JP2000293650A - Module for non-contact type ic card and non-contact type ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a module for a non-contact type IC card and a non-contact type IC card for increasing yield and reducing costs. SOLUTION: In a non-contact IC card, the size and weight of an IC chip 16 is made extremely small and light so that the hardness of two terminal wires 15 arranged across a spatial part 13 formed in a substrate 12 and fixed in the neighborhood can be made relatively high, and that this IC chip 16 can be easily held even at the time of handling in a card manufacturing process. The size of the spatial part 13 is made small so that a protecting function against any outer force can be secured at the time of handling. In assembling a card, even when a plastic plate 17 is mounted on the both face of the module by thermal fusion or the like, any excessive force can be prevented from being imposed on the IC chip 16, any yield can be increased. In combining the IC chip 16 with a coil 14 made of enamel coated aluminum wires, direct bonding is attained. Thus, it is not necessary to interpose any gold on a boundary face between the IC chip 16 and the terminal wires 15 so that it is possible to reduce costs.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact type IC card module and a non-contact type IC card.

[0002]

2. Description of the Related Art FIG. 4A is a plan view showing a conventional example of a non-contact type IC card module, and FIG.
FIG. 2 is a partially enlarged sectional view of a region A of FIG. The non-contact type IC card conforms to the ISO14443 standard.

[0003] This non-contact type IC card module includes:
An IC chip 2 is electrically connected to both ends of a rectangular coil 1 formed in the same plane using a winding (enamel-coated copper fine wire), and sandwiched between two card-shaped nonwoven fabrics 3a and 3b. It is fixed with.

FIG. 5 (a) is a plan view showing another conventional example of a non-contact type IC card module, and FIG. 5 (b) is a partially enlarged sectional view of a region B in FIG. 5 (a).

[0005] This non-contact type IC card module includes:
A chip unit in which a winding coil 1 and an IC chip 6 are mounted on a glass epoxy board (hereinafter, referred to as “glass epoxy board”) 5 which is slightly larger than the IC chip 6 in a peripheral portion on one card-shaped plastic plate 4. Are fixed, and both end wires of the winding coil 1 are joined to predetermined positions of the glass epoxy substrate 5 by means such as soldering (Japanese Patent Application Laid-Open No. 9-5077).
No. 27).

FIG. 6A is a plan perspective view showing another conventional example of a non-contact type IC card module, and FIG.
FIG. 6 is a partially enlarged view of a region C in FIG.
FIG. 7 is a sectional view taken along line DD of FIG.

[0007] This non-contact type IC card module comprises:
A chip unit composed of an IC chip 9 mounted on a lead frame 8 and a winding coil 1
Are fixed, and both end wires of the winding coil 1 are joined at predetermined positions on both ends of the lead frame 8.

The lead frame 8 on which the IC chip 9 is mounted is accommodated in a space 10 formed so as to penetrate the plastic substrate 7, and only both ends are fixed to the plastic substrate 7. In a portion where the winding coil 1 crosses the lead frame 8, the space between the winding coil 1 and the lead frame 8 is insulated by a thin insulator 11.

Both sides of the non-contact type IC card module shown in FIGS. 4 and 6 or the non-contact type IC shown in FIG.
A non-contact IC card is formed by attaching the coil of the card module and the IC chip to one surface to which the coil and the IC chip are fixed by a method such as heat fusion using a thin plate of cover plastic of the same material as the substrate as a protective plate. You. Non-contact IC
The total thickness after completion of the card is specified to be 0.76 mm or less according to the above-mentioned ISO standard.
mm.

[0010]

By the way, the winding used for the above-mentioned transmitting / receiving antenna of the conventional non-contact type IC card is formed by enamel-coating a thin copper wire, but is bonded to an IC chip. Therefore, the following method is usually employed.

1) An IC chip is mounted on a glass epoxy substrate, a lead frame, or the like on which a predetermined pattern is formed, and terminal wires are joined at predetermined positions by means such as soldering.

2) A terminal wire is bonded to the surface of the IC with gold bumps by a bonding method.

[0013] 3) The IC chip with gold bumps and the terminal wire are joined with an anisotropic conductive adhesive.

4) Using an enameled wire using a copper wire with gold plating, a terminal wire is bonded to the IC by a bonding method.

However, these methods 1) to 4) all cause an increase in cost.

Further, in the conventional example shown in FIGS. 4 and 5, when attaching a thin sheet of plastic for the cover by means such as heat fusion, high temperature and high pressure are applied to the IC chip, and the yield is reduced due to breakage of the IC chip. There is a problem that it is lowered, which is a factor of cost increase.

It is an object of the present invention to solve the above-mentioned problems and to provide a non-contact type IC card module and a non-contact type IC card with high yield and low cost.

[0018]

In order to achieve the above object, a non-contact type IC card module according to the present invention comprises an IC chip mounted on a winding coil for a transmitting / receiving antenna fixed to a peripheral portion on a card-like substrate. Non-contact type I electrically connected
In the C card module, the thickness of the substrate is slightly larger than the sum of the thickness of the IC chip and the outer diameter of the winding, and the IC chip is housed in a space formed inside the winding coil of the substrate. Both terminal wires of the wire coil are fixed in the vicinity of the space portion across the space portion, and the IC chip is joined to and held by the both terminal wires in the space portion.

In addition to the above configuration, the non-contact type IC card module of the present invention is such that the winding is an enamel-coated aluminum wire, and the IC chip is bonded to the terminal wire of the winding coil by a direct bonding method. preferable.

The non-contact type IC card of the present invention is a non-contact type IC card in which an IC chip is electrically connected to a transmission / reception antenna winding coil fixed to a peripheral portion on a card-like substrate.
In a non-contact type IC card in which a plastic plate is integrated by applying heat fusion to both sides of a card module, the thickness of the substrate is slightly larger than the sum of the thickness of the IC chip and the outer diameter of the winding, The IC chip is accommodated in a space formed inside the winding coil of the substrate, and both terminal wires of the winding coil are fixed in the vicinity of the space across the space, and the IC chip is inserted in the space. It is held by being joined to both terminal wires.

In addition to the above configuration, in the non-contact type IC card of the present invention, the winding is preferably an enamel-coated aluminum wire, and the IC chip is preferably joined to the terminal wire of the winding coil by a direct bonding method.

In addition to the above structure, the non-contact type IC card of the present invention has a structure in which the I
It is preferable that the gap between the C chip and the plastic plate is filled with an amorphous curable resin.

Generally, since the size of an IC chip is as small as several mm square and the weight is several mg, the rigidity of two terminal wires fixed across and near a space formed in a substrate is as follows.
It is relatively large enough to be easily held during handling in the card manufacturing process. Since the space for accommodating the IC chip is small, it has a function of protecting against external force during handling. At the time of assembling the card, no excessive force is applied to the IC chip even if plastic plates are attached to both sides by heat fusion or the like. As a result, the yield of the non-contact IC card module and the non-contact IC card is improved.

[0024] Direct bonding between a copper terminal wire and an IC chip is difficult without gold (Au), but direct bonding is possible when an IC chip and an aluminum wire are combined. The combination of the IC chip and the aluminum wire eliminates the need to mount the IC chip on a glass epoxy substrate or a lead frame, and eliminates the need for intervening gold at the interface between the IC chip and the coil terminal wire, thereby reducing costs.

A large number of modules (for example, 3 horizontal × 8 vertical, a total of 24
Individually processed products are handled as one unit, or they are further connected in the longitudinal direction and wound into a roll, and this sheet is cut off by means of a press or the like in the card manufacturing process to form individual modules, thereby improving productivity. Can be greatly improved.

[0026]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1A is an exploded exploded view showing one embodiment of a non-contact type IC card using the non-contact type IC card module of the present invention, and FIG. 1B is an exploded view of FIG. Area E
1 (c) is a partially enlarged sectional view of a region F in FIG. 1 (a), and FIG. 1 (d) is a plan view of a region F in FIG. 1 (a).

The non-contact type IC card module mainly includes a card-shaped module substrate (hereinafter, referred to as a “substrate”) 12 and an enamel-coated aluminum wire for transmitting and receiving antennas fixed to the periphery of the substrate 12. Winding coil 1
4 and an IC chip 16 electrically connected to the winding coil 14. The thin plastic plate 1 is formed by applying heat fusion to both sides of the non-contact type IC card module.
7, a non-contact type IC card can be obtained.

The non-contact type IC card module is a substrate made of a plastic thin plate whose thickness is slightly larger than the sum of the IC chip 16 and the outer diameter of the wire of the coil 14 (or the total thickness of the chip unit). A space 13 formed of a through hole for accommodating an IC chip 16 is formed on the substrate 12, and the winding coil 1 is formed on one surface (the upper surface in the figure) of the substrate 12.
Part 4 is formed and fixed while being partially embedded in the substrate 12 by means such as applying ultrasonic waves and / or heat.

The terminal wire 15 of the winding coil 14 is
3, and both ends thereof are fixed in the vicinity of the space 13 of the substrate 12 by means similar to the conventional example.

The IC chip 16 is bonded to both terminal wires 15 by a direct bonding method, so that the contact type I
A C card module is formed.

A noncontact IC card is formed by attaching a plastic plate 17 made of the same material as the substrate 12 and serving as a protective cover to both sides of the noncontact IC card module by means such as heat fusion. .

FIG. 2 (a) is a partial perspective view of the non-contact type IC card of the present invention, FIG. 2 (b) is a sectional view taken along line GG of FIG. 2 (a), and FIG. 2 (c) is FIG. It is a HH sectional view taken on the line a).

2 (a) to 2 (c), it can be seen that the rectangular winding coil 14 slightly protrudes from the substrate 12, but the plastic plate 17 is heat-sealed on both the front and back surfaces of the substrate 12. Thereby, the plastic flow of each plastic plate 17 including the substrate 12 is absorbed and a smooth card surface is obtained.

The space 1 for accommodating the IC chip 16
The card surface at the position corresponding to the position 3 is also filled with the amorphous hardening resin 18 in the gap between the IC chip 16 and the plastic plate 17 before the plastic plates 17 are mounted on both sides. The card surface can be kept smooth without applying excessive force to the chip 16.

FIG. 3 is a plan view of a semi-finished product of the non-contact type IC card module shown in FIG. 1 before completion.

A large number of winding coils 14 and IC chips 16 are attached to a wide and long plastic sheet 12a serving as a module substrate in the vertical and horizontal directions.

Here, the space 13 for accommodating the IC chip 16 does not necessarily have to penetrate both sides, and may have a bottomed shape by means such as milling. It takes much time and effort as compared with punching of a through hole by a press, and also impairs the workability of bonding the IC chip 16, which is not preferable.

According to the present invention described above, the present invention is also applicable to a type in which a copper winding is used and bonded to an IC chip unit using a glass epoxy substrate or a lead frame.

The present invention is applicable to all thin non-contact IC cards other than products conforming to the ISO14443 standard.

It is possible to stably manufacture a large amount of thin non-contact type IC cards at low cost. In particular, it is effective to manufacture flip-chip type cards at low cost.

[0042]

In summary, according to the present invention, the following excellent effects are exhibited.

It is possible to provide a high-yield and low-cost module for a non-contact type IC card and a non-contact type IC card.

[Brief description of the drawings]

FIG. 1A is an exploded exploded view showing one embodiment of a non-contact type IC card using the non-contact type IC card module of the present invention, and FIG. 1B is a partially enlarged view of a region E of FIG. Sectional view, (c) is a partial enlarged sectional view of region F of (a), (d)
3 is a plan view of a region F in FIG.

2 (a) is a partial perspective view of the non-contact type IC card of the present invention, FIG. 2 (b) is a sectional view taken along line GG of FIG. 2 (a), and FIG. 2 (c) is a sectional view taken along line H-H of FIG. It is.

3 is a plan view of a semi-finished product of the non-contact type IC card module shown in FIG. 1 before completion.

4A is a plan view showing a conventional example of a non-contact type IC card module, and FIG. 4B is a partially enlarged cross-sectional view of a region A of FIG.

5A is a plan view showing another conventional example of a non-contact type IC card, and FIG. 5B is a partially enlarged sectional view of a region B of FIG.

6A is a perspective plan view showing another conventional example of a non-contact type IC card, FIG. 6B is a partially enlarged view of a region C in FIG. 6A, and FIG. FIG. 4 is a sectional view taken along line DD of FIG.

[Explanation of symbols]

 Reference Signs List 12 board 13 space 14 wound coil 15 terminal wire 16 IC chip 17 plastic plate

Claims (5)

[Claims] 1. A non-contact type IC card module in which an IC chip is electrically coupled to a transmission / reception antenna winding coil fixed to a peripheral portion on a card-like substrate.
The thickness of the substrate is slightly larger than the sum of the thickness of the IC chip and the outer diameter of the winding, and the IC chip is housed in a space formed inside the winding coil of the substrate. Both terminal wires of the coil are fixed in the vicinity of the space portion across the space portion, and the IC is inserted in the space portion.
A non-contact type IC card module, wherein a chip is held by being joined to both terminal lines. 2. The non-contact IC card module according to claim 1, wherein the winding is an enamel-coated aluminum wire, and the IC chip is joined to a terminal wire of the winding coil by a direct bonding method. . 3. A non-contact type IC card module in which an IC chip is electrically coupled to a transmission / reception antenna winding coil fixed to a peripheral portion on a card-shaped substrate, and heat-fused to both surfaces of the module. The thickness of the substrate is slightly larger than the sum of the thickness of the IC chip and the outer diameter of the winding, and is formed inside the winding coil of the substrate. The IC chip is accommodated in the formed space, and both terminal wires of the winding coil are fixed in the vicinity of the space portion across the space portion, and the IC chip is connected to the both terminal wires in the space portion. A non-contact type IC card which is held by being joined to a non-contact type IC card. 4. The non-contact IC card according to claim 3, wherein the winding is an enamel-coated aluminum wire, and the IC chip is joined to a terminal wire of the winding coil by a direct bonding method. 5. The non-curable resin according to claim 4, wherein a gap between the IC chip and the plastic plate is filled with an irregularly curable resin in a space of the substrate sandwiched between the two plastic plates. Contact type IC card.