JP2000294406A - Ｐｔｃ回路保護装置 - Google Patents
Ｐｔｃ回路保護装置Info
- Publication number
- JP2000294406A JP2000294406A JP2000050491A JP2000050491A JP2000294406A JP 2000294406 A JP2000294406 A JP 2000294406A JP 2000050491 A JP2000050491 A JP 2000050491A JP 2000050491 A JP2000050491 A JP 2000050491A JP 2000294406 A JP2000294406 A JP 2000294406A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode
- electrode disposed
- disposed
- electrically insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 164
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims abstract description 5
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims abstract description 4
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229920000642 polymer Polymers 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 7
- 239000011888 foil Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- -1 for example Polymers 0.000 description 8
- 239000011231 conductive filler Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011135 tin Substances 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229920003317 Fusabond® Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12104399P | 1999-02-22 | 1999-02-22 | |
| US60/121043 | 1999-02-22 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004028565A Division JP2004193626A (ja) | 1999-02-22 | 2004-02-04 | Ｐｔｃ回路保護装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000294406A true JP2000294406A (ja) | 2000-10-20 |
Family
ID=22394139
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000050491A Withdrawn JP2000294406A (ja) | 1999-02-22 | 2000-02-22 | Ｐｔｃ回路保護装置 |
| JP2004028565A Pending JP2004193626A (ja) | 1999-02-22 | 2004-02-04 | Ｐｔｃ回路保護装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004028565A Pending JP2004193626A (ja) | 1999-02-22 | 2004-02-04 | Ｐｔｃ回路保護装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP2000294406A (enrdf_load_stackoverflow) |
| DE (1) | DE10007888A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2790136A1 (enrdf_load_stackoverflow) |
| TW (1) | TW463443B (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103333385A (zh) * | 2013-05-29 | 2013-10-02 | 安徽荣玖光纤通信科技有限公司 | 一种铜导线ptc高分子导电材料及其制备方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1573753B1 (en) * | 2002-12-11 | 2006-05-31 | Bourns, Inc. | Encapsulated electronic device and method of manufacturing the same |
| JP2006510204A (ja) * | 2002-12-11 | 2006-03-23 | ブアンズ・インコーポレイテッド | 導電性高分子素子及びその製造方法 |
-
2000
- 2000-02-21 DE DE2000107888 patent/DE10007888A1/de not_active Withdrawn
- 2000-02-21 TW TW89102986A patent/TW463443B/zh not_active IP Right Cessation
- 2000-02-22 FR FR0002207A patent/FR2790136A1/fr not_active Withdrawn
- 2000-02-22 JP JP2000050491A patent/JP2000294406A/ja not_active Withdrawn
-
2004
- 2004-02-04 JP JP2004028565A patent/JP2004193626A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103333385A (zh) * | 2013-05-29 | 2013-10-02 | 安徽荣玖光纤通信科技有限公司 | 一种铜导线ptc高分子导电材料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004193626A (ja) | 2004-07-08 |
| FR2790136A1 (fr) | 2000-08-25 |
| TW463443B (en) | 2001-11-11 |
| DE10007888A1 (de) | 2000-10-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040204 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040203 |
|
| A911 | Transfer of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20040426 |
|
| A912 | Removal of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20041224 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20050725 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20050802 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20060929 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070511 |