JP2000292479A - Board unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrict deflection under heat by a burn-in board, and a frame of a frame body of different coefficients of linear expansion which are mutually fixed. SOLUTION: The board unit is composed of a burn-in board 11 having a predetermined function, a frame 12 of a frame body of a shape corresponding to an outline of the burn-in board 11, first fitting members 17 each set nearly to the center of each arm part 15 constituting the frame 12 for fixing the frame 12 to the outer periphery of the burn-in board 11, and second fitting members 18 each of which is placed between the first fitting member 17 and an end part of the arm part 15, fixed to the frame 12, has a gap to a clamp hole formed in the burn-in board 11 and, penetrates the clamp hole to project from the burn-in board 11. The second fitting member has a flange 20 formed to a projecting part for prohibiting the burn-in board 11 from separating while allowing the movement of the arm part 15 in a longitudinal direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board unit comprising a board and a frame as a frame for holding the board, and more particularly to a technique which is effective when applied to prevent warping due to deformation of the board unit during heating. .

[0002]

2. Description of the Related Art The manufacturing process until a semiconductor device is completed is extremely complicated and delicate, and there are factors that cause failure in everywhere. These include design problems, inspection site problems, and usage problems, including the environment and circuit configuration from across the user. Further, in manufacturing, there are factors such as a silicon substrate, diffusion passivation, wiring electrodes, a frame, a package, die bonding, wire bonding, sealing, etc., which cause a failure.

[0003] The main failure modes are surface defects (such as ion contamination), oxide film defects (pinholes), metal wiring defects, and input / output circuit defects.

There is a burn-in device as an inspection device for removing a semiconductor integrated circuit device which causes a failure depending on time and stress due to these inherent defects and manufacturing variations.

In this burn-in apparatus, screening is performed by operating the semiconductor integrated circuit device for a certain period of time under heating of, for example, about 125 ° C. while applying a rating or a voltage higher than the rating by 10 to 20% in order to eliminate an initial failure. Do.

To set a semiconductor integrated circuit device in such a burn-in device, a burn-in board (board) must be used.
Is used.

The burn-in board comprises a laminated substrate of glass epoxy resin having a wiring layer formed thereon, and a plurality of semiconductor integrated circuit devices are mounted at predetermined positions on the burn-in board via sockets. At one end of the burn-in board, there is provided an edge terminal for electrically connecting the edge connector on the burn-in device side to the burn-in board, and the burn-in board on which the semiconductor integrated circuit device is mounted is mounted on the burn-in device. By fitting the edge terminal and the edge connector together, a voltage of a predetermined level is applied from the burn-in device to the semiconductor integrated circuit device.

[0008] A frame, which is a metal frame made of, for example, aluminum, is fixed to the burn-in board along the outer periphery for the purpose of reinforcement and handling convenience. A board unit is formed by the burn-in board and the frame.

[0009]

Since the semiconductor integrated circuit device is subjected to thermal stress in the burn-in device, the board unit is also subjected to the same heating as the semiconductor integrated circuit device. Then, both the burn-in board and the frame thermally expand.

[0010] Since the burn-in board made of glass epoxy resin and the aluminum frame have different coefficients of linear expansion, when the two members are heated in a state where they are fixed to each other, the board unit becomes linear. It warps toward the burn-in board with a small expansion coefficient.

[0011] The warpage of the board unit changes the fitting state of the edge terminal to the edge connector, resulting in poor contact.

In this case, it becomes impossible to apply a predetermined level of voltage from the burn-in device to the semiconductor integrated circuit device via the edge connector and the edge terminal, so that the semiconductor integrated circuit device cannot be screened.

The inventor made the following three attempts to prevent the warpage of the board unit described above.

The first attempt is to form the burn-in board and the frame with members whose linear expansion coefficients are close to each other. However, the types of members are extremely limited, and it has been difficult to specify an effective member.

The second attempt is to forcibly suppress the warping by sandwiching the burn-in board between two frames (or sandwiching the frame between two burn-in boards). However, a stress is generated due to a change over time, resulting in warpage.

A third approach is to fix one end of each of the arms constituting the frame as a frame, and attach the other part to the burn-in board with a play. The part absorbs the difference in the amount of thermal expansion between the two. However, since the entire extension of the arm portion extended by the thermal deformation acts on the fixing portion of the adjacent arm portion, the warpage could not be completely eliminated.

At this time, it was considered that all parts of the frame were attached to the burn-in board with play, but the burn-in board that was not fixed to the frame was not easy to use because it was disturbed when setting or handling the burn-in device. In addition, it may cause failure.

If it is possible to adopt a plate-like body instead of a frame for the frame, the center of the frame of such a plate-like body is fixed to the burn-in board, and the other parts play with respect to the burn-in board. By mounting with the, the difference in the amount of thermal expansion between the two can be absorbed in the play area.

However, on both sides of the burn-in board, sockets, terminals, connectors, wire wirings, etc. for fixing the semiconductor integrated circuit device to be mounted and making electrical contacts are attached. It is difficult to adopt a frame of a shape itself. Even if it is possible to use a plate-shaped frame, simply fixing the center will cause backlash between the frame and the burn-in board. It is difficult and may cause defects.

The problem described above applies not only to a board unit composed of a burn-in board and a frame, but also to various board units warped by thermal expansion.

Accordingly, an object of the present invention is to provide a board unit capable of suppressing warpage of a frame and a frame fixed to each other having different linear expansion coefficients under heating.

[0022]

In order to solve the above-mentioned problems, a board unit according to the present invention comprises a board having a predetermined function, a frame comprising a frame having a shape corresponding to the outer shape of the board, and a frame. A first mounting member that is provided substantially at the center of each of the arm portions and that fixes the frame along the outer periphery of the board; and a first mounting member that is located between the first mounting member and an end of the arm portion and fixed to the frame. A flange is provided on the protruding portion, which has a gap with respect to a fastening hole formed in the board and which protrudes from the board through the fastening hole and which prevents movement of the board while allowing movement in the length direction of the arm portion. The second mounting member is formed, and the frame is thermally deformable independently of the board.

According to the invention, it is possible to suppress the warpage of the frame and the frame fixed to each other having different linear expansion coefficients under heating.

[0024]

Embodiments of the present invention will be described below more specifically with reference to the drawings. Here, the same reference numerals are given to the same members in the attached drawings,
In addition, duplicate description is omitted. The embodiments of the present invention are particularly useful forms in which the present invention is implemented, and the present invention is not limited to the embodiments.

(Embodiment 1) FIG. 1 is a plan view showing a board unit according to Embodiment 1 of the present invention, and FIG.
FIG. 3 is a plan view showing the second mounting member and its periphery in the board unit of FIG. 1, FIG. 3 is a cross-sectional view showing the second mounting member and its periphery in a state where the board unit of FIG. 1 is not thermally deformed, and FIG. FIG. 5 is a cross-sectional view showing the second mounting member and its periphery in a thermally deformed state of the board unit. FIG. 5 compares the board unit of FIG. 1 in a state where it is not thermally deformed and the board unit in FIG. 1 in a thermally deformed state. FIG. 6 is a plan view showing a second mounting member and its periphery in a modified example of the board unit according to Embodiment 1 of the present invention, and FIG.
FIG. 8 is a plan view showing a second mounting member and its periphery in another modified example of the board unit according to Embodiment 1 of the present invention. FIG. 8 is a plan view showing still another modified example of the board unit according to Embodiment 1 of the present invention. FIG. 9 is a cross-sectional view showing a second mounting member and its periphery, FIG. 9 is a cross-sectional view showing a main part of still another modification of the board unit according to the first embodiment of the present invention, and FIG. 10 is a first embodiment of the present invention.
It is sectional drawing which shows the principal part in other modification of the board unit in.

As shown in FIG. 1, a board unit 10 of the present embodiment includes a burn-in board (board) 11,
The burn-in board 11 includes a frame 12 fixed along the outer periphery.

The burn-in board 11 is used for a burn-in device, and is composed of, for example, a glass epoxy resin laminated substrate on which a copper wiring layer is formed. In the present invention, the board is not limited to the burn-in board 11, and various boards having a predetermined function can be applied. The burn-in board 11 can be made of a material other than glass epoxy resin, and the wiring layer can be made of a material other than copper.

At one end of the burn-in board 11, an edge terminal 1 for electrically connecting an edge connector (not shown) on the burn-in device side to the burn-in board 11 is provided.
And a burn-in board 1 on which a semiconductor integrated circuit device 14 is mounted via a socket (not shown).
By mounting 1 in the burn-in device and fitting the edge terminal 13 and the edge connector together, a voltage of a predetermined level is applied to the semiconductor integrated circuit device 14 from the burn-in device. By operating the semiconductor integrated circuit device 14 while applying such an electrical stress under heating for a predetermined time, a product that may cause an initial failure is removed.

The frame 12 has a frame shape including a plurality of arms 15 made of, for example, aluminum, and is fixed to the outer periphery of the burn-in board 11 to reinforce the burn-in board 11 as described above. Also, the edge terminal 13
A handle 16 is provided at the opposite end of the
Convenience is achieved so that good handling properties can be obtained.

It should be noted that the frame 12 is not limited to aluminum, but can be formed using other various metals such as plastics and other various materials. Further, the handle 16 may not be provided. Further, in the present embodiment, the frame 12, which is a quadrangular frame, is composed of four arms 15, but may be a frame of another shape, and therefore, the number of the arms 15 is It is determined according to the shape.

At the approximate center of each arm 15, a frame 1
A first attachment member 17 for fixing the second member 2 along the outer periphery of the burn-in board 11 is provided. This first
The mounting members 17 are, for example, screws, and are provided at two positions substantially at the center of the arm portions 15 located on the left and right in FIG. ing.

The frame 12 and the burn-in board 1
The first mounting member 17 for fixing the first member 1 does not need to be provided at the center of the arm portion 15 in a strict sense, and it suffices to be provided at substantially the center of the arm portion 15. Further, as shown in the drawing, the first attachment member 17 can be provided at one or two places of the arm portion 15, but can be provided at three or more places. Furthermore, the first
The attachment member 17 need not be a screw, and various fasteners such as rivets that can fix the frame 12 and the burn-in board 11 can be used.

A second mounting member 18 is provided between the first mounting member 17 and the end of the arm 15 as described above.

The second mounting member 18 is also a screw, and has a gap (for example, 0.3 to 0.5 mm) with respect to a fastening hole 19 formed in the burn-in board 11, as shown in detail in FIGS. Degree) and having this fastening hole 19
And is fixed to the arm 15.

The second mounting member 18 protrudes from the burn-in board 11, and this protruding portion has an arm 1
5 Burn-in board 1 while allowing movement in the length direction
A flange 20 for preventing detachment of the first member 1 is formed. Therefore, the second mounting member 18 does not fix both the frame 12 and the burn-in board 11 so as not to move.

Here, in this embodiment, the flange 20 is fitted between the screw head and the screw hole and the fastening hole 19 of the burn-in board 11 and is a washer having a larger diameter than the fastening hole 19. However, there is a burn-in board 1 such as a screw head having a diameter larger than the fastening hole 19.
Any member can be used as long as it can prevent detachment of the first member. Further, in order to allow the arm portion 15 to move in the length direction, a spacer 25 for holding the flange 20 and the arm portion 15 at a predetermined interval is fitted into the screw main body. A slight clearance (e.g., 0.05 to 0.2)
(About 5 mm). The second mounting member 18 does not need to be a screw, and various fasteners such as rivets and stepped screws can be used.

When such a board unit 10 is set in a burn-in device and heated, the aluminum frame 12 has a larger linear expansion coefficient than the burn-in board 11 made of glass epoxy resin.
The arm 15 extends in the length direction.

Here, as described above, the second mounting member 18 is fixed to the arm 15 so as to allow the arm 15 to move in the length direction, and is formed on the burn-in board 11. There is a gap with respect to the fastening hole 19.

Therefore, the second mounting member 18
As shown in FIG. 4, the gap between the fastening holes 19 moves with the arm 15 extending in this manner. Since the first attachment member 17 is provided substantially at the center of the arm portion 15, the arm portion 15 extends evenly in the two length directions, and the amount of extension per direction is the entire arm portion 15. Half of the extension. As a result, the amount of movement of the second mounting member 18 is half the amount of extension of the entire arm portion 15 and does not come into contact with the fastening hole 19.
1 is not deformed.

Then, as shown in FIG. 5A, the frame 12 is fixed to the burn-in board 11 along the outer periphery of the burn-in board 11 by the first mounting member 17 and is set in a burn-in device and heated. When the arm 15 extends in the length direction, the heat is transformed so that the four corners of the frame 12 protrude outside the burn-in board 11 as shown in FIG.

However, since the second mounting member 18 does not deform the burn-in board 11, the frame 1
2 can be thermally deformed independently of the burn-in board 11, and it is possible to suppress warpage of the burn-in board 11 and the frame 12 that are mutually fixed and have different linear expansion coefficients under heating. .

In the above description, the fastening hole 19 has a round shape (see FIG. 2). For example, the fastening hole 19 may have an oval shape as shown in FIG. 6 or a notch shape as shown in FIG. And various shapes such as a polygon and an ellipse.

As shown in FIG. 8, a compression coil spring 21 is provided between the flange 20 and the burn-in board 11.
May be attached. The use of the compression coil spring 21 eliminates the need for the spacer 25 for allowing the arm portion 15 to move in the length direction.

Further, the second mounting member 18 described above
Instead, as shown in FIG. 9, a groove 22 for holding the edge of the burn-in board 11 may be formed in the arm 15 while allowing the arm 15 to move in the length direction.

In FIG. 9, the groove portion 22 is formed integrally with the arm portion 15, but as shown in FIG. 10, the groove portion is formed by attaching another component to the arm portion 15 having the step. 22 may be formed.

(Embodiment 2) FIG. 11 is a plan view showing a board unit according to Embodiment 2 of the present invention, FIG. 12 is a plan view showing the vicinity of a corner of the board unit in FIG. FIG. 13 is a plan view showing the periphery of a corner in a state where the board unit of FIG. 11 is thermally deformed.

In the present embodiment, a block 23 is provided at the corner of the frame 12 to hold the burn-in board 11 by gripping the corner of the burn-in board 11 and to be displaceable outward. Is what it is. In this embodiment, since the frame 12 has a larger linear expansion coefficient than the burn-in board 11, the block 23 is provided on the frame 12 side, but the burn-in board 11 has a higher linear expansion coefficient. If larger, the block 23 is provided on the burn-in board 11 side.

When such a board unit 10 is heated, the arm 15 constituting the frame 12 extends in the length direction.

At this time, as described above, the frame 12
Since the block 23 provided at the corner of and holding the corner of the burn-in board 11 can be displaced outward, from the position before the thermal deformation shown in FIG. 12, as shown in FIG. It is displaced away from the burn-in board 11.

Therefore, the frame 12 can be thermally deformed independently of the burn-in board 11, and the warpage of the burn-in board 11 and the frame 12 fixed to each other and having different linear expansion coefficients under heating is suppressed. It becomes possible to do.

(Embodiment 3) FIG. 14 is a plan view showing a board unit according to Embodiment 3 of the present invention. FIG. 15 is a plan view showing the vicinity of a corner of the board unit in FIG. FIG. 16 is a plan view showing the periphery of a corner portion of the board unit of FIG. 14 in a thermally deformed state.

In the present embodiment, holding pins 24 for holding the frame 12 are provided at the corners of the burn-in board 11 so as to push the corners of the frame 12 as a frame from the inside. Things. In this embodiment, since the burn-in board 11 has a smaller linear expansion coefficient than the frame 12, the holding pins 2
4 is provided on the burn-in board 11 side, but when the frame 12 has a smaller linear expansion coefficient, the holding pin 24 is provided on the frame 12 side. When the holding pins 24 are provided on the frame 12 side, a frame is formed on the outer periphery of the burn-in board 11, and this frame is
Hold at 4.

When such a board unit 10 is heated and the arm 15 constituting the frame 12 extends in the longitudinal direction, the arm unit 15 is moved from the position before thermal deformation shown in FIG.
As shown in FIG. 16, the frame 12 spreads away from the holding pins 24.

Therefore, the frame 12 can be thermally deformed independently of the burn-in board 11, and the warpage of the burn-in board 11 and the frame 12 fixed to each other and having different linear expansion coefficients under heating is suppressed. It becomes possible to do.

[0055]

As apparent from the above description, the following effects can be obtained according to the present invention.

(1). Since the frame can be thermally deformed independently of the board, it is possible to suppress warpage of the frame and the frame fixed to each other having different linear expansion coefficients under heating.

(2). As a result, when a burn-in board is applied as a board, the warp of the burn-in board disappears even under heating, so that the edge terminals and the edge connector are stably fitted, and screening of the semiconductor integrated circuit device is performed. It can be performed reliably.

[Brief description of the drawings]

FIG. 1 is a plan view showing a board unit according to Embodiment 1 of the present invention.

FIG. 2 is a plan view showing a second mounting member and its periphery in the board unit of FIG. 1;

FIG. 3 is a cross-sectional view showing a second mounting member and its periphery in a state where the board unit of FIG. 1 is not thermally deformed.

FIG. 4 is a cross-sectional view showing a second mounting member and its periphery in a thermally deformed state of the board unit of FIG. 1;

5 is an explanatory diagram showing a comparison between the board unit of FIG. 1 in a state where it is not thermally deformed and the board unit of FIG. 1 in a state where it is thermally deformed.

FIG. 6 is a plan view showing a second mounting member and its periphery in a modification of the board unit according to Embodiment 1 of the present invention.

FIG. 7 is a plan view showing a second mounting member and its periphery in another modified example of the board unit according to Embodiment 1 of the present invention.

FIG. 8 is a cross-sectional view showing a second mounting member and its periphery in still another modification of the board unit according to Embodiment 1 of the present invention.

FIG. 9 is a cross-sectional view showing a main part of still another modification of the board unit according to Embodiment 1 of the present invention.

FIG. 10 is a cross-sectional view showing a main part of still another modified example of the board unit according to Embodiment 1 of the present invention.

FIG. 11 is a plan view showing a board unit according to Embodiment 2 of the present invention.

FIG. 12 is a plan view showing the vicinity of a corner of the board unit of FIG. 11 in a state where the board unit is not thermally deformed.

FIG. 13 is a plan view showing the vicinity of a corner in a state where the board unit of FIG. 11 is thermally deformed.

FIG. 14 is a plan view showing a board unit according to Embodiment 3 of the present invention.

FIG. 15 is a plan view showing the periphery of a corner portion of the board unit of FIG. 14 in a state where it is not thermally deformed.

FIG. 16 is a plan view showing the vicinity of a corner in a state where the board unit of FIG. 14 is thermally deformed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Board unit 11 Burn-in board (board) 12 Frame 13 Edge terminal 14 Semiconductor integrated circuit device 15 Arm part 16 Handle 17 First attachment member 18 Second attachment member 19 Fastening hole 20 Flange 21 Compression coil spring 22 Groove 23 Block 24 Holding Pin 25 spacer

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] March 22, 2000 (200.3.2)
2)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0022

[Correction method] Change

[Correction contents]

[0022]

In order to solve the above problems SUMMARY OF THE INVENTION The board unit according to the present invention, a board having a predetermined function, and quadrilateral shapes comprising four arm portions frame, each arm portion A first mounting member provided substantially at the center of the frame and fixing the frame along the outer periphery of the board to form a fixed portion; and an arm portion positioned between the first mounting member and an end of the arm portion. A flange that is fixed to the board and has a gap with respect to the fastening hole formed in the board and protrudes from the board through the fastening hole and prevents the board from floating while allowing the arm portion to move in the length direction. The second formed on the protruding portion to form the sliding holding portion
Of the board, the thermal deformation of the board
It is characterized by being concentrated in the four corners of the road.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0029

[Correction method] Change

[Correction contents]

The frame 12 is made of, for example, aluminum 4
It has a quadrangular shape composed of book arms 15 and is fixed to the outer periphery of the burn-in board 11 to reinforce the burn-in board 11 as described above. Edge terminal 1
A handle 16 is provided at an end opposite to the end 3 for convenience such that good handleability is obtained.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0030

[Correction method] Change

[Correction contents]

It should be noted that the frame 12 is not limited to aluminum, but can be formed using other various metals such as plastics and other various materials. Further, the handle 16 may not be provided.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0031

[Correction method] Change

[Correction contents]

At the approximate center of each arm 15, a frame 1
2 were fixed along the outer periphery of the burn-in board 11 fixed
A first attachment member 17 for forming a part is provided. The first attachment member 17 is, for example, a screw. In FIG. 1, the left and right arm portions 15 are provided at approximately two central locations, and the upper and lower arm portions 15 are provided at substantially central one location. Each is provided.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0035

[Correction method] Change

[Correction contents]

The second mounting member 18 protrudes from the burn-in board 11, and this protruding portion has an arm 1
A flange 20 is formed to prevent the burn-in board 11 from floating while allowing the sliding movement in the length direction of the burn-in board 5. Therefore, the second mounting member 18
A sliding holding portion is formed, and neither the frame 12 nor the burn-in board 11 is fixed so as not to move.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0039

[Correction method] Change

[Correction contents]

Therefore, the second holding part for forming the sliding holding part is provided .
As shown in FIG. 4, the mounting member 18 moves in the gap between the fastening holes 19 with the arm portion 15 extending in this manner. Then, the first attachment member 17 forming the fixing portion
Since the arm 15 is provided substantially at the center of the arm 15, the arm 15 extends evenly in two longitudinal directions, and the amount of extension in one direction is half the amount of extension of the entire arm 15. As a result, the amount of movement of the second mounting member 18 becomes half of the amount of extension of the entire arm portion 15 and the fastening hole 19
, The burn-in board 11 is not deformed.

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0040

[Correction method] Change

[Correction contents]

Then, as shown in FIG. 5A, the frame 12 is fixed to the burn-in board 11 along the outer periphery of the burn-in board 11 by the first mounting member 17 and is set in a burn-in device and heated. When the arm 15 extends in the length direction, the heat is transformed so that the four corners of the frame 12 protrude outside the burn-in board 11 as shown in FIG. That is, the burn-in board
Thermal deformation of the board 11 collects at the four corners of the burn-in board 11.
Become inside.

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0044

[Correction method] Change

[Correction contents]

Further, the second mounting member 18 described above
Instead, as shown in FIG. 9, a groove 22 that forms a sliding holding portion by holding the edge of the burn-in board 11 while allowing the arm 15 to move in the length direction is formed on the arm 15. It may be formed.

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0050

[Correction method] Change

[Correction contents]

Therefore, the heat change of the burn-in board 11
Since the shapes are concentrated at the four corners of the burn-in board 11, it is possible to suppress the warpage caused by the burn-in board 11 and the frame 12 of the frame fixed to each other and having different linear expansion coefficients.

[Procedure amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0054

[Correction method] Change

[Correction contents]

Therefore, the thermal change of the burn-in board 11
Since the shapes are concentrated at the four corners of the burn-in board 11, it is possible to suppress the warpage caused by the burn-in board 11 and the frame 12 of the frame fixed to each other and having different linear expansion coefficients.

[Procedure amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0056

[Correction method] Change

[Correction contents]

(1) The thermal deformation of the board is at the four corners of the board .
Since it is concentrated, it is possible to suppress the warpage of the frame and the frame fixed to each other having different linear expansion coefficients under heating.

Claims (6)

[Claims] 1. A board having a predetermined function, a frame formed of a plurality of arms, and a frame provided substantially at the center of each of the arms, and fixing the frame along the outer periphery of the board. A first mounting member, fixed between the first mounting member and the end of the arm portion, the first mounting member being fixed to the arm portion, having a gap with a fastening hole formed in the board, and A second mounting member formed in the protruding portion, the flange protruding from the board through a fastening hole, and preventing the detachment of the board while allowing movement in the length direction of the arm portion; A board unit, wherein the frame is thermally deformable independently of the board. 2. Between the flange and the board,
The board unit according to claim 1, wherein a compression coil spring is mounted. 3. A board having a predetermined function, a frame formed of a plurality of arms, and a frame provided substantially at the center of each of the arms, and fixing the frame along the outer periphery of the board. A first mounting member, and a groove formed on the arm portion, the groove portion sandwiching an edge of the board while allowing movement in a length direction of the arm portion, wherein the frame is independent of the board. A board unit characterized by being heat deformable. 4. A board having a predetermined function, a frame-shaped frame including a plurality of arms, and a corner of the frame or the board provided at a corner having a larger linear expansion coefficient, A plurality of blocks that can be displaced outward while holding the counterpart while holding the part, wherein the frame attached along the outer periphery of the board is thermally deformable independently of the board. Board unit characterized by becoming. 5. A board having a predetermined function, a frame having a frame shape composed of a plurality of arms, and a frame provided on a corner of the frame or the board having a smaller coefficient of linear expansion, and having a counterpart frame. It consists of a plurality of fixing pins that hold this counterpart by pushing the corners of the body from the inside, and the frame attached along the outer periphery of the board can be thermally deformed independently of the board A board unit characterized in that: 6. The burn-in board according to claim 1, wherein said board is a burn-in board for mounting a semiconductor integrated circuit device and applying an electrical stress to said semiconductor integrated circuit device under heating. The board unit according to any one of the above.