents

Stiffener integrating a heat sink and a method of manufacturing the same

Info

Publication number
JP2000294697A
JP2000294697A JP9605299A JP9605299A JP2000294697A JP 2000294697 A JP2000294697 A JP 2000294697A JP 9605299 A JP9605299 A JP 9605299A JP 9605299 A JP9605299 A JP 9605299A JP 2000294697 A JP2000294697 A JP 2000294697A
Authority
JP
Japan
Prior art keywords
hole
heat sink
stiffener
recess
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9605299A
Other languages
Japanese (ja)
Inventor
Satoshi Takase
聡 高瀬
Tomoaki Ono
知章 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP9605299A priority Critical patent/JP2000294697A/en
Publication of JP2000294697A publication Critical patent/JP2000294697A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a stiffener integrating a heat sink that enables high volume production which may not cause residual distortion and deformation and requiring the cutting process after the diffusing process and the etching process. SOLUTION: At least one through-hole is provided to a metal heat sink 1 having at least one flat surface, one surface 1a of the heat sink 1 is pressed to form the recess 2 and the through-hole is filled through the movement of metal part pressed with the press work. The volume of the through-hole filled with the movement of the pressed metal part is set to 0.1 to 1.0 times or preferably to 0.2 to 0.8 times the volume of the metal part located at the recess. Moreover, the distance between the edge of recess and the edge of through-hole provided opposed to the recess is set to 0.4 to 3.0 times or preferably to 0.6 to 1.2 times the distance between the center of through-hole and the edge of through-hole.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は放熱板一体型スティ
フナ及びその製造方法、特に、ICやメモリーなどのチ
ップの収納、チップと外部回路との接続部分の補強、チ
ップで発生した熱の放出などの機能を担うキャビティ型
の放熱板一体型スティフナ及びその製造方法に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stiffener integrated with a heat sink and a method for manufacturing the stiffener. And a method of manufacturing the same.

【0002】[0002]

【従来の技術】パソコンや携帯電話などに使用される半
導体パッケージは小型化、高密度化の一途を辿り、IC
やメモリーなどのチップと外部回路との接続部分にフレ
キシブルプリント基板やTABフィルムを用いた半導体
パッケージが主流となりつつある。
2. Description of the Related Art Semiconductor packages used in personal computers, mobile phones, and the like continue to be miniaturized and densified.
Semiconductor packages using a flexible printed circuit board or a TAB film for a connection portion between a chip such as a chip and a memory and an external circuit are becoming mainstream.

【0003】然しながら、上記フレキシブルプリント基
板やTABフィルムは剛性がなく、そりが発生しやすい
ため補強する必要があり、また、チップの高集積化・大
容量化の結果、発熱量が増大するため放熱する必要があ
る。
However, the above-mentioned flexible printed circuit board or TAB film has no rigidity and is liable to be warped, so that it is necessary to reinforce it. There is a need to.

【0004】図12及び図13は上記従来の半導体パッ
ケージの一例を示し、1は放熱板一体型スティフナを形
成する平坦な一方の面1a及び他方の面1bを有する矩
形状の銅や銅合金等の放熱板、2は上記一方の面1aに
形成した矩形状の凹部、3は上記一方の面1aに接着剤
により接着固定される、上記凹部2とほぼ同じ大きさの
窓孔3aを有するフレキシブルプリント基板やTABフ
ィルムなどの配線基板、4は上記配線基板3の窓孔3a
の周縁にプリント配線により形成された多数の端子部、
5は上記窓孔3aを介して上記凹部2に嵌合され、接着
剤により固定されるICやメモリー等のチップ、6は上
記チップ5の上面に形成した上記端子部4と同数の端
子、7は上記配線基板3の端子部4と上記チップ5の端
子6とを電気的に接続するボンディングワイヤ、8は上
記凹部2に注入し、上記チップ5とボンディングワイヤ
7を外部から封止する封止剤、9は上記配線基板3の外
縁の外付け端子に配設したハンダボールである。
FIGS. 12 and 13 show an example of the above-mentioned conventional semiconductor package. Reference numeral 1 denotes a rectangular copper or copper alloy having one flat surface 1a and the other surface 1b for forming a heat sink integrated stiffener. The heat sink 2 has a rectangular recess formed on the one surface 1a, and the flexible plate 3 has a window hole 3a having the same size as the recess 2 and is fixed to the one surface 1a with an adhesive. Wiring board 4 such as a printed board or TAB film, and 4 is a window hole 3a of the wiring board 3.
A large number of terminal parts formed by printed wiring on the periphery of
Reference numeral 5 denotes a chip such as an IC or a memory fitted in the recess 2 through the window hole 3a and fixed by an adhesive, 6 denotes the same number of terminals as the terminal portions 4 formed on the upper surface of the chip 5, 7 Is a bonding wire for electrically connecting the terminal portion 4 of the wiring board 3 and the terminal 6 of the chip 5, and 8 is a seal for injecting the concave portion 2 to seal the chip 5 and the bonding wire 7 from the outside. The agent 9 is a solder ball provided on an external terminal on the outer edge of the wiring board 3.

【0005】上記従来のキャビティ型の放熱板一体型ス
ティフナは、両面が平坦である矩形状の放熱板1を型
に入れ、一方の面にプレス加工で凹部を形成し、その後
に周囲に逃げた材料を切除する方法や、数回にわたる
一方の面から他方の面に張り出し加工を行なって凹部を
形成し、その張り出し加工により他方側の面から張り出
した部分を切削して除去する方法や、一方の面にエッ
チング加工を施し凹部を形成する方法で形成している。
In the conventional cavity type heat sink integrated stiffener, a rectangular heat sink 1 having flat surfaces on both sides is put into a mold, a concave portion is formed on one surface by press working, and thereafter, it is released to the periphery. A method of cutting off material, a method of overhanging from one surface to the other surface several times to form a concave portion, and a method of cutting and removing a portion overhanging from the other surface by the overhanging process, Is formed by a method of forming a concave portion by performing an etching process on the surface.

【0006】[0006]

【発明が解決しようとする課題】然しながら、上記の
方法では、凹部の容積に相当する金属が放熱板一体型ス
ティフナの凹部以外の部分に押し込まれ、金属部分が圧
縮されて残留ひずみが残り、放熱板一体型スティフナの
平坦性が損なわれ、また、チップ実装工程などで加熱さ
れた際に変形が生ずる恐れがあった。
However, in the above-described method, the metal corresponding to the volume of the concave portion is pushed into a portion other than the concave portion of the stiffener integrated with the heat sink, and the metal portion is compressed, the residual strain remains, and the heat dissipation is reduced. The flatness of the plate-integrated stiffener may be impaired, and deformation may occur when heated in a chip mounting step or the like.

【0007】また、の方法では、製造工程中に切削工
程が必要で、短時間での大量生産が困難である。
In the above method, a cutting step is required during the manufacturing process, and mass production in a short time is difficult.

【0008】また、の方法では、エッチング前に凹部
となる部分以外の部分にマスキングをする必要があり、
コスト高になり、また、短時間での大量生産に不向きで
あるという欠点があった。
Further, in the method (1), it is necessary to mask a portion other than a portion to be a concave portion before etching.
There are drawbacks that the cost is high and that it is not suitable for mass production in a short time.

【0009】本発明は上記の欠点を除くようにしたもの
である。
The present invention has been made to eliminate the above disadvantages.

【0010】[0010]

【課題を解決するための手段】[Means for Solving the Problems]

【0011】本発明の放熱板一体型スティフナ製造方法
は、平坦な金属の放熱板に少くとも1個の貫通孔を設け
る工程と、上記貫通孔を含む上記放熱板の一方の面をプ
レスして凹部を形成すると共に上記プレスにより移動さ
れる金属部分により上記貫通孔を埋める工程とよりなる
ことを特徴とする。
According to the method of manufacturing a stiffener integrated with a heat sink of the present invention, at least one through hole is provided in a flat metal heat sink, and one surface of the heat sink including the through hole is pressed. Forming a recess and filling the through-hole with a metal portion moved by the press.

【0012】上記金属部分の移動により埋められる上記
貫通孔部分の容積は、上記凹部に位置する金属部分の容
積の0.1〜1.0倍、好ましくは0.2〜0.8倍と
することを特徴とする。
The volume of the through hole portion filled by the movement of the metal portion is 0.1 to 1.0 times, preferably 0.2 to 0.8 times the volume of the metal portion located in the concave portion. It is characterized by the following.

【0013】上記凹部の縁と、この縁に対面する貫通孔
の縁との間の距離は、上記貫通孔の中心と上記貫通孔の
縁との間の距離の0.4〜3.0倍、好ましくは0.6
〜1.2倍とすることを特徴とする。
The distance between the edge of the recess and the edge of the through hole facing the edge is 0.4 to 3.0 times the distance between the center of the through hole and the edge of the through hole. , Preferably 0.6
1.21.2 times.

【0014】本発明の放熱板一体型スティフナは、平坦
な放熱板と、この放熱板の一方の面に形成された凹部と
より成り、この凹部の幅及び長さが上記放熱板の幅及び
長さの夫々90%以下であることを特徴とする。
The heat sink integrated stiffener of the present invention comprises a flat heat sink and a recess formed on one surface of the heat sink, and the width and length of the recess are the width and length of the heat sink. It is characterized in that each of them is 90% or less.

【0015】上記凹部位置における上記放熱板の厚さ
は、上記放熱板の厚さの10%以上であることを特徴と
する。
[0015] The thickness of the heat sink at the position of the recess is at least 10% of the thickness of the heat sink.

【0016】[0016]

【発明の実施の形態】本発明の放熱板一体型スティフナ
の製造方法においては、図1及び図2に示すように、一
方及び他方の面が平坦である矩形状の金属の放熱板1
を、プレス等により打ち抜き、その一方の面から他方の
面に貫通した1個の円形の貫通孔10を設ける。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a method of manufacturing a stiffener integrated with a heat radiating plate according to the present invention, as shown in FIGS. 1 and 2, a rectangular metal heat radiating plate having one and the other surface flat.
Is punched by a press or the like, and one circular through hole 10 penetrating from one surface to the other surface is provided.

【0017】次ぎに、上記金属の放熱板1を型に入れ、
その一方の面1aから、プレス加工により上記貫通孔1
0を含む所定の範囲を必要とされる深さまでプレスし、
図3に示すように凹部2を形成せしめ、このプレスされ
た凹部2の部分の金属によって上記放熱板1に形成した
貫通孔10を図3に示すように埋めるようにして放熱板
一体型スティフナを形成せしめる。
Next, the metal heat sink 1 is put into a mold,
From the one surface 1a, the through hole 1 is formed by pressing.
Pressing a predetermined range including 0 to the required depth,
A recess 2 is formed as shown in FIG. 3, and the through hole 10 formed in the heat sink 1 is filled with the metal of the pressed recess 2 as shown in FIG. Let it form.

【0018】なお、上記放熱板一体型スティフナの機械
的強度及び平坦性の問題から上記放熱板1の幅をA,長
をBとすれば、上記凹部2の幅,長さを夫々上記A,B
の90%以下とし、また、上記放熱板1の厚さをCとす
れば上記凹部位置における放熱板1の厚さをCの10%
以上とするのが好ましい。
If the width of the radiator plate 1 is assumed to be A and the length of the radiator plate 1 is assumed to be B due to the problems of mechanical strength and flatness of the stiffener integrated with the radiator plate, the width and the length of the concave portion 2 will be A, B
If the thickness of the radiator plate 1 is C, the thickness of the radiator plate 1 at the concave position is 10% of C.
It is preferable to make the above.

【0019】また、凹部2の形成により、移動する図4
の上部に点線で示す部分の金属の容積をV2とし、この
金属により埋められる図4の下部に点線で示す貫通孔部
分の容積をV1とすると、V1がV2より大きい場合に
は貫通孔部分を埋めるべき金属が足りないので貫通孔部
分を完全に埋めることができなくなる。
FIG. 4 shows a movement due to the formation of the recess 2.
Let V2 be the volume of the metal in the portion indicated by the dotted line at the top of FIG. 4, and let V1 be the volume of the through-hole portion indicated by the dotted line at the bottom of FIG. Since there is not enough metal to be filled, the through hole cannot be completely filled.

【0020】また、V1がV2の0.1倍未満の場合に
は貫通孔部分を埋めた以外の金属部分が凹部2以外の部
分に移動して、放熱板一体型スティフナの平坦性を悪化
せしめ、または、全体に余分な残留ひずみを残してしま
う。
When V1 is less than 0.1 times V2, metal parts other than those filling the through-holes move to parts other than the concave parts 2, thereby deteriorating the flatness of the heat sink integrated stiffener. Or, an excessive residual strain is left as a whole.

【0021】従って、V1はV2の0.1〜1.0倍、
好ましくは0.2〜0.8倍の範囲とするのが好まし
い。
Therefore, V1 is 0.1 to 1.0 times V2,
Preferably, it is set in the range of 0.2 to 0.8 times.

【0022】また、図5に示すように、凹部2の縁とこ
れに対面している貫通孔10の縁との間の距離Xが、上
記貫通孔10の中心と上記貫通孔10の縁との間の距離
Rの0.4倍より小さいと、上記貫通孔10を上記凹部
2の縁と貫通孔10の縁間に存在する金属部分によって
埋められない恐れがある。
As shown in FIG. 5, the distance X between the edge of the recess 2 and the edge of the through hole 10 facing the recess 2 is equal to the distance between the center of the through hole 10 and the edge of the through hole 10. If the distance R is smaller than 0.4 times the distance R, the through-hole 10 may not be filled with the metal part existing between the edge of the recess 2 and the edge of the through-hole 10.

【0023】また、XがRの3.0倍より大きいと上記
金属部分が上記貫通孔部分に移動することなく、貫通孔
部分以外の部分に移動して、放熱板一体型スティフナの
平坦性を悪化し、あるいは、全体に余分なひずみを残し
てしまう恐れがある。
If X is larger than 3.0 times R, the metal portion does not move to the through hole portion but moves to a portion other than the through hole portion to improve the flatness of the heat sink integrated stiffener. It may worsen or leave extra strain on the whole.

【0024】従って、XはRの0.4〜3.0倍、好ま
しくは0.6〜1.2倍の範囲とするのが好ましい。
Therefore, X is preferably in the range of 0.4 to 3.0 times, preferably 0.6 to 1.2 times R.

【0025】上記貫通孔10は複数個設けても良く、ま
た、円形以外の任意の形状としても良い。
A plurality of the through holes 10 may be provided, and the through holes 10 may have an arbitrary shape other than a circular shape.

【0026】図6は貫通孔10を矩形とし、その数を9
個とした本発明の他の実験例を示す。
FIG. 6 shows that the through-hole 10 is rectangular and the number thereof is nine.
Another experimental example of the present invention is shown below.

【0027】また、上記放熱板1は矩形以外の任意の形
状としても良い。
Further, the heat radiating plate 1 may have an arbitrary shape other than a rectangular shape.

【0028】更に、ロールされた金属板を引き出してこ
れに貫通孔10をあけ、その後プレスして凹部2を形成
した後任意の形状にカットして放熱板1としても良い。
Further, the rolled metal plate may be drawn out, a through hole 10 may be formed in the rolled metal plate, and then pressed to form the concave portion 2 and then cut into an arbitrary shape to form the heat sink 1.

【0029】(実験例1)(Experimental example 1)

【0030】厚さ0.7mm、幅27mm、長さ27m
mの無酸素銅の放熱板1にプレス打ち抜きにより貫通孔
10を設け、その後、この貫通孔10を含む上記放熱板
1の一方の面1aの一部をプレスして縦,横11mm、
深さ0.4mmの凹部2を形成し、仕上げ加工を行ない
放熱板一体型スティフナを作製した。また、上記貫通孔
10の形状を円形、数を13、貫通孔10の配置を図7
とし、プレスによって移動される金属により埋められる
貫通孔部分の総容積(V1)を、プレスされる凹部2に
位置する金属部分の容積(V2)の0.6倍とし、上記
凹部2の縁とこの縁に対面する、貫通孔10の縁との間
の距離(X)を上記貫通孔10の中心と上記貫通孔10
の縁との間の距離(R)の2.4倍とした。
Thickness 0.7 mm, width 27 mm, length 27 m
A through-hole 10 is formed in the heat-dissipating plate 1 made of oxygen-free copper of m by press punching, and then a part of one surface 1a of the heat-dissipating plate 1 including the through-hole 10 is pressed to be 11 mm long and 11 mm wide.
A recess 2 having a depth of 0.4 mm was formed, and finishing was performed to produce a heat sink integrated stiffener. The shape of the through hole 10 is circular, the number is 13, and the arrangement of the through hole 10 is shown in FIG.
The total volume (V1) of the through-hole portion filled with the metal moved by the press is set to 0.6 times the volume (V2) of the metal portion located in the concave portion 2 to be pressed. The distance (X) between the edge of the through hole 10 facing this edge and the center of the through hole 10 is defined by the distance (X).
2.4 times the distance (R) between the edge and the edge.

【0031】プレス後に調べた結果、埋め残った貫通孔
部分はなかった。また、200℃で60分間の熱処理後
の放熱板一体型スティフナの変形の有無を調べた結果、
変形が認められなかった。
As a result of examination after pressing, there was no through hole portion left unfilled. Also, as a result of examining the presence or absence of deformation of the heat sink integrated stiffener after heat treatment at 200 ° C. for 60 minutes,
No deformation was observed.

【0032】(実験例2)(Experimental example 2)

【0033】実験例1と同様に放熱板一体型スティフナ
を作製し、実験例1と同様の試験を行なった。なお、上
記貫通孔の形状を円形、貫通孔の数を16、貫通孔の配
置を図8とし、V1とV2の比を0.6,XとRの比を
2.1とした。埋め残った貫通孔部分はなく、熱処理後
の変形も認められなかった。
A heat sink integrated stiffener was manufactured in the same manner as in Experimental Example 1, and the same test as in Experimental Example 1 was performed. The shape of the through-hole was circular, the number of through-holes was 16, the arrangement of the through-holes was as shown in FIG. 8, the ratio between V1 and V2 was 0.6, and the ratio between X and R was 2.1. There were no through-hole portions left unfilled, and no deformation was observed after the heat treatment.

【0034】(実験例3)(Experimental example 3)

【0035】実験例1と同様に放熱板一体型スティフナ
を作製し、実験例1と同様の試験を行なった。なお、上
記貫通孔の形状を円形、貫通孔の数を25、貫通孔の配
置を図9とし、V1とV2の比を0.6,XとRの比を
1.0とした。埋め残った貫通孔部分はなく、熱処理後
の変形も認められなかった。
A heat sink integrated stiffener was manufactured in the same manner as in Experimental Example 1, and the same test as in Experimental Example 1 was performed. The shape of the through-holes was circular, the number of through-holes was 25, the arrangement of the through-holes was as shown in FIG. 9, the ratio between V1 and V2 was 0.6, and the ratio between X and R was 1.0. There were no through-hole portions left unfilled, and no deformation was observed after the heat treatment.

【0036】(実験例4)(Experimental example 4)

【0037】実験例1と同様に放熱板一体型スティフナ
を作製し、実験例1と同様の試験を行なった。なお、貫
通孔の形状を正方形、貫通孔の数を25、貫通孔の配置
を図10とし、V1とV2の比を0.6,XとRの比を
1.0とした。埋め残った貫通孔部分はなく、熱処理後
の変形も認められなかった。
A heat sink integrated stiffener was manufactured in the same manner as in Experimental Example 1, and the same test as in Experimental Example 1 was performed. The shape of the through holes was square, the number of the through holes was 25, the arrangement of the through holes was as shown in FIG. 10, the ratio between V1 and V2 was 0.6, and the ratio between X and R was 1.0. There were no through-hole portions left unfilled, and no deformation was observed after the heat treatment.

【0038】(比較例1)(Comparative Example 1)

【0039】実験例1と同様に放熱板一体型スティフナ
を作製し、実験例1と同様の試験を行なった。なお、貫
通孔の形状を円形、貫通孔の数を1とし、V1とV2の
比を0.5,XとRの比を3.4とした。埋め残った貫
通孔部分はないが、熱処理後の変形が認められた。
A heat sink integrated stiffener was manufactured in the same manner as in Experimental Example 1, and the same test as in Experimental Example 1 was performed. The shape of the through-hole was circular, the number of the through-holes was 1, the ratio between V1 and V2 was 0.5, and the ratio between X and R was 3.4. Although there was no buried through hole, deformation after the heat treatment was observed.

【0040】(比較例2)Comparative Example 2

【0041】実験例1と同様に放熱板一体型スティフナ
を作製し、実験例1と同様の試験を行なった。なお、貫
通孔の形状を円形、貫通孔の数を9、貫通孔の配置を図
11とし、V1とV2の比を0.5,XとRの比を3.
2とした。埋め残った貫通孔部分はないが、熱処理後の
変形がやや認められた。
A heat sink integrated stiffener was manufactured in the same manner as in Experimental Example 1, and the same test as in Experimental Example 1 was performed. The shape of the through-holes is circular, the number of through-holes is 9, the arrangement of the through-holes is shown in FIG. 11, the ratio between V1 and V2 is 0.5, and the ratio between X and R is 3.
And 2. Although there was no buried through-hole portion, deformation after the heat treatment was slightly observed.

【0042】(比較例3)(Comparative Example 3)

【0043】実験例1と同様に放熱板一体型スティフナ
を作製し、実験例1と同様の試験を行なった。なお、貫
通孔の形状を円形、貫通孔の数を9、孔の配置を図11
とし、V1とV2の比を0.5,XとRの比を0.2と
した。埋め残った貫通孔部分が認められた。
A heat sink integrated stiffener was manufactured in the same manner as in Experimental Example 1, and the same test as in Experimental Example 1 was performed. The shape of the through holes is circular, the number of the through holes is 9, and the arrangement of the holes is shown in FIG.
The ratio between V1 and V2 was 0.5, and the ratio between X and R was 0.2. The portion of the through-hole left unfilled was observed.

【0044】(比較例4)(Comparative Example 4)

【0045】実験例1と同様に放熱板一体型スティフナ
を作製し、実験例1と同様の試験を行なった。なお、貫
通孔の形状を円形、貫通孔の数を9、孔の配置を図11
とし、V1とV2の比を1.1,XとRの比を2.0と
した。埋め残った貫通孔部分が認められた。
A heat sink integrated stiffener was manufactured in the same manner as in Experimental Example 1, and the same test as in Experimental Example 1 was performed. The shape of the through holes is circular, the number of the through holes is 9, and the arrangement of the holes is shown in FIG.
The ratio between V1 and V2 was 1.1, and the ratio between X and R was 2.0. The portion of the through-hole left unfilled was observed.

【0046】(比較例5)Comparative Example 5

【0047】実験例1と同様に放熱板一体型スティフナ
を作製し、実験例1と同様の試験を行なった。なお、貫
通孔の形状を円形、貫通孔の数を9、孔の配置を図11
とし、V1とV2の比を0.05,XとRの比を2.0
とした。埋め残った貫通孔部分はないが、熱処理後の変
形が認められた。
A heat sink integrated stiffener was manufactured in the same manner as in Experimental Example 1, and the same test as in Experimental Example 1 was performed. The shape of the through holes is circular, the number of the through holes is 9, and the arrangement of the holes is shown in FIG.
And the ratio between V1 and V2 is 0.05, and the ratio between X and R is 2.0.
And Although there was no buried through hole, deformation after the heat treatment was observed.

【0048】(比較例6)Comparative Example 6

【0049】厚さ0.7mm、幅27mm、長さ27m
mの無酸素銅の放熱板を型に入れ、その一方の面をプレ
スして縦,横11mm、深さ0.4mmの凹部を形成
し、周囲に逃げた材料を切除し、仕上げ加工を行ない、
放熱板一体型スティフナを作製し、実験例1と同様の試
験を行なった。熱処理後の変形が認められた。
0.7 mm thick, 27 mm wide, 27 m long
m heat-dissipating plate of oxygen-free copper is placed in a mold, and one surface thereof is pressed to form a recess having a length of 11 mm, a width of 11 mm, and a depth of 0.4 mm. ,
A heat sink integrated stiffener was manufactured, and the same test as in Experimental Example 1 was performed. Deformation after heat treatment was observed.

【0050】(比較例7)(Comparative Example 7)

【0051】厚さ0.7mm、幅27mm、長さ27m
mの無酸素銅の放熱板を型に入れ、その一方の面をプレ
スし、他方の面から張り出して上記一方の面に凹部を形
成し、他方の面の張り出した部分を切削し、仕上げ加工
を行ない、放熱板一体型スティフナを作製し、実験例1
と同様の試験を行なった。熱処理後の変形は認められな
かったが、張り出し部分の切削加工に時間を要し、短時
間の大量生産ができなかった。
0.7 mm thick, 27 mm wide, 27 m long
m into a mold, press one side of the mold, overhang from the other side to form a recess on the one side, cut the overhanging part on the other side, and finish To produce a heat sink integrated stiffener. Experimental Example 1
The same test was performed. Although no deformation was observed after the heat treatment, it took time to cut the overhang, and mass production in a short time was not possible.

【0052】(比較例8)(Comparative Example 8)

【0053】厚さ0.7mm、幅27mm、長さ27m
mの無酸素銅の放熱板の一方の面にマスキング及びエッ
チング加工を行ない、凹部を形成し、洗浄後、仕上げ加
工を行ない、放熱板一体型スティフナを作製し、実験例
1と同様の試験を行なった。熱処理後の変形は認められ
なかったが、マスキングする工程に時間を要し、短時間
の大量生産ができなかった。
0.7 mm thick, 27 mm wide, 27 m long
m, a mask is formed on one surface of a heat-dissipating plate made of oxygen-free copper, a concave portion is formed, a cleaning process is performed, and a finishing process is performed to produce a heat-dissipating plate-integrated stiffener. Done. Although no deformation was observed after the heat treatment, the masking process required a long time, and short-term mass production was not possible.

【0054】以上の結果を表1に示す。Table 1 shows the above results.

【0055】[0055]

【表1】 [Table 1]

【0056】[0056]

【発明の効果】上記のように本発明の放熱板一体型ステ
ィフナ及びその製造方法によれば、放熱板一体型スティ
フナの製造時間を短縮でき、製造コストを低く抑え、大
量製造ができるようになる。
As described above, according to the heat sink integrated stiffener and the method of manufacturing the same according to the present invention, the manufacturing time of the heat sink integrated stiffener can be shortened, the manufacturing cost can be reduced, and mass production can be performed. .

【0057】また、ひずみが残留しないため、熱を加え
た場合の変形がない等大きな利益がある。
Further, since no distortion remains, there is a great advantage that there is no deformation when heat is applied.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の放熱板一体型スティフナ用放熱板の平
面図である。
FIG. 1 is a plan view of a heat sink for a stiffener integrated with a heat sink according to the present invention.

【図2】本発明の放熱板一体型スティフナ用放熱板の縦
断側面図である。
FIG. 2 is a vertical sectional side view of a heat sink for a stiffener integrated with a heat sink according to the present invention.

【図3】本発明の放熱板一体型スティフナの縦断側面図
である。
FIG. 3 is a vertical sectional side view of the heat sink integrated stiffener of the present invention.

【図4】本発明の放熱板一体型スティフナの一部の拡大
縦断側面図である。
FIG. 4 is an enlarged vertical sectional side view of a part of the heat sink integrated stiffener of the present invention.

【図5】本発明の放熱板一体型スティフナの一部の平面
図である。
FIG. 5 is a plan view of a part of the heat sink integrated stiffener of the present invention.

【図6】本発明の放熱板一体型スティフナの他の実験例
を示す平面図である。
FIG. 6 is a plan view showing another experimental example of the heat sink integrated stiffener of the present invention.

【図7】本発明の放熱板一体型スティフナの他の実験例
を示す平面図である。
FIG. 7 is a plan view showing another experimental example of the heat sink integrated stiffener of the present invention.

【図8】本発明の放熱板一体型スティフナの更に他の実
験例を示す平面図である。
FIG. 8 is a plan view showing still another experimental example of the heat sink integrated stiffener of the present invention.

【図9】本発明の放熱板一体型スティフナの更に他の実
験例を示す平面図である。
FIG. 9 is a plan view showing still another experimental example of the heat sink integrated stiffener of the present invention.

【図10】本発明の放熱板一体型スティフナの更に他の
実験例を示す平面図である。
FIG. 10 is a plan view showing still another experimental example of the heat sink integrated stiffener of the present invention.

【図11】本発明の放熱板一体型スティフナの比較例を
示す平面図である。
FIG. 11 is a plan view showing a comparative example of the heat sink integrated stiffener of the present invention.

【図12】従来の半導体パッケージの分解斜視図であ
る。
FIG. 12 is an exploded perspective view of a conventional semiconductor package.

【図13】従来の半導体パッケージの縦断側面図であ
る。
FIG. 13 is a vertical sectional side view of a conventional semiconductor package.

【符号の説明】[Explanation of symbols]

1 放熱板 1a 一方の面 1b 他方の面 2 凹部 3 配線基板 3a 窓孔 4 端子部 5 チップ 6 端子 7 ボンディングワイヤ 8 封止剤 9 ハンダボール 10 貫通孔 DESCRIPTION OF SYMBOLS 1 Heat sink 1a One surface 1b The other surface 2 Concave part 3 Wiring board 3a Window hole 4 Terminal part 5 Chip 6 Terminal 7 Bonding wire 8 Sealant 9 Solder ball 10 Through hole

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 平坦な金属の放熱板に少くとも1個の貫
通孔を設ける工程と、上記貫通孔を含む上記放熱板の一
方の面をプレスして凹部を形成すると共に上記プレスに
より移動される金属部分により上記貫通孔を埋める工程
とよりなることを特徴とする放熱板一体型スティフナの
製造方法。
1. A step of providing at least one through hole in a flat metal radiator plate, and pressing one surface of the radiator plate including the through hole to form a recess and move by the press. And filling the through hole with a metal part.
【請求項2】 上記金属部分の移動により埋められる上
記貫通孔部分の容積を、上記凹部に位置する金属部分の
容積の0.1〜1.0倍、好ましくは0.2〜0.8倍
とすることを特徴とする請求項1記載の放熱板一体型ス
ティフナの製造方法。
2. The volume of the through hole portion filled by the movement of the metal portion is 0.1 to 1.0 times, preferably 0.2 to 0.8 times the volume of the metal portion located in the recess. The method for manufacturing a stiffener integrated with a heat sink according to claim 1, wherein:
【請求項3】 上記凹部の縁と、この縁に対面する貫通
孔の縁との間の距離を、上記貫通孔の中心と上記貫通孔
の縁との間の距離の0.4〜3.0倍、好ましくは0.
6〜1.2倍とすることを特徴とする請求項1又は2記
載の放熱板一体型スティフナの製造方法。
3. The distance between the edge of the recess and the edge of the through hole facing the edge is 0.4 to 3.3 times the distance between the center of the through hole and the edge of the through hole. 0 times, preferably 0.1 times.
3. The method according to claim 1, wherein the stiffener is integrated with a heat sink.
【請求項4】 平坦な放熱板と、この放熱板の一方の面
に形成された凹部とより成り、この凹部の幅及び長さが
上記放熱板の幅及び長さの夫々90%以下であることを
特徴とする放熱板一体型スティフナ。
4. A flat heat radiating plate and a concave portion formed on one surface of the heat radiating plate, and the width and the length of the concave portion are 90% or less of the width and the length of the heat radiating plate, respectively. A stiffener integrated with a heat sink.
【請求項5】 上記凹部位置における上記放熱板の厚さ
が、上記放熱板の厚さの10%以上であることを特徴と
する請求項4記載の放熱板一体型スティフナ。
5. The stiffener integrated with a radiator plate according to claim 4, wherein the thickness of the radiator plate at the concave position is 10% or more of the thickness of the radiator plate.
JP9605299A 1999-04-02 1999-04-02 Stiffener integrating a heat sink and a method of manufacturing the same Pending JP2000294697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9605299A JP2000294697A (en) 1999-04-02 1999-04-02 Stiffener integrating a heat sink and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9605299A JP2000294697A (en) 1999-04-02 1999-04-02 Stiffener integrating a heat sink and a method of manufacturing the same

Publications (1)

Publication Number Publication Date
JP2000294697A true JP2000294697A (en) 2000-10-20

Family

ID=14154700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9605299A Pending JP2000294697A (en) 1999-04-02 1999-04-02 Stiffener integrating a heat sink and a method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2000294697A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100382713B1 (en) * 2001-02-27 2003-05-09 주식회사 인지디스플레이 Heat spreader processing method using stamping and heat treatment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100382713B1 (en) * 2001-02-27 2003-05-09 주식회사 인지디스플레이 Heat spreader processing method using stamping and heat treatment

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